サーマルインターフェース材料の市場規模、シェア、成長分析、タイプ別、材料別、用途別、地域別 - 産業予測 2025-2032年

サーマルインターフェース材料2023年の市場規模は36億米ドルで、2024年の39億5,000万米ドルから2032年には82億1,000万米ドルに拡大し、予測期間（2025-2032年）のCAGRは9.6%で成長する見通しです。

サーマルインターフェース材料（TIM）市場は、ますます小型化・高性能化する電子機器における効率的な熱管理に対する需要の高まりを背景に、大きな成長を遂げています。自動車、家電、航空宇宙、通信など幅広い産業への応用により、効果的な放熱ソリューションへの需要が急増しています。小型化と複雑な回路は、より厳しいエネルギー効率規制と持続可能性への取り組みに対応し、堅牢な熱管理の必要性を高めています。高コストやアプリケーションの複雑さといった課題がある一方で、相変化材料や液体金属といった先端材料の技術革新により、熱伝導性と信頼性が向上しています。さらに、5G、IoT、電気自動車といった新たな技術が市場拡大の好機をもたらす一方、再生可能エネルギーへの取り組みが効果的な熱管理ソリューションへの需要を高め、米国TIM市場は今後数年間で持続的な成長を遂げるものと思われます。

目次

イントロダクション

• 調査の目的
• 調査範囲
• 定義

調査手法

• 情報調達
• 二次と一次データの方法
• 市場規模予測
• 市場の前提条件と制限

エグゼクティブサマリー

• 世界市場の見通し
• 供給と需要の動向分析
• セグメント別機会分析

市場力学と見通し

• 市場概要
• 市場規模
• 市場力学
  • 促進要因と機会
  • 抑制要因と課題
• ポーターの分析

主な市場の考察

• 重要成功要因
• 競合の程度
• 主な投資機会
• 市場エコシステム
• 市場の魅力指数（2024年）
• PESTEL分析
• マクロ経済指標
• バリューチェーン分析
• 価格分析
• 特許分析
• 規制分析
• 技術分析
• ケーススタディ

サーマルインターフェース材料市場規模：タイプ別& CAGR（2025-2032）

• 市場概要
• グリースと接着剤
• テープとフィルム
• ギャップフィラー
• 金属系サーマルインターフェース材料
• 相変化材料
• その他のタイプ

サーマルインターフェース材料市場規模：材料別& CAGR（2025-2032）

• 市場概要
• シリコーン
• エポキシ
• ポリイミド
• その他の材料

サーマルインターフェース材料市場規模：用途別& CAGR（2025-2032）

• 市場概要
• コンピューター・データセンター
• 通信
• 産業
• ヘルスケア・医療機器
• 耐久消費財
• 自動車
• その他の用途

サーマルインターフェース材料市場規模：地域別& CAGR（2025-2032）

• 北米
  • 米国
  • カナダ
• 欧州
  • ドイツ
  • スペイン
  • フランス
  • 英国
  • イタリア
  • その他欧州地域
• アジア太平洋地域
  • 中国
  • インド
  • 日本
  • 韓国
  • その他アジア太平洋地域
• ラテンアメリカ
  • ブラジル
  • その他ラテンアメリカ地域
• 中東・アフリカ
  • GCC諸国
  • 南アフリカ
  • その他中東・アフリカ

競合情報

• 上位5社の比較
• 主要企業の市場ポジショニング（2024年）
• 主な市場企業が採用した戦略
• 最近の市場動向
• 企業の市場シェア分析（2024年）
• 主要企業の企業プロファイル
  • 企業の詳細
  • 製品ポートフォリオ分析
  • 企業のセグメント別シェア分析
  • 収益の前年比比較（2022-2024年）

主要企業プロファイル

• Henkel AG & Co. KGaA（Germany）
• Dow Inc.（US）
• 3M Company（US）
• Parker-Hannifin Corporation（US）
• Honeywell International Inc.（US）
• Fujipoly（Japan）
• Shin-Etsu Chemical Co., Ltd.（Japan）
• Indium Corporation（US）
• Zalman Tech Co., Ltd.（South Korea）
• SEMIKRON International GmbH（Germany）
• Avery Dennison Corporation（US）
• AOS Thermal Compounds LLC（US）
• Enerdyne Solutions（US）
• Electrolube（UK）
• Polytec PT GmbH（Germany）
• Arctic Cooling（Switzerland）
• Thermal Grizzly（Germany）
• Gelid Solutions Ltd.（Hong Kong）
• Nanografi（Turkey）
• ProTek Devices（US）
• Silicone Solutions（US）

結論と提言

Thermal Interface Materials Market size was valued at USD 3.6 billion in 2023 and is poised to grow from USD 3.95 billion in 2024 to USD 8.21 billion by 2032, growing at a CAGR of 9.6% during the forecast period (2025-2032).

The Thermal Interface Material (TIM) Market is experiencing significant growth, driven by the rising demand for efficient thermal management in increasingly compact and powerful electronic devices. With applications spanning industries such as automotive, consumer electronics, aerospace, and telecommunications, the demand for effective heat dissipation solutions is surging. Miniaturization and complex circuitry heighten the necessity for robust thermal management, aligning with stricter energy efficiency regulations and sustainability efforts. While challenges like high costs and application complexities exist, innovations in advanced materials such as phase change and liquid metals are enhancing thermal conductivity and reliability. Furthermore, emerging technologies in 5G, IoT, and electric vehicles present lucrative opportunities for market expansion, while renewable energy initiatives increase demand for effective thermal management solutions, positioning the US TIM Market for sustainable growth in the coming years.

Top-down and bottom-up approaches were used to estimate and validate the size of the Thermal Interface Materials market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Thermal Interface Materials Market Segments Analysis

Global Thermal Interface Materials Market is segmented by Type, Material, Application and region. Based on Type, the market is segmented into Grease & Adhesives, Tapes & Films, Gap Fillers, Metal-Based Thermal Interface Materials, Phase Change Materials and Other Types. Based on Material, the market is segmented into Silicone, Epoxy, Polyimide and Other Materials. Based on Application, the market is segmented into Computers & Data Centers, Telecommunications, Industrial, Healthcare & Medical Devices, Consumer Durables, Automotive and Other Applications. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Thermal Interface Materials Market

The increasing demand for smartphones, laptops, gaming consoles, and various electronic devices is significantly fueling the need for efficient thermal management solutions. Thermal Interface Materials (TIMs) play a crucial role in dissipating the heat produced by these devices, thereby preventing overheating and ensuring they operate at peak performance. Notably, the surge in gaming enthusiasts has resulted in a higher demand for high-performance computers, which necessitate advanced thermal management solutions to maintain optimal functionality. This growing reliance on technology and the need for effective thermal control are driving the expansion of the Thermal Interface Materials market.

Restraints in the Thermal Interface Materials Market

The Thermal Interface Materials (TIMs) market faces certain constraints due to the varied types of TIMs, each exhibiting different thermal conductivity characteristics. Some materials struggle to achieve optimal heat transfer, as they do not possess sufficiently high thermal conductivity, which can limit their performance in applications that require significant heat dissipation. This deficiency can be especially detrimental in high-demand scenarios where efficient thermal management is crucial. Consequently, ongoing research and development initiatives are directed towards creating new TIM formulations that enhance thermal conductivity, aiming to overcome these limitations and address the needs of advanced applications in the market.

Market Trends of the Thermal Interface Materials Market

The Thermal Interface Materials (TIM) market is experiencing a significant shift towards the increasing adoption of phase change materials (PCMs) due to their superior thermal management capabilities. As industries like data centers and electric vehicles prioritize efficient heat dissipation to enhance performance and longevity, PCMs, which change phases from solid to liquid and vice versa under varying temperatures, have become crucial. Their ability to provide high thermal conductivity during phase transitions is driving innovation and demand within the market. This trend highlights the expanding role of PCMs in key applications, suggesting a robust growth trajectory for the TIM industry moving forward.

Table of Contents

Introduction

• Objectives of the Study
• Scope of the Report
• Definitions

Research Methodology

• Information Procurement
• Secondary & Primary Data Methods
• Market Size Estimation
• Market Assumptions & Limitations

Executive Summary

• Global Market Outlook
• Supply & Demand Trend Analysis
• Segmental Opportunity Analysis

Market Dynamics & Outlook

• Market Overview
• Market Size
• Market Dynamics
  • Drivers & Opportunities
  • Restraints & Challenges
• Porters Analysis
  • Competitive rivalry
  • Threat of substitute
  • Bargaining power of buyers
  • Threat of new entrants
  • Bargaining power of suppliers

Key Market Insights

• Key Success Factors
• Degree of Competition
• Top Investment Pockets
• Market Ecosystem
• Market Attractiveness Index, 2024
• PESTEL Analysis
• Macro-Economic Indicators
• Value Chain Analysis
• Pricing Analysis
• Patent Analysis
• Regulatory Analysis
• Technology Analysis
• Case Studies

Global Thermal Interface Materials Market Size by Type & CAGR (2025-2032)

• Market Overview
• Grease & Adhesives
• Tapes & Films
• Gap Fillers
• Metal-Based Thermal Interface Materials
• Phase Change Materials
• Other Types

Global Thermal Interface Materials Market Size by Material & CAGR (2025-2032)

• Market Overview
• Silicone
• Epoxy
• Polyimide
• Other Materials

Global Thermal Interface Materials Market Size by Application & CAGR (2025-2032)

• Market Overview
• Computers & Data Centers
• Telecommunications
• Industrial
• Healthcare & Medical Devices
• Consumer Durables
• Automotive
• Other Applications

Global Thermal Interface Materials Market Size & CAGR (2025-2032)

• North America (Type, Material, Application)
  • US
  • Canada
• Europe (Type, Material, Application)
  • Germany
  • Spain
  • France
  • UK
  • Italy
  • Rest of Europe
• Asia Pacific (Type, Material, Application)
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
• Latin America (Type, Material, Application)
  • Brazil
  • Rest of Latin America
• Middle East & Africa (Type, Material, Application)
  • GCC Countries
  • South Africa
  • Rest of Middle East & Africa

Competitive Intelligence

• Top 5 Player Comparison
• Market Positioning of Key Players, 2024
• Strategies Adopted by Key Market Players
• Recent Developments in the Market
• Company Market Share Analysis, 2024
• Company Profiles of All Key Players
  • Company Details
  • Product Portfolio Analysis
  • Company's Segmental Share Analysis
  • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

• Henkel AG & Co. KGaA (Germany)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Dow Inc. (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• 3M Company (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Parker-Hannifin Corporation (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Honeywell International Inc. (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Fujipoly (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Shin-Etsu Chemical Co., Ltd. (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Indium Corporation (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Zalman Tech Co., Ltd. (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• SEMIKRON International GmbH (Germany)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Avery Dennison Corporation (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• AOS Thermal Compounds LLC (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Enerdyne Solutions (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Electrolube (UK)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Polytec PT GmbH (Germany)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Arctic Cooling (Switzerland)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Thermal Grizzly (Germany)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Gelid Solutions Ltd. (Hong Kong)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Nanografi (Turkey)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• ProTek Devices (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Silicone Solutions (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments

Conclusion & Recommendations