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サーマルインターフェース材料の世界市場規模：製品タイプ別、用途別、地域別、予測

Global Thermal Interface Materials Market Size By Product Type (Gap Fillers, Metal-Based Thermal Interface Materials), By Application (Medical Devices, Industrial Machinery), By Geographic Scope And Forecast

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英文 202 Pages
納期
2～3営業日
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価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=144.76円
サーマルインターフェース材料の世界市場規模：製品タイプ別、用途別、地域別、予測
出版日: 2025年05月07日
発行: Verified Market Research
ページ情報: 英文 202 Pages
納期: 2～3営業日
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概要

サーマルインターフェイス材料の市場規模と予測

サーマルインターフェイス材料の市場規模は、2024年に28億米ドルと評価され、2026～2032年にかけて11.13%のCAGRで成長し、2032年には65億1,000万米ドルに達すると予測されています。

サーマルインターフェイス材料（TIM）は、コンピュータプロセッサやLED照明システムなどの電気機器において、2つの表面間の熱伝導性と熱伝達を改善する化合物です。これらの材料は一般的に、熱放散効率を向上させ、過熱を回避し、電子機器の寿命を延ばすために、発熱部品とヒートシンクまたはヒートスプレッダの間に使用されます。TIMには、サーマルグリース、サーマルパッド、相変化材料、サーマル接着剤など、さまざまな形態があり、それぞれ塗布の容易さ、適合性、熱性能の面で独自の利点があります。

サーマルインターフェース材料（TIM）は、効果的な熱放散が重要な電子機器やシステムで広く使用されています。TIMは、コンピュータープロセッサー、グラフィックプロセッシングユニット（GPU）、集積回路（IC）、LED、自動車用電子機器、パワーエレクトロニクス、通信機器などに広く利用されています。TIMは、発熱部品とヒートシンクやサーマルスプレッダーとの間の微細な隙間や凹凸を埋めることで熱抵抗を下げ、より効率的な熱伝達を可能にすることで、熱管理を改善します。これにより、電気機器が適切な温度で動作することが保証され、性能、信頼性、寿命が向上するとともに、熱による故障や劣化が防止されます。

サーマルインターフェイス材料（TIMs）は、5G通信、高性能コンピューター、電気自動車、高性能LED照明システムなどの新技術に関連する熱管理の問題に対処する上で重要な役割を果たすと期待されています。これらの技術が進歩し、より小型で高性能、エネルギー効率の高い電子機器への需要が高まるにつれ、熱伝導性、信頼性、耐久性を向上させたTIMの重要性はますます高まるでしょう。さらに、材料科学とナノ技術の進歩により、優れた熱特性と製造可能性の向上により、より効率的な放熱と次世代電子用途向けの熱管理ソリューションを実現する新しいTIM配合の開発が推進されると予想されます。

サーマルインターフェイス材料の市場力学

サーマルインターフェイス材料市場を形成している主な市場力学は以下の通り：

主な市場促進要因

高性能電子機器に対する需要の増加：スマートフォン、タブレット、ゲーム機、車載用電子機器などの高性能電子機器の人気の高まりが、TIMの需要を促進しています。これらの機器は大量の熱を発生するため、動作温度を安定させ、性能低下や故障を防ぐための高度な熱管理ソリューションが必要となります。

技術の向上：電子機器の小型化の推進は、電力密度の向上とよりコンパクトなパッケージ設計につながります。その結果、ますます小型化する電子部品から効率的に熱を排出するために、高い熱伝導性と安定性を備えたTIMに対する需要が高まっています。

エネルギー効率と持続可能性の重視：エネルギー効率と持続可能性の重要性が高まるにつれ、よりエネルギー効率の高い電子機器や、電気自動車や再生可能エネルギーシステムなどのグリーンテクノロジーへのシフトが進んでいます。TIMは、より効果的な放熱を可能にし、エネルギー消費を抑え、電子機器の寿命を延ばすことで、こうしたシステムのエネルギー効率を高める上で重要な役割を果たしています。さらに、環境に優しいTIMの配合や製造技術の開発は、環境目標や規制と一致するため、市場の成長をもたらしています。

主な課題

熱性能対機械的信頼性：高い熱伝導性と機械的信頼性の適切なバランスを見つけることは大きな問題です。TIMは、熱サイクル、機械的ストレス、長期の経年変化など、さまざまな使用環境において構造的完全性と耐久性を維持しながら、効率的に熱を伝えなければなりません。時間の経過とともに材料が劣化することなく、継続的な性能を維持することは難しい課題です。

製造と応用の複雑さ：TIMを正確に塗布することは、最高の性能を発揮するために不可欠です。しかし、一貫した厚さの維持、エアギャップの排除、表面間の強力な接着の達成など、製造と塗布のプロセス全体に障害が存在します。不適切な塗布は、熱接触不良や放熱効率の低下を招き、電子機器全体の性能を低下させる可能性があります。

コストと材料の互換性：リーズナブルなコストで優れた熱性能を持つTIMを開発することは、現在進行中の課題です。さらに、TIMは、金属、セラミック、プラスチックなど、電子部品やデバイスに見られるさまざまな材料と互換性がなければなりません。熱性能を犠牲にしたり、化学反応や経時的な材料劣化を発生させることなく互換性を確保することは、適切なTIMの開発と選択を複雑にしています。

主な動向

材料科学の進歩：グラフェン、カーボンナノチューブ、ナノコンポジットなどの革新的な材料を組み込んだ先進的なTIMの開発への関心が高まっています。これらの材料は熱伝導性と機械的性質が高く、熱伝達の効率と耐久性が向上します。性能特性を向上させた次世代TIMは、材料科学の研究とイノベーションを通じて開発されています。

環境に優しく持続可能なソリューション：環境に対する意識と規制の圧力が高まるにつれ、環境に優しく持続可能なTIM配合へのシフトが顕著になっています。メーカーは、有害化合物を含まず、製造時の環境への影響が小さく、リサイクルや責任ある廃棄が容易なTIMの製造に取り組んでいます。この傾向は、カーボンフットプリントを削減し、持続可能な活動を支援するという、より広範な業界の目標と一致しています。

新技術との統合：TIMと、5G通信、電気自動車、先進コンピュータシステムなどの新技術との統合は、増加傾向にあります。これらの技術が向上するにつれて、電力密度が高まり、より効率的な熱管理ソリューションが必要となります。TIMは、ますます厳しくなる条件下で最高の性能と信頼性を保証するため、さまざまな用途のける特定の熱ニーズに合わせてカスタマイズされています。

目次

第1章 イントロダクション

  • 市場の定義
  • 市場セグメンテーション
  • 調査スケジュール
  • 前提条件
  • 制限事項

第2章 VERIFIED MARKET RESEARCHの調査手法

  • データマイニング
  • データの三角測量
  • ボトムアップアプローチ
  • トップダウンアプローチ
  • 調査の流れ
  • 業界専門家による主要な洞察
  • データソース

第3章 エグゼクティブサマリー

  • 市場概要
  • エコロジーマッピング
  • 絶対的収益機会
  • 市場の魅力
  • サーマルインターフェイス材料の世界市場：地域別
  • サーマルインターフェイス材料の世界市場：製品タイプ別
  • サーマルインターフェイス材料の世界市場：用途別
  • 今後の市場機会
  • 世界市場内訳
  • 製品ライフライン

第4章 市場概要

  • 世界のサーマルインターフェイス材料の進化
  • 促進要因
  • 抑制要因
  • 機会
  • ポーターのファイブフォースモデル
  • バリューチェーン分析
  • 価格分析
  • マクロ経済分析

第5章 サーマルインターフェイス材料市場：製品タイプ別

  • 概要
  • ギャップフィラー
  • 金属系サーマルインターフェイス材料
  • グリース・接着剤
  • テープ・フィルム
  • 相変化材料

第6章 サーマルインターフェイス材料市場、用途別

  • 概要
  • 医療機器
  • 産業機械
  • 耐久消費財
  • コンピューター
  • 通信機器
  • 車載用電子機器

第7章 サーマルインターフェイス材料市場：地域別

  • 概要
  • 北米
    • 米国
    • カナダ
    • メキシコ
  • 欧州
    • ドイツ
    • 英国
    • フランス
    • イタリア
    • スペイン
    • その他欧州
  • アジア太平洋
    • 中国
    • 日本
    • インド
    • その他アジア太平洋地域
  • ラテンアメリカ
    • ブラジル
    • アルゼンチン
    • その他ラテンアメリカ
  • 中東・アフリカ
    • アラブ首長国連邦
    • サウジアラビア
    • 南アフリカ
    • その他中東とアフリカ

第8章 競合情勢

  • 概要
  • 各社の市場ランキング
  • 主な発展
  • 企業の地域別フットプリント
  • 企業の業界フットプリント
  • ACEマトリックス

第9章 企業プロファイル

  • Bergquist Company
  • Henkel Corporation
  • Indium Corporation
  • Dow Corning

第10章 製品ベンチマーク

    • 主な発展
    • 勝利の条件
    • 現在の焦点と戦略
    • 競合からの脅威
    • SWOT分析
  • Parker Chomerics
    • 会社概要
    • 企業洞察
    • 製品ベンチマーク
    • 主な発展
    • 勝利の条件
    • 現在の焦点と戦略
    • 競合からの脅威
    • SWOT分析
  • Laird Technologies
    • 会社概要
    • 企業洞察
    • 製品ベンチマーク
    • 主な発展
    • 勝利の条件
    • 現在の焦点と戦略
    • 競合からの脅威
    • SWOT分析
  • Honeywell International Inc.
    • 会社概要
    • 企業洞察
    • 製品ベンチマーク
    • 主な発展
    • 勝利の条件
    • 現在の焦点と戦略
    • 競合からの脅威
    • SWOT分析
  • 3M
    • 会社概要
    • 企業洞察
    • 製品ベンチマーク
    • 主な発展
    • 勝利の条件
    • 現在の焦点と戦略
    • 競合からの脅威
    • SWOT分析
  • Zalman Tech Co., Ltd.
    • 会社概要
    • 企業洞察
    • 製品ベンチマーク
    • 主な発展
    • 勝利の鍵
    • 現在の焦点と戦略
    • 競合からの脅威
    • SWOT分析
  • Momentive Performance Materials Inc.
    • 会社概要
    • 企業洞察
    • 製品ベンチマーク
    • 主な発展
    • 勝利の条件
    • 現在の焦点と戦略
    • 競合からの脅威
    • SWOT分析

第11章 VERIFIED MARKET INTELLIGENCE

  • VERIFIED MARKET INTELLIGENCEについて
  • ダイナミックなデータの可視化
目次
Product Code: 41465

Thermal Interface Materials Market Size And Forecast

Thermal Interface Materials Market size was valued at USD 2.8 Billion in 2024 and is projected to reach USD 6.51 Billion by 2032, growing at a CAGR of 11.13% from 2026 to 2032.

Thermal interface materials (TIMs) are compounds that improve thermal conductivity and heat transmission between two surfaces in electrical equipment like computer processors and LED lighting systems. These materials are commonly used between the heat-generating component and a heatsink or heat spreader to improve thermal dissipation efficiency, avoid overheating, and extend the life of electronic equipment. TIMs are available in a variety of forms including thermal greases, thermal pads, phase-change materials, and thermal adhesives each with unique benefits in terms of application ease, conformability, and thermal performance.

Thermal interface materials (TIMs) are widely used in electronic devices and systems where effective heat dissipation is crucial. They are widely utilised in computer processors, graphic processing units (GPUs), integrated circuits (ICs), LEDs, automotive electronics, power electronics, and telecommunications devices. TIMs improve thermal management by filling microscopic gaps and irregularities between heat-generating components and heatsinks or thermal spreaders lowering thermal resistance and allowing for more efficient heat transmission. This guarantees that electrical equipment run at appropriate temperatures improving performance, reliability, and lifetime while preventing thermal failures and deterioration.

Thermal interface materials (TIMs) are expected to play an important role in addressing heat management difficulties associated with new technologies such as 5G telecommunications, high-performance computers, electric cars, and sophisticated LED lighting systems. As these technologies advance and demand for smaller, more powerful, and energy-efficient electronic devices grows, TIMs with improved thermal conductivity, dependability, and durability will become increasingly important. Furthermore, advances in material science and nanotechnology are expected to drive the development of novel TIM formulations with superior thermal properties and increased manufacturability resulting in more efficient heat dissipation and thermal management solutions for next-generation electronic applications.

Global Thermal Interface Materials Market Dynamics

The key market dynamics that are shaping the Thermal Interface Materials Market include:

Key Market Drivers:

Increasing Demand for High-Performance Electronics: The rising popularity of high-performance electronic gadgets such as smartphones, tablets, gaming consoles, and automotive electronics is driving demand for TIMs. These devices generate a large quantity of heat demanding sophisticated thermal management solutions to keep operating temperatures stable and prevent performance degradation or failure.

Technological Improvements: The push towards miniaturisation in electronics lead to increased power densities and more compact packaging designs. As a result, there is a rising demand for TIMs with high thermal conductivity and stability to efficiently drain heat from increasingly compact electronic components.

Focus on Energy Efficiency and Sustainability: As energy efficiency and sustainability become increasingly important, there is a shift towards more energy-efficient electronic equipment and green technology such as electric vehicles and renewable energy systems. TIMs play an important role in increasing the energy efficiency of these systems by allowing for more effective heat dissipation, lowering energy consumption, and extending the lifespan of electronics. Furthermore, the development of eco-friendly TIM formulations and manufacturing techniques coincides with environmental goals and regulatory regulations resulting in increased market growth.

Key Challenges:

Thermal Performance vs. Mechanical Reliability: Finding the right balance between high thermal conductivity and mechanical reliability is a big problem. TIMs must transmit heat efficiently while retaining structural integrity and durability in a variety of working circumstances including as thermal cycling, mechanical stress, and long-term ageing. It can be challenging to maintain continuous performance without material degradation over time.

Manufacturing and Application Complexity: Precise application of TIMs is critical for peak performance. However, obstacles exist throughout the production and application processes such as maintaining consistent thickness, eliminating air gaps, and achieving strong adhesion between surfaces. Improper application might result in poor thermal contact and reduced heat dissipation efficiency lowering the overall performance of the electronic equipment.

Cost and Material Compatibility: Developing TIMs with good thermal performance at a reasonable cost is an ongoing issue. Furthermore, TIMs must be compatible with a variety of materials found in electronic components and devices including metals, ceramics, and plastics. Ensuring compatibility without sacrificing thermal performance or generating chemical reactions and material degradation over time complicates the development and selection of appropriate TIMs.

Key Trends:

Advancements in Material Science: There is a rising interest in developing advanced TIMs that incorporate innovative materials such as graphene, carbon nanotubes, and nanocomposites. These materials have greater thermal conductivity and mechanical qualities resulting in more efficient heat transfer and increased durability. Next-generation TIMs with improved performance characteristics are being developed through material science research and innovation.

Eco-Friendly and Sustainable Solutions: As environmental awareness and regulatory pressures grow, there is a noticeable shift towards eco-friendly and sustainable TIM formulations. Manufacturers are working to create TIMs that are free of harmful compounds have a smaller environmental effect during manufacturing, and are easier to recycle or dispose of responsibly. This tendency is consistent with the broader industry goal of lowering carbon footprints and supporting sustainable practices.

Integration with New Technologies: The integration of TIMs with new technologies such as 5G telecommunications, electric vehicles, and advanced computer systems is a growing trend. As these technologies improve, they provide increasing power densities and necessitate more efficient thermal management solutions. TIMs are being customised to match the specific thermal needs of various applications assuring peak performance and dependability in increasingly challenging conditions.

Global Thermal Interface Materials Market Regional Analysis

Here is a more detailed regional analysis of the Thermal Interface Materials Market:

Asia-Pacific:

According to Verified Market Research analyst, the biggest market share for Thermal Interface Materials Market is held by the Asia-Pacific region. The area is home to some of the world's largest and most influential electronics manufacturers including those from China, Japan, South Korea, and Taiwan. These countries are important manufacturers of consumer electronics, automotive electronics, and industrial electronics all of which require effective heat management systems. The high concentration of industrial facilities as well as the ongoing demand for innovative electronic gadgets drive the region's significant TIM use and production.

Rapid economic expansion and modernization in Asia Pacific countries have resulted in greater investment in infrastructure and technology. This rise has spurred the expansion of several industries including automotive, telecommunications, and renewable energy where thermal control is vital. The development of electric vehicles (EVs) and the construction of 5G networks is especially noteworthy as these technologies require high-performance TIMs to assure reliability and efficiency. Asia Pacific's supremacy in the TIMs market is due to its significant focus on technical advancement and innovation in these fields.

Favourable government policies and incentives in the region promote the growth of the electronics and semiconductor sectors, hence increasing demand for TIMs. Governments in China and South Korea are aggressively encouraging programmes to strengthen domestic semiconductor capabilities and encourage local production. These policies offer a favourable climate for the expansion of industries that rely largely on efficient thermal management technologies. Furthermore, Asia Pacific's trained workforce and modern manufacturing skills allow for the manufacture of high-quality TIMs at reasonable prices bolstering the region's worldwide market leadership.

North America:

The North America region is experiencing rapid growth in the Thermal Interface Materials Market. The region is experiencing rapid technical developments and innovations particularly in high-performance computing, data centres, and advanced telecommunications. The rising adoption of technologies like artificial intelligence (AI), machine learning, and the Internet of Things (IoT) has raised the need for effective thermal management systems. As devices become more powerful and compact, the demand for improved TIMs to properly manage heat dissipation fuels market growth.

The rapid growth of the electric vehicle (EV) sector in North America is a significant driver of the TIMs market. Leading automobile manufacturers and startups are focusing on the development and production of electric vehicles creating a greater demand for improved thermal management systems to assure the safety, reliability, and efficiency of EV batteries and power electronics. Government subsidies and laws that encourage the use of electric vehicles drive this demand resulting in increased investment in TIM technologies designed for automotive applications.

North America's strong emphasis on sustainability and energy efficiency is fueling the TIMs market's rapid expansion. The region's regulatory environment as well as consumer preferences for energy-efficient and environmentally friendly technology promote the use of high-performance thermal management solutions. Furthermore, major investments in R&D by prominent firms and academic institutes in the United States and Canada are propelling advancements in TIM materials and applications. These developments not only improve the performance and reliability of electronic products but also help the region maintain its position in the global market for sophisticated thermal management systems.

Global Thermal Interface Materials Market: Segmentation Analysis

The Global Thermal Interface Materials Market is segmented on the basis of Product Type, Application, and Geography.

Thermal Interface Materials Market, By Product Type

  • Gap Fillers
  • Metal-based Thermal Interface Materials
  • Greases And Adhesives
  • Tapes And Films
  • Phase Change Materials

Based on Product Type, The market is segmented into Gap Fillers, Metal-based Thermal Interface Materials, Greases And Adhesives, Tapes And Films, and Phase Change Materials. Greases and adhesives experienced the fastest market growth due to their widespread use in consumer goods and strong thermal resistance. Elastomeric pads are expected to have a significant market share since they are easier to build than greases. The handling mechanism is improved even more with elastomeric pads because there are less options to reduce contact resistance.

Thermal Interface Materials Market, By Application

  • Medical Devices
  • Industrial Machinery
  • Consumer Durables
  • Computers
  • Telecom
  • Automotive Electronics

Based on Application, The market is segmented into Medical Devices, Industrial Machinery, Consumer Durables, Computers, Telecom, and Automotive Electronics. The computer application category accounted for a sizable percentage of the market owing to increased usage in office settings. PC demand and supply have shifted substantially as a result of their cheap prices. Following the pandemic as more people preferred to work from home, the PC market experienced a rise in upgrades, sales, and installations.

Thermal Interface Materials Market, By Geography

  • North America
  • Europe
  • Asia-Pacific
  • Middle East And Africa
  • Latin America

Based on Geography, The Global Thermal Interface Materials Market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America. APAC is the world's largest market for thermal interface materials owing to its fast rising population, internet user base, per capita income, industrialization, and end-use industry expansion. To meet the increased demand for thermal interface materials, prominent market players are establishing and expanding their manufacturing bases in APAC. The region's TIM markets are primarily concentrated in developing countries such as China, India, and Japan.

Key Players

The "Global Thermal Interface Materials Market" study report will provide valuable insight with an emphasis on the global market. The major players in the market are Bergquist Company, Henkel Corporation, Indium Corporation, Dow Corning, Parker Chomerics, Laird Technologies, Honeywell International Inc., 3M, Zalman Tech Co., Ltd., and Momentive Performance Materials Inc.

Our market analysis also includes a part dedicated specifically to such significant firms, in which our experts provide insights into their financial statements, as well as product benchmarking and SWOT analysis. The competitive landscape section also contains important development strategies, market share, and market ranking analysis for the aforementioned competitors worldwide.

  • Thermal Interface Materials Market Recent Developments
  • In 2022, 3M expanded its operations in Clinton, Tennessee. By 2025, the company intends to have established over 600 new jobs and invested around USD 470 million at its Clinton, Tennessee location.
  • In 2022, Dow Corning Corporation introduced the DOWSIL TC-4040 TIMs. This gap filler is easy to use, does not sink, and transmits heat effectively. The introduction of this new product will help the company compete in the TIMs market.
  • In June 2020, Henkel AG and Co. KGaA announced the TIM Bergquist Gap Filler TGF 7000 as a new product. It is used in a variety of applications, including power conversion systems, ADAS systems for cars, and electric pumps.

TABLE OF CONTENTS

1 INTRODUCTION OF THE GLOBAL THERMAL INTERFACE MATERIALS MARKET

  • 1.1 Market Definition
  • 1.2 Market Segmentation
  • 1.3 Research Timelines
  • 1.4 Assumptions
  • 1.5 Limitations

2 RESEARCH METHODOLOGY OF VERIFIED MARKET RESEARCH

  • 2.1 Data Mining
  • 2.2 Data Triangulation
  • 2.3 Bottom-Up Approach
  • 2.4 Top-Down Approach
  • 2.5 Research Flow
  • 2.6 Key Insights from Industry Experts
  • 2.7 Data Sources

3 EXECUTIVE SUMMARY

  • 3.1 Market Overview
  • 3.2 Ecology Mapping
  • 3.3 Absolute Market Opportunity
  • 3.4 Market Attractiveness
  • 3.5 Global Thermal Interface Materials Market Geographical Analysis (CAGR %)
  • 3.6 Global Thermal Interface Materials Market, By Product Type (USD Million)
  • 3.7 Global Thermal Interface Materials Market, By Application (USD Million)
  • 3.8 Future Market Opportunities
  • 3.9 Global Market Split
  • 3.10 Product Life Line

4 GLOBAL THERMAL INTERFACE MATERIALS MARKET OUTLOOK

  • 4.1 Global Thermal Interface Materials Evolution
  • 4.2 Drivers
    • 4.2.1 Driver1
    • 4.2.2 Driver 2
  • 4.3 Restraints
    • 4.3.1 Restraint1
    • 4.3.2 Restraint 2
  • 4.4 Opportunities
    • 4.4.1 Opportunity1
    • 4.4.2 Opportunity 2
  • 4.5 Porters Five Force Model
  • 4.6 Value Chain Analysis
  • 4.7 Pricing Analysis
  • 4.8 Macroeconomic Analysis

5 GLOBAL THERMAL INTERFACE MATERIALS MARKET, BY PRODUCT TYPE

  • 5.1 Overview
  • 5.2 Gap Fillers
  • 5.3 Metal-based Thermal Interface Materials
  • 5.4 Greases & Adhesives
  • 5.5 Tapes & Films
  • 5.6 Phase Change Materials

6 GLOBAL THERMAL INTERFACE MATERIALS MARKET, BY APPLICATION

  • 6.1 Overview
  • 6.2 Medical Devices
  • 6.3 Industrial Machinery
  • 6.4 Consumer Durables
  • 6.5 Computers
  • 6.6 Telecom
  • 6.7 Automotive Electronics

7 GLOBAL THERMAL INTERFACE MATERIALS MARKET, BY GEOGRAPHY

  • 7.1 Overview
  • 7.2 North America
    • 7.2.1 U.S.
    • 7.2.2 Canada
    • 7.2.3 Mexico
  • 7.3 Europe
    • 7.3.1 Germany
    • 7.3.2 U.K.
    • 7.3.3 France
    • 7.3.4 Italy
    • 7.3.5 Spain
    • 7.3.6 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 China
    • 7.4.2 Japan
    • 7.4.3 India
    • 7.4.4 Rest of Asia Pacific
  • 7.5 Latin America
    • 7.5.1 Brazil
    • 7.5.2 Argentina
    • 7.5.3 Rest of Latin America
  • 7.6 Middle-East and Africa
    • 7.6.1 UAE
    • 7.6.2 Saudi Arabia
    • 7.6.3 South Africa
    • 7.6.4 Rest of Middle-East and Africa

8 GLOBAL THERMAL INTERFACE MATERIALS MARKET COMPETITIVE LANDSCAPE

  • 8.1 Overview
  • 8.2 Company Market Ranking
  • 8.3 Key Developments
  • 8.4 Company Regional Footprint
  • 8.5 Company Industry Footprint
  • 8.6 ACE Matrix

9 COMPANY PROFILES

  • 9.1 Bergquist Company
    • 9.1.1 Company Overview
    • 9.1.2 Company Insights
    • 9.1.3 Product Benchmarking
    • 9.1.4 Key Developments
    • 9.1.5 Winning Imperatives
    • 9.1.6 Current Focus & Strategies
    • 9.1.7 Threat from Competition
    • 9.1.8 SWOT Analysis
  • 9.2 Henkel Corporation
    • 9.2.1 Company Overview
    • 9.2.2 Company Insights
    • 9.2.3 Product Benchmarking
    • 9.2.4 Key Developments
    • 9.2.5 Winning Imperatives
    • 9.2.6 Current Focus & Strategies
    • 9.2.7 Threat from Competition
    • 9.2.8 SWOT Analysis
  • 9.3 Indium Corporation
    • 9.3.1 Company Overview
    • 9.3.2 Company Insights
    • 9.3.3 Product Benchmarking
    • 9.3.4 Key Developments
    • 9.3.5 Winning Imperatives
    • 9.3.6 Current Focus & Strategies
    • 9.3.7 Threat from Competition
    • 9.3.8 SWOT Analysis
  • 9.4 Dow Corning
    • 9.4.1 Company Overview
    • 9.4.2 Company Insights

9..3 Product Benchmarking

    • 9.41.4 Key Developments
    • 9.4.5 Winning Imperatives
    • 9.4.6 Current Focus & Strategies
    • 9.4.7 Threat from Competition
    • 9.4.8 SWOT Analysis
  • 9.5 Parker Chomerics
    • 9.5.1 Company Overview
    • 9.5.2 Company Insights
    • 9.5.3 Product Benchmarking
    • 9.5.4 Key Developments
    • 9.5.5 Winning Imperatives
    • 9.5.6 Current Focus & Strategies
    • 9.5.7 Threat from Competition
    • 9.5.8 SWOT Analysis
  • 9.6 Laird Technologies
    • 9.6.1 Company Overview
    • 9.6.2 Company Insights
    • 9.6.3 Product Benchmarking
    • 9.6.4 Key Developments
    • 9.6.5 Winning Imperatives
    • 9.6.6 Current Focus & Strategies
    • 9.6.7 Threat from Competition
    • 9.6.8 SWOT Analysis
  • 9.7 Honeywell International Inc.
    • 9.7.1 Company Overview
    • 9.7.2 Company Insights
    • 9.7.3 Product Benchmarking
    • 9.7.4 Key Developments
    • 9.7.5 Winning Imperatives
    • 9.7.6 Current Focus & Strategies
    • 9.7.7 Threat from Competition
    • 9.7.8 SWOT Analysis
  • 9.8 3M
    • 9.8.1 Company Overview
    • 9.8.2 Company Insights
    • 9.8.3 Product Benchmarking
    • 9.8.4 Key Developments
    • 9.8.5 Winning Imperatives
    • 9.8.6 Current Focus & Strategies
    • 9.8.7 Threat from Competition
    • 9.8.8 SWOT Analysis
  • 9.9 Zalman Tech Co., Ltd.
    • 9.9.1 Company Overview
    • 9.9.2 Company Insights
    • 9.9.3 Product Benchmarking
    • 9.9.4 Key Developments
    • 9.9.5 Winning Imperatives
    • 9.9.6 Current Focus & Strategies
    • 9.9.7 Threat from Competition
    • 9.9.8 SWOT Analysis
  • 9.10 Momentive Performance Materials Inc.
    • 9.10.1 Company Overview
    • 9.10.2 Company Insights
    • 9.10.3 Product Benchmarking
    • 9.10.4 Key Developments
    • 9.10.5 Winning Imperatives
    • 9.10.6 Current Focus & Strategies
    • 9.10.7 Threat from Competition
    • 9.10.8 SWOT Analysis

10 VERIFIED MARKET INTELLIGENCE

  • 10.1 About Verified Market Intelligence
  • 10.2 Dynamic Data Visualization