表紙：サーマルインターフェイスマテリアル（TIM）の世界市場（2025年～2035年）

市場調査レポート

商品コード

1657667

サーマルインターフェイスマテリアル（TIM）の世界市場（2025年～2035年）

The Global Thermal Interface Materials (TIMs) Market 2025-2035

出版日: 2025年02月18日
発行: Future Markets, Inc.
ページ情報: 英文 272 Pages, 75 Tables, 84 Figures
納期: 即納可能

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概要
図表
目次

概要

サンプル依頼リストに入れる

電子機器やシステムの小型化、高速化、高出力化に伴い、効果的なサーマルインターフェイスマテリアルは、産業全体でますます重要になってきています。電気自動車のパワーエレクトロニクスや再生可能エネルギーのインバーターから先進の半導体やデータセンターのサーバーに至るまで、サーマルインターフェースを効率的に管理することは、最適なパフォーマンス、デバイスの信頼性、システムの長寿命化に不可欠です。企業は、熱伝導性、費用対効果、環境の持続可能性のバランスを取りながら、増大する熱抵抗の課題に対処する最先端のサーマルインターフェースソリューションを採用する必要に迫られています。これに対し、材料科学者やメーカーは、新しい相変化処方、カーボンナノチューブやグラフェンを組み込んだ次世代複合材料、熱伝導性セラミックス、液体金属インターフェースなど、先進の熱界面材料の開発に取り組んでいます。これらの技術革新は、適合性、信頼性、適用のしやすさといった重要な特性を維持しながら、熱伝導性の限界を押し広げることを目的としています。焦点は、より高い熱流束に対応し、熱抵抗を低減し、長期の動作サイクルにわたって性能を維持できるTIMの開発です。

パワーエレクトロニクスにおけるワイドバンドギャップ半導体への移行、コンピューティング用途におけるプロセッサーの高密度化、電気自動車の採用の拡大など、複数の重要な動向により、強化されたサーマルインターフェイスマテリアルへの需要が高まっています。これらの用途では、厳しい環境条件下で安定した性能を発揮しながら、より高い動作温度を管理できるTIMが必要とされています。デバイスが進化し続ける中、サーマルインターフェイスマテリアルは、次世代電子とパワーシステムを実現する上で、ますます重要な役割を果たしています。

サーマルインターフェイスマテリアル（TIM）市場は、電子、自動車、医療機器、工業用途などのさまざまな部門での需要の高まりによって力強い成長を示しています。従来の材料が引き続き市場を独占しており、サーマルグリースとギャップフィラーが現在の用途の約45～50%を占めています。しかし、相変化コンパウンド、グラフェン強化製品、新複合材料を含む先進の材料は、特に高性能用途で大きな市場シェアを獲得しつつあります。液体金属セグメントは、規模は小さい一方、熱性能が重要な高級用途で急成長を示しています。

当レポートでは、世界のサーマルインターフェイスマテリアル（TIM）市場について調査分析し、2025年～2035年の市場動向、技術開発、成長機会に関する詳細な考察を提供しています。

熱管理 - アクティブとパッシブ
サーマルインターフェイスマテリアル（TIM）とは
TIMの比較特性
サーマルパッドとグリースの違い
TIMの利点と欠点：タイプ別
パフォーマンス
価格
TIMにおける新技術
TIMのサプライチェーン
原材料の分析と価格設定
環境規制と持続可能性

第2章材料

先進の多機能なTIM
TIMフィラー
熱伝導グリース、ペースト
サーマルギャップパッド
サーマルギャップフィラー
ポッティングコンパウンド/封止材
粘着テープ
相変化材料
金属ベースTIM
炭素ベースTIM
メタマテリアル
自己修復型サーマルインターフェイスマテリアル
TIMディスペンシング

第3章サーマルインターフェイスマテリアル（TIM）の市場

コンシューマーエレクトロニクス
電気自動車（EV）
データセンター
ADASセンサー
EMIシールド
5G
航空宇宙・防衛
工業用電子機器
再生可能エネルギー
医療用電子機器

第4章企業プロファイル（企業11社のプロファイル）

第5章調査手法

第6章参考文献

図表

List of Tables

Table 1. Thermal conductivities (K) of common metallic, carbon, and ceramic fillers employed in TIMs
Table 2. Commercial TIMs and their properties
Table 3. Advantages and disadvantages of TIMs, by type
Table 4. Key Factors in System Level Performance for TIMs
Table 5. Thermal interface materials prices
Table 6. Comparisons of Price and Thermal Conductivity for TIMs
Table 7. Price Comparison of TIM Fillers
Table 8. Raw Material Analysis and Pricing
Table 9. Characteristics of some typical TIMs
Table 10. Trends on TIM Fillers
Table 11. Pros and Cons of TIM Fillers
Table 12. Commercial thermal paste products
Table 13.Commercial thermal gap pads (thermal interface materials)
Table 14. Commercial thermal gap fillers products
Table 15. Types of Potting Compounds/Encapsulants
Table 16. TIM adhesives tapes
Table 17. Commercial phase change materials (PCM) thermal interface materials (TIMs) products
Table 18. Properties of PCMs
Table 19. PCM Types and properties
Table 20. Advantages and disadvantages of organic PCMs
Table 21. Advantages and disadvantages of organic PCM Fatty Acids
Table 22. Advantages and disadvantages of salt hydrates
Table 23. Advantages and disadvantages of low melting point metals
Table 24. Advantages and disadvantages of eutectics
Table 25. Benefits and drawbacks of PCMs in TIMs
Table 26. Comparison of Carbon-based TIMs
Table 27. Properties of CNTs and comparable materials
Table 28. Typical properties of SWCNT and MWCNT
Table 29. Comparison of carbon-based additives in terms of the main parameters influencing their value proposition as a conductive additive
Table 30. Thermal conductivity of CNT-based polymer composites
Table 31. Comparative properties of BNNTs and CNTs
Table 32. Properties of graphene, properties of competing materials, applications thereof
Table 33. Properties of nanodiamonds
Table 34. Comparison between Natural and Synthetic Graphite
Table 35. Classification of natural graphite with its characteristics
Table 36. Characteristics of synthetic graphite
Table 37. Thermal Conductivity Comparison of Graphite TIMs
Table 38. Properties of hexagonal boron nitride (h-BN)
Table 39. Comparison of self-healing systems
Table 40. Types of self-healing coatings and materials
Table 41. Comparative properties of self-healing materials
Table 42. Challenges for Dispensing TIM
Table 43. Thermal Management Application Areas in Consumer Electronics
Table 44. Trends in Smartphone Thermal Materials
Table 45. Thermal Management approaches in commercial Smartphones
Table 46. Global market in consumer electronics 2022-2035, by TIM type (millions USD)
Table 47. Global market in electric vehicles 2022-2035, by TIM type (millions USD)
Table 48. TIM Trends in Data Centers
Table 49. TIM Area Forecast in Server Boards: 2022-2035 (m2)
Table 50. Global market in data centers 2022-2035, by TIM type (millions USD)
Table 51. TIM Players in ADAS
Table 52. Die Attach for ADAS Sensors
Table 53. Die Attach Area Forecast for Key Components Within ADAS Sensors: 2022-2035 (m2)
Table 54. Global market in ADAS sensors 2022-2035, by TIM type (millions USD)
Table 55. TIM Area Forecast for 5G Antennas by Station Size: 2022-2035 (m2)
Table 56. TIM Area Forecast for 5G Antennas by Station Frequency: 2022-2035 (m2)
Table 57. TIMS in BBU
Table 58. 5G BBY models
Table 59. TIM Area Forecast for 5G BBU: 2022-2035 (m2)
Table 60. Power Consumption Forecast for 5G: 2022-2035 (GW)
Table 61. TIM Area Forecast for Power Supplies: 2022-2035 (m2)
Table 62. TIM market players in 5G
Table 63. Global market in 5G 2022-2035, by TIM type (millions USD)
Table 64. Market Drivers for TIMS in aerospace and defense
Table 65. Applications for TIMS in aerospace and defense
Table 66. Global Market for TIMs in aerospace and defense 2022-2035, by TIM Type (Millions USD)
Table 67. Market Drivers for TIMs in industrial electronics
Table 68. Applications for TIMs in industrial electronics
Table 69. Global Market 2022-2035, by TIM Type in Industrial Electronics (Millions USD)
Table 70. Market Drivers for TIMs in renewable energy
Table 71. Applications for TIMs in renewable energy
Table 72. Global Market for TIMs in Renewable Energy 2022-2035 (Millions USD)
Table 73. Market Drivers for TIMs in medical electronics
Table 74. Applications for TIMs in medical electronics
Table 75. Global Market 2022-2035 for TIMs in Medical Electronics (Millions USD)

List of Figures

Figure 1. (L-R) Surface of a commercial heatsink surface at progressively higher magnifications, showing tool marks that create a rough surface and a need for a thermal interface material
Figure 2. Schematic of thermal interface materials used in a flip chip package
Figure 3. Thermal grease
Figure 4. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module
Figure 5. Supply Chain for TIMs
Figure 6. Commercial thermal paste products
Figure 7. Application of thermal silicone grease
Figure 8. A range of thermal grease products
Figure 9. SWOT analysis for thermal greases and pastes
Figure 10. Thermal Pad
Figure 11. SWOT analysis for thermal gap pads
Figure 12. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module
Figure 13. SWOT analysis for thermal gap fillers
Figure 14. SWOT analysis for Potting compounds/encapsulants
Figure 15. Thermal adhesive products
Figure 16. SWOT analysis for TIM adhesives tapes
Figure 17. Phase-change TIM products
Figure 18. PCM mode of operation
Figure 19. Classification of PCMs
Figure 20. Phase-change materials in their original states
Figure 21. Thermal energy storage materials
Figure 22. Phase Change Material transient behaviour
Figure 23. PCM TIMs
Figure 24. Phase Change Material - die cut pads ready for assembly
Figure 25. SWOT analysis for phase change materials
Figure 26. Typical IC package construction identifying TIM1 and TIM2
Figure 27. Liquid metal TIM product
Figure 28. Pre-mixed SLH
Figure 29. HLM paste and Liquid Metal Before and After Thermal Cycling
Figure 30. SLH with Solid Solder Preform
Figure 31. Automated process for SLH with solid solder preforms and liquid metal
Figure 32. SWOT analysis for metal-based TIMs
Figure 33. Schematic diagram of a multi-walled carbon nanotube (MWCNT)
Figure 34. Schematic of single-walled carbon nanotube
Figure 35. Types of single-walled carbon nanotubes
Figure 36. Schematic of a vertically aligned carbon nanotube (VACNT) membrane used for water treatment
Figure 37. Schematic of Boron Nitride nanotubes (BNNTs). Alternating B and N atoms are shown in blue and red
Figure 38. Graphene layer structure schematic
Figure 39. Illustrative procedure of the Scotch-tape based micromechanical cleavage of HOPG
Figure 40. Graphene and its descendants: top right: graphene; top left: graphite = stacked graphene; bottom right: nanotube=rolled graphene; bottom left: fullerene=wrapped graphene
Figure 41. Flake graphite
Figure 42. Applications of flake graphite
Figure 43. Graphite-based TIM products
Figure 44. Structure of hexagonal boron nitride
Figure 45. SWOT analysis for carbon-based TIMs
Figure 46. Classification of metamaterials based on functionalities
Figure 47. Electromagnetic metamaterial
Figure 48. Schematic of Electromagnetic Band Gap (EBG) structure
Figure 49. Schematic of chiral metamaterials
Figure 50. Nonlinear metamaterials- 400-nm thick nonlinear mirror that reflects frequency-doubled output using input light intensity as small as that of a laser pointer
Figure 51. Schematic of self-healing polymers. Capsule based (a), vascular (b), and intrinsic (c) schemes for self-healing materials. Red and blue colours indicate chemical species which react (purple) to heal damage
Figure 52. Stages of self-healing mechanism
Figure 53. Self-healing mechanism in vascular self-healing systems
Figure 54. Schematic of TIM operation in electronic devices
Figure 55. Schematic of Thermal Management Materials in smartphone
Figure 56. Wearable technology inventions
Figure 57. Global market in consumer electronics 2022-2035, by TIM type (millions USD)
Figure 58. Application of thermal interface materials in automobiles
Figure 59. EV battery components including TIMs
Figure 60. Battery pack with a cell-to-pack design and prismatic cells
Figure 61. Cell-to-chassis battery pack
Figure 62. TIMS in EV charging station
Figure 63. Global market in electric vehicles 2022-2035, by TIM type (millions USD)
Figure 64. Image of data center layout
Figure 65. Application of TIMs in line card
Figure 66. Global market in data centers 2022-2035, by TIM type (millions USD)
Figure 67. ADAS radar unit incorporating TIMs
Figure 68. Global market in ADAS sensors 2022-2035, by TIM type (millions USD)
Figure 69. Coolzorb 5G
Figure 70. TIMs in Base Band Unit (BBU)
Figure 71. Global market in 5G 2022-2035, by TIM type (millions USD)
Figure 72. Boron Nitride Nanotubes products
Figure 73. Transtherm-R PCMs
Figure 74. Carbice carbon nanotubes
Figure 75. Internal structure of carbon nanotube adhesive sheet
Figure 76. Carbon nanotube adhesive sheet
Figure 77. HI-FLOW Phase Change Materials
Figure 78. Thermoelectric foil, consists of a sequence of semiconductor elements connected with conductive metal. At the top (in red) is the thermal interface
Figure 79. Parker Chomerics THERM-A-GAP GEL
Figure 80. Metamaterial structure used to control thermal emission
Figure 81. Shinko Carbon Nanotube TIM product
Figure 82. The Sixth Element graphene products
Figure 83. Thermal conductive graphene film
Figure 84. VB Series of TIMS from Zeon

Effective thermal interface materials are becoming increasingly critical across industries as electronic devices and systems grow smaller, faster, and more power-dense. From electric vehicle power electronics and renewable energy inverters to advanced semiconductors and data center servers, managing thermal interfaces efficiently is essential for optimal performance, device reliability, and system longevity. Companies are facing rising pressure to adopt cutting-edge thermal interface solutions that address growing thermal resistance challenges while balancing thermal conductivity, cost-effectiveness, and environmental sustainability. In response, materials scientists and manufacturers are developing advanced thermal interface materials - including novel phase-change formulations, next-generation composite materials incorporating carbon nanotubes and graphene, thermally conductive ceramics, and liquid metal interfaces. These innovations aim to push the boundaries of thermal conductivity while maintaining critical properties like conformability, reliability, and ease of application. The focus is on developing TIMs that can handle higher heat fluxes, reduce thermal resistance, and maintain performance over extended operating cycles.

The demand for enhanced thermal interface materials is being driven by several key trends: the transition to wide bandgap semiconductors in power electronics, increasing processor densities in computing applications, and the growing adoption of electric vehicles. These applications require TIMs capable of managing higher operating temperatures while providing consistent performance under challenging environmental conditions. As devices continue to evolve, thermal interface materials play an increasingly vital role in enabling next-generation electronics and power systems.

The thermal interface materials (TIM) market demonstrates robust growth driven by increasing demands across multiple sectors including electronics, automotive, medical devices, and industrial applications. Traditional materials continue to dominate the market, with thermal greases and gap fillers representing approximately 45-50% of current applications. However, advanced materials including phase change compounds, graphene-enhanced products, and novel composites are gaining significant market share, particularly in high-performance applications. The liquid metal segment, while smaller, shows rapid growth in premium applications where thermal performance is critical.

"The Global Thermal Interface Materials Market 2025-2035" analyzes the global thermal interface materials (TIMs) industry, providing detailed insights into market trends, technological developments, and growth opportunities from 2025 to 2035. The report examines the crucial role of thermal interface materials in managing heat dissipation across various industries, including consumer electronics, electric vehicles, data centers, aerospace & defense, and emerging technology sectors. The study provides in-depth analysis of various TIM types, including thermal greases, gap fillers, phase change materials, metal-based TIMs, and emerging technologies such as graphene-enhanced compounds and carbon nanotubes. A detailed examination of material properties, performance characteristics, and application-specific requirements offers valuable insights for industry stakeholders.

Report contents include:

Key market segments covered include consumer electronics, where increasing device miniaturization drives demand for advanced thermal management solutions; electric vehicles, where battery thermal management and power electronics create new opportunities; and data centers, where growing computing demands necessitate improved cooling solutions.
Emerging applications in 5G infrastructure, ADAS sensors, and medical electronics.
Carbon-based TIMs, metamaterials, and self-healing compounds.
Supply chain analysis
Price analysis of both raw materials and finished products.
Market forecasts for all major segments, with detailed breakdowns by material type, application, and geographic region. The analysis includes market size projections, growth rates, and emerging opportunities across different end-use sectors.
Detailed profiles of 111 companies active in the thermal interface materials market, from established global manufacturers to innovative technology startups. Each profile includes company overview, product portfolio, technological capabilities, and strategic developments. Companies profiled include 3M, ADA Technologies, AI Technology Inc., Aismalibar S.A., Alpha Assembly, AOK Technologies, AOS Thermal Compounds LLC, Arkema, Arieca Inc., ATP Adhesive Systems AG, Aztrong Inc., Bando Chemical Industries Ltd., BestGraphene, BNNano, BNNT LLC, Boyd Corporation, BYK, Cambridge Nanotherm, Carbice Corp., Carbon Waters, Carbodeon Ltd. Oy, CondAlign AS, Denka Company Limited, Detakta Isolier- und Messtechnik GmbH & Co. KG, Dexerials Corporation, Deyang Carbonene Technology, Dow Corning, Dupont (Laird Performance Materials), Dymax Corporation, Dynex Semiconductor (CRRC), ELANTAS Europe GmbH, Elkem Silcones, Enerdyne Thermal Solutions Inc., Epoxies Etc., First Graphene Ltd, Fujipoly, Fujitsu Laboratories, GCS Thermal, GLPOLY, Global Graphene Group, Goodfellow Corporation, Graphmatech AB, GuangDong KingBali New Material Co. Ltd., HALA Contec GmbH & Co. KG, Hamamatsu Carbonics Corporation, H.B. Fuller Company, Henkel AG & Co. KGAA, Hitek Electronic Materials, Honeywell, Hongfucheng New Materials, Huber Martinswerk, HyMet Thermal Interfaces SIA, Indium Corporation, Inkron, KB Element, Kerafol Keramische Folien GmbH & Co. KG, Kitagawa, KULR Technology Group Inc., Kyocera, Leader Tech Inc., LiSAT, LiquidCool Solutions, Liquid Wire Inc., MacDermid Alpha, MG Chemicals Ltd, Minoru Co. Ltd., Mithras Technology AG, Molecular Rebar Design LLC, Momentive Performance Materials, Morion NanoTech, Nanoramic Laboratories, Nano Tim, NeoGraf Solutions LLC, Nitronix, Nolato Silikonteknik, NovoLinc and more.
Technical specifications and performance metrics for various TIM types, enabling comparison of different solutions for specific applications.

1. INTRODUCTION

1.1. Thermal management-active and passive
1.2. What are thermal interface materials (TIMs)?
- 1.2.1. Types
- 1.2.2. Thermal conductivity
1.3. Comparative properties of TIMs
1.4. Differences between thermal pads and grease
1.5. Advantages and disadvantages of TIMs, by type
1.6. Performance
1.7. Prices
1.8. Emerging Technologies in TIMs
1.9. Supply Chain for TIMs
1.10. Raw Material Analysis and Pricing
1.11. Environmental Regulations and Sustainability

2. MATERIALS

2.1. Advanced and Multi-Functional TIMs
2.2. TIM fillers
- 2.2.1. Trends
- 2.2.2. Pros and Cons
- 2.2.3. Thermal Conductivity
- 2.2.4. Spherical Alumina
- 2.2.5. Alumina Fillers
- 2.2.6. Boron nitride (BN)
- 2.2.7. Filler and polymer TIMs
- 2.2.8. Filler Sizes
2.3. Thermal greases and pastes
- 2.3.1. Overview and properties
- 2.3.2. SWOT analysis
2.4. Thermal gap pads
- 2.4.1. Overview and properties
- 2.4.2. SWOT analysis
2.5. Thermal gap fillers
- 2.5.1. Overview and properties
- 2.5.2. SWOT analysis
2.6. Potting compounds/encapsulants
- 2.6.1. Overview and properties
- 2.6.2. SWOT analysis
2.7. Adhesive Tapes
- 2.7.1. Overview and properties
- 2.7.2. SWOT analysis
2.8. Phase Change Materials
- 2.8.1. Overview and properties
- 2.8.2. Types
  - 2.8.2.1. Organic/biobased phase change materials
    - 2.8.2.1.1. Advantages and disadvantages
    - 2.8.2.1.2. Paraffin wax
    - 2.8.2.1.3. Non-Paraffins/Bio-based
  - 2.8.2.2. Inorganic phase change materials
    - 2.8.2.2.1. Salt hydrates
      - 2.8.2.2.1.1. Advantages and disadvantages
    - 2.8.2.2.2. Metal and metal alloy PCMs (High-temperature)
  - 2.8.2.3. Eutectic mixtures
  - 2.8.2.4. Encapsulation of PCMs
    - 2.8.2.4.1. Macroencapsulation
    - 2.8.2.4.2. Micro/nanoencapsulation
  - 2.8.2.5. Nanomaterial phase change materials
- 2.8.3. Thermal energy storage (TES)
  - 2.8.3.1. Sensible heat storage
  - 2.8.3.2. Latent heat storage
- 2.8.4. Application in TIMs
  - 2.8.4.1. Thermal pads
  - 2.8.4.2. Low Melting Alloys (LMAs)
- 2.8.5. SWOT analysis
2.9. Metal-based TIMs
- 2.9.1. Overview
- 2.9.2. Solders and low melting temperature alloy TIMs
  - 2.9.2.1. Solder TIM1
  - 2.9.2.2. Sintering
- 2.9.3. Liquid metals
- 2.9.4. Solid liquid hybrid (SLH) metals
  - 2.9.4.1. Hybrid liquid metal pastes
  - 2.9.4.2. SLH created during chip assembly (m2TIMs)
  - 2.9.4.3. Die-attach materials
    - 2.9.4.3.1. Solder Alloys and Conductive Adhesives
    - 2.9.4.3.2. Silver-Sintered Paste
    - 2.9.4.3.3. Copper (Cu) sintered TIMs
      - 2.9.4.3.3.1. TIM1 - Sintered Copper
      - 2.9.4.3.3.2. Cu Sinter Materials
    - 2.9.4.3.4. Sintered Copper Die-Bonding Paste
    - 2.9.4.3.5. Graphene Enhanced Sintered Copper TIMs
- 2.9.5. SWOT analysis
2.10. Carbon-based TIMs
- 2.10.1. Carbon nanotube (CNT) TIM Fabrication
- 2.10.2. Multi-walled nanotubes (MWCNT)
  - 2.10.2.1. Properties
  - 2.10.2.2. Application as thermal interface materials
- 2.10.3. Single-walled carbon nanotubes (SWCNTs)
  - 2.10.3.1. Properties
  - 2.10.3.2. Application as thermal interface materials
- 2.10.4. Vertically aligned CNTs (VACNTs)
  - 2.10.4.1. Properties
  - 2.10.4.2. Applications
  - 2.10.4.3. Application as thermal interface materials
- 2.10.5. BN nanotubes (BNNT) and nanosheets (BNNS)
  - 2.10.5.1. Properties
  - 2.10.5.2. Application as thermal interface materials
- 2.10.6. Graphene
  - 2.10.6.1. Properties
  - 2.10.6.2. Application as thermal interface materials
    - 2.10.6.2.1. Graphene fillers
    - 2.10.6.2.2. Graphene foam
    - 2.10.6.2.3. Graphene aerogel
    - 2.10.6.2.4. Graphene Heat Spreaders
    - 2.10.6.2.5. Graphene in Thermal Interface Pads
- 2.10.7. Nanodiamonds
  - 2.10.7.1. Properties
  - 2.10.7.2. Application as thermal interface materials
- 2.10.8. Graphite
  - 2.10.8.1. Properties
  - 2.10.8.2. Natural graphite
    - 2.10.8.2.1. Classification
    - 2.10.8.2.2. Processing
    - 2.10.8.2.3. Flake
      - 2.10.8.2.3.1. Grades
      - 2.10.8.2.3.2. Applications
  - 2.10.8.3. Synthetic graphite
    - 2.10.8.3.1. Classification
      - 2.10.8.3.1.1. Primary synthetic graphite
      - 2.10.8.3.1.2. Secondary synthetic graphite
      - 2.10.8.3.1.3. Processing
  - 2.10.8.4. Applications as thermal interface materials
    - 2.10.8.4.1. Graphite Sheets
    - 2.10.8.4.2. Vertical graphite
    - 2.10.8.4.3. Graphite pastes
- 2.10.9. Hexagonal Boron Nitride
  - 2.10.9.1. Properties
  - 2.10.9.2. Application as thermal interface materials
- 2.10.10. SWOT analysis
2.11. Metamaterials
- 2.11.1. Types and properties
  - 2.11.1.1. Electromagnetic metamaterials
    - 2.11.1.1.1. Double negative (DNG) metamaterials
    - 2.11.1.1.2. Single negative metamaterials
    - 2.11.1.1.3. Electromagnetic bandgap metamaterials (EBG)
    - 2.11.1.1.4. Bi-isotropic and bianisotropic metamaterials
    - 2.11.1.1.5. Chiral metamaterials
    - 2.11.1.1.6. Electromagnetic "Invisibility" cloak
  - 2.11.1.2. Terahertz metamaterials
  - 2.11.1.3. Photonic metamaterials
  - 2.11.1.4. Tunable metamaterials
  - 2.11.1.5. Frequency selective surface (FSS) based metamaterials
  - 2.11.1.6. Nonlinear metamaterials
  - 2.11.1.7. Acoustic metamaterials
- 2.11.2. Application as thermal interface materials
2.12. Self-healing thermal interface materials
- 2.12.1. Extrinsic self-healing
- 2.12.2. Capsule-based
- 2.12.3. Vascular self-healing
- 2.12.4. Intrinsic self-healing
- 2.12.5. Healing volume
- 2.12.6. Types of self-healing materials, polymers and coatings
- 2.12.7. Applications in thermal interface materials
2.13. TIM Dispensing
- 2.13.1. Low-volume Dispensing Methods
- 2.13.2. High-volume Dispensing Methods
- 2.13.3. Meter, Mix, Dispense (MMD) Systems
- 2.13.4. TIM Dispensing Equipment Suppliers

3. MARKETS FOR THERMAL INTERFACE MATERIALS (TIMs)

3.1. Consumer electronics
- 3.1.1. Market overview
  - 3.1.1.1. Market drivers
  - 3.1.1.2. Applications
    - 3.1.1.2.1. Smartphones and tablets
    - 3.1.1.2.2. Wearable electronics
- 3.1.2. Global market 2022-2035, by TIM type
3.2. Electric Vehicles (EV)
- 3.2.1. Market overview
  - 3.2.1.1. Market drivers
  - 3.2.1.2. Applications
    - 3.2.1.2.1. Lithium-ion batteries
      - 3.2.1.2.1.1. Cell-to-pack designs
      - 3.2.1.2.1.2. Cell-to-chassis/body
    - 3.2.1.2.2. Power electronics
      - 3.2.1.2.2.1. Types
      - 3.2.1.2.2.2. Properties for EV power electronics
      - 3.2.1.2.2.3. TIM2 in SiC MOSFET
    - 3.2.1.2.3. Charging stations
- 3.2.2. Global market 2022-2035, by TIM type
3.3. Data Centers
- 3.3.1. Market overview
  - 3.3.1.1. Market drivers
  - 3.3.1.2. Applications
    - 3.3.1.2.1. Router, switches and line cards
      - 3.3.1.2.1.1. Transceivers
      - 3.3.1.2.1.2. Server Boards
      - 3.3.1.2.1.3. Switches and Routers
    - 3.3.1.2.2. Servers
    - 3.3.1.2.3. Power supply converters
- 3.3.2. Global market 2022-2035, by TIM type
3.4. ADAS Sensors
- 3.4.1. Market overview
  - 3.4.1.1. Market drivers
  - 3.4.1.2. Applications
    - 3.4.1.2.1. ADAS Cameras
      - 3.4.1.2.1.1. Commercial examples
    - 3.4.1.2.2. ADAS Radar
      - 3.4.1.2.2.1. Radar technology
      - 3.4.1.2.2.2. Radar boards
      - 3.4.1.2.2.3. Commercial examples
    - 3.4.1.2.3. ADAS LiDAR
      - 3.4.1.2.3.1. Role of TIMs
      - 3.4.1.2.3.2. Commercial examples
    - 3.4.1.2.4. Electronic control units (ECUs) and computers
      - 3.4.1.2.4.1. Commercial examples
    - 3.4.1.2.5. Die attach materials
    - 3.4.1.2.6. Commercial examples
- 3.4.2. Global market 2022-2035, by TIM type
3.5. EMI shielding
- 3.5.1. Market overview
  - 3.5.1.1. Market drivers
  - 3.5.1.2. Applications
    - 3.5.1.2.1. Dielectric Constant
    - 3.5.1.2.2. ADAS
      - 3.5.1.2.2.1. Radar
      - 3.5.1.2.2.2. 5G
    - 3.5.1.2.3. Commercial examples
3.6. 5G
- 3.6.1. Market overview
  - 3.6.1.1. Market drivers
  - 3.6.1.2. Applications
    - 3.6.1.2.1. EMI shielding and EMI gaskets
    - 3.6.1.2.2. Antenna
    - 3.6.1.2.3. Base Band Unit (BBU)
    - 3.6.1.2.4. Liquid TIMs
    - 3.6.1.2.5. Power supplies
      - 3.6.1.2.5.1. Increased power consumption in 5G
- 3.6.2. Market players
- 3.6.3. Global market 2022-2035, by TIM type
3.7. Aerospace & Defense
- 3.7.1. Market overview
  - 3.7.1.1. Market drivers
  - 3.7.1.2. Applications
    - 3.7.1.2.1. Satellite thermal management
    - 3.7.1.2.2. Avionics cooling
    - 3.7.1.2.3. Military electronics
  - 3.7.1.3. Global market 2022-2035, by TIM type
3.8. Industrial Electronics
- 3.8.1. Market overview
  - 3.8.1.1. Market drivers
  - 3.8.1.2. Applications
    - 3.8.1.2.1. Industrial automation
    - 3.8.1.2.2. Power supplies
    - 3.8.1.2.3. Motor drives
    - 3.8.1.2.4. LED lighting
- 3.8.2. Global market 2022-2035, by TIM type
3.9. Renewable Energy
- 3.9.1. Market overview
  - 3.9.1.1. Market drivers
  - 3.9.1.2. Applications
    - 3.9.1.2.1. Solar inverters
    - 3.9.1.2.2. Wind power electronics
    - 3.9.1.2.3. Energy storage systems
- 3.9.2. Global market 2022-2035, by TIM type
3.10. Medical Electronics
- 3.10.1. Market overview
  - 3.10.1.1. Market drivers
  - 3.10.1.2. Applications
    - 3.10.1.2.1. Diagnostic equipment
    - 3.10.1.2.2. Medical imaging systems
    - 3.10.1.2.3. Patient monitoring devices
- 3.10.2. Global market 2022-2035, by TIM type

サーマルインターフェイスマテリアル（TIM）の世界市場（2025年～2035年）

The Global Thermal Interface Materials (TIMs) Market 2025-2035

目次

第1章イントロダクション

第2章材料

第3章サーマルインターフェイスマテリアル（TIM）の市場

第4章企業プロファイル（企業11社のプロファイル）

第5章調査手法

第6章参考文献

List of Tables

List of Figures

Report contents include:

TABLE OF CONTENTS

1. INTRODUCTION

2. MATERIALS

3. MARKETS FOR THERMAL INTERFACE MATERIALS (TIMs)

4. COMPANY PROFILES (11 company profiles)

5. RESEARCH METHODOLOGY

6. REFERENCES

サーマルインターフェイスマテリアル（TIM）の世界市場（2025年～2035年）

The Global Thermal Interface Materials (TIMs) Market 2025-2035

目次

第1章 イントロダクション

第2章 材料

第3章 サーマルインターフェイスマテリアル（TIM）の市場

第4章 企業プロファイル（企業11社のプロファイル）

第5章 調査手法

第6章 参考文献

List of Tables

List of Figures

Report contents include:

TABLE OF CONTENTS

1. INTRODUCTION

2. MATERIALS

3. MARKETS FOR THERMAL INTERFACE MATERIALS (TIMs)

4. COMPANY PROFILES (11 company profiles)

5. RESEARCH METHODOLOGY

6. REFERENCES

第1章イントロダクション

第2章材料

第3章サーマルインターフェイスマテリアル（TIM）の市場

第4章企業プロファイル（企業11社のプロファイル）

第5章調査手法

第6章参考文献