中国のICパッケージ・検査産業の動向と主要企業

中国半導体産業協会 (CSIA) の統計によると、2022年の中国半導体産業の売上高は1兆2,000億人民元 (1,714億米ドル、1米ドル＝7人民元に換算) に達しました。このうち、IC設計産業、IC製造産業、ICパッケージ・検査産業の総売上高に占める割合は、それぞれ43%、32%、25%でした。ICパッケージ・検査産業は、中国で開発された初期の半導体サブ産業の1つです。2016年以前、中国のICパッケージ・検査産業は一貫して半導体産業の主導的地位を占めていました。しかし、IC設計産業とウエハーファウンドリー産業の急速な拡大により、中国の半導体産業の売上高に占めるICパッケージ・検査産業の割合は低下しています。

当レポートでは、中国のICパッケージ・検査産業の動向について分析し、市場規模や産業構造の変化、主要企業の動静などの側面に焦点を当てながら調査しております。

目次

第1章 中国のICパッケージ・検査産業の動向

• 中国のICパッケージ・検査業界の市場規模と近年の変化
• 中国のICパッケージ・検査業界の企業の立地状況

第2章 中国国内の主要なICパッケージ・検査企業の動向

• 中国国内のICパッケージ・検査企業：上位10社のランキング
• 中国国内のICパッケージ・検査企業：上位3社の最近の業績
  • JCET
  • Tongfu Microelectronics
  • Huatian Technology

第3章 業界の展望

• 国家集成電路産業投資基金の効果
• 米中対立の影響と中国からのデカップリング
• 先進プロセス技術の障害を受けて、中国は車載用半導体に焦点を移す

付録

• 企業一覧

Companies covered

AMD
Amkor
Ardentec Technology
ASE Group
ASEN Semiconductors
Bosch
Broadcom
China Wafer Level
Chipmore Technology
Chrysler
FlipChip International
Ford
Forehope Electronic
General Motors
Hana Microelectronics
Hua Hong Semiconductor
Huatian Technology
Infineon
Intel
JCET
Kore Semiconductor
KYEC
Lingsen Precision
Micron
Nepes
NXP
Onsemi
Payton Technology
Powertech Technology
Qorvo
Samsung
SFA
Sigurd Microelectronics
Siliconware
SJ Semiconductor
SK Hynix
Skyworks
SMIC
Sony
STATS ChipPAC
STMicro
Texas Instruments
Tongfu Electronics
Unimos Microelectronics
Unisem
Unitech Holdings
UTAC
Walton Advanced Engineering
Wise Road Capital
Xilinx
YTEC

According to statistics from the China Semiconductor Industry Association (CSIA), the sales revenue of China's semiconductor industry in 2022 amounted to 1.2 trillion RMB (US$171.4 billion; US$=7 RMB). Among them, the proportions of IC design industry, IC manufacturing industry, and IC packaging and testing industry in the total sales revenue were 43%, 32%, and 25%, respectively. The IC packaging and testing industry was one of the early semiconductor sub-industries to be developed in China. Before 2016, China's IC packaging and testing industry consistently held a leading position in the semiconductor industry. However, due to the rapid expansion of the IC design and wafer foundry industries, the proportion of the IC packaging and testing industry in China's semiconductor industry revenue has decreased. This report provides an overview of the development of the IC packaging and testing industry in China, focusing on aspects such as market size, changes in industry structure, and the dynamics of major players.

Table of Contents

1.Development of China IC Packaging and Testing Industry

• 1.1 Market Size and Recent Changes in China's IC Packaging and Testing Industry
• 1.2 Regional Distribution of IC Packaging and Testing Industry Players in China

2.Development of major IC Packaging and Testing Players in China

• 2.1 Ranking of the Top-10 Chinese IC Packaging and Testing Companies
• 2.2 Recent Performance of the Top-3 Chinese IC Packaging and Testing Companies
  • 2.2.1 JCET
  • 2.2.2 Tongfu Microelectronics
  • 2.2.3 Huatian Technology

3.Outlook for the Industry

• 3.1 Effects of National Integrated Circuit Industry Investment Fund
• 3.2 Impact of US-China Conflict and Decoupling from China
• 3.3 China Shifting Focus to Automotive Semiconductors Following Obstacles in Advanced Process Technology

Appendix

• List of Companies

List of Tables

• Table 1 Ranking of the Top-10 Chinese IC Packaging and Testing Companies in 2022

List of Figures

• Figure 1 Chinese IC Packaging and Testing Shipment Value, 2018-2022
• Figure 2 Regional Distribution of IC Packaging and Testing Brands in China
• Figure 3 Financial Information of JCET, 2018-2022
• Figure 4 Revenue of JCET by Product Application, 2021-2022
• Figure 5 Financial Information of Tongfu Microelectronics, 2018-2022
• Figure 6 Financial Information of Huatian Technology, 2018-2022