電源管理ICパッケージング市場：タイプ、ソリューション、アプリケーション別-2025-2030年の世界予測

電源管理ICパッケージング市場の2023年の市場規模は494億9,000万米ドルで、2024年には520億6,000万米ドルに達すると予測され、CAGR 5.27%で成長し、2030年には709億2,000万米ドルに達すると予測されています。

パワーマネージメントIC（PMIC）パッケージングは、半導体産業において不可欠なセグメントであり、電子機器内の配電管理を担う集積回路の封止と保護に重点を置いています。PMICパッケージングの必要性は、エネルギー効率の高いデバイスやシステムに対する需要の高まりによって強調されており、コンパクトで信頼性が高く、熱効率の高い電源管理ソリューションが求められています。PMICパッケージングの用途は、民生用電子機器、自動車、産業用制御システム、再生可能エネルギーシステムなど、さまざまな業界に及んでいます。最終用途の範囲には、スマートフォン、タブレット、ノートパソコン、電気自動車、IoT機器などが含まれ、これらすべてが堅牢なPMICパッケージング・ソリューションの大きな需要に貢献しています。

市場成長の主な原動力は、ポータブル・エレクトロニクスの採用拡大、車載用エレクトロニクスの需要増加、IoT技術の継続的な進歩です。さらに、再生可能エネルギー源へのシフトにより、効率的な電源管理システムが必要となり、PMICパッケージング材料と設計の革新が推進されています。ウエハーレベル・パッケージングや3Dスタッキングなどの先進パッケージング技術の開発には機会が多く、ICの性能向上と小型化が期待できます。

とはいえ、同市場は、初期開発コストの高さ、先進パッケージングプロセスの複雑さ、厳しい業界標準への準拠の必要性といった課題に直面しています。新たなビジネスチャンスを生かすには、熱管理と信頼性を向上させる高性能材料と持続可能なパッケージング・ソリューションの調査と技術革新に注力すべきです。さらに、主要な業界プレーヤーとの協力や研究開発への投資は、この分野の進歩を促進することができます。

まとめると、PMICパッケージング市場は、成長促進要因・課題が混在するダイナミックな様相を呈しています。特に、持続可能で技術的に先進的な電子機器に向けた世界の動向に伴い、効率的な電源管理ソリューションに対する需要が高まっていることから、イノベーションと戦略的パートナーシップを重視することが、市場シェア獲得を目指す企業にとって極めて重要です。

市場力学：急速に進化する電源管理ICパッケージング市場の主要市場インサイトを公開

電源管理ICパッケージング市場は、需要と供給のダイナミックな相互作用によって変貌を遂げています。このような市場力学の進化を理解することで、企業は十分な情報に基づいた投資決定、戦略的決定の精緻化、そして新たなビジネスチャンスの獲得に備えることができます。これらの動向を包括的に把握することで、企業は政治的、地理的、技術的、社会的、経済的な領域にわたる様々なリスクを軽減することができるとともに、消費者行動とそれが製造コストや購買動向に与える影響をより明確に理解することができます。

• 市場促進要因
  • スマートデバイスとウェアラブルデバイスの需要増加
  • デバイス・サイズの最小化と様々なコンポーネントの単一デバイスへの統合の動向の高まり
  • 小型、高速、高信頼性デバイスを実現するためのチップ内蔵フレキシブル・パッケージング技術の必要性
• 市場抑制要因
  • PMICのマルチパワードメインSoCの複雑な集積とパッケージング
• 市場機会
  • 進化する2.5DICおよび3.0DIC技術
  • 次世代スマート・デバイスの3Dパッケージング・プロセス設計への投資
• 市場の課題
  • パッケージング規格の限定的な統一

ポーターの5つの力：電源管理ICパッケージング市場をナビゲートする戦略ツール

ポーターの5つの力フレームワークは、市場情勢の競合情勢を把握するための重要なツールです。ポーターのファイブフォース・フレームワークは、企業の競争力を評価し、戦略的機会を探るための明確な手法を提供します。このフレームワークは、企業が市場内の勢力図を評価し、新規事業の収益性を判断するのに役立ちます。これらの洞察により、企業は自社の強みを活かし、弱みに対処し、潜在的な課題を回避することができ、より強靭な市場でのポジショニングを確保することができます。

PESTLE分析：電源管理ICパッケージング市場における外部からの影響の把握

外部マクロ環境要因は、電源管理ICパッケージング市場の業績ダイナミクスを形成する上で極めて重要な役割を果たします。政治的、経済的、社会的、技術的、法的、環境的要因の分析は、これらの影響をナビゲートするために必要な情報を提供します。PESTLE要因を調査することで、企業は潜在的なリスクと機会をよりよく理解することができます。この分析により、企業は規制、消費者の嗜好、経済動向の変化を予測し、先を見越した積極的な意思決定を行う準備ができます。

市場シェア分析電源管理ICパッケージング市場における競合情勢の把握

電源管理ICパッケージング市場の詳細な市場シェア分析により、ベンダーの業績を包括的に評価することができます。企業は、収益、顧客ベース、成長率などの主要指標を比較することで、競争上のポジショニングを明らかにすることができます。この分析により、市場の集中、断片化、統合の動向が明らかになり、ベンダーは競争が激化する中で自社の地位を高める戦略的意思決定を行うために必要な知見を得ることができます。

FPNVポジショニング・マトリックス電源管理ICパッケージング市場におけるベンダーのパフォーマンス評価

FPNVポジショニングマトリックスは、電源管理ICパッケージング市場においてベンダーを評価するための重要なツールです。このマトリックスにより、ビジネス組織はベンダーのビジネス戦略と製品満足度に基づき評価することで、目標に沿った十分な情報に基づいた意思決定を行うことができます。4つの象限によってベンダーを明確かつ正確にセグメント化し、戦略目標に最適なパートナーやソリューションを特定することができます。

戦略分析と推奨電源管理ICパッケージング市場における成功への道筋を描く

電源管理ICパッケージング市場の戦略分析は、世界市場でのプレゼンス強化を目指す企業にとって不可欠です。主要なリソース、能力、業績指標を検討することで、企業は成長機会を特定し、改善に取り組むことができます。このアプローチにより、競合情勢における課題を克服し、新たなビジネスチャンスを活かして長期的な成功を収めるための体制を整えることができます。

本レポートでは、主要な注目分野を網羅した市場の包括的な分析を提供しています：

1.市場の浸透度：現在の市場環境の詳細なレビュー、主要企業による広範なデータ、市場でのリーチと全体的な影響力の評価。

2.市場の開拓度：新興市場における成長機会を特定し、既存分野における拡大可能性を評価し、将来の成長に向けた戦略的ロードマップを提供します。

3.市場の多様化：最近の製品発売、未開拓の地域、業界の主要な進歩、市場を形成する戦略的投資を分析します。

4.競合の評価と情報：競合情勢を徹底的に分析し、市場シェア、事業戦略、製品ポートフォリオ、認証、規制当局の承認、特許動向、主要企業の技術進歩などを検証します。

5.製品開発およびイノベーション：将来の市場成長を促進すると期待される最先端技術、研究開発活動、製品イノベーションをハイライトしています。

また、利害関係者が十分な情報を得た上で意思決定できるよう、重要な質問にも答えています：

1.現在の市場規模と今後の成長予測は？

2.最高の投資機会を提供する製品、セグメント、地域はどこか？

3.市場を形成する主な技術動向と規制の影響とは？

4.主要ベンダーの市場シェアと競合ポジションは？

5.ベンダーの市場参入・撤退戦略の原動力となる収益源と戦略的機会は何か？

目次

第1章 序文

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場の概要

第5章 市場洞察

• 市場力学
  • 促進要因
    • スマートデバイスやウェアラブルデバイスの需要増加
    • デバイスサイズの最小化とさまざまなコンポーネントを1つのデバイスに統合する傾向が高まっている
    • 小型、高速、信頼性の高いデバイスを実現するために、チップを内蔵したフレキシブルパッケージング技術が必要
  • 抑制要因
    • PMICのマルチパワードメインSoCの複雑な統合とパッケージング
  • 機会
    • 進化する2.5DICと3.0DICテクノロジー
    • 次世代スマートデバイスの3Dパッケージングプロセス設計への投資
  • 課題
    • 包装基準の限定的な統一
• 市場セグメンテーション分析
• ポーターのファイブフォース分析
• PESTEL分析
  • 政治的
  • 経済
  • 社交
  • 技術的
  • 法律上
  • 環境

第6章 電源管理ICパッケージング市場：タイプ別

• ＢＧＡ
• HSOP32
• 非公開
• ＨＶＱＦＮ
• クワッド
• WLCS

第7章 電源管理ICパッケージング市場：ソリューション別

• 構成可能なPMIC
• DC-DCソリューション
• リニア電圧レギュレータ
• i.アプリケーションプロセッサ向けPMIC
• ネットワーク向けPMIC
• スイッチングレギュレータ

第8章 電源管理ICパッケージング市場：用途別

• 自動車インフォテインメントおよびテレマティクスデバイス
• デジタルカメラ
• デジタルテレビプロセッサ
• フィットネストラッカーとウェアラブルデバイス
• ポータブル産業・医療機器
• ポータブルメディアプレーヤーとリーダー
• スマートフォン
• タブレットとPC

第9章 南北アメリカの電源管理ICパッケージング市場

• アルゼンチン
• ブラジル
• カナダ
• メキシコ
• 米国

第10章 アジア太平洋地域の電源管理ICパッケージング市場

• オーストラリア
• 中国
• インド
• インドネシア
• 日本
• マレーシア
• フィリピン
• シンガポール
• 韓国
• 台湾
• タイ
• ベトナム

第11章 欧州・中東・アフリカの電源管理ICパッケージング市場

• デンマーク
• エジプト
• フィンランド
• フランス
• ドイツ
• イスラエル
• イタリア
• オランダ
• ナイジェリア
• ノルウェー
• ポーランド
• カタール
• ロシア
• サウジアラビア
• 南アフリカ
• スペイン
• スウェーデン
• スイス
• トルコ
• アラブ首長国連邦
• 英国

第12章 競合情勢

• 市場シェア分析2023
• FPNVポジショニングマトリックス, 2023
• 競合シナリオ分析
• 戦略分析と提言

企業一覧

• 3D Plus, Inc.
• ABLIC Inc.
• Allegro MicroSystems, Inc.
• Analog Devices, Inc.
• Infineon Technologies AG
• Maxim Integrated Products Inc.
• Microchip Technology Inc.
• NXP Semiconductors N.V.
• Renesas Electronics Corporation
• Semiconductor Components Industries, LLC
• Semtech Corporation
• Shenzhen Electronics Group Co. Ltd.
• STMicroelectronics International N.V.
• Texas Instruments Incorporated
• Toshiba Corporation

LIST OF FIGURES

• FIGURE 1. POWER MANAGEMENT IC PACKAGING MARKET RESEARCH PROCESS
• FIGURE 2. POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2023 VS 2030
• FIGURE 3. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
• FIGURE 4. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 5. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 6. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2023 VS 2030 (%)
• FIGURE 7. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 8. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2023 VS 2030 (%)
• FIGURE 9. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 10. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
• FIGURE 11. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 12. AMERICAS POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 13. AMERICAS POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 14. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2030 (%)
• FIGURE 15. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 16. ASIA-PACIFIC POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 17. ASIA-PACIFIC POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 18. EUROPE, MIDDLE EAST & AFRICA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 19. EUROPE, MIDDLE EAST & AFRICA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 20. POWER MANAGEMENT IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
• FIGURE 21. POWER MANAGEMENT IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

• TABLE 1. POWER MANAGEMENT IC PACKAGING MARKET SEGMENTATION & COVERAGE
• TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
• TABLE 3. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
• TABLE 4. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 5. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 6. POWER MANAGEMENT IC PACKAGING MARKET DYNAMICS
• TABLE 7. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 8. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY BGA, BY REGION, 2018-2030 (USD MILLION)
• TABLE 9. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HSOP32, BY REGION, 2018-2030 (USD MILLION)
• TABLE 10. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HVNON10, BY REGION, 2018-2030 (USD MILLION)
• TABLE 11. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HVQFN, BY REGION, 2018-2030 (USD MILLION)
• TABLE 12. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY QFN, BY REGION, 2018-2030 (USD MILLION)
• TABLE 13. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY WLCSP, BY REGION, 2018-2030 (USD MILLION)
• TABLE 14. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 15. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY CONFIGURABLE PMICS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 16. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DC-TO-DC SOLUTIONS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 17. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY LINEAR VOLTAGE REGULATORS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 18. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PMICS FOR I.MX APPLICATION PROCESSORS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 19. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PMICS FOR NETWORKING, BY REGION, 2018-2030 (USD MILLION)
• TABLE 20. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SWITCHING REGULATORS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 21. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 22. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY AUTOMOTIVE INFOTAINMENT & TELEMATIC DEVICES, BY REGION, 2018-2030 (USD MILLION)
• TABLE 23. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DIGITAL CAMERAS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 24. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DIGITAL TV PROCESSOR, BY REGION, 2018-2030 (USD MILLION)
• TABLE 25. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY FITNESS TRACKERS & WEARABLE DEVICES, BY REGION, 2018-2030 (USD MILLION)
• TABLE 26. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PORTABLE INDUSTRIAL & MEDICAL DEVICES, BY REGION, 2018-2030 (USD MILLION)
• TABLE 27. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PORTABLE MEDIA PLAYERS & READERS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 28. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SMARTPHONES, BY REGION, 2018-2030 (USD MILLION)
• TABLE 29. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TABLETS & PCS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 30. AMERICAS POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 31. AMERICAS POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 32. AMERICAS POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 33. AMERICAS POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 34. ARGENTINA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 35. ARGENTINA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 36. ARGENTINA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 37. BRAZIL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 38. BRAZIL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 39. BRAZIL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 40. CANADA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 41. CANADA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 42. CANADA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 43. MEXICO POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 44. MEXICO POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 45. MEXICO POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 46. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 47. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 48. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 49. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
• TABLE 50. ASIA-PACIFIC POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 51. ASIA-PACIFIC POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 52. ASIA-PACIFIC POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 53. ASIA-PACIFIC POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 54. AUSTRALIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 55. AUSTRALIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 56. AUSTRALIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 57. CHINA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 58. CHINA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 59. CHINA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 60. INDIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 61. INDIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 62. INDIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 63. INDONESIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 64. INDONESIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 65. INDONESIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 66. JAPAN POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 67. JAPAN POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 68. JAPAN POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 69. MALAYSIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 70. MALAYSIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 71. MALAYSIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 72. PHILIPPINES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 73. PHILIPPINES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 74. PHILIPPINES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 75. SINGAPORE POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 76. SINGAPORE POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 77. SINGAPORE POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 78. SOUTH KOREA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 79. SOUTH KOREA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 80. SOUTH KOREA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 81. TAIWAN POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 82. TAIWAN POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 83. TAIWAN POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 84. THAILAND POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 85. THAILAND POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 86. THAILAND POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 87. VIETNAM POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 88. VIETNAM POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 89. VIETNAM POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 90. EUROPE, MIDDLE EAST & AFRICA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 91. EUROPE, MIDDLE EAST & AFRICA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 92. EUROPE, MIDDLE EAST & AFRICA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 93. EUROPE, MIDDLE EAST & AFRICA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 94. DENMARK POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 95. DENMARK POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 96. DENMARK POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 97. EGYPT POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 98. EGYPT POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 99. EGYPT POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 100. FINLAND POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 101. FINLAND POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 102. FINLAND POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 103. FRANCE POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 104. FRANCE POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 105. FRANCE POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 106. GERMANY POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 107. GERMANY POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 108. GERMANY POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 109. ISRAEL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 110. ISRAEL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 111. ISRAEL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 112. ITALY POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 113. ITALY POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 114. ITALY POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 115. NETHERLANDS POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 116. NETHERLANDS POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 117. NETHERLANDS POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 118. NIGERIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 119. NIGERIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 120. NIGERIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 121. NORWAY POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 122. NORWAY POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 123. NORWAY POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 124. POLAND POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 125. POLAND POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 126. POLAND POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 127. QATAR POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 128. QATAR POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 129. QATAR POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 130. RUSSIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 131. RUSSIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 132. RUSSIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 133. SAUDI ARABIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 134. SAUDI ARABIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 135. SAUDI ARABIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 136. SOUTH AFRICA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 137. SOUTH AFRICA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 138. SOUTH AFRICA POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 139. SPAIN POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 140. SPAIN POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 141. SPAIN POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 142. SWEDEN POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 143. SWEDEN POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 144. SWEDEN POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 145. SWITZERLAND POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 146. SWITZERLAND POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 147. SWITZERLAND POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 148. TURKEY POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 149. TURKEY POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 150. TURKEY POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 151. UNITED ARAB EMIRATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 152. UNITED ARAB EMIRATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 153. UNITED ARAB EMIRATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 154. UNITED KINGDOM POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 155. UNITED KINGDOM POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2030 (USD MILLION)
• TABLE 156. UNITED KINGDOM POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 157. POWER MANAGEMENT IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
• TABLE 158. POWER MANAGEMENT IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023

The Power Management IC Packaging Market was valued at USD 49.49 billion in 2023, expected to reach USD 52.06 billion in 2024, and is projected to grow at a CAGR of 5.27%, to USD 70.92 billion by 2030.

Power Management IC (PMIC) packaging is an integral segment within the semiconductor industry, focusing on the encapsulation and protection of integrated circuits responsible for managing power distribution within electronic devices. The necessity for PMIC packaging is underscored by the increasing demand for energy-efficient devices and systems, which in turn require compact, reliable, and thermally efficient power management solutions. Applications of PMIC packaging span across various industries, including consumer electronics, automotive, industrial control systems, and renewable energy systems. The end-use scope includes smartphones, tablets, laptops, electric vehicles, and IoT devices, all of which contribute to the substantial demand for robust PMIC packaging solutions.

Market growth is primarily driven by the escalating adoption of portable electronics, rise in demand for automotive electronics, and ongoing advancements in IoT technology. Additionally, the shift towards renewable energy sources necessitates efficient power management systems, propelling innovations in PMIC packaging materials and designs. Opportunities abound in the development of advanced packaging technologies such as wafer-level packaging and 3D stacking, which promise enhanced performance and miniaturization of ICs.

That said, the market faces challenges such as high initial development costs, complexities involved in advanced packaging processes, and the need to adhere to stringent industry standards. To capitalize on emerging opportunities, businesses should focus on research and innovation in high-performance materials and sustainable packaging solutions that improve thermal management and reliability. Further, collaborations with key industry players and investment in R&D can propel advancements in this sector.

In summary, the PMIC packaging market presents a dynamic landscape with a blend of growth drivers and challenges. Emphasizing innovation and strategic partnerships will be pivotal for businesses aiming to capture market share, especially given the evolving demand for efficient power management solutions in line with global trends toward sustainable and technologically advanced electronic devices.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Power Management IC Packaging Market

The Power Management IC Packaging Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

• Market Drivers
  • Increasing demand of smart and wearable devices
  • Growing trend of minimization of device size and the integration of various components into a single device
  • Need for chip-embedded flexible packaging technology to ensure small size, rapid, and reliable devices
• Market Restraints
  • Complex integration and packaging for multi-power domain SoCs of PMICs
• Market Opportunities
  • Evolving 2.5DIC and 3.0DIC technologies
  • Investment in 3D packaging process design of next-generation smart devices
• Market Challenges
  • Limited unification of packaging standards

Porter's Five Forces: A Strategic Tool for Navigating the Power Management IC Packaging Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Power Management IC Packaging Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Power Management IC Packaging Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Power Management IC Packaging Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Power Management IC Packaging Market

A detailed market share analysis in the Power Management IC Packaging Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Power Management IC Packaging Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Power Management IC Packaging Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Power Management IC Packaging Market

A strategic analysis of the Power Management IC Packaging Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Power Management IC Packaging Market, highlighting leading vendors and their innovative profiles. These include 3D Plus, Inc., ABLIC Inc., Allegro MicroSystems, Inc., Analog Devices, Inc., Infineon Technologies AG, Maxim Integrated Products Inc., Microchip Technology Inc., NXP Semiconductors N.V., Renesas Electronics Corporation, Semiconductor Components Industries, LLC, Semtech Corporation, Shenzhen Electronics Group Co. Ltd., STMicroelectronics International N.V., Texas Instruments Incorporated, and Toshiba Corporation.

Market Segmentation & Coverage

This research report categorizes the Power Management IC Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

• Based on Type, market is studied across BGA, HSOP32, HVNON10, HVQFN, QFN, and WLCSP.
• Based on Solution, market is studied across Configurable PMICs, DC-to-DC Solutions, Linear Voltage Regulators, PMICs for i.MX Application Processors, PMICs for Networking, and Switching Regulators.
• Based on Application, market is studied across Automotive Infotainment & Telematic Devices, Digital Cameras, Digital TV Processor, Fitness Trackers & Wearable Devices, Portable Industrial & Medical Devices, Portable Media Players & Readers, Smartphones, and Tablets & PCs.
• Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Increasing demand of smart and wearable devices
    • 5.1.1.2. Growing trend of minimization of device size and the integration of various components into a single device
    • 5.1.1.3. Need for chip-embedded flexible packaging technology to ensure small size, rapid, and reliable devices
  • 5.1.2. Restraints
    • 5.1.2.1. Complex integration and packaging for multi-power domain SoCs of PMICs
  • 5.1.3. Opportunities
    • 5.1.3.1. Evolving 2.5DIC and 3.0DIC technologies
    • 5.1.3.2. Investment in 3D packaging process design of next-generation smart devices
  • 5.1.4. Challenges
    • 5.1.4.1. Limited unification of packaging standards
• 5.2. Market Segmentation Analysis
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. Power Management IC Packaging Market, by Type

• 6.1. Introduction
• 6.2. BGA
• 6.3. HSOP32
• 6.4. HVNON10
• 6.5. HVQFN
• 6.6. QFN
• 6.7. WLCSP

7. Power Management IC Packaging Market, by Solution

• 7.1. Introduction
• 7.2. Configurable PMICs
• 7.3. DC-to-DC Solutions
• 7.4. Linear Voltage Regulators
• 7.5. PMICs for i.MX Application Processors
• 7.6. PMICs for Networking
• 7.7. Switching Regulators

8. Power Management IC Packaging Market, by Application

• 8.1. Introduction
• 8.2. Automotive Infotainment & Telematic Devices
• 8.3. Digital Cameras
• 8.4. Digital TV Processor
• 8.5. Fitness Trackers & Wearable Devices
• 8.6. Portable Industrial & Medical Devices
• 8.7. Portable Media Players & Readers
• 8.8. Smartphones
• 8.9. Tablets & PCs

9. Americas Power Management IC Packaging Market

• 9.1. Introduction
• 9.2. Argentina
• 9.3. Brazil
• 9.4. Canada
• 9.5. Mexico
• 9.6. United States

10. Asia-Pacific Power Management IC Packaging Market

• 10.1. Introduction
• 10.2. Australia
• 10.3. China
• 10.4. India
• 10.5. Indonesia
• 10.6. Japan
• 10.7. Malaysia
• 10.8. Philippines
• 10.9. Singapore
• 10.10. South Korea
• 10.11. Taiwan
• 10.12. Thailand
• 10.13. Vietnam

11. Europe, Middle East & Africa Power Management IC Packaging Market

• 11.1. Introduction
• 11.2. Denmark
• 11.3. Egypt
• 11.4. Finland
• 11.5. France
• 11.6. Germany
• 11.7. Israel
• 11.8. Italy
• 11.9. Netherlands
• 11.10. Nigeria
• 11.11. Norway
• 11.12. Poland
• 11.13. Qatar
• 11.14. Russia
• 11.15. Saudi Arabia
• 11.16. South Africa
• 11.17. Spain
• 11.18. Sweden
• 11.19. Switzerland
• 11.20. Turkey
• 11.21. United Arab Emirates
• 11.22. United Kingdom

12. Competitive Landscape

• 12.1. Market Share Analysis, 2023
• 12.2. FPNV Positioning Matrix, 2023
• 12.3. Competitive Scenario Analysis
• 12.4. Strategy Analysis & Recommendation

Companies Mentioned

• 1. 3D Plus, Inc.
• 2. ABLIC Inc.
• 3. Allegro MicroSystems, Inc.
• 4. Analog Devices, Inc.
• 5. Infineon Technologies AG
• 6. Maxim Integrated Products Inc.
• 7. Microchip Technology Inc.
• 8. NXP Semiconductors N.V.
• 9. Renesas Electronics Corporation
• 10. Semiconductor Components Industries, LLC
• 11. Semtech Corporation
• 12. Shenzhen Electronics Group Co. Ltd.
• 13. STMicroelectronics International N.V.
• 14. Texas Instruments Incorporated
• 15. Toshiba Corporation