3D ICおよび2.5D ICパッケージング市場：技術、エンドユーザー、用途別-2025-2030年の世界予測

3D ICおよび2.5D ICパッケージング市場の2023年の市場規模は923億6,000万米ドル、2024年には1,181億9,000万米ドルに達すると予測され、CAGR 28.05%で成長し、2030年には5,214億9,000万米ドルに達すると予測されています。

3D ICおよび2.5D ICパッケージング業界は、半導体設計における重要な進化を象徴しており、チップを垂直に積み重ねたり（3D IC）、インターポーザーを使ってチップを横に並べたり（2.5D IC）することで、性能の向上と消費電力の削減を図っています。この市場を牽引しているのは、ムーアの法則による物理的制約を克服し、高性能コンピューティング、人工知能、スマートフォンやウェアラブルなどの高度な家電製品に対する需要の増加に対応する必要性です。アプリケーションはデータセンター、車載エレクトロニクス、ヘルスケア機器、IoTに及び、エンドユーザーには、製品の効率向上とレイテンシ低減を求めるテクノロジー企業、自動車会社、ヘルスケアプロバイダーなどが含まれます。主な市場成長要因としては、AIワークロードの急速な進展、コネクテッドデバイスの普及、コンパクトでエネルギー効率の高い技術へのニーズなどが挙げられます。ビジネスチャンスは、AI駆動分野の拡大、スマートシティインフラの継続的な開発、高度なICパッケージングが重要なVRおよびAR技術の利用の拡大にあります。企業は、適応可能な設計手法に投資し、AIやIoTに特化した業界とのパートナーシップを確立することで、資本を得ることができます。しかし、製造コストの高さ、技術の複雑さ、サプライチェーンの課題などの制約があります。また、こうした先進パッケージの設計と組み立てには、顕著なスキル格差があります。イノベーションは、新興材料を用いた製造コストの削減、設計プロセスの強化のための機械学習の活用、持続可能でリサイクル可能な材料の開発に焦点を当てることができます。チップレットアーキテクチャやヘテロジニアスインテグレーションなどの調査分野は、さらに限界を押し広げる可能性があります。市場は依然としてダイナミックな状態にあり、半導体とエレクトロニクスの主要プレーヤー間の活発な研究開発と競争協力が特徴です。課題はあるもの、こうしたICパッケージング・ソリューションがもたらす技術革新の可能性は大きく、産業界が進化する技術や消費者の要求に応えようとする中で、堅調な軌道が予想されます。

市場力学：急速に進化する3D ICおよび2.5D ICパッケージング市場の主要市場インサイトを公開

3D ICおよび2.5D ICパッケージング市場は、需要と供給のダイナミックな相互作用によって変貌を遂げています。このような市場力学の進化を理解することで、企業は十分な情報に基づいた投資決定、戦略的決定の精緻化、そして新たなビジネスチャンスの獲得に備えることができます。こうした動向を包括的に把握することで、企業は政治的、地理的、技術的、社会的、経済的な領域にわたる様々なリスクを軽減することができるとともに、消費者行動とそれが製造コストや購買動向に与える影響をより明確に理解することができます。

• 市場促進要因
  • 電子製品における高度な設計への需要
  • 電子機器の小型化志向の高まり
  • ゲーム機器やタブレット型スマートフォンの増加
• 市場抑制要因
  • 高集積化による熱問題
• 市場機会
  • ハイエンド・コンピューティング、データセンター、サーバーの需要増加
  • メーカーによる革新的製品の登場と先進パッケージング
• 市場の課題
  • 3D ICと2.5D ICの単位当たりのコスト高

ポーターのファイブフォース：3D ICおよび2.5D ICパッケージング市場をナビゲートする戦略ツール

ポーターのファイブフォースフレームワークは、市場情勢の競合情勢を把握するための重要なツールです。ポーターのファイブフォース・フレームワークは、企業の競争力を評価し、戦略的機会を探るための明確な手法を提供します。このフレームワークは、企業が市場内の勢力図を評価し、新規事業の収益性を判断するのに役立ちます。これらの洞察により、企業は自社の強みを活かし、弱みに対処し、潜在的な課題を回避することで、より強靭な市場でのポジショニングを確保することができます。

PESTLE分析：3D ICおよび2.5D ICパッケージング市場における外部からの影響の把握

外部マクロ環境要因は、3D ICおよび2.5D ICパッケージング市場の業績ダイナミクスを形成する上で極めて重要な役割を果たします。政治的、経済的、社会的、技術的、法的、環境的要因の分析は、これらの影響をナビゲートするために必要な情報を提供します。PESTLE要因を調査することで、企業は潜在的なリスクと機会をよりよく理解することができます。この分析により、企業は規制、消費者の嗜好、経済動向の変化を予測し、先を見越した積極的な意思決定を行う準備ができます。

市場シェア分析3D ICおよび2.5D ICパッケージング市場における競合情勢の把握

3D ICおよび2.5D ICパッケージング市場の詳細な市場シェア分析により、ベンダーの業績を包括的に評価することができます。企業は、収益、顧客ベース、成長率などの主要指標を比較することで、競争上のポジショニングを明らかにすることができます。この分析により、市場の集中、断片化、統合の動向が明らかになり、ベンダーは競争が激化する中で自社の地位を高める戦略的意思決定を行うために必要な知見を得ることができます。

FPNVポジショニング・マトリックス3D ICおよび2.5D ICパッケージング市場におけるベンダーのパフォーマンス評価

FPNVポジショニングマトリックスは、3D ICおよび2.5D ICパッケージング市場においてベンダーを評価するための重要なツールです。このマトリックスにより、ビジネス組織はベンダーのビジネス戦略と製品満足度に基づき評価することで、目標に沿った十分な情報に基づいた意思決定を行うことができます。4つの象限によってベンダーを明確かつ正確にセグメント化し、戦略目標に最適なパートナーやソリューションを特定することができます。

戦略分析と推奨3D ICおよび2.5D ICパッケージング市場における成功への道筋を描く

3D ICおよび2.5D ICパッケージング市場の戦略分析は、世界市場でのプレゼンス強化を目指す企業にとって不可欠です。主要なリソース、能力、業績指標を見直すことで、企業は成長機会を特定し、改善に取り組むことができます。このアプローチにより、競合情勢における課題を克服し、新たなビジネスチャンスを活かして長期的な成功を収めるための体制を整えることができます。

本レポートでは、主要な注目分野を網羅した市場の包括的な分析を提供しています：

1.市場の浸透度：現在の市場環境の詳細なレビュー、主要企業による広範なデータ、市場でのリーチと全体的な影響力の評価。

2.市場の開拓度：新興市場における成長機会を特定し、既存分野における拡大可能性を評価し、将来の成長に向けた戦略的ロードマップを提供します。

3.市場の多様化：最近の製品発売、未開拓の地域、業界の主要な進歩、市場を形成する戦略的投資を分析します。

4.競合の評価と情報：競合情勢を徹底的に分析し、市場シェア、事業戦略、製品ポートフォリオ、認証、規制当局の承認、特許動向、主要企業の技術進歩などを検証します。

5.製品開発およびイノベーション：将来の市場成長を促進すると期待される最先端技術、研究開発活動、製品イノベーションをハイライトしています。

また、利害関係者が十分な情報を得た上で意思決定できるよう、重要な質問にも答えています：

1.現在の市場規模と今後の成長予測は？

2.最高の投資機会を提供する製品、セグメント、地域はどこか？

3.市場を形成する主な技術動向と規制の影響とは？

4.主要ベンダーの市場シェアと競合ポジションは？

5.ベンダーの市場参入・撤退戦略の原動力となる収益源と戦略的機会は何か？

目次

第1章 序文

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場の概要

第5章 市場洞察

• 市場力学
  • 促進要因
    • 電子製品における高度なデザインへの需要
    • 電子機器の小型化への傾向の高まり
    • ゲーム機やタブレット型スマートフォンの拡大
  • 抑制要因
    • 統合レベルが高くなると熱の問題が発生する
  • 機会
    • ハイエンドコンピューティング、データセンター、サーバーの需要増加
    • メーカーによる革新的な製品と先進パッケージングの登場
  • 課題
    • 3D ICと2.5D ICの単位当たりのコストが高い
• 市場セグメンテーション分析
• ポーターのファイブフォース分析
• PESTEL分析
  • 政治的
  • 経済
  • 社交
  • 技術的
  • 法律上
  • 環境

第6章 3D ICおよび2.5D ICパッケージング市場：技術別

• 2.5D
• 3D TSV
• 3Dウエハレベルチップスケールパッケージング

第7章 3D ICおよび2.5D ICパッケージング市場：エンドユーザー別

• 自動車
• 家電
• 産業部門
• 医療機器
• 軍事・航空宇宙
• スマートテクノロジー
• 通信

第8章 3D ICおよび2.5D ICパッケージング市場：用途別

• イメージングとオプトエレクトロニクス
• 導かれた
• 論理
• メモリ
• MEMS/センサー
• フォトニクス
• 無線周波数

第9章 南北アメリカの3D ICおよび2.5D ICパッケージング市場

• アルゼンチン
• ブラジル
• カナダ
• メキシコ
• 米国

第10章 アジア太平洋地域の3D ICおよび2.5D ICパッケージング市場

• オーストラリア
• 中国
• インド
• インドネシア
• 日本
• マレーシア
• フィリピン
• シンガポール
• 韓国
• 台湾
• タイ
• ベトナム

第11章 欧州・中東・アフリカの3D ICおよび2.5D ICパッケージング市場

• デンマーク
• エジプト
• フィンランド
• フランス
• ドイツ
• イスラエル
• イタリア
• オランダ
• ナイジェリア
• ノルウェー
• ポーランド
• カタール
• ロシア
• サウジアラビア
• 南アフリカ
• スペイン
• スウェーデン
• スイス
• トルコ
• アラブ首長国連邦
• 英国

第12章 競合情勢

• 市場シェア分析2023
• FPNVポジショニングマトリックス, 2023
• 競合シナリオ分析
• 戦略分析と提言

企業一覧

• 3M Company
• Amkor Technology, Inc.
• ASE Technology Holding Co, Ltd.
• Broadcom Inc.
• Fujitsu Limited
• Intel Corporation
• International Business Machines Corporation
• Jiangsu Changjiang Electronics Technology Co., Ltd.
• MonolithIC 3D Inc.
• Samsung Electronics Co. Ltd
• STMicroelectronics NV
• Texas Instruments Incorporated
• Tezzaron Semiconductor Corporation
• Toshiba Electronic Devices & Storage Corporation
• United Microelectronics Corporation
• Xilinx Inc.

LIST OF FIGURES

• FIGURE 1. 3D IC & 2.5D IC PACKAGING MARKET RESEARCH PROCESS
• FIGURE 2. 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2023 VS 2030
• FIGURE 3. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
• FIGURE 4. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 5. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 6. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2023 VS 2030 (%)
• FIGURE 7. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 8. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2023 VS 2030 (%)
• FIGURE 9. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 10. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
• FIGURE 11. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 12. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 13. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 14. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2030 (%)
• FIGURE 15. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 16. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 17. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 18. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 19. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 20. 3D IC & 2.5D IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
• FIGURE 21. 3D IC & 2.5D IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

• TABLE 1. 3D IC & 2.5D IC PACKAGING MARKET SEGMENTATION & COVERAGE
• TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
• TABLE 3. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
• TABLE 4. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 5. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 6. 3D IC & 2.5D IC PACKAGING MARKET DYNAMICS
• TABLE 7. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 8. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 2.5D, BY REGION, 2018-2030 (USD MILLION)
• TABLE 9. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 3D TSV, BY REGION, 2018-2030 (USD MILLION)
• TABLE 10. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 3D WAFER-LEVEL CHIP-SCALE PACKAGING, BY REGION, 2018-2030 (USD MILLION)
• TABLE 11. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 12. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 13. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 14. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY INDUSTRIAL SECTOR, BY REGION, 2018-2030 (USD MILLION)
• TABLE 15. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEDICAL DEVICES, BY REGION, 2018-2030 (USD MILLION)
• TABLE 16. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MILITARY & AEROSPACE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 17. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY SMART TECHNOLOGIES, BY REGION, 2018-2030 (USD MILLION)
• TABLE 18. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TELECOMMUNICATION, BY REGION, 2018-2030 (USD MILLION)
• TABLE 19. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 20. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY IMAGING & OPTOELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 21. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY LED, BY REGION, 2018-2030 (USD MILLION)
• TABLE 22. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY LOGIC, BY REGION, 2018-2030 (USD MILLION)
• TABLE 23. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEMORY, BY REGION, 2018-2030 (USD MILLION)
• TABLE 24. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEMS/SENSORS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 25. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY PHOTONICS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 26. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY RF, BY REGION, 2018-2030 (USD MILLION)
• TABLE 27. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 28. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 29. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 30. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 31. ARGENTINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 32. ARGENTINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 33. ARGENTINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 34. BRAZIL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 35. BRAZIL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 36. BRAZIL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 37. CANADA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 38. CANADA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 39. CANADA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 40. MEXICO 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 41. MEXICO 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 42. MEXICO 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 43. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 44. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 45. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 46. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
• TABLE 47. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 48. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 49. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 50. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 51. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 52. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 53. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 54. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 55. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 56. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 57. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 58. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 59. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 60. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 61. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 62. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 63. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 64. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 65. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 66. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 67. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 68. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 69. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 70. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 71. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 72. SINGAPORE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 73. SINGAPORE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 74. SINGAPORE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 75. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 76. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 77. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 78. TAIWAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 79. TAIWAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 80. TAIWAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 81. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 82. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 83. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 84. VIETNAM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 85. VIETNAM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 86. VIETNAM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 87. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 88. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 89. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 90. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 91. DENMARK 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 92. DENMARK 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 93. DENMARK 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 94. EGYPT 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 95. EGYPT 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 96. EGYPT 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 97. FINLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 98. FINLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 99. FINLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 100. FRANCE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 101. FRANCE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 102. FRANCE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 103. GERMANY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 104. GERMANY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 105. GERMANY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 106. ISRAEL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 107. ISRAEL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 108. ISRAEL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 109. ITALY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 110. ITALY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 111. ITALY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 112. NETHERLANDS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 113. NETHERLANDS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 114. NETHERLANDS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 115. NIGERIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 116. NIGERIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 117. NIGERIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 118. NORWAY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 119. NORWAY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 120. NORWAY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 121. POLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 122. POLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 123. POLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 124. QATAR 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 125. QATAR 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 126. QATAR 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 127. RUSSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 128. RUSSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 129. RUSSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 130. SAUDI ARABIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 131. SAUDI ARABIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 132. SAUDI ARABIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 133. SOUTH AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 134. SOUTH AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 135. SOUTH AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 136. SPAIN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 137. SPAIN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 138. SPAIN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 139. SWEDEN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 140. SWEDEN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 141. SWEDEN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 142. SWITZERLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 143. SWITZERLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 144. SWITZERLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 145. TURKEY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 146. TURKEY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 147. TURKEY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 148. UNITED ARAB EMIRATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 149. UNITED ARAB EMIRATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 150. UNITED ARAB EMIRATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 151. UNITED KINGDOM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 152. UNITED KINGDOM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
• TABLE 153. UNITED KINGDOM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 154. 3D IC & 2.5D IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
• TABLE 155. 3D IC & 2.5D IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023

The 3D IC & 2.5D IC Packaging Market was valued at USD 92.36 billion in 2023, expected to reach USD 118.19 billion in 2024, and is projected to grow at a CAGR of 28.05%, to USD 521.49 billion by 2030.

The 3D IC and 2.5D IC packaging industry represents a crucial evolution in semiconductor design, characterized by vertically stacking chips (3D IC) or placing chips side-by-side with an interposer (2.5D IC) to improve performance and reduce power consumption. This market is driven by the necessity to overcome the physical limitations of Moore's Law and cater to the increasing demand for high-performance computing, artificial intelligence, and advanced consumer electronics, such as smartphones and wearables. With applications spanning data centers, automotive electronics, healthcare devices, and IoT, end-users include technology firms, automotive companies, and healthcare providers seeking enhanced efficiency and reduced latency in their products. Key market growth factors include the rapid advancement in AI workloads, the proliferation of connected devices, and the need for compact, energy-efficient technology. Opportunities lie in expanding AI-driven sectors, the ongoing development of smart city infrastructures, and the growing use of VR and AR technologies, where sophisticated IC packaging is critical. Businesses can capitalize by investing in adaptable design methodologies and establishing partnerships with AI and IoT-focused industries. However, limitations include high manufacturing costs, technological complexity, and supply chain challenges. There is also a notable skills gap in designing and assembling these advanced packages. Innovations could focus on reducing manufacturing costs using emerging materials, leveraging machine learning for enhanced design processes, and developing sustainable, recyclable materials. Research areas such as chiplet architecture and heterogeneous integration could further push the envelope. The market remains in a dynamic state, characterized by intense R&D and competitive collaboration between key players in semiconductors and electronics. Despite challenges, the potential for technology revolution driven by these IC packaging solutions is significant, with a robust trajectory likely as industries look to meet evolving technical and consumer demands.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving 3D IC & 2.5D IC Packaging Market

The 3D IC & 2.5D IC Packaging Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

• Market Drivers
  • Demand for advanced design in electronic products
  • Increasing inclination to miniaturization of electronic devices
  • Augment of gaming devices and tablet smartphones
• Market Restraints
  • Greater levels of integration causes thermal issues
• Market Opportunities
  • Rising demand for high-end computing, data centers, and servers
  • Advent of innovative products from manufacturers and advanced packaging
• Market Challenges
  • High cost per unit of 3D IC and 2.5D IC

Porter's Five Forces: A Strategic Tool for Navigating the 3D IC & 2.5D IC Packaging Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the 3D IC & 2.5D IC Packaging Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the 3D IC & 2.5D IC Packaging Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the 3D IC & 2.5D IC Packaging Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the 3D IC & 2.5D IC Packaging Market

A detailed market share analysis in the 3D IC & 2.5D IC Packaging Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the 3D IC & 2.5D IC Packaging Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the 3D IC & 2.5D IC Packaging Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the 3D IC & 2.5D IC Packaging Market

A strategic analysis of the 3D IC & 2.5D IC Packaging Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the 3D IC & 2.5D IC Packaging Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Amkor Technology, Inc., ASE Technology Holding Co, Ltd., Broadcom Inc., Fujitsu Limited, Intel Corporation, International Business Machines Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd., MonolithIC 3D Inc., Samsung Electronics Co. Ltd, STMicroelectronics NV, Texas Instruments Incorporated, Tezzaron Semiconductor Corporation, Toshiba Electronic Devices & Storage Corporation, United Microelectronics Corporation, and Xilinx Inc..

Market Segmentation & Coverage

This research report categorizes the 3D IC & 2.5D IC Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

• Based on Technology, market is studied across 2.5D, 3D TSV, and 3D Wafer-Level Chip-Scale Packaging.
• Based on End User, market is studied across Automotive, Consumer Electronics, Industrial Sector, Medical Devices, Military & Aerospace, Smart Technologies, and Telecommunication.
• Based on Application, market is studied across Imaging & Optoelectronics, LED, Logic, Memory, MEMS/Sensors, Photonics, and RF.
• Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Demand for advanced design in electronic products
    • 5.1.1.2. Increasing inclination to miniaturization of electronic devices
    • 5.1.1.3. Augment of gaming devices and tablet smartphones
  • 5.1.2. Restraints
    • 5.1.2.1. Greater levels of integration causes thermal issues
  • 5.1.3. Opportunities
    • 5.1.3.1. Rising demand for high-end computing, data centers, and servers
    • 5.1.3.2. Advent of innovative products from manufacturers and advanced packaging
  • 5.1.4. Challenges
    • 5.1.4.1. High cost per unit of 3D IC and 2.5D IC
• 5.2. Market Segmentation Analysis
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. 3D IC & 2.5D IC Packaging Market, by Technology

• 6.1. Introduction
• 6.2. 2.5D
• 6.3. 3D TSV
• 6.4. 3D Wafer-Level Chip-Scale Packaging

7. 3D IC & 2.5D IC Packaging Market, by End User

• 7.1. Introduction
• 7.2. Automotive
• 7.3. Consumer Electronics
• 7.4. Industrial Sector
• 7.5. Medical Devices
• 7.6. Military & Aerospace
• 7.7. Smart Technologies
• 7.8. Telecommunication

8. 3D IC & 2.5D IC Packaging Market, by Application

• 8.1. Introduction
• 8.2. Imaging & Optoelectronics
• 8.3. LED
• 8.4. Logic
• 8.5. Memory
• 8.6. MEMS/Sensors
• 8.7. Photonics
• 8.8. RF

9. Americas 3D IC & 2.5D IC Packaging Market

• 9.1. Introduction
• 9.2. Argentina
• 9.3. Brazil
• 9.4. Canada
• 9.5. Mexico
• 9.6. United States

10. Asia-Pacific 3D IC & 2.5D IC Packaging Market

• 10.1. Introduction
• 10.2. Australia
• 10.3. China
• 10.4. India
• 10.5. Indonesia
• 10.6. Japan
• 10.7. Malaysia
• 10.8. Philippines
• 10.9. Singapore
• 10.10. South Korea
• 10.11. Taiwan
• 10.12. Thailand
• 10.13. Vietnam

11. Europe, Middle East & Africa 3D IC & 2.5D IC Packaging Market

• 11.1. Introduction
• 11.2. Denmark
• 11.3. Egypt
• 11.4. Finland
• 11.5. France
• 11.6. Germany
• 11.7. Israel
• 11.8. Italy
• 11.9. Netherlands
• 11.10. Nigeria
• 11.11. Norway
• 11.12. Poland
• 11.13. Qatar
• 11.14. Russia
• 11.15. Saudi Arabia
• 11.16. South Africa
• 11.17. Spain
• 11.18. Sweden
• 11.19. Switzerland
• 11.20. Turkey
• 11.21. United Arab Emirates
• 11.22. United Kingdom

12. Competitive Landscape

• 12.1. Market Share Analysis, 2023
• 12.2. FPNV Positioning Matrix, 2023
• 12.3. Competitive Scenario Analysis
• 12.4. Strategy Analysis & Recommendation

Companies Mentioned

• 1. 3M Company
• 2. Amkor Technology, Inc.
• 3. ASE Technology Holding Co, Ltd.
• 4. Broadcom Inc.
• 5. Fujitsu Limited
• 6. Intel Corporation
• 7. International Business Machines Corporation
• 8. Jiangsu Changjiang Electronics Technology Co., Ltd.
• 9. MonolithIC 3D Inc.
• 10. Samsung Electronics Co. Ltd
• 11. STMicroelectronics NV
• 12. Texas Instruments Incorporated
• 13. Tezzaron Semiconductor Corporation
• 14. Toshiba Electronic Devices & Storage Corporation
• 15. United Microelectronics Corporation
• 16. Xilinx Inc.