市場調査レポート

商品コード

1623689

ICパッケージングの市場規模、シェア、成長分析、タイプ別、技術別、素材別、エンドユーザー別、地域別 - 産業予測、2025～2032年

IC Packaging Market Size, Share, Growth Analysis, By Type (Surface Mount Technology Packaging, Through-Hole Packaging), By Technology (Traditional Packaging, Dual In-Line Package ), By Material, By End User, By Region - Industry Forecast 2025-2032

出版日: 2024年12月28日
発行: SkyQuest
ページ情報: 英文 221 Pages
納期: 3～5営業日

価格

PDF & Excel (Single User License)

USD 5,300 779,047円

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PDF & Excel (Multiple User License)

USD 6,200 911,338円

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PDF & Excel (Enterprise License)

USD 7,100 1,043,629円

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価格表記: USDを日本円(税抜)に換算

本日の銀行送金レート: 1USD=146.99円

全表示
概要
目次

概要

サンプル依頼リストに入れる

ICパッケージングの世界市場規模は、2023年に409億米ドルと評価され、2024年には443億米ドルから2032年には838億3,000万米ドルに成長し、予測期間（2025年～2032年）のCAGRは8.3％で成長する見通しです。eの2023年の市場規模は409億4,000万米ドルで、予測期間（2025-2032年）のCAGRは8.37%で、2024年の443億7,000万米ドルから2032年には844億1,000万米ドルに成長する見込みです。

ICパッケージング市場は、エレクトロニクス技術、特にAIとクラウドコンピューティングの急速な進歩によって、大きな成長が見込まれています。高速、高集積、低消費電力集積回路（IC）の需要が高まるにつれ、ICパッケージングの保護的役割はますます重要になっています。半導体製造の後期段階において、シリコンウエハー、ロジックユニット、メモリーを確実に保護し、物理的な損傷や腐食を防ぎます。さらに、プリント回路基板にチップを実装するための確実な電気的接続を容易にし、さまざまなタイプのICの多様なパッケージング要件に対応します。進化する技術とICパッケージングの重要な役割との間のこの相互作用は、2023年以降まで市場機会の拡大に拍車をかけると予想されます。

市場概要
伝統的な包装
デュアルインラインパッケージ（DIP）
- 小型アウトライン集積回路（SOIC）
- プラスチックリードチップキャリア（PLCC）
- セラミックパッケージ
先進パッケージング
- ボールグリッドアレイ（BGA）
- クアッドフラットパッケージ（QFP）
- ウェーハレベルパッケージング（WLP）
- フリップチップパッケージング
- システムインパッケージ（SIP）
- 3Dパッケージング

ICパッケージング市場規模：素材別

市場概要
有機基質
セラミック基板
金属基板
その他

ICパッケージング市場規模：エンドユーザー別

市場概要
家電
自動車
産業
ヘルスケア
航空宇宙および防衛
通信・IT
その他

ICパッケージング市場規模

北米
- 米国
- カナダ
欧州
- ドイツ
- スペイン
- フランス
- 英国
- イタリア
- その他欧州地域
アジア太平洋地域
- 中国
- インド
- 日本
- 韓国
- その他アジア太平洋地域
ラテンアメリカ
- ブラジル
- その他ラテンアメリカ地域
中東・アフリカ
- GCC諸国
- 南アフリカ
- その他中東・アフリカ

競合情報

上位5社の比較
主要企業の市場ポジショニング（2024年）
主な市場企業が採用した戦略
市場の最近の動向
企業の市場シェア分析（2024年）
主要企業の企業プロファイル
- 会社概要
- 製品ポートフォリオ分析
- セグメント別シェア分析
- 収益の前年比比較（2022-2024）

主要企業プロファイル

Amkor Technology（USA）
ASE Group（Taiwan）
STATS ChipPAC（Singapore）
Siliconware Precision Industries Co., Ltd.（Taiwan）
Jiangsu Changjiang Electronics Technology Co., Ltd.（China）
Powertech Technology Inc.（Taiwan）
UTAC Holdings Ltd.（Singapore）
Chipbond Technology Corporation（Taiwan）
King Yuan Electronics Co., Ltd.（Taiwan）
TongFu Microelectronics Co., Ltd.（China）
Nepes Corporation（South Korea）
Advanced Semiconductor Engineering Inc.（Taiwan）
Shinko Electric Industries Co., Ltd.（Japan）
Kyocera Corporation（Japan）
Samsung Electro-Mechanics Co., Ltd.（South Korea）
Fujitsu Limited（Japan）
JCET Group Co., Ltd.（China）
Texas Instruments Incorporated（USA）
Infineon Technologies AG（Germany）
NXP Semiconductors N.V.（Netherlands）

結論と推奨事項

Product Code: SQMIG45N2089

Global IC Packaging Market size was valued at USD 40.9 billion in 2023 and is poised to grow from USD 44.3 billion in 2024 to USD 83.83 billion by 2032, growing at a CAGR of 8.3% during the forecast period (2025-2032). e was valued at USD 40.94 Billion in 2023 and is poised to grow from USD 44.37 Billion in 2024 to USD 84.41 Billion by 2032, growing at a CAGR of 8.37% during the forecast period (2025-2032).

The IC packaging market is poised for significant growth, driven by the rapid advancements in electronics technology, particularly in AI and cloud computing. As demand escalates for high-speed, high-integration, and low-power integrated circuits (ICs), the protective role of IC packaging becomes increasingly vital. It ensures the safeguarding of silicon wafers, logic units, and memory during the latter stages of semiconductor manufacturing, preventing physical damage and corrosion. Furthermore, it facilitates secure electrical connections for chip mounting on printed circuit boards, addressing the diverse packaging requirements of various IC types. This interplay between evolving technology and the essential role of IC packaging is expected to fuel expanding market opportunities through 2023 and beyond.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Ic Packaging market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Ic Packaging Market Segmental Analysis

Global IC Packaging Market is segmented by type, technology, material, end user and region. Based on type, the market is segmented into surface mount technology (SMT) packaging and through-hole packaging. Based on technology, the market is segmented into traditional packaging, dual in-line package (DIP) and advanced packaging. Based on material, the market is segmented into organic substrates, ceramic substrates, metal substrates and others. Based on end user, the market is segmented into consumer electronics, automotive, industrial, healthcare, aerospace & defense, telecom & it and others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Ic Packaging Market

The global IC packaging market is expected to experience significant growth propelled by increasing government support, particularly through initiatives like the CHIPS for America Act, which promotes investments in semiconductor manufacturing, research, and supply chain security in the U.S. Additionally, the surging demand for AI-driven applications across diverse sectors-including healthcare, telecommunications, finance, and automotive-will create fresh opportunities for semiconductor manufacturers and suppliers. AI advancements are likely to streamline manufacturing processes, enhance chip efficacy, cut down production costs, and boost output. Moreover, the evolving automotive landscape demands semiconductors that enhance connectivity and performance in electrified vehicles, further driving the IC packaging market forward.

Restraints in the Global Ic Packaging Market

The global IC packaging market faces significant restraints due to its concentrated nature, dominated by a handful of countries including the United States, Taiwan, South Korea, Japan, China, and Europe. This uneven distribution of production means that no single region manages the entire production spectrum. For instance, Asian countries account for 57% of semiconductor materials, 56% of wafer fabrications, and an impressive 70% of memory production. Meanwhile, the United States excels in electronic design automation (EDA) and various logic and equipment categories. Consequently, this interdependence among countries inhibits any one nation from achieving total leadership within the entire value chain.

Market Trends of the Global Ic Packaging Market

The global IC packaging market is experiencing significant pressure due to the surging demand for integrated circuits across various sectors, including consumer electronics, automotive, and telecommunications. This escalating demand has exacerbated the ongoing semiconductor shortage, posing formidable challenges to the industry's growth trajectory. Additionally, environmental factors, such as the recent drought in Taiwan-home to key semiconductor manufacturing facilities-have further strained supply chains and production capabilities. These issues underscore the need for innovation and diversification within the IC packaging sector to enhance resilience and adapt to market fluctuations. The market's future will hinge on overcoming these supply challenges while meeting global technological demands.

Introduction

Objectives of the Study
Scope of the Report
Definitions

Research Methodology

Information Procurement
Secondary & Primary Data Methods
Market Size Estimation
Market Assumptions & Limitations

Executive Summary

Global Market Outlook
Supply & Demand Trend Analysis
Segmental Opportunity Analysis

Market Dynamics & Outlook

Market Overview
Market Size
Market Dynamics
- Drivers & Opportunities
- Restraints & Challenges
Porters Analysis
- Competitive rivalry
- Threat of substitute
- Bargaining power of buyers
- Threat of new entrants
- Bargaining power of suppliers

Key Market Insights

Key Success Factors
Degree of Competition
Top Investment Pockets
Market Ecosystem
Market Attractiveness Index, 2024
PESTEL Analysis
Macro-Economic Indicators
Value Chain Analysis
Pricing Analysis
Regulatory Landscape
Case Studies
Technological Advancement

Global IC Packaging Market Size by Type & CAGR (2025-2032)

Market Overview
Surface Mount Technology (SMT) Packaging
Through-Hole Packaging

Global IC Packaging Market Size by Technology & CAGR (2025-2032)

Market Overview
Traditional Packaging
Dual In-Line Package (DIP)
- Small Outline Integrated Circuit (SOIC)
- Plastic Leaded Chip Carrier (PLCC)
- Ceramic Package
Advanced Packaging
- Ball Grid Array (BGA)
- Quad Flat Package (QFP)
- Wafer-Level Packaging (WLP)
- Flip-Chip Packaging
- System-In-Package (SIP)
- 3D Packaging

Global IC Packaging Market Size by Material & CAGR (2025-2032)

Market Overview
Organic Substrates
Ceramic Substrates
Metal Substrates
Others

Global IC Packaging Market Size by End User & CAGR (2025-2032)

Market Overview
Consumer Electronics
Automotive
Industrial
Healthcare
Aerospace & Defense
Telecom & IT
Others

Global IC Packaging Market Size & CAGR (2025-2032)

North America (Type, Technology, Material, End User)
- US
- Canada
Europe (Type, Technology, Material, End User)
- Germany
- Spain
- France
- UK
- Italy
- Rest of Europe
Asia Pacific (Type, Technology, Material, End User)
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
Latin America (Type, Technology, Material, End User)
- Brazil
- Rest of Latin America
Middle East & Africa (Type, Technology, Material, End User)
- GCC Countries
- South Africa
- Rest of Middle East & Africa

Competitive Intelligence

Top 5 Player Comparison
Market Positioning of Key Players, 2024
Strategies Adopted by Key Market Players
Recent Developments in the Market
Company Market Share Analysis, 2024
Company Profiles of All Key Players
- Company Details
- Product Portfolio Analysis
- Company's Segmental Share Analysis
- Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

Amkor Technology (USA)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
ASE Group (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
STATS ChipPAC (Singapore)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Siliconware Precision Industries Co., Ltd. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Jiangsu Changjiang Electronics Technology Co., Ltd. (China)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Powertech Technology Inc. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
UTAC Holdings Ltd. (Singapore)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Chipbond Technology Corporation (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
King Yuan Electronics Co., Ltd. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
TongFu Microelectronics Co., Ltd. (China)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Nepes Corporation (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Advanced Semiconductor Engineering Inc. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Shinko Electric Industries Co., Ltd. (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Kyocera Corporation (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Samsung Electro-Mechanics Co., Ltd. (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Fujitsu Limited (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
JCET Group Co., Ltd. (China)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Texas Instruments Incorporated (USA)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Infineon Technologies AG (Germany)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
NXP Semiconductors N.V. (Netherlands)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments

ICパッケージングの市場規模、シェア、成長分析、タイプ別、技術別、素材別、エンドユーザー別、地域別 - 産業予測、2025～2032年

IC Packaging Market Size, Share, Growth Analysis, By Type (Surface Mount Technology Packaging, Through-Hole Packaging), By Technology (Traditional Packaging, Dual In-Line Package ), By Material, By End User, By Region - Industry Forecast 2025-2032

目次

イントロダクション

調査手法

エグゼクティブサマリー

市場力学と見通し

主な市場の考察

ICパッケージング市場規模：タイプ別

ICパッケージング市場規模：技術別