先進ICパッケージング市場：タイプ別、用途別-2025-2030年の世界予測

先進ICパッケージング市場の2023年の市場規模は450億2,000万米ドル、2024年には485億1,000万米ドルに達すると予測され、CAGR 8.26％で成長し、2030年には785億米ドルに達すると予測されています。

先進ICパッケージングとは、集積回路（IC）のアセンブリとカプセル化に使用され、その性能、効率、拡張性を向上させる技術のことです。先進ICパッケージングの必要性は、家電、自動車、通信、ヘルスケアなどの分野におけるエレクトロニクスの高性能化、低消費電力化、小型化への継続的な要求に起因しています。先進ICパッケージングのアプリケーションには、携帯電話、ウェアラブル、AI、IoTデバイス、車載エレクトロニクスなどがあり、多様な条件下での高信頼性と堅牢な性能が重要な要件となっています。最終用途の範囲は広大で、クラウドコンピューティング、エッジデバイス、半導体製造などの垂直分野にも及んでいます。同市場は、5G技術の台頭、AIの利用拡大、スマートデバイスの増加といった主要な成長要因に後押しされています。さらに、コンシューマーエレクトロニクスの進化とカーエレクトロニクス市場の拡大は、新たな成長手段を提示しています。しかし、初期コストの高さ、複雑な製造プロセス、サプライチェーンのボトルネックといった課題が、大きな制約となっています。市場は現在、異種集積やシステム・イン・パッケージ（SiP）技術などの分野に潜在的なビジネスチャンスをもたらしています。企業は、熱管理と電気的性能を強化するための研究開発に投資することで、こうした機会を生かすことができます。技術革新のための最良の分野には、優れた電気的・熱的性能、低消費電力、より小さなフットプリントを提供するパッケージング・ソリューションの開発が含まれます。半導体メーカーとエンドユーザー企業とのコラボレーションも、価値創造を促進する可能性があります。世界的に市場は競争的であり、主要プレーヤーは常に優位に立つために技術革新を行っています。課題にもかかわらず、効率的でコンパクトかつパワフルなエレクトロニクスへのニーズの高まりは、継続的な成長を確実なものにしています。AIとIoTの新たなアプリケーションに戦略的に焦点を当てることは、先進ICパッケージング領域で事業成長の最大化を目指す市場プレーヤーにとって極めて重要です。

市場力学：急速に進化する先進ICパッケージング市場の主要市場インサイトを公開

先進ICパッケージング市場は、需要と供給のダイナミックな相互作用によって変貌を遂げています。このような市場力学の進化を理解することで、企業は十分な情報に基づいた投資決定、戦略的意思決定、新たなビジネスチャンスの獲得を行うことができます。これらの動向を包括的に把握することで、企業は政治的、地理的、技術的、社会的、経済的な領域にわたる様々なリスクを軽減することができるとともに、消費者行動とそれが製造コストや購買動向に与える影響をより明確に理解することができます。

• 市場促進要因
  • 消費者向け電子機器の需要増加と普及
  • 防衛分野からの小型化電子製品に対する需要の高まり
  • 各経済圏で進む輸送分野の電動化
• 市場抑制要因
  • 先進ICパッケージングプロセスの高コスト
• 市場機会
  • 新しい先進ICパッケージングソリューションの進化と開発
  • 半導体製造産業への投資の増加
• 市場の課題
  • 先進ICパッケージングに関連する信頼性、電力損失、電力使用の課題

ポーターのファイブフォース：先進ICパッケージング市場をナビゲートする戦略ツール

ポーターのファイブフォースフレームワークは、先進ICパッケージング市場の競合情勢を理解するための重要なツールです。ポーターのファイブフォース・フレームワークは、企業の競争力を評価し、戦略的機会を探るための明確な手法を提供します。このフレームワークは、企業が市場内の勢力図を評価し、新規事業の収益性を判断するのに役立ちます。これらの洞察により、企業は自社の強みを活かし、弱みに対処し、潜在的な課題を回避することができ、より強靭な市場でのポジショニングを確保することができます。

PESTLE分析：先進ICパッケージング市場における外部からの影響の把握

外部マクロ環境要因は、先進ICパッケージング市場の業績ダイナミクスを形成する上で極めて重要な役割を果たします。政治的、経済的、社会的、技術的、法的、環境的要因の分析は、これらの影響をナビゲートするために必要な情報を提供します。PESTLE要因を調査することで、企業は潜在的なリスクと機会をよりよく理解することができます。この分析により、企業は規制、消費者の嗜好、経済動向の変化を予測し、先を見越した積極的な意思決定を行う準備ができます。

市場シェア分析先進ICパッケージング市場における競合情勢の把握

先進ICパッケージング市場の詳細な市場シェア分析により、ベンダーの業績を包括的に評価することができます。企業は、収益、顧客ベース、成長率などの主要指標を比較することで、競争上のポジショニングを明らかにすることができます。この分析により、市場の集中、断片化、統合の動向が明らかになり、ベンダーは競争が激化する中で自社の地位を高める戦略的意思決定を行うために必要な知見を得ることができます。

FPNVポジショニング・マトリックス先進ICパッケージング市場におけるベンダーのパフォーマンス評価

FPNVポジショニングマトリックスは、先進ICパッケージング市場においてベンダーを評価するための重要なツールです。このマトリックスにより、ビジネス組織はベンダーのビジネス戦略と製品満足度に基づき評価することで、目標に沿った十分な情報に基づいた意思決定を行うことができます。4つの象限によりベンダーを明確かつ的確にセグメント化し、戦略目標に最適なパートナーやソリューションを特定することができます。

戦略分析と推奨先進ICパッケージング市場における成功への道筋を描く

先進ICパッケージング市場の戦略分析は、世界市場でのプレゼンス強化を目指す企業にとって不可欠です。主要なリソース、能力、業績指標を検討することで、企業は成長機会を特定し、改善に取り組むことができます。このアプローチにより、競合情勢における課題を克服し、新たなビジネスチャンスを活かして長期的な成功を収めるための体制を整えることができます。

本レポートでは、主要な注目分野を網羅した市場の包括的な分析を提供しています：

1.市場の浸透度：現在の市場環境の詳細なレビュー、主要企業による広範なデータ、市場でのリーチと全体的な影響力の評価。

2.市場の開拓度：新興市場における成長機会を特定し、既存分野における拡大可能性を評価し、将来の成長に向けた戦略的ロードマップを提供します。

3.市場の多様化：最近の製品発売、未開拓の地域、業界の主要な進歩、市場を形成する戦略的投資を分析します。

4.競合の評価と情報：競合情勢を徹底的に分析し、市場シェア、事業戦略、製品ポートフォリオ、認証、規制当局の承認、特許動向、主要企業の技術進歩などを検証します。

5.製品開発およびイノベーション：将来の市場成長を促進すると期待される最先端技術、研究開発活動、製品イノベーションをハイライトしています。

また、利害関係者が十分な情報を得た上で意思決定できるよう、重要な質問にも答えています：

1.現在の市場規模と今後の成長予測は？

2.最高の投資機会を提供する製品、セグメント、地域はどこか？

3.市場を形成する主な技術動向と規制の影響とは？

4.主要ベンダーの市場シェアと競合ポジションは？

5.ベンダーの市場参入・撤退戦略の原動力となる収益源と戦略的機会は何か？

目次

第1章 序文

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場の概要

第5章 市場洞察

• 市場力学
  • 促進要因
    • 消費者向け電子機器の需要と採用の増加
    • 防衛分野における小型電子製品への需要増加
    • 各国の交通機関の電化が進む
  • 抑制要因
    • 先進ICパッケージングプロセスの高コスト
  • 機会
    • 新しい先進ICパッケージングソリューションの進化と開発
    • 半導体製造業界への投資増加
  • 課題
    • 先進ICパッケージングに関連する信頼性、電力消費、電力使用の課題
• 市場セグメンテーション分析
• ポーターのファイブフォース分析
• PESTEL分析
  • 政治的
  • 経済
  • 社交
  • 技術的
  • 法律上
  • 環境

第6章 先進ICパッケージング市場：タイプ別

• 2.5D集積回路
• 2D集積回路
• 3D集積回路
• ファンアウトシリコンインパッケージ
• ファンアウトウエハーレベルパッケージ
• フリップチップ
• ウエハーレベルチップスケールパッケージ

第7章 先進ICパッケージング市場：用途別

• 航空宇宙および防衛
• 自動車・輸送
• 家電
• ITおよび通信

第8章 南北アメリカの先進ICパッケージング市場

• アルゼンチン
• ブラジル
• カナダ
• メキシコ
• 米国

第9章 アジア太平洋地域の先進ICパッケージング市場

• オーストラリア
• 中国
• インド
• インドネシア
• 日本
• マレーシア
• フィリピン
• シンガポール
• 韓国
• 台湾
• タイ
• ベトナム

第10章 欧州・中東・アフリカの先進ICパッケージング市場

• デンマーク
• エジプト
• フィンランド
• フランス
• ドイツ
• イスラエル
• イタリア
• オランダ
• ナイジェリア
• ノルウェー
• ポーランド
• カタール
• ロシア
• サウジアラビア
• 南アフリカ
• スペイン
• スウェーデン
• スイス
• トルコ
• アラブ首長国連邦
• 英国

第11章 競合情勢

• 市場シェア分析2023
• FPNVポジショニングマトリックス, 2023
• 競合シナリオ分析
• 戦略分析と提言

企業一覧

• Amkor Technology, Inc.
• ASE Technology Holding Co, Ltd.
• ASMPT
• Broadcom, Inc.
• Cadence Design Systems, Inc.
• Carsem（M）Sdn Bhd
• Faraday Technology Corporation
• FormFactor, Inc.
• Intel Corporation
• Jiangsu Changdian Technology Co., Ltd.
• KYOCERA Corporation
• Microchip Technology Inc.
• Micross Components, Inc.
• NHanced Semiconductors, Inc.
• NXP Semiconductors N.V.
• Optima Technology Associates, Inc.
• Pac Tech-Packaging Technologies GmbH
• Powertech Technology Inc.
• Renesas Electronics Corporation
• Samsung Electronics Co., Ltd.
• Taiwan Semiconductor Manufacturing Company, Ltd.
• Tektronix, Inc.
• Texas Instruments Incorporated
• United Microelectronics Corporation

LIST OF FIGURES

• FIGURE 1. ADVANCED IC PACKAGING MARKET RESEARCH PROCESS
• FIGURE 2. ADVANCED IC PACKAGING MARKET SIZE, 2023 VS 2030
• FIGURE 3. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
• FIGURE 4. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 5. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 6. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2023 VS 2030 (%)
• FIGURE 7. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 8. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
• FIGURE 9. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 10. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 11. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 12. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2030 (%)
• FIGURE 13. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 14. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 15. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 16. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 17. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 18. ADVANCED IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
• FIGURE 19. ADVANCED IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

• TABLE 1. ADVANCED IC PACKAGING MARKET SEGMENTATION & COVERAGE
• TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
• TABLE 3. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
• TABLE 4. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 5. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 6. ADVANCED IC PACKAGING MARKET DYNAMICS
• TABLE 7. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 8. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY 2.5D INTEGRATED CIRCUIT, BY REGION, 2018-2030 (USD MILLION)
• TABLE 9. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY 2D INTEGRATED CIRCUIT, BY REGION, 2018-2030 (USD MILLION)
• TABLE 10. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY 3D INTEGRATED CIRCUIT, BY REGION, 2018-2030 (USD MILLION)
• TABLE 11. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT SILICON IN PACKAGE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 12. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT WAFER LEVEL PACKAGE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 13. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FLIP CHIP, BY REGION, 2018-2030 (USD MILLION)
• TABLE 14. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL CHIP SCALE PACKAGE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 15. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 16. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY AEROSPACE & DEFENSE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 17. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE & TRANSPORTATION, BY REGION, 2018-2030 (USD MILLION)
• TABLE 18. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 19. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY IT & TELECOM, BY REGION, 2018-2030 (USD MILLION)
• TABLE 20. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 21. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 22. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 23. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 24. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 25. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 26. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 27. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 28. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 29. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 30. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 31. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 32. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 33. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
• TABLE 34. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 35. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 36. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 37. AUSTRALIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 38. AUSTRALIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 39. CHINA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 40. CHINA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 41. INDIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 42. INDIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 43. INDONESIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 44. INDONESIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 45. JAPAN ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 46. JAPAN ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 47. MALAYSIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 48. MALAYSIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 49. PHILIPPINES ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 50. PHILIPPINES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 51. SINGAPORE ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 52. SINGAPORE ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 53. SOUTH KOREA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 54. SOUTH KOREA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 55. TAIWAN ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 56. TAIWAN ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 57. THAILAND ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 58. THAILAND ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 59. VIETNAM ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 60. VIETNAM ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 61. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 62. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 63. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 64. DENMARK ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 65. DENMARK ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 66. EGYPT ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 67. EGYPT ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 68. FINLAND ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 69. FINLAND ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 70. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 71. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 72. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 73. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 74. ISRAEL ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 75. ISRAEL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 76. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 77. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 78. NETHERLANDS ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 79. NETHERLANDS ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 80. NIGERIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 81. NIGERIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 82. NORWAY ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 83. NORWAY ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 84. POLAND ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 85. POLAND ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 86. QATAR ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 87. QATAR ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 88. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 89. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 90. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 91. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 92. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 93. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 94. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 95. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 96. SWEDEN ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 97. SWEDEN ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 98. SWITZERLAND ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 99. SWITZERLAND ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 100. TURKEY ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 101. TURKEY ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 102. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 103. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 104. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
• TABLE 105. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 106. ADVANCED IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
• TABLE 107. ADVANCED IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023

The Advanced IC Packaging Market was valued at USD 45.02 billion in 2023, expected to reach USD 48.51 billion in 2024, and is projected to grow at a CAGR of 8.26%, to USD 78.50 billion by 2030.

Advanced IC Packaging refers to the technologies used in the assembly and encapsulation of integrated circuits (ICs) that improve their performance, efficiency, and scalability. The necessity for advanced IC packaging stems from the continual demand for increased performance, reduced power consumption, and miniaturization in electronics across sectors like consumer electronics, automotive, telecommunications, and healthcare. Applications of advanced IC packaging include mobile phones, wearables, AI, IoT devices, and automotive electronics, where the demand for high reliability and robust performance under diverse conditions is critical. The end-use scope is vast, touching verticals such as cloud computing, edge devices, and semiconductor manufacturing. The market is propelled by key growth factors like the rise of 5G technology, increased use of AI, and the growth of smart devices. Furthermore, evolving consumer electronics and expanding automotive electronics markets present new growth avenues. However, challenges such as high initial costs, complex manufacturing processes, and supply chain bottlenecks pose considerable limitations. The market currently offers potential opportunities in areas such as heterogeneous integration and System-in-Package (SiP) technologies. Companies can capitalize on these opportunities by investing in R&D to enhance thermal management and electrical performance. Best areas for innovation include developing packaging solutions that offer superior electrical and thermal performance, lower power consumption, and smaller footprints. Collaborations between semiconductor manufacturers and end-user companies could also drive value creation. Globally, the market is competitive with key players constantly innovating to gain an edge. Despite the challenges, the increasing need for efficient, compact, and powerful electronics ensures ongoing growth. A strategic focus on emerging applications in AI and IoT will be crucial for market players aiming to maximize business growth in the advanced IC packaging domain.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Advanced IC Packaging Market

The Advanced IC Packaging Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

• Market Drivers
  • Increasing demand and adoption of consumer electronic devices
  • Gowing demand for miniaturized electronic products from defense sector
  • Ongoing electrification of transportation sector across economies
• Market Restraints
  • High cost of advanced IC packaging processes
• Market Opportunities
  • Evolution and development of new advanced IC packaging solutions
  • Rising investment in semiconductor manufacturing industry
• Market Challenges
  • Reliablity, power dissipation and power usage challenges associated with advanced IC packaging

Porter's Five Forces: A Strategic Tool for Navigating the Advanced IC Packaging Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Advanced IC Packaging Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Advanced IC Packaging Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Advanced IC Packaging Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Advanced IC Packaging Market

A detailed market share analysis in the Advanced IC Packaging Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Advanced IC Packaging Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Advanced IC Packaging Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Advanced IC Packaging Market

A strategic analysis of the Advanced IC Packaging Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Advanced IC Packaging Market, highlighting leading vendors and their innovative profiles. These include Amkor Technology, Inc., ASE Technology Holding Co, Ltd., ASMPT, Broadcom, Inc., Cadence Design Systems, Inc., Carsem (M) Sdn Bhd, Faraday Technology Corporation, FormFactor, Inc., Intel Corporation, Jiangsu Changdian Technology Co., Ltd., KYOCERA Corporation, Microchip Technology Inc., Micross Components, Inc., NHanced Semiconductors, Inc., NXP Semiconductors N.V., Optima Technology Associates, Inc., Pac Tech - Packaging Technologies GmbH, Powertech Technology Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company, Ltd., Tektronix, Inc., Texas Instruments Incorporated, and United Microelectronics Corporation.

Market Segmentation & Coverage

This research report categorizes the Advanced IC Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

• Based on Type, market is studied across 2.5D Integrated Circuit, 2D Integrated Circuit, 3D Integrated Circuit, Fan Out Silicon In Package, Fan Out Wafer Level Package, Flip Chip, and Wafer Level Chip Scale Package.
• Based on Application, market is studied across Aerospace & Defense, Automotive & Transportation, Consumer Electronics, and IT & Telecom.
• Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Increasing demand and adoption of consumer electronic devices
    • 5.1.1.2. Gowing demand for miniaturized electronic products from defense sector
    • 5.1.1.3. Ongoing electrification of transportation sector across economies
  • 5.1.2. Restraints
    • 5.1.2.1. High cost of advanced IC packaging processes
  • 5.1.3. Opportunities
    • 5.1.3.1. Evolution and development of new advanced IC packaging solutions
    • 5.1.3.2. Rising investment in semiconductor manufacturing industry
  • 5.1.4. Challenges
    • 5.1.4.1. Reliablity, power dissipation and power usage challenges associated with advanced IC packaging
• 5.2. Market Segmentation Analysis
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. Advanced IC Packaging Market, by Type

• 6.1. Introduction
• 6.2. 2.5D Integrated Circuit
• 6.3. 2D Integrated Circuit
• 6.4. 3D Integrated Circuit
• 6.5. Fan Out Silicon In Package
• 6.6. Fan Out Wafer Level Package
• 6.7. Flip Chip
• 6.8. Wafer Level Chip Scale Package

7. Advanced IC Packaging Market, by Application

• 7.1. Introduction
• 7.2. Aerospace & Defense
• 7.3. Automotive & Transportation
• 7.4. Consumer Electronics
• 7.5. IT & Telecom

8. Americas Advanced IC Packaging Market

• 8.1. Introduction
• 8.2. Argentina
• 8.3. Brazil
• 8.4. Canada
• 8.5. Mexico
• 8.6. United States

9. Asia-Pacific Advanced IC Packaging Market

• 9.1. Introduction
• 9.2. Australia
• 9.3. China
• 9.4. India
• 9.5. Indonesia
• 9.6. Japan
• 9.7. Malaysia
• 9.8. Philippines
• 9.9. Singapore
• 9.10. South Korea
• 9.11. Taiwan
• 9.12. Thailand
• 9.13. Vietnam

10. Europe, Middle East & Africa Advanced IC Packaging Market

• 10.1. Introduction
• 10.2. Denmark
• 10.3. Egypt
• 10.4. Finland
• 10.5. France
• 10.6. Germany
• 10.7. Israel
• 10.8. Italy
• 10.9. Netherlands
• 10.10. Nigeria
• 10.11. Norway
• 10.12. Poland
• 10.13. Qatar
• 10.14. Russia
• 10.15. Saudi Arabia
• 10.16. South Africa
• 10.17. Spain
• 10.18. Sweden
• 10.19. Switzerland
• 10.20. Turkey
• 10.21. United Arab Emirates
• 10.22. United Kingdom

11. Competitive Landscape

• 11.1. Market Share Analysis, 2023
• 11.2. FPNV Positioning Matrix, 2023
• 11.3. Competitive Scenario Analysis
• 11.4. Strategy Analysis & Recommendation

Companies Mentioned

• 1. Amkor Technology, Inc.
• 2. ASE Technology Holding Co, Ltd.
• 3. ASMPT
• 4. Broadcom, Inc.
• 5. Cadence Design Systems, Inc.
• 6. Carsem (M) Sdn Bhd
• 7. Faraday Technology Corporation
• 8. FormFactor, Inc.
• 9. Intel Corporation
• 10. Jiangsu Changdian Technology Co., Ltd.
• 11. KYOCERA Corporation
• 12. Microchip Technology Inc.
• 13. Micross Components, Inc.
• 14. NHanced Semiconductors, Inc.
• 15. NXP Semiconductors N.V.
• 16. Optima Technology Associates, Inc.
• 17. Pac Tech - Packaging Technologies GmbH
• 18. Powertech Technology Inc.
• 19. Renesas Electronics Corporation
• 20. Samsung Electronics Co., Ltd.
• 21. Taiwan Semiconductor Manufacturing Company, Ltd.
• 22. Tektronix, Inc.
• 23. Texas Instruments Incorporated
• 24. United Microelectronics Corporation