アジア太平洋のHMC (ハイブリッドメモリーキューブ) およびHBM (広帯域メモリー) 市場：用途・エンドユーザー・メモリタイプ・容量・国別の分析・予測 (2023-2033年)

アジア太平洋のHMC (ハイブリッドメモリーキューブ) およびHBM (広帯域メモリー) の市場規模は、2023年の約11億720万米ドルから、予測期間中はCAGR 27.25%で推移し、2033年には123億2,860万米ドルの規模に成長すると予測されています。

AI、ビッグデータ分析、ハイパフォーマンスコンピューティングの活用により、さまざまな分野でデータ生成量が急速に増加しており、高帯域幅の大容量メモリーソリューションへのニーズが高まっています。こうした高度なメモリーソリューションは、特にAIアクセラレータやIoT・自動システム向けのエッジコンピューティング用途において、大規模なデータセットを効率的に管理するために不可欠であり、市場の成長を後押ししています。

アジア太平洋のHMC (ハイブリッドメモリーキューブ) およびHBM (広帯域メモリー) の市場は、データ中心の用途の増加に牽引され、著しい成長を遂げています。同地域では、通信、自動車、CE製品などの業界でAI、IoT、高性能コンピューティングの導入が急速に進んでおり、先進的なメモリソリューションの需要が高まっています。HMCおよびHBM技術は、優れた帯域幅、効率、性能を提供するため、大規模データセットの管理や計算能力の強化に最適です。中国、日本、韓国などの国は技術とインフラへの多額の投資を行っており、市場をリードしています。

当レポートでは、アジア太平洋のHMC (ハイブリッドメモリーキューブ) およびHBM (広帯域メモリー) の市場を調査し、業界の動向、技術・特許の動向、市場成長促進要因・抑制要因、市場規模の推移・予測、各種区分・主要国別の詳細分析、競合情勢、主要企業のプロファイルなどをまとめています。

市場の分類

セグメント1：用途別

• GPU
• ASIC
• CPU
• APU
• その他

セグメント2：エンドユーザー別

• 高性能コンピューティング
• ネットワーキング・通信
• データセンター
• グラフィックレンダリング・ゲーム
• その他

セグメント3：メモリータイプ別

• ハイブリッドメモリーキューブ（HMC）
• 広帯域メモリー（HBM）

セグメント4：容量別

• 2GB～8GB
• 8GB～16GB
• 16GB超

セグメント5：国別

• 中国
• インド
• 日本
• 韓国
• その他

目次

エグゼクティブサマリー

第1章 市場

• 動向：現在および将来の影響評価
  • トレンド分析：HMCおよびHBM市場
  • データセンター用途の進歩
  • メモリ業界におけるエネルギー効率の高い技術ソリューションへの注目の高まり
• サプライチェーンの概要
  • バリューチェーン分析
  • マーケットマップ
• R&Dレビュー
  • 特許出願動向（国・企業別）
• 主な世界的イベントの影響分析
• 市場力学の概要
  • 市場促進要因
  • 市場の課題
  • 市場機会

第2章 地域

• 地域別概要
• アジア太平洋
  • 地域概要
  • 市場成長推進因子
  • 市場課題
  • 用途
  • 製品
  • 中国
  • インド
  • 日本
  • 韓国
  • その他

第3章 市場：競合ベンチマーキング・企業プロファイル

• 競合情勢
  • Samsung Electronics Co., Ltd.
  • Fujitsu Ltd.
  • SK HYNIX INC.
  • Renesas Electronics Corporation

第4章 調査手法

List of Figures

• Figure 1: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), 2022, 2026, and 2033
• Figure 2: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), 2022, 2026, and 2033
• Figure 3: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), 2022, 2026, and 2033
• Figure 4: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), 2022, 2026, and 2033
• Figure 5: Hybrid Memory Cube and High-Bandwidth Memory, Recent Developments
• Figure 6: Supply Chain Analysis for Hybrid Memory Cube and High-Bandwidth Memory Market
• Figure 7: Patent Filed (by Company), January 2020-December 2023
• Figure 8: Patent Filed (by Country), January 2020-December 2023
• Figure 9: Impact Analysis of Market Navigating Factors, 2022-2033
• Figure 10: Strategic Initiatives, 2020-2023
• Figure 11: Share of Strategic Initiatives
• Figure 12: Data Triangulation
• Figure 13: Top-Down and Bottom-Up Approach
• Figure 14: Assumptions and Limitations

List of Tables

• Table 1: Market Snapshot
• Table 2: Hybrid Memory Cube and High-Bandwidth Memory Market, Regional Opportunities
• Table 3: Hybrid Memory Cube and High-Bandwidth Memory Market (by Region), $Million, 2022-2033
• Table 4: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), $Million, 2022-2033
• Table 5: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), $Million, 2022-2033
• Table 6: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), $Million, 2022-2033
• Table 7: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), $Million, 2022-2033
• Table 8: China Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), $Million, 2022-2033
• Table 9: China Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), $Million, 2022-2033
• Table 10: China Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), $Million, 2022-2033
• Table 11: China Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), $Million, 2022-2033
• Table 12: India Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), $Million, 2022-2033
• Table 13: India Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), $Million, 2022-2033
• Table 14: India Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), $Million, 2022-2033
• Table 15: India Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), $Million, 2022-2033
• Table 16: Japan Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), $Million, 2022-2033
• Table 17: Japan Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), $Million, 2022-2033
• Table 18: Japan Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), $Million, 2022-2033
• Table 19: Japan Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), $Million, 2022-2033
• Table 20: South Korea Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), $Million, 2022-2033
• Table 21: South Korea Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), $Million, 2022-2033
• Table 22: South Korea Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), $Million, 2022-2033
• Table 23: South Korea Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), $Million, 2022-2033
• Table 24: Rest-of-Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), $Million, 2022-2033
• Table 25: Rest-of-Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), $Million, 2022-2033
• Table 26: Rest-of-Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), $Million, 2022-2033
• Table 27: Rest-of-Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), $Million, 2022-2033
• Table 28: Market Share

Introduction to Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market

The Asia-Pacific memory cube and high-bandwidth memory market was valued at around $1,107.2 million in 2023 and is expected to reach $12,328.6 million by 2033, at a CAGR of 27.25% from 2023 to 2033. The rapid increase in data generation across multiple sectors, spurred by the use of AI, big data analytics, and high-performance computing, is driving the need for high-bandwidth and high-capacity memory solutions. These advanced memory solutions are essential for managing large datasets effectively, particularly in AI accelerators and edge computing applications for IoT and autonomous systems, thereby propelling market growth.

Market Introduction

The APAC Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) market is witnessing significant growth driven by increasing data-centric applications. The region's rapid adoption of AI, IoT, and high-performance computing in industries such as telecommunications, automotive, and consumer electronics fuels the demand for advanced memory solutions. HMC and HBM technologies provide superior bandwidth, efficiency, and performance, making them ideal for managing large datasets and enhancing computational capabilities. Countries like China, Japan, and South Korea are leading the market, backed by substantial investments in technology and infrastructure. According to Market Research Future, the APAC region is expected to dominate the HMC and HBM market due to these technological advancements and growing industry applications.

Market Segmentation:

Segmentation 1: by Application

• Graphics Processing Unit (GPU)
• Application-Specific Integrated Circuit (ASIC)
• Central Processing Unit (CPU)
• Accelerated Processing Unit (APU)
• Others

Segmentation 2: by End Use

• High-Performance Computing
• Networking and Telecommunications
• Data Centers
• Graphics Rendering and Gaming
• Others

Segmentation 3: by Memory Type

• Hybrid Memory Cube (HMC)
• High-Bandwidth Memory (HBM)

Segmentation 4: by Capacity

• 2GB to 8GB
• 8GB to 16GB
• Above 16GB

Segmentation 5: by Country

• China
• India
• Japan
• South Korea
• Rest-of-Asia-Pacific

Key Market Players and Competition Synopsis

The companies that are profiled in the market have been selected based on inputs gathered from primary experts and analyzing company coverage, product portfolio, and market penetration.

Some of the prominent names in the market are:

• Samsung Electronics Co., Ltd.
• Fujitsu Ltd.
• SK HYNIX INC.
• Renesas Electronics Corporation

Table of Contents

Executive Summary

Scope and Definition

1 Markets

• 1.1 Trends: Current and Future Impact Assessment
  • 1.1.1 Trend Analysis: Hybrid Memory Cube and High-Bandwidth Memory Market
  • 1.1.2 Advancements in Data Center Applications
  • 1.1.3 Increasing Focus on Energy-Efficient Technology Solutions in the Memory Industry
• 1.2 Supply Chain Overview
  • 1.2.1 Value Chain Analysis
  • 1.2.2 Market Map
    • 1.2.2.1 Hybrid Memory Cube and High-Bandwidth Memory Market - Product (by Memory Type)
      • 1.2.2.1.1 Hybrid Memory Cube (HMC)
      • 1.2.2.1.2 High-Bandwidth Memory (HBM)
• 1.3 Research and Development Review
  • 1.3.1 Patent Filing Trend (by Country, Company)
• 1.4 Impact Analysis for Key Global Events
• 1.5 Market Dynamics Overview
  • 1.5.1 Market Drivers
    • 1.5.1.1 Massive Growth of Artificial Intelligence (AI)
    • 1.5.1.2 Increasing Use of Augmented Reality (AR) and Virtual Reality (VR)
  • 1.5.2 Market Challenges
    • 1.5.2.1 Higher Cost than Other Standard DRAMs
    • 1.5.2.2 Heat Dissipation Problems due to Integrated 3D Architectures
  • 1.5.3 Market Opportunities
    • 1.5.3.1 Growing Applications of Edge-Based Technologies
    • 1.5.3.2 Increasing Adoption of Autonomous Driving

2 Regions

• 2.1 Regional Summary
• 2.2 Asia-Pacific
  • 2.2.1 Regional Overview
  • 2.2.2 Driving Factors for Market Growth
  • 2.2.3 Factors Challenging the Market
  • 2.2.4 Application
  • 2.2.5 Product
  • 2.2.6 China
  • 2.2.7 India
  • 2.2.8 Japan
  • 2.2.9 South Korea
  • 2.2.10 Rest-of-Asia-Pacific

3 Markets - Competitive Benchmarking & Company Profiles

• 3.1 Competitive Landscape
  • 3.1.1 Samsung Electronics Co., Ltd.
    • 3.1.1.1 Overview
    • 3.1.1.2 Top Products/Product Portfolio
    • 3.1.1.3 Top Competitors
    • 3.1.1.4 Target Customers
    • 3.1.1.5 Key Personnel
    • 3.1.1.6 Analyst View
    • 3.1.1.7 Market Share (2022)
  • 3.1.2 Fujitsu Ltd.
    • 3.1.2.1 Overview
    • 3.1.2.2 Top Products/Product Portfolio
    • 3.1.2.3 Top Competitors
    • 3.1.2.4 Target Customers
    • 3.1.2.5 Key Personnel
    • 3.1.2.6 Analyst View
    • 3.1.2.7 Market Share (2022)
  • 3.1.3 SK HYNIX INC.
    • 3.1.3.1 Overview
    • 3.1.3.2 Top Products/Product Portfolio
    • 3.1.3.3 Top Competitors
    • 3.1.3.4 Target Customers
    • 3.1.3.5 Key Personnel
    • 3.1.3.6 Analyst View
    • 3.1.3.7 Market Share (2022)
  • 3.1.4 Renesas Electronics Corporation
    • 3.1.4.1 Overview
    • 3.1.4.2 Top Products/Product Portfolio
    • 3.1.4.3 Top Competitors
    • 3.1.4.4 Target Customers
    • 3.1.4.5 Key Personnel
    • 3.1.4.6 Analyst View
    • 3.1.4.7 Market Share (2022)

4 Research Methodology

• 4.1 Data Sources
  • 4.1.1 Primary Data Sources
  • 4.1.2 Secondary Data Sources
  • 4.1.3 Data Triangulation
• 4.2 Market Estimation and Forecast