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先進半導体パッケージング市場：包装タイプ別、包装材料別、製造方法別、エンドユーザー別、国別、地域別-2025年～2032年の産業分析、市場規模、市場シェア、予測

Advanced Semiconductor Packaging Market, By Packaging Type, By Packaging Material, By Fabrication Method, By End-User, By Country, and By Region - Global Industry Analysis, Market Size, Market Share & Forecast from 2025-2032

出版日
ページ情報
英文 288 Pages
納期
2～3営業日
カスタマイズ可能
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=144.70円
先進半導体パッケージング市場：包装タイプ別、包装材料別、製造方法別、エンドユーザー別、国別、地域別-2025年～2032年の産業分析、市場規模、市場シェア、予測
出版日: 2025年05月04日
発行: AnalystView Market Insights
ページ情報: 英文 288 Pages
納期: 2～3営業日
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  • 概要
  • 目次
概要

レポートハイライト

先進半導体パッケージング市場規模は2024年に382億943万米ドルとなり、2025年から2032年にかけてCAGR 8.50%で拡大

先進半導体パッケージング市場-市場力学

高性能・小型電子機器への需要の高まりが先進半導体パッケージングの採用を加速

高性能かつコンパクトな電子機器に対する需要の高まりにより、先進半導体パッケージングの採用が加速しています。米国エネルギー省によると、データセンターは米国の総電力使用量の約2%を占めており、よりエネルギー効率の高いチップアーキテクチャの推進を促し、3D ICやシステムインパッケージのような技術の導入を促進しています。2023年、アップルはチップレットベースのアーキテクチャをMシリーズ・プロセッサーに統合し、性能最適化のための高密度実装へのシフトを示しました。同様に、欧州連合（EU）のChips Actは、AIとIoTエコシステムをサポートするパッケージングのイノベーションに重点を置き、半導体能力を高めるために430億ユーロ以上を投資しています。エレクトロニクスの小型化と高機能化が進む中、先進パッケージングは現代のコンピューティングシステムにおける熱、電気、空間の課題に対応するために不可欠となっています。

先進半導体パッケージング市場-主な洞察

リサーチアナリストの分析によると、世界市場は予測期間（2025-2032年）に約8.50%のCAGRで年間成長すると推定されます。

包装タイプ別のセグメンテーションに基づくと、フリップチップは2024年に最大の市場シェアを示すと予測されました。

包装材料別では、基板が2024年に主要な包装材料となります。

製造方法別では、2024年にバックエンドが主要な製造方法となりました。

地域別では、アジア太平洋地域が2024年の売上高をリードしています。

先進半導体パッケージング市場-セグメンテーション分析：

先進半導体パッケージングの世界市場は、包装タイプ、包装材料、製造方法、エンドユーザー、地域に基づいてセグメント化されます。

市場は包装タイプに基づいて5つのカテゴリーに分けられる：フリップチップ、ファンアウトウエハーレベル、2.5D/3D IC、システムインパッケージ（SiP）、ウエハーレベルチップスケールです。フリップチップはCPUとGPUで広く使用されており、モバイル機器とウェアラブル機器向けのファンアウトウエハーレベルがこれに続きます。2.5D/3D ICはAIやHPCで人気を集め、SiPはIoTの小型化に対応し、ウエハーレベルチップスケールは小型センサーに適しています。

市場は、包装材料に基づいて4つのカテゴリーに分類される：基板、ボンディングワイヤー、封止樹脂、ダイアタッチ材料です。サブストレートは、マルチダイ集積化において重要な役割を果たすため優位を占めており、ボンディングワイヤは従来の接続に不可欠です。封止樹脂は過酷な環境下での耐久性を保証し、ダイ・アタッチ材料は先端チップアセンブリの熱管理と電気的性能をサポートします。

先進半導体パッケージング市場-地理的洞察

先進半導体パッケージング市場は、台湾、韓国、中国、日本のような半導体製造およびパッケージングインフラストラクチャの国々の優位性により、アジア太平洋がリードしており、強い地理的多様性を示しています。台湾のTSMCと韓国のSamsungは、AIとHPCチップをサポートするために2.5Dと3Dパッケージング能力を大幅に拡大し、中国は地政学的緊張の中で国内パッケージング技術の強化を目指し、「メイド・イン・チャイナ2025」イニシアティブの下で継続的な投資を行っています。日本は材料とプロセス装置のイノベーションに貢献し、地域のサプライチェーンを強化します。北米、特に米国では、CHIPSや科学法といった政府の支援イニシアティブが勢いを増しており、海外の鋳造所への依存を減らすために国内のパッケージング能力を奨励しています。欧州では、ドイツやオランダのような国々が、特に信頼性と統合性が重要な車載および産業用アプリケーション向けのパッケージング技術革新を支援するため、官民パートナーシップを通じて共同研究開発を進めています。

先進半導体パッケージング市場-競合情勢：

先進半導体パッケージング市場の競合情勢は、集積デバイスメーカー、鋳造メーカー、半導体組立・テスト（OSAT）アウトソーシングプロバイダー、材料サプライヤーが混在し、最先端のパッケージングソリューションの開発にしのぎを削っています。TSMC、インテル、サムスンなどの業界大手は、次世代プロセッサーとAIワークロードをサポートするため、チップレット集積と3Dパッケージングに多額の投資を行っています。インテルの先進的なFoverosとEMIB技術、TSMCのCoWoSとInFOプラットフォームが、ヘテロジニアス集積の競争を牽引しています。ASEグループやAmkor TechnologyなどのOSAT企業は、多様なアプリケーションの需要に対応するため、ファンアウト・ウエハーレベルとシステム・イン・パッケージの能力を拡大しています。一方、装置メーカーと基板メーカーが協力して熱管理と相互接続密度の課題に取り組むなど、サプライチェーン全体で技術提携が形成されつつあります。また、独自のパッケージング・プラットフォームが重視されるようになったことで、戦略的提携や買収が相次ぎ、各社は市場シェアと技術的リーダーシップの確保に努めています。

目次

第1章 先進半導体パッケージング市場概要

  • 調査範囲
  • 市場推定年数

第2章 エグゼクティブサマリー

  • 市場内訳
  • 競合考察

第3章 先進半導体パッケージングの主要市場動向

  • 市場促進要因
  • 市場抑制要因
  • 市場機会
  • 市場の将来動向

第4章 先進半導体パッケージング産業の調査

  • PEST分析
  • ポーターのファイブフォース分析
  • 成長見通しマッピング
  • 規制枠組み分析

第5章 先進半導体パッケージング市場：高まる地政学的緊張の影響

  • COVID-19パンデミックの影響
  • ロシア・ウクライナ戦争の影響
  • 中東紛争の影響

第6章 先進半導体パッケージング市場情勢

  • 先進半導体パッケージング市場シェア分析、2024年
  • 主要メーカー別内訳データ
    • ベテラン選手の分析
    • 新興企業の分析

第7章 先進半導体パッケージング市場- 包装タイプ別

  • 概要
    • セグメントシェア分析：包装タイプ別
    • フリップチップ
    • ファンアウトウエハーレベル
    • 2.5D/3D IC
    • システムインパッケージ（SiP）
    • ウェーハレベルチップスケール

第8章 先進半導体パッケージング市場- 包装材料別

  • 概要
    • セグメントシェア分析：包装材料別
    • 基板
    • ボンディングワイヤ
    • 封止樹脂
    • ダイアタッチ材

第9章 先進半導体パッケージング市場- 製造方法別

  • 概要
    • セグメントシェア分析：製造方法別
    • フロントエンド
    • バックエンド
    • ミッドエンド

第10章 先進半導体パッケージング市場- エンドユーザー別

  • 概要
    • セグメントシェア分析：エンドユーザー別
    • 家電
    • 自動車
    • IT・通信
    • 産業
    • ヘルスケア

第11章 先進半導体パッケージング市場-地域別

  • イントロダクション
  • 北米
    • 概要
    • 北米の主要メーカー
    • 米国
    • カナダ
  • 欧州
    • 概要
    • 欧州の主要メーカー
    • ドイツ
    • 英国
    • フランス
    • イタリア
    • スペイン
    • オランダ
    • スウェーデン
    • ロシア
    • ポーランド
    • その他
  • アジア太平洋（APAC）
    • 概要
    • アジア太平洋地域の主要メーカー
    • 中国
    • インド
    • 日本
    • 韓国
    • オーストラリア
    • インドネシア
    • タイ
    • フィリピン
    • その他
  • ラテンアメリカ（LATAM）
    • 概要
    • ラテンアメリカの主要メーカー
    • ブラジル
    • メキシコ
    • アルゼンチン
    • コロンビア
    • その他
  • 中東およびアフリカ（MEA）
    • 概要
    • 中東およびアフリカの主要メーカー
    • サウジアラビア
    • アラブ首長国連邦
    • イスラエル
    • トルコ
    • アルジェリア
    • エジプト
    • その他

第12章 主要ベンダー分析- 先進半導体パッケージング業界

  • 競合ダッシュボード
    • Competitive Benchmarking
    • Competitive Positioning
  • 企業プロファイル
    • Amkor Technology
    • ASE Group
    • Broadcom
    • ChipMOS Technologies
    • Intel Corporation
    • JCET Group
    • Micron Technology
    • NXP Semiconductors
    • Powertech Technology Inc.
    • Qualcomm
    • Renesas Electronics
    • Samsung Electronics
    • SPIL（Siliconware Precision Industries）
    • Texas Instruments
    • TSMC
    • UTAC
    • Others

第13章 アナリストの全方位的展望

目次
Product Code: ANV5330

REPORT HIGHLIGHT

The Advanced Semiconductor Packaging Market size was valued at US$ 38,209.43 Million in 2024, expanding at a CAGR of 8.50% from 2025 to 2032.

The **Advanced Semiconductor Packaging Market** refers to the segment of the semiconductor industry that involves integrating multiple chips into a single package using technologies like 2.5D, 3D IC, fan-out wafer-level packaging, and system-in-package (SiP) to enhance performance and reduce footprint. This market is experiencing transformation due to the surging demand for high-performance computing, AI-enabled devices, and energy-efficient electronics across data centers, automotive, and consumer electronics sectors. Emerging use cases in autonomous driving and edge AI are pushing chipmakers to adopt chiplet-based designs and advanced interconnects. With over 60% of high-end smartphone models in 2024 adopting fan-out packaging, manufacturers are heavily investing in R&D to meet thermal and electrical performance requirements. However, challenges such as high manufacturing cost, yield loss in complex designs, and limited infrastructure compatibility restrain widespread adoption. Opportunities are emerging from the growing interest in heterogeneous integration, particularly among cloud service providers and telecom players deploying 5G infrastructure, where advanced packaging plays a critical role in minimizing latency and maximizing bandwidth efficiency.

Advanced Semiconductor Packaging Market- Market Dynamics

Rising demand for high-performance and compact electronics to accelerate the adoption of advanced semiconductor packaging

Rising demand for high-performance and compact electronics is accelerating the adoption of advanced semiconductor packaging as industries seek to enhance device efficiency while reducing size and power consumption. According to the U.S. Department of Energy, data centers account for about 2% of total U.S. electricity use, prompting a push for more energy-efficient chip architectures, which is driving uptake of technologies like 3D IC and system-in-package. In 2023, Apple integrated a chiplet-based architecture in its M-series processors, showcasing the shift toward high-density packaging for performance optimization. Similarly, the European Union's Chips Act is investing over €43 billion to boost semiconductor capabilities, with a focus on innovation in packaging to support AI and IoT ecosystems. As electronics continue to scale down in size and ramp up in functionality, advanced packaging is becoming essential to meet the thermal, electrical, and spatial challenges in modern computing systems.

Advanced Semiconductor Packaging Market- Key Insights

As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 8.50% over the forecast period (2025-2032)

Based on Packaging Type segmentation, Flip Chip was predicted to show maximum market share in the year 2024

Based on Packaging Material segmentation, Substrate was the leading Packaging Material in 2024

Based on Fabrication Method segmentation, Back-End was the leading Fabrication Method in 2024

On the basis of region, Asia-Pacific was the leading revenue generator in 2024

Advanced Semiconductor Packaging Market- Segmentation Analysis:

The Global Advanced Semiconductor Packaging Market is segmented on the basis of Packaging Type, Packaging Material, Fabrication Method, End-User, and Region.

The market is divided into five categories based on Packaging Type: Flip Chip, Fan-Out Wafer Level, 2.5D/3D IC, System-in-Package (SiP), and Wafer-Level Chip Scale. Flip Chip leads with widespread use in CPUs and GPUs, followed by Fan-Out Wafer Level for mobile and wearable devices. 2.5D/3D IC gains traction in AI and HPC, while SiP supports IoT miniaturization; Wafer-Level Chip Scale suits compact sensors.

The market is divided into four categories based on Packaging Material: Substrate, Bonding Wire, Encapsulation Resin, and Die-Attach Material. Substrate dominates due to its critical role in multi-die integration, while Bonding Wire remains essential for traditional connections. Encapsulation Resin ensures durability in harsh environments, and Die-Attach Material supports thermal management and electrical performance in advanced chip assemblies.

Advanced Semiconductor Packaging Market- Geographical Insights

The Advanced Semiconductor Packaging Market demonstrates strong geographical diversity, with Asia-Pacific leading due to the dominance of countries like Taiwan, South Korea, China, and Japan in semiconductor fabrication and packaging infrastructure. Taiwan's TSMC and South Korea's Samsung have significantly scaled up 2.5D and 3D packaging capabilities to support AI and HPC chips, while China's ongoing investments under its "Made in China 2025" initiative aim to enhance domestic packaging technologies amid geopolitical tensions. Japan contributes innovations in materials and process equipment, reinforcing the regional supply chain. North America, particularly the United States, is witnessing increased momentum with government-backed initiatives such as the CHIPS and Science Act, encouraging domestic packaging capabilities to reduce reliance on overseas foundries. In Europe, countries like Germany and the Netherlands are advancing collaborative R&D through public-private partnerships to support packaging innovation, especially for automotive and industrial applications, where reliability and integration are critical.

Advanced Semiconductor Packaging Market- Competitive Landscape:

The competitive landscape of the Advanced Semiconductor Packaging Market is shaped by a mix of integrated device manufacturers, foundries, outsourced semiconductor assembly and test (OSAT) providers, and materials suppliers, all racing to develop cutting-edge packaging solutions. Industry giants like TSMC, Intel, and Samsung are heavily investing in chiplet integration and 3D packaging to support next-generation processors and AI workloads. Intel's advanced Foveros and EMIB technologies and TSMC's CoWoS and InFO platforms are driving competition in heterogeneous integration. OSAT players such as ASE Group and Amkor Technology are scaling up fan-out wafer-level and system-in-package capabilities to meet diverse application demands. Meanwhile, tech alliances are forming across the supply chain, with equipment and substrate makers collaborating to address challenges in thermal management and interconnect density. The growing emphasis on proprietary packaging platforms has also triggered a wave of strategic partnerships and acquisitions as players strive to secure market share and technological leadership.

Recent Developments:

In September 2024, Electroninks launched the world's first copper MOD ink for advanced semiconductor packaging, offering faster production, lower ownership costs, and greater sustainability by replacing traditional electroless copper plating and PVD methods.

In March 2025, Toray Engineering launched the UC5000, a high-accuracy semiconductor packaging bonder for large glass panels using panel-level packaging. Targeting advanced AI server demand, it enables +-0.8μm precision and supports next-generation chiplet integration from April 2025.

In January 2025, GlobalFoundries announced a $575 million Advanced Packaging and Photonics Center in Malta, New York, offering onshore advanced packaging, assembly, and testing for U.S.-made chips used in AI, automotive, aerospace, and defense, with an additional $186 million R&D investment planned.

In June 2024, Japan's Shin-Etsu Chemical launched advanced semiconductor packaging equipment using its new dual damascene method with excimer laser technology. This innovation eliminates the need for interposers, enabling finer microfabrication, reducing costs, and simplifying chiplet-based advanced semiconductor assembly.

SCOPE OF THE REPORT

The scope of this report covers the market by its major segments, which include as follows:

GLOBAL ADVANCED SEMICONDUCTOR PACKAGING MARKET KEY PLAYERS- DETAILED COMPETITIVE INSIGHTS

  • Amkor Technology
  • ASE Group
  • Broadcom
  • ChipMOS Technologies
  • Intel Corporation
  • JCET Group
  • Micron Technology
  • NXP Semiconductors
  • Powertech Technology Inc.
  • Qualcomm
  • Renesas Electronics
  • Samsung Electronics
  • SPIL (Siliconware Precision Industries)
  • Texas Instruments
  • TSMC
  • UTAC
  • Others

GLOBAL ADVANCED SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING TYPE- MARKET ANALYSIS, 2019 - 2032

  • Flip Chip
  • Fan-Out Wafer Level
  • 2.5D/3D IC
  • System-in-Package (SiP)
  • Wafer-Level Chip Scale

GLOBAL ADVANCED SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL- MARKET ANALYSIS, 2019 - 2032

  • Substrate
  • Bonding Wire
  • Encapsulation Resin
  • Die-Attach Material

GLOBAL ADVANCED SEMICONDUCTOR PACKAGING MARKET, BY FABRICATION METHOD- MARKET ANALYSIS, 2019 - 2032

  • Front-End
  • Back-End
  • Mid-End

GLOBAL ADVANCED SEMICONDUCTOR PACKAGING MARKET, BY END-USER- MARKET ANALYSIS, 2019 - 2032

  • Consumer Electronics
  • Automotive
  • IT & Telecommunication
  • Industrial
  • Healthcare

GLOBAL ADVANCED SEMICONDUCTOR PACKAGING MARKET, BY REGION- MARKET ANALYSIS, 2019 - 2032

  • North America
  • U.S.
  • Canada
  • Europe
  • Germany
  • UK
  • France
  • Italy
  • Spain
  • The Netherlands
  • Sweden
  • Russia
  • Poland
  • Rest of Europe
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
  • Indonesia
  • Thailand
  • Philippines
  • Rest of APAC
  • Latin America
  • Brazil
  • Mexico
  • Argentina
  • Colombia
  • Rest of LATAM
  • The Middle East and Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Turkey
  • Algeria
  • Egypt
  • Rest of MEA

Table of Contents

1. Advanced Semiconductor Packaging Market Overview

  • 1.1. Study Scope
  • 1.2. Market Estimation Years

2. Executive Summary

  • 2.1. Market Snippet
    • 2.1.1. Advanced Semiconductor Packaging Market Snippet by Packaging Type
    • 2.1.2. Advanced Semiconductor Packaging Market Snippet by Packaging Material
    • 2.1.3. Advanced Semiconductor Packaging Market Snippet by Fabrication Method
    • 2.1.4. Advanced Semiconductor Packaging Market Snippet by End-User
    • 2.1.5. Advanced Semiconductor Packaging Market Snippet by Country
    • 2.1.6. Advanced Semiconductor Packaging Market Snippet by Region
  • 2.2. Competitive Insights

3. Advanced Semiconductor Packaging Key Market Trends

  • 3.1. Advanced Semiconductor Packaging Market Drivers
    • 3.1.1. Impact Analysis of Market Drivers
  • 3.2. Advanced Semiconductor Packaging Market Restraints
    • 3.2.1. Impact Analysis of Market Restraints
  • 3.3. Advanced Semiconductor Packaging Market Opportunities
  • 3.4. Advanced Semiconductor Packaging Market Future Trends

4. Advanced Semiconductor Packaging Industry Study

  • 4.1. PEST Analysis
  • 4.2. Porter's Five Forces Analysis
  • 4.3. Growth Prospect Mapping
  • 4.4. Regulatory Framework Analysis

5. Advanced Semiconductor Packaging Market: Impact of Escalating Geopolitical Tensions

  • 5.1. Impact of COVID-19 Pandemic
  • 5.2. Impact of Russia-Ukraine War
  • 5.3. Impact of Middle East Conflicts

6. Advanced Semiconductor Packaging Market Landscape

  • 6.1. Advanced Semiconductor Packaging Market Share Analysis, 2024
  • 6.2. Breakdown Data, by Key Manufacturer
    • 6.2.1. Established Players' Analysis
    • 6.2.2. Emerging Players' Analysis

7. Advanced Semiconductor Packaging Market - By Packaging Type

  • 7.1. Overview
    • 7.1.1. Segment Share Analysis, By Packaging Type, 2024 & 2032 (%)
    • 7.1.2. Flip Chip
    • 7.1.3. Fan-Out Wafer Level
    • 7.1.4. 2.5D/3D IC
    • 7.1.5. System-in-Package (SiP)
    • 7.1.6. Wafer-Level Chip Scale

8. Advanced Semiconductor Packaging Market - By Packaging Material

  • 8.1. Overview
    • 8.1.1. Segment Share Analysis, By Packaging Material, 2024 & 2032 (%)
    • 8.1.2. Substrate
    • 8.1.3. Bonding Wire
    • 8.1.4. Encapsulation Resin
    • 8.1.5. Die-Attach Material

9. Advanced Semiconductor Packaging Market - By Fabrication Method

  • 9.1. Overview
    • 9.1.1. Segment Share Analysis, By Fabrication Method, 2024 & 2032 (%)
    • 9.1.2. Front-End
    • 9.1.3. Back-End
    • 9.1.4. Mid-End

10. Advanced Semiconductor Packaging Market - By End-User

  • 10.1. Overview
    • 10.1.1. Segment Share Analysis, By End-User, 2024 & 2032 (%)
    • 10.1.2. Consumer Electronics
    • 10.1.3. Automotive
    • 10.1.4. IT & Telecommunication
    • 10.1.5. Industrial
    • 10.1.6. Healthcare

11. Advanced Semiconductor Packaging Market- By Geography

  • 11.1. Introduction
    • 11.1.1. Segment Share Analysis, By Geography, 2024 & 2032 (%)
  • 11.2. North America
    • 11.2.1. Overview
    • 11.2.2. Advanced Semiconductor Packaging Key Manufacturers in North America
    • 11.2.3. North America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.2.4. North America Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
    • 11.2.5. North America Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
    • 11.2.6. North America Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
    • 11.2.7. North America Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.2.8. U.S.
      • 11.2.8.1. Overview
      • 11.2.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.2.8.3. U.S. Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.2.8.4. U.S. Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.2.8.5. U.S. Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.2.8.6. U.S. Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.2.9. Canada
      • 11.2.9.1. Overview
      • 11.2.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.2.9.3. Canada Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.2.9.4. Canada Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.2.9.5. Canada Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.2.9.6. Canada Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
  • 11.3. Europe
    • 11.3.1. Overview
    • 11.3.2. Advanced Semiconductor Packaging Key Manufacturers in Europe
    • 11.3.3. Europe Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.3.4. Europe Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
    • 11.3.5. Europe Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
    • 11.3.6. Europe Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
    • 11.3.7. Europe Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.3.8. Germany
      • 11.3.8.1. Overview
      • 11.3.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.8.3. Germany Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.3.8.4. Germany Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.3.8.5. Germany Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.3.8.6. Germany Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.3.9. UK
      • 11.3.9.1. Overview
      • 11.3.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.9.3. UK Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.3.9.4. UK Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.3.9.5. UK Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.3.9.6. UK Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.3.10. France
      • 11.3.10.1. Overview
      • 11.3.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.10.3. France Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.3.10.4. France Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.3.10.5. France Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.3.10.6. France Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.3.11. Italy
      • 11.3.11.1. Overview
      • 11.3.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.11.3. Italy Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.3.11.4. Italy Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.3.11.5. Italy Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.3.11.6. Italy Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.3.12. Spain
      • 11.3.12.1. Overview
      • 11.3.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.12.3. Spain Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.3.12.4. Spain Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.3.12.5. Spain Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.3.12.6. Spain Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.3.13. The Netherlands
      • 11.3.13.1. Overview
      • 11.3.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.13.3. The Netherlands Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.3.13.4. The Netherlands Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.3.13.5. The Netherlands Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.3.13.6. The Netherlands Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.3.14. Sweden
      • 11.3.14.1. Overview
      • 11.3.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.14.3. Sweden Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.3.14.4. Sweden Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.3.14.5. Sweden Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.3.14.6. Sweden Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.3.15. Russia
      • 11.3.15.1. Overview
      • 11.3.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.15.3. Russia Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.3.15.4. Russia Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.3.15.5. Russia Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.3.15.6. Russia Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.3.16. Poland
      • 11.3.16.1. Overview
      • 11.3.16.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.16.3. Poland Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.3.16.4. Poland Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.3.16.5. Poland Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.3.16.6. Poland Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.3.17. Rest of Europe
      • 11.3.17.1. Overview
      • 11.3.17.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.17.3. Rest of the Europe Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.3.17.4. Rest of the Europe Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.3.17.5. Rest of the Europe Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.3.17.6. Rest of the Europe Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
  • 11.4. Asia Pacific (APAC)
    • 11.4.1. Overview
    • 11.4.2. Advanced Semiconductor Packaging Key Manufacturers in Asia Pacific
    • 11.4.3. APAC Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.4.4. APAC Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
    • 11.4.5. APAC Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
    • 11.4.6. APAC Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
    • 11.4.7. APAC Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.4.8. China
      • 11.4.8.1. Overview
      • 11.4.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.8.3. China Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.4.8.4. China Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.4.8.5. China Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.4.8.6. China Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.4.9. India
      • 11.4.9.1. Overview
      • 11.4.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.9.3. India Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.4.9.4. India Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.4.9.5. India Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.4.9.6. India Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.4.10. Japan
      • 11.4.10.1. Overview
      • 11.4.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.10.3. Japan Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.4.10.4. Japan Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.4.10.5. Japan Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.4.10.6. Japan Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.4.11. South Korea
      • 11.4.11.1. Overview
      • 11.4.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.11.3. South Korea Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.4.11.4. South Korea Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.4.11.5. South Korea Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.4.11.6. South Korea Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.4.12. Australia
      • 11.4.12.1. Overview
      • 11.4.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.12.3. Australia Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.4.12.4. Australia Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.4.12.5. Australia Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.4.12.6. Australia Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.4.13. Indonesia
      • 11.4.13.1. Overview
      • 11.4.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.13.3. Indonesia Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.4.13.4. Indonesia Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.4.13.5. Indonesia Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.4.13.6. Indonesia Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.4.14. Thailand
      • 11.4.14.1. Overview
      • 11.4.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.14.3. Thailand Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.4.14.4. Thailand Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.4.14.5. Thailand Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.4.14.6. Thailand Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.4.15. Philippines
      • 11.4.15.1. Overview
      • 11.4.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.15.3. Philippines Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.4.15.4. Philippines Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.4.15.5. Philippines Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.4.15.6. Philippines Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.4.16. Rest of APAC
      • 11.4.16.1. Overview
      • 11.4.16.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.16.3. Rest of APAC Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.4.16.4. Rest of APAC Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.4.16.5. Rest of APAC Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.4.16.6. Rest of APAC Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
  • 11.5. Latin America (LATAM)
    • 11.5.1. Overview
    • 11.5.2. Advanced Semiconductor Packaging Key Manufacturers in Latin America
    • 11.5.3. LATAM Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.5.4. LATAM Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
    • 11.5.5. LATAM Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
    • 11.5.6. LATAM Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
    • 11.5.7. LATAM Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.5.8. Brazil
      • 11.5.8.1. Overview
      • 11.5.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.8.3. Brazil Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.5.8.4. Brazil Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.5.8.5. Brazil Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.5.8.6. Brazil Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.5.9. Mexico
      • 11.5.9.1. Overview
      • 11.5.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.9.3. Mexico Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.5.9.4. Mexico Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.5.9.5. Mexico Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.5.9.6. Mexico Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.5.10. Argentina
      • 11.5.10.1. Overview
      • 11.5.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.10.3. Argentina Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.5.10.4. Argentina Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.5.10.5. Argentina Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.5.10.6. Argentina Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.5.11. Colombia
      • 11.5.11.1. Overview
      • 11.5.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.11.3. Colombia Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.5.11.4. Colombia Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.5.11.5. Colombia Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.5.11.6. Colombia Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.5.12. Rest of LATAM
      • 11.5.12.1. Overview
      • 11.5.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.12.3. Rest of LATAM Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.5.12.4. Rest of LATAM Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.5.12.5. Rest of LATAM Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.5.12.6. Rest of LATAM Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
  • 11.6. Middle East and Africa (MEA)
    • 11.6.1. Overview
    • 11.6.2. Advanced Semiconductor Packaging Key Manufacturers in Middle East and Africa
    • 11.6.3. MEA Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.6.4. MEA Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
    • 11.6.5. MEA Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
    • 11.6.6. MEA Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
    • 11.6.7. MEA Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.6.8. Saudi Arabia
      • 11.6.8.1. Overview
      • 11.6.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.8.3. Saudi Arabia Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.6.8.4. Saudi Arabia Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.6.8.5. Saudi Arabia Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.6.8.6. Saudi Arabia Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.6.9. United Arab Emirates
      • 11.6.9.1. Overview
      • 11.6.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.9.3. United Arab Emirates Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.6.9.4. United Arab Emirates Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.6.9.5. United Arab Emirates Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.6.9.6. United Arab Emirates Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.6.10. Israel
      • 11.6.10.1. Overview
      • 11.6.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.10.3. Israel Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.6.10.4. Israel Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.6.10.5. Israel Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.6.10.6. Israel Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.6.11. Turkey
      • 11.6.11.1. Overview
      • 11.6.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.11.3. Turkey Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.6.11.4. Turkey Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.6.11.5. Turkey Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.6.11.6. Turkey Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.6.12. Algeria
      • 11.6.12.1. Overview
      • 11.6.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.12.3. Algeria Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.6.12.4. Algeria Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.6.12.5. Algeria Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.6.12.6. Algeria Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.6.13. Egypt
      • 11.6.13.1. Overview
      • 11.6.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.13.3. Egypt Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.6.13.4. Egypt Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.6.13.5. Egypt Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.6.13.6. Egypt Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)
    • 11.6.14. Rest of MEA
      • 11.6.14.1. Overview
      • 11.6.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.14.3. Rest of MEA Market Size and Forecast, By Packaging Type, 2019 - 2032 (US$ Million)
      • 11.6.14.4. Rest of MEA Market Size and Forecast, By Packaging Material, 2019 - 2032 (US$ Million)
      • 11.6.14.5. Rest of MEA Market Size and Forecast, By Fabrication Method, 2019 - 2032 (US$ Million)
      • 11.6.14.6. Rest of MEA Market Size and Forecast, By End-User, 2019 - 2032 (US$ Million)

12. Key Vendor Analysis- Advanced Semiconductor Packaging Industry

  • 12.1. Competitive Dashboard
    • 12.1.1. Competitive Benchmarking
    • 12.1.2. Competitive Positioning
  • 12.2. Company Profiles
    • 12.2.1. Amkor Technology
    • 12.2.2. ASE Group
    • 12.2.3. Broadcom
    • 12.2.4. ChipMOS Technologies
    • 12.2.5. Intel Corporation
    • 12.2.6. JCET Group
    • 12.2.7. Micron Technology
    • 12.2.8. NXP Semiconductors
    • 12.2.9. Powertech Technology Inc.
    • 12.2.10. Qualcomm
    • 12.2.11. Renesas Electronics
    • 12.2.12. Samsung Electronics
    • 12.2.13. SPIL (Siliconware Precision Industries)
    • 12.2.14. Texas Instruments
    • 12.2.15. TSMC
    • 12.2.16. UTAC
    • 12.2.17. Others

13. 360 Degree AnalystView

14. Appendix

  • 14.1. Research Methodology
  • 14.2. References
  • 14.3. Abbreviations
  • 14.4. Disclaimer
  • 14.5. Contact Us