ベアダイの出荷・ハンドリングと加工・保管の世界市場予測（～2030年）：製品別、用途別、地域別の分析

Stratistics MRCによると、世界のベアダイの出荷・ハンドリングと加工・保管の市場規模は、2024年に11億5,000万米ドルを占め、予測期間中にCAGR8.0％で成長し、2030年には18億3,000万米ドルに達すると予測されています。 ベアダイの出荷・ハンドリングと加工・保管は、最初の輸送から最終的な保管まで、個々の半導体チップのライフサイクル全体を包含します。

これには、ベアダイを製造施設から組立工場やパッケージング工場まで慎重に輸送すること、損傷を防ぐために正確に取り扱うこと、厳格な試験、洗浄、検査工程にかけること、品質と完全性を維持するために管理された環境で保管することなどが含まれます。これらの細心の工程は、さまざまな産業における半導体デバイスの信頼性と最適な性能を確保するために不可欠です。

成長する半導体産業

活況を呈する半導体産業では、半導体の取り扱いに精密さが求められるようになり、ベアダイの安全で効率的な出荷・保管ソリューションの成長が促進されています。チップの複雑化と小型化が進むにつれ、メーカーは輸送や保管中の損傷、汚染、静電気放電を防止する特殊な装置や材料を必要としています。さらに、半導体産業がより小型で繊細な部品へとシフトしていることも、パッケージングとハンドリングの技術革新を促し、市場の需要をさらに押し上げています。最後に、世界の半導体サプライチェーンは効率とリスク管理を重視しており、高品質のハンドリング・保管製品への投資を促し、市場の継続的な成長を促進しています。

ハンドリングと出荷の複雑さ

取り扱いと出荷が複雑なのは、ほこり、湿気、静電気などの敏感な環境要因によるもので、特殊なパッケージングと制御された出荷条件が必要です。先進パッケージングソリューションの必要性はコストを上昇させ、製造業者やエンドユーザーにとって魅力的なプロセスではなくなります。さらに、輸送中に破損する危険性が高いため、細心の取り扱いが要求され、しばしば出荷が遅れ、全体的な物流効率に影響を与えます。ベアダイの安全な取り扱いと輸送に必要な専門的な知識と設備は、こうしたサービスを提供できるプロバイダーの数を制限し、市場の拡大を制限しています。最後に、各地域における安全性と品質に関する厳しい規制基準の遵守が物流をさらに複雑にし、市場のシームレスな成長を妨げる運用上のハードルを増やしています。

先進パッケージング技術の開発

先進パッケージング技術の開発により、輸送や保管中のベアダイ部品の保護が強化され、繊細な半導体素子にとって極めて重要な損傷や損失のリスクが軽減されます。先進パッケージングソリューションはまた、熱管理と小型化を改善し、小型電子機器に対する需要の増加をサポートします。強化されたハンドリングソリューションは、デリケートなベアダイ材料特有のニーズに対応し、物流を最適化して汚染リスクを低減します。さらに、高性能コンピューティングとIoTデバイスの増加に伴い、先進パッケージング技術は、信頼性が高く効率的なコンポーネントの輸送と保管のニーズに対応しています。この進歩は、半導体サプライチェーン全体を通じて品質と信頼性を確保することで、最終的に市場の成長を支えています。

原材料価格の変動

シリコン、金属、パッケージング化合物のような原材料価格の変動は、製造費用に直接影響し、この分野の企業にとって価格戦略や利益率に矛盾を生じさせます。原材料価格が高騰すると、企業は操業コストの上昇に直面し、収益性が低下し、先端技術への投資や生産能力の拡大が制限される可能性があります。また、こうした不安定さは、最終顧客にとっても予測不可能な価格設定につながり、安定した需要を維持することを困難にします。さらに、価格変動は、企業が契約の再交渉を求めたり、代替ソースを探したりすることで、サプライヤーとの関係を緊張させ、サプライチェーンを混乱させる可能性があります。

COVID-19の影響

COVID-19の大流行は、ベアダイの出荷・ハンドリングと加工・保管市場に大きな影響を与えました。サプライチェーンの混乱、労働力不足、電子機器の需要増により、ベアダイのシームレスな流れに課題が生じました。しかし、パンデミックはリモートワークやオンライン学習の採用を加速させ、電子機器や半導体の需要を牽引しました。世界経済が回復するにつれて、将来の混乱を緩和するための弾力性のあるサプライチェーン、自動化、先端技術に焦点が当てられ、市場は回復すると予想されます。

予測期間中、輸送用チューブセグメントが最大になる見込み

予測期間中、輸送用チューブセグメントは、繊細なベアダイ部品に合わせた安全で効率的なパッケージングソリューションを提供することで、最大の市場シェアを獲得するとみられます。これらのチューブは、物理的損傷、汚染、静電気放電から保護するように設計されており、輸送中のベアダイの安全性と完全性を保証します。さらに、輸送用チューブは、円筒形状のため積み重ねやスペースの最適化が容易で、輸送コストを削減し、取り扱いの利便性を向上させるため、物流効率を高めます。全体として、輸送用チューブのような信頼性の高いパッケージングに対する需要は、安全な取り扱いや保管ソリューションに対する世界のニーズの高まりと一致しており、この分野の市場成長を後押ししています。

予測期間中、コンピュータセグメントのCAGRが最も高くなる見込み

予測期間中、高性能でコンパクトなコンピューティングデバイスにより、コンピュータセグメントが最も高い成長率を示すと予測されます。デバイスの小型化と高性能化に伴い、ベアダイの取り扱いと処理は、損傷を最小限に抑え、無駄を省き、信頼性を向上させるために、正確に行われる必要があります。さらに、人工知能（AI）、クラウドコンピューティング、データセンターなどのコンピュータ産業の拡大により、高密度チップの必要性が高まっています。3D積層や微細化のような洗練された技術は、特定のベアダイの取り扱いと保管ソリューションを必要とするため、半導体製造における絶え間ない技術革新も市場を後押しします。安全で効果的なダイ処理における技術的ブレークスルーを促進することで、この動向はコンピュータカテゴリーが引き続き市場に大きく貢献することを保証しています。

最大のシェアを占める地域：

予測期間中、アジア太平洋は堅調な半導体製造業により、最大の市場シェアを占めると予測されています。アジア太平洋は、世界のベアダイの出荷・ハンドリングと加工・保管市場を独占しています。同地域の急速な技術進歩、家電生産の増加、自動車部門の台頭が市場の成長を後押ししています。さらに、半導体製造を促進する政府の取り組みや研究開発への投資が、市場の潜在力をさらに高めています。

CAGRが最も高い地域：

予測期間中、北米が最も高いCAGRを記録すると予測されます。これは、大手半導体メーカーの存在と、技術的進歩への強い注目によるものです。同地域の企業は、高品質なパッケージングソリューションの提供、安全な保管、汚染や損傷を防ぐための効率的な取り扱いに注力しています。パッケージングには、最終製品にパッケージされる前の個々の半導体チップであるベア半導体のダイの輸送と保管が含まれます。同市場は、製造プロセスの進歩や小型化された電子部品の採用急増に伴い、成長が見込まれています。

無料カスタマイズサービス：

本レポートをご購読のお客様には、以下の無料カスタマイズオプションのいずれかをご利用いただけます：

• 企業プロファイル
  • 追加市場企業の包括的プロファイリング（3社まで）
  • 主要企業のSWOT分析（3社まで）
• 地域セグメンテーション
  • 顧客の関心に応じた主要国の市場推計・予測・CAGR（注：フィージビリティチェックによる）
• 競合ベンチマーキング
  • 製品ポートフォリオ、地理的プレゼンス、戦略的提携に基づく主要企業のベンチマーキング

目次

第1章 エグゼクティブサマリー

第2章 序文

• 概要
• ステークホルダー
• 調査範囲
• 調査手法
  • データマイニング
  • データ分析
  • データ検証
  • 調査アプローチ
• 調査情報源
  • 1次調査情報源
  • 2次調査情報源
  • 前提条件

第3章 市場動向分析

• 促進要因
• 抑制要因
• 機会
• 脅威
• 製品分析
• 用途分析
• 新興市場
• COVID-19の影響

第4章 ポーターのファイブフォース分析

• 供給企業の交渉力
• 買い手の交渉力
• 代替品の脅威
• 新規参入業者の脅威
• 競争企業間の敵対関係

第5章 世界のベアダイの出荷・ハンドリングと加工・保管市場：製品別

• 輸送用チューブ
• トレイ
• キャリアテープ
• その他の製品

第6章 世界のベアダイの出荷・ハンドリングと加工・保管市場：用途別

• 自動車
• 通信
• コンピュータ
• 家電
• 防衛
• 産業・医療
• その他の用途

第7章 世界のベアダイの出荷・ハンドリングと加工・保管市場：地域別

• 北米
  • 米国
  • カナダ
  • メキシコ
• 欧州
  • ドイツ
  • 英国
  • イタリア
  • フランス
  • スペイン
  • その他欧州
• アジア太平洋
  • 日本
  • 中国
  • インド
  • オーストラリア
  • ニュージーランド
  • 韓国
  • その他アジア太平洋
• 南米
  • アルゼンチン
  • ブラジル
  • チリ
  • その他南米
• 中東・アフリカ
  • サウジアラビア
  • アラブ首長国連邦
  • カタール
  • 南アフリカ
  • その他中東・アフリカ

第8章 主な発展

• 契約、パートナーシップ、コラボレーション、合弁事業
• 買収と合併
• 新製品発売
• 事業拡大
• その他の主要戦略

第9章 企業プロファイリング

• Advanced Semiconductor Engineering, Inc.（ASE Group）
• Amkor Technology, Inc.
• STATS ChipPAC Ltd.
• Carsem（M）Sdn. Bhd.
• JCET Group Co., Ltd.
• Siliconware Precision Industries Co., Ltd.（SPIL）
• Tianshui Huatian Technology Co., Ltd.
• Nepes Corporation
• Deca Technologies
• J-Devices Corporation
• UTAC Group
• Semiconductor Manufacturing International Corporation（SMIC）
• Skyworks Solutions, Inc.
• Qualcomm Technologies, Inc.
• Xilinx, Inc.

List of Tables

• Table 1 Global Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Region (2022-2030) ($MN)
• Table 2 Global Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Product (2022-2030) ($MN)
• Table 3 Global Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Shipping Tubes (2022-2030) ($MN)
• Table 4 Global Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Trays (2022-2030) ($MN)
• Table 5 Global Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Carrier Tapes (2022-2030) ($MN)
• Table 6 Global Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Other Products (2022-2030) ($MN)
• Table 7 Global Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Application (2022-2030) ($MN)
• Table 8 Global Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Automotive (2022-2030) ($MN)
• Table 9 Global Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Communications (2022-2030) ($MN)
• Table 10 Global Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Computers (2022-2030) ($MN)
• Table 11 Global Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Consumer Electronics (2022-2030) ($MN)
• Table 12 Global Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Defense (2022-2030) ($MN)
• Table 13 Global Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Industrial & Medical (2022-2030) ($MN)
• Table 14 Global Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Other Applications (2022-2030) ($MN)
• Table 15 North America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Country (2022-2030) ($MN)
• Table 16 North America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Product (2022-2030) ($MN)
• Table 17 North America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Shipping Tubes (2022-2030) ($MN)
• Table 18 North America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Trays (2022-2030) ($MN)
• Table 19 North America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Carrier Tapes (2022-2030) ($MN)
• Table 20 North America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Other Products (2022-2030) ($MN)
• Table 21 North America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Application (2022-2030) ($MN)
• Table 22 North America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Automotive (2022-2030) ($MN)
• Table 23 North America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Communications (2022-2030) ($MN)
• Table 24 North America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Computers (2022-2030) ($MN)
• Table 25 North America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Consumer Electronics (2022-2030) ($MN)
• Table 26 North America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Defense (2022-2030) ($MN)
• Table 27 North America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Industrial & Medical (2022-2030) ($MN)
• Table 28 North America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Other Applications (2022-2030) ($MN)
• Table 29 Europe Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Country (2022-2030) ($MN)
• Table 30 Europe Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Product (2022-2030) ($MN)
• Table 31 Europe Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Shipping Tubes (2022-2030) ($MN)
• Table 32 Europe Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Trays (2022-2030) ($MN)
• Table 33 Europe Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Carrier Tapes (2022-2030) ($MN)
• Table 34 Europe Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Other Products (2022-2030) ($MN)
• Table 35 Europe Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Application (2022-2030) ($MN)
• Table 36 Europe Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Automotive (2022-2030) ($MN)
• Table 37 Europe Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Communications (2022-2030) ($MN)
• Table 38 Europe Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Computers (2022-2030) ($MN)
• Table 39 Europe Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Consumer Electronics (2022-2030) ($MN)
• Table 40 Europe Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Defense (2022-2030) ($MN)
• Table 41 Europe Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Industrial & Medical (2022-2030) ($MN)
• Table 42 Europe Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Other Applications (2022-2030) ($MN)
• Table 43 Asia Pacific Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Country (2022-2030) ($MN)
• Table 44 Asia Pacific Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Product (2022-2030) ($MN)
• Table 45 Asia Pacific Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Shipping Tubes (2022-2030) ($MN)
• Table 46 Asia Pacific Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Trays (2022-2030) ($MN)
• Table 47 Asia Pacific Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Carrier Tapes (2022-2030) ($MN)
• Table 48 Asia Pacific Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Other Products (2022-2030) ($MN)
• Table 49 Asia Pacific Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Application (2022-2030) ($MN)
• Table 50 Asia Pacific Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Automotive (2022-2030) ($MN)
• Table 51 Asia Pacific Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Communications (2022-2030) ($MN)
• Table 52 Asia Pacific Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Computers (2022-2030) ($MN)
• Table 53 Asia Pacific Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Consumer Electronics (2022-2030) ($MN)
• Table 54 Asia Pacific Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Defense (2022-2030) ($MN)
• Table 55 Asia Pacific Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Industrial & Medical (2022-2030) ($MN)
• Table 56 Asia Pacific Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Other Applications (2022-2030) ($MN)
• Table 57 South America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Country (2022-2030) ($MN)
• Table 58 South America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Product (2022-2030) ($MN)
• Table 59 South America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Shipping Tubes (2022-2030) ($MN)
• Table 60 South America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Trays (2022-2030) ($MN)
• Table 61 South America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Carrier Tapes (2022-2030) ($MN)
• Table 62 South America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Other Products (2022-2030) ($MN)
• Table 63 South America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Application (2022-2030) ($MN)
• Table 64 South America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Automotive (2022-2030) ($MN)
• Table 65 South America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Communications (2022-2030) ($MN)
• Table 66 South America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Computers (2022-2030) ($MN)
• Table 67 South America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Consumer Electronics (2022-2030) ($MN)
• Table 68 South America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Defense (2022-2030) ($MN)
• Table 69 South America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Industrial & Medical (2022-2030) ($MN)
• Table 70 South America Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Other Applications (2022-2030) ($MN)
• Table 71 Middle East & Africa Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Country (2022-2030) ($MN)
• Table 72 Middle East & Africa Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Product (2022-2030) ($MN)
• Table 73 Middle East & Africa Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Shipping Tubes (2022-2030) ($MN)
• Table 74 Middle East & Africa Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Trays (2022-2030) ($MN)
• Table 75 Middle East & Africa Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Carrier Tapes (2022-2030) ($MN)
• Table 76 Middle East & Africa Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Other Products (2022-2030) ($MN)
• Table 77 Middle East & Africa Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Application (2022-2030) ($MN)
• Table 78 Middle East & Africa Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Automotive (2022-2030) ($MN)
• Table 79 Middle East & Africa Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Communications (2022-2030) ($MN)
• Table 80 Middle East & Africa Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Computers (2022-2030) ($MN)
• Table 81 Middle East & Africa Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Consumer Electronics (2022-2030) ($MN)
• Table 82 Middle East & Africa Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Defense (2022-2030) ($MN)
• Table 83 Middle East & Africa Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Industrial & Medical (2022-2030) ($MN)
• Table 84 Middle East & Africa Bare Die Shipping & Handling and Processing & Storage Market Outlook, By Other Applications (2022-2030) ($MN)

According to Stratistics MRC, the Global Bare Die Shipping & Handling and Processing & Storage Market is accounted for $1.15 billion in 2024 and is expected to reach $1.83 billion by 2030 growing at a CAGR of 8.0% during the forecast period. Bare Die Shipping, Handling, Processing, and Storage encompasses the entire lifecycle of individual semiconductor chips, from their initial transportation to their final storage. This involves carefully transporting bare dies from manufacturing facilities to assembly and packaging plants, handling them with precision to prevent damage, subjecting them to rigorous testing, cleaning, and inspection processes, and storing them in controlled environments to maintain their quality and integrity. These meticulous processes are essential to ensure the reliability and optimal performance of semiconductor devices across various industries.

Market Dynamics:

Driver:

Growing semiconductor industry

The booming semiconductor industry, the need for precision in semiconductor handling has intensified, fostering growth in safe and efficient shipping and storage solutions for bare dies. As chip complexity and miniaturization increase, manufacturers require specialized equipment and materials that prevent damage, contamination, and electrostatic discharge during transport and storage. Furthermore, the semiconductor industry's shift toward smaller, more delicate components also drives innovation in packaging and handling, further boosting market demand. Lastly, the global semiconductor supply chain's emphasis on efficiency and risk management encourages investments in high-quality handling and storage products, promoting continuous market growth.

Restraint:

Complexity in handling and shipping

Complexity in handling and shipping is due to sensitive environmental factors like dust, moisture, and static electricity, requiring specialized packaging and controlled shipping conditions. The need for advanced packaging solutions increases costs, making the process less appealing for manufacturers and end-users. Additionally, the high risk of damage during transit demands meticulous handling and often delays shipment, impacting overall logistics efficiency. The specialized knowledge and equipment needed for safe handling and transport of bare dies limit the number of providers capable of offering these services, restricting market expansion. Lastly, compliance with strict regulatory standards for safety and quality in different regions further complicates logistics, adding operational hurdles that impede the seamless growth of the market.

Opportunity:

Development of advanced packaging technologies

The development of advanced packaging technologies, enhance the protection of bare die components during transportation and storage, reducing the risk of damage and loss, which is crucial for sensitive semiconductor elements. Advanced packaging solutions also improve thermal management and miniaturization, supporting the increasing demand for compact electronic devices. Enhanced handling solutions address the specific needs of delicate bare die materials, optimizing logistics and reducing contamination risks. Moreover, with the rise in high-performance computing and IoT devices, advanced packaging technologies cater to the need for reliable and efficient component transport and storage. This advancement ultimately supports the market's growth by ensuring quality and reliability throughout the semiconductor supply chain.

Threat:

Volatility in raw material prices

Volatility in raw material prices like silicon, metals, and packaging compounds directly impact manufacturing expenses, causing inconsistencies in pricing strategies and profit margins for companies in this sector. When raw material prices surge, companies face higher operational costs, which can reduce profitability and limit their capacity to invest in advanced technologies or expand their production capabilities. This instability can also lead to unpredictable pricing for end customers, making it challenging to maintain steady demand. Additionally, price volatility can strain supplier relationships as companies seek to renegotiate contracts or look for alternative sources, potentially disrupting supply chains.

Covid-19 Impact

The COVID-19 pandemic significantly impacted the Bare Die Shipping, Handling, Processing, and Storage market. Supply chain disruptions, labor shortages, and increased demand for electronic devices led to challenges in the seamless flow of bare dies. However, the pandemic also accelerated the adoption of remote work and online learning, driving demand for electronic devices and semiconductors. As the global economy recovers, the market is expected to rebound, with a focus on resilient supply chains, automation, and advanced technologies to mitigate future disruptions.

The shipping tubes segment is expected to be the largest during the forecast period

Over the estimation period, the shipping tubes segment is likely to capture the largest market share, by providing secure, efficient packaging solutions tailored to sensitive bare die components. These tubes are designed to protect against physical damage, contamination, and static discharge, ensuring the safety and integrity of bare dies during transit. Additionally, shipping tubes enhance logistics efficiency, as their cylindrical shape enables easy stacking and space optimization, lowering shipping costs and improving handling convenience. Overall, the demand for reliable packaging like shipping tubes aligns with the increased global need for secure handling and storage solutions, propelling market growth in this sector.

The computers segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the computers segment is predicted to witness the highest growth rate, due to high-performance and compact computing devices. The handling and processing of bare dies must be done precisely as devices get smaller and more powerful in order to minimise damage, cut down on waste, and improve dependability. Furthermore, the expansion of computer industries likes artificial intelligence (AI), cloud computing, and data centres increases the need for high-density chips. Continuous innovation in semiconductor manufacturing also helps the market because sophisticated techniques like 3D stacking and miniaturisation call for specific bare die handling and storage solutions. By promoting technological breakthroughs in safe and effective die processing, this trend guarantees that the computers category will continue to contribute significantly to the market.

Region with largest share:

Over the forecast period, the Asia Pacific region is anticipated to hold the largest market share due to their robust semiconductor manufacturing industries. The Asia Pacific region dominates the global Bare Die Shipping, Handling, Processing, and Storage market. The region's rapid technological advancements, increasing consumer electronics production, and rising automotive sector fuel the market's growth. Additionally, government initiatives to promote semiconductor manufacturing and investments in research and development further bolster the market's potential.

Region with highest CAGR:

During the forecast period, the North America region is anticipated to register the highest CAGR, owing to the presence of major semiconductor manufacturers and a strong focus on technological advancements. Companies in the region focus on providing high-quality packaging solutions, secure storage, and efficient handling to prevent contamination or damage. It involves the transportation and storage of bare semiconductor dies, which are individual chips before being packaged into final products. The market is expected to grow with advancements in manufacturing processes and a surge in the adoption of miniaturized electronic components.

Key players in the market

Some of the key players profiled in the Bare Die Shipping & Handling and Processing & Storage Market include Advanced Semiconductor Engineering, Inc. (ASE Group), Amkor Technology, Inc., STATS ChipPAC Ltd., Carsem (M) Sdn. Bhd., JCET Group Co., Ltd., Siliconware Precision Industries Co., Ltd. (SPIL), Tianshui Huatian Technology Co., Ltd., Nepes Corporation, Deca Technologies, J-Devices Corporation, UTAC Group, Semiconductor Manufacturing International Corporation (SMIC), Skyworks Solutions, Inc., Qualcomm Technologies, Inc. and Xilinx, Inc.

Key Developments:

In October 2024, Amkor and TSMC announced a significant collaboration to bring advanced packaging and test capabilities to Arizona. This strategic partnership aims to expand the region's semiconductor ecosystem and accelerate the development of advanced technologies like Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS).

In April 2024, Amkor and Infineon strengthened their long-standing partnership by establishing a dedicated packaging and test center in Porto, Portugal. This collaboration aims to enhance the European semiconductor supply chain and cater to the growing demand for automotive and IoT applications.

Products Covered:

• Shipping Tubes
• Trays
• Carrier Tapes
• Other Products

Applications Covered:

• Automotive
• Communications
• Computers
• Consumer Electronics
• Defense
• Industrial & Medical
• Other Applications

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Product Analysis
• 3.7 Application Analysis
• 3.8 Emerging Markets
• 3.9 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Bare Die Shipping & Handling and Processing & Storage Market, By Product

• 5.1 Introduction
• 5.2 Shipping Tubes
• 5.3 Trays
• 5.4 Carrier Tapes
• 5.5 Other Products

6 Global Bare Die Shipping & Handling and Processing & Storage Market, By Application

• 6.1 Introduction
• 6.2 Automotive
• 6.3 Communications
• 6.4 Computers
• 6.5 Consumer Electronics
• 6.6 Defense
• 6.7 Industrial & Medical
• 6.8 Other Applications

7 Global Bare Die Shipping & Handling and Processing & Storage Market, By Geography

• 7.1 Introduction
• 7.2 North America
  • 7.2.1 US
  • 7.2.2 Canada
  • 7.2.3 Mexico
• 7.3 Europe
  • 7.3.1 Germany
  • 7.3.2 UK
  • 7.3.3 Italy
  • 7.3.4 France
  • 7.3.5 Spain
  • 7.3.6 Rest of Europe
• 7.4 Asia Pacific
  • 7.4.1 Japan
  • 7.4.2 China
  • 7.4.3 India
  • 7.4.4 Australia
  • 7.4.5 New Zealand
  • 7.4.6 South Korea
  • 7.4.7 Rest of Asia Pacific
• 7.5 South America
  • 7.5.1 Argentina
  • 7.5.2 Brazil
  • 7.5.3 Chile
  • 7.5.4 Rest of South America
• 7.6 Middle East & Africa
  • 7.6.1 Saudi Arabia
  • 7.6.2 UAE
  • 7.6.3 Qatar
  • 7.6.4 South Africa
  • 7.6.5 Rest of Middle East & Africa

8 Key Developments

• 8.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 8.2 Acquisitions & Mergers
• 8.3 New Product Launch
• 8.4 Expansions
• 8.5 Other Key Strategies

9 Company Profiling

• 9.1 Advanced Semiconductor Engineering, Inc. (ASE Group)
• 9.2 Amkor Technology, Inc.
• 9.3 STATS ChipPAC Ltd.
• 9.4 Carsem (M) Sdn. Bhd.
• 9.5 JCET Group Co., Ltd.
• 9.6 Siliconware Precision Industries Co., Ltd. (SPIL)
• 9.7 Tianshui Huatian Technology Co., Ltd.
• 9.8 Nepes Corporation
• 9.9 Deca Technologies
• 9.10 J-Devices Corporation
• 9.11 UTAC Group
• 9.12 Semiconductor Manufacturing International Corporation (SMIC)
• 9.13 Skyworks Solutions, Inc.
• 9.14 Qualcomm Technologies, Inc.
• 9.15 Xilinx, Inc.