ブロードバンド電力線通信チップセット市場レポート：動向、予測、競合分析 (2031年まで)

世界のブロードバンド電力線通信 (PLC) チップセット市場の将来は、スマートグリッド、ネットワーキング、照明、セキュリティ・監視、長距離、M2M（Machine to Machine）市場に機会があり、有望視されています。世界のブロードバンド電力線通信チップセット市場は、2025年から2031年までのCAGRが14.6%で、2031年までに推定98億米ドルに達すると予想されています。この市場の主な促進要因は、スマートグリッド技術の利用拡大や高速インターネット需要の高まり、スマートシティの市場開拓を推進する政府の取り組みの活発化、エネルギー効率の重視の高まりなどです。

• Lucintelは、スタンドアロンPLCチップセットは電力網への接続を必要とするだけであるため設置が容易であり、既存の住宅や建物の改修に最適であることから、技術カテゴリーではスタンドアロン・セグメントが予測期間中最大のセグメントであり続けると予測しています。
• 地域別では、アジア太平洋がインターネットアクセスの旺盛な需要により、予測期間中も最大地域であり続けると思われます。

ブロードバンド電力線通信チップセット市場の戦略的成長機会

ブロードバンドPLCチップセット市場の活用領域は、幅広い用途で数多くの戦略的成長機会を提供しているように見えます。利害関係者が市場の利用可能な動向を最大限に活用し、それに応じて供給を満たすには、こうした機会を特定することが極めて重要です。

• スマートホーム用途：スマートホーム・ソリューションに対する需要の高まりは、PLCチップセットの可能性を生み出しています。この技術は、スマートデバイスのシームレスな相互作用と制御を促進し、ホームオートメーションを強化します。
• 産業オートメーション：産業オートメーションへのPLCチップセットの応用が増加しています。これらのチップセットは産業環境において効果的な通信と制御を提供し、自動化システムとスマート製造の成長を促進します。
• スマートグリッド統合：スマートグリッドでの用途向けにPLCチップセットの開発が進む市場があります。これらのチップセットは、エネルギー管理、モニタリング、制御の新機能を提供し、より優れた効率的なエネルギーシステムの進化につながります。
• 農村接続ソリューション：農村部や遠隔地の接続性を改善するためのPLCチップセットの使用も増加しています。このようなソリューションにより、通信やブロードバンドアクセスのインフラが限られている地域での開発が可能になります。
• エネルギー管理システム：エネルギー管理システムにはPLCチップセットの可能性があります。これらの技術は、エネルギー消費の観察と制御を強化し、持続可能性と効率性の目標達成を可能にします。

スマートホーム、産業オートメーション、スマートグリッド統合の活用領域の拡大は、ブロードバンドPLCチップセット市場の戦略的成長機会となっています。農村部の接続とエネルギー管理の戦略も、市場の成長と技術革新の促進に影響を与えています。

ブロードバンド電力線通信チップセット市場促進要因・課題

ブロードバンドPLCチップセット市場は、技術革新、経済状況、規制要因など、さまざまな要因の影響を受けます。これらの要因を理解することは、効果的な市場管理に不可欠です。

ブロードバンド電力線通信チップセット市場を牽引する要因は以下の通り：

• 技術の進歩：PLCチップセット技術の絶え間ない改良は、その統合性、速度、性能を向上させます。新技術は、より効果的で信頼性の高い通信ソリューションの構築に役立ちます。
• 高速インターネットへの需要の高まり：より高速なブロードバンド接続を必要とする人が増えるにつれ、PLCチップセットに対する需要も増加しています。高度な用途には、より高速なデータ伝送速度と強化されたネットワーク技術が必要です。
• スマートグリッドとスマートホームソリューションの利用の増加：スマートグリッドとスマートホーム技術の展開は、PLCチップセットの採用を促進します。純粋なビジネスモデルでは、開発後のエネルギー相乗効果や統合が制限されます。
• ブロードバンド・アクセス促進のための政府の取り組み：ブロードバンドアクセスの拡大を目指した政府の好意的な政策や施策は、PLCチップセットの需要を生み出します。通信技術とインフラのアップグレードへの投資は、市場の機会を高めます。
• エネルギー効率の重視：省エネ技術の重視により、PLCチップセットは低消費電力へと進化しています。この開発は世界の省エネ目標に合致し、市場に利益をもたらします。

ブロードバンド電力線通信チップセット市場の課題は次のとおりである：

• 初期コストの高さ：PLCチップセットの初期コストの高さは、特に小規模PLC用途において、普及の障壁の1つとなっています。コストの問題は、高度な通信技術の手頃な価格と利用可能性を制限します。
• 複雑な統合要件：既存のフレームワークでPLCチップセットを採用する場合、多くの課題が発生する可能性があります。技術的な難しさ、互換性の問題、実装の課題、採用のハードルはすべて、展開を遅らせたり、妨げたりする可能性があります。
• 規制遵守の問題：多くの通信技術が存在する一方で、法律や標準の追求は多くの企業の成長の可能性を制限する可能性があります。コンプライアンスコストや規制の変更は、市場の平準化や強化に影響を与えます。
• 代替技術との競合：ワイヤレスや光ファイバーなど、他の通信方法の使用は、PLCチップセットの採用を制限する傾向があります。市場で成功するには、これらの製品の優位性を差別化して効果的にマーケティングすることが不可欠です。
• 技術的限界と干渉：技術的な制限や他の通信チャネルとの干渉の可能性は、PLCチップセットの機能に影響を与える可能性があります。効果的な通信システムを提供するためには、これらの問題に対処しなければなりません。

ブロードバンド電力線通信チップセット市場は、継続的な技術開拓とユーザー間の電子活動ニーズの高まりから恩恵を受ける一方、高コストや規制政策などの制約が成長を制限しています。成長の可能性を活用し、市場の課題を克服するには、これらすべての要因を管理することが重要です。

目次

第1章 エグゼクティブサマリー

第2章 世界のブロードバンド電力線通信チップセット市場：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 業界の促進要因と課題

第3章 市場動向と予測分析 (2019年～2031年)

• マクロ経済動向 (2019～2024年) と予測 (2025～2031年)
• 世界のブロードバンド電力線通信チップセット市場の動向 (2019～2024年) と予測 (2025～2031年)
• 世界のブロードバンド電力線通信チップセット市場：規格別
  • Homeplug AV　
  • HomePlug AV1　
  • HomePlug AV2　
  • IEEE 1901　
  • IEEE 1905.1　
  • G.Hn
  • HomePNA
  • その他
• 世界のブロードバンド電力線通信チップセット市場：技術別
  • スタンドアロン
  • ハイブリッド
  • Wi-Fi
  • Zigbee
  • Ethernet
  • その他
• 世界のブロードバンド電力線通信チップセット市場：用途別
  • スマートグリッド
  • ネットワーキング
  • 照明器
  • セキュリティ・監視
  • 長距離
  • M2M (Machine to Machine)
  • その他

第4章 地域別の市場動向と予測分析 (2019年～2031年)

• 世界のブロードバンド電力線通信チップセット市場：地域別
• 北米のブロードバンド電力線通信チップセット市場
• 欧州のブロードバンド電力線通信チップセット市場
• アジア太平洋のブロードバンド電力線通信チップセット市場
• その他地域のブロードバンド電力線通信チップセット市場

第5章 競合分析

• 製品ポートフォリオ分析
• 運用統合
• ポーターのファイブフォース分析

第6章 成長機会と戦略分析

• 成長機会分析
  • 世界のブロードバンド電力線通信チップセット市場の成長機会：規格別
  • 世界のブロードバンド電力線通信チップセット市場の成長機会：技術別
  • 世界のブロードバンド電力線通信チップセット市場の成長機会：用途別
  • 世界のブロードバンド電力線通信チップセット市場の成長機会：地域別
• 世界のブロードバンド電力線通信チップセット市場の新たな動向
• 戦略的分析
  • 新製品の開発
  • 世界のブロードバンド電力線通信チップセット市場の生産能力拡大
  • 世界のブロードバンド電力線通信チップセット市場における企業合併・買収 (M&A)、合弁事業
  • 認証とライセンシング

第7章 主要企業のプロファイル

• Broadcom
• Intel
• Marvell Technology
• Maxim Integrated
• Megachips
• Qualcomm
• Semtech
• ST Microelectronics
• Vango Technologies
• Yitran Technologies

The future of the global broadband power line communication chipset market looks promising with opportunities in the smart grids, networking, lighting, security & surveillance, long haul, and machine to machine markets. The global broadband power line communication chipset market is expected to reach an estimated $9.8 billion by 2031 with a CAGR of 14.6% from 2025 to 2031. The major drivers for this market are the rising use of smart grid technologies and rising demand for high-speed internet, growing government efforts to promote the development of smart cities, as well as, an increased emphasis on energy efficiency.

• Lucintel forecasts that, within the technology category, the standalone segment will remain the largest segment over the forecast period because the standalone PLC chipsets only require a connection to the electrical grid, making them easy to install and ideal for retrofitting existing homes and buildings.
• In terms of region, APAC will remain the largest region over the forecast period due to strong demand for internet access in the region.

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Emerging Trends in the Broadband Power Line Communication Chipset Market

Emerging trends in the broadband PLC chipset market are transforming this industry by embracing new technologies and applications. These trends are affecting the way PLC solutions are developed and deployed in many parts of the world.

• Integration with Smart Grid Technologies: PLC chipsets are increasingly coupled with smart grids for enhanced energy management and efficiency. This integration enhances real-time monitoring and control, improving the reliability of the grid and lowering energy costs.
• Advancements in Data Transmission Speeds: Improving data transmission speed using new PLC chipsets is gaining popularity. Newer and higher speeds help develop high-bandwidth applications and dependable communication networks, which are essential due to the rising need for fast internet access.
• Expansion into IoT Applications: The PLC chipsets are utilized as elements to enhance the Internet of Things (IoT). This trend helps meet the increasing demand for connected and smart systems that aid in communication and control in an IoT ecosystem.
• Development of Cost-Effective Solutions: In the market, the trend of developing affordable PLC chipsets is becoming more common. Due to the reduction in production costs, these technologies are spreading rapidly, especially in developing countries with a high demand for broadband.
• Focus on Energy Efficiency: The new PLC chipsets focus on energy efficiency in design and use, thereby reducing power consumption and increasing performance simultaneously. This aligns with the global appetite for sustainability and will help bring about eco-friendlier communication technologies.

These trends are revolutionizing the broadband PLC chipset market by facilitating new levels of integration with smart technologies, increasing data transmission speeds, and opening new markets. The emphasis on affordability and energy efficiency will foster wider acceptance, propelling the advancement of the communication solutions market.

Recent Developments in the Broadband Power Line Communication Chipset Market

The broadband PLC chipset has undergone numerous key developments that influence its future and the market's trajectory. These improvements have aimed at enhancing technology performance, widening its use, and satisfying market needs.

• Launch of High-Speed PLC Chipsets: The last decade has witnessed the introduction of next-generation high-speed PLC chipsets, which have made it possible to transfer data at much higher rates, consequently improving network efficiency. Such chipsets are critical in high-bandwidth applications and enhance overall communication efficiency.
• Integration with Smart Grid Technologies: Smart grid planning solutions have recently been identified as one of the new applications of PLC chipsets. This integration improves energy management and the performance of advanced grid management and control systems.
• Improvements in Energy Efficiency: New PLC chipsets come with enhanced energy efficiency features, improving overall performance with low power consumption. This advancement dovetails with sustainability efforts and the quest to reduce energy consumption globally.
• Growth in Industrial Sector Applications: More PLC chipsets are being adopted in the industrial sector. These developments cater to the growing demand for reliable and high-speed communication systems for industrial automation and control applications.
• Reduction of Costs: Technologies and materials emerging from current manufacturing systems will help reduce the price of PLC chipsets. This price reduction enables broader adoption of these technologies across more applications and markets.

These developments are positively impacting the broadband PLC chipset market by enhancing technology performance, increasing the number of applications, and reducing costs. Integration with smart grids, improved energy efficiency, and cost reductions are enhancing growth and innovation within the market.

Strategic Growth Opportunities for Broadband Power Line Communication Chipset Market

The application of the broadband PLC chipset market appears to provide numerous strategic growth opportunities across a wide range of applications. Identifying these opportunities is crucial for stakeholders to maximize available trends in the market and meet supply accordingly.

• Smart Home Applications: The increasing demand for smart home solutions creates potential for PLC chipsets. The technology promotes seamless interaction and control of smart devices, thereby enhancing home automation.
• Industrial Automation: There is a rise in the application of PLC chipsets in industrial automation. These chipsets provide effective communication and control in industrial environments, thereby enhancing the growth of automated systems and smart manufacturing.
• Smart Grid Integration: There is a market for further development of PLC chipsets for applications in smart grids. These chipsets offer new features in energy management, monitoring, and control, leading to the evolution of better and more efficient energy systems.
• Rural Connectivity Solutions: There is also an increase in the use of PLC chipsets for improved rural and remote area connectivity. These solutions enable the development of communication and broadband access infrastructure in areas with limited provision.
• Energy Management Systems: There is potential for PLC chipsets in energy management systems. These technologies enable enhanced observation and control of energy consumption, resulting in the achievement of sustainability and efficiency goals.

The expanding application of smart homes, industrial automation, and smart grid integration represents strategic growth opportunities in the broadband PLC chipset market. Strategies for rural connectivity and energy management are also influencing market growth and fostering innovation.

Broadband Power Line Communication Chipset Market Driver and Challenges

The broadband PLC chipset market is influenced by various factors, including but not limited to technological innovations, economic conditions, and regulatory factors. Understanding these factors is essential for effective market management.

The factors driving the broadband power line communication chipset market include:

• Technological Advancement: The constant improvement of PLC chipset technology enhances its integration, speed, and performance. New technologies help create more effective and reliable communication solutions.
• Growing Demand for High-Speed Internet: As more people require faster broadband connectivity, the demand for PLC chipsets increases. Advanced applications require greater data transmission rates and enhanced networking technologies.
• Increase in Usage of Smart Grid and Smart Home Solutions: The deployment of smart grid and smart home technologies drives the adoption of PLC chipsets. Purely business models would limit energy synergies and integration post-development.
• Government Efforts to Promote Broadband Access: Favorable government policies and measures aimed at increasing broadband access create demand for PLC chipsets. Investments in communication technologies and infrastructure upgrades enhance opportunities in the market.
• Focus on Energy Efficiency: The emphasis on energy-saving technologies drives the evolution of PLC chipsets towards lower power consumption. This development aligns with global conservation goals and benefits the market.

Challenges in the broadband power line communication chipset market are:

• High Initial Costs: The high initial cost of PLC chipsets constitutes one of the barriers to adoption, especially for small-scale PLC applications. Cost issues limit the affordability and availability of advanced communication technologies.
• Complex Integration Requirements: Numerous challenges may arise when adopting PLC chipsets within existing frameworks. Technical difficulties, compatibility issues, implementation challenges, and adoption hurdles can all slow down or impede deployment.
• Regulatory Compliance Issues: While many communication technologies exist, pursuing laws and standards can limit the growth potential of many companies. Compliance costs and regulatory changes affect the market's leveling and enhancement.
• Competition from Alternative Technologies: The use of other communication methods, such as wireless and fiber optics, tends to limit the adoption of PLC chipsets. Effectively marketing these products by differentiating their advantages is essential for success in the market.
• Technical Limitations and Interference: Technical limitations and potential interference with other communication channels can impact the functionality of PLC chipsets. These issues must be addressed to provide effective communication systems.

The broadband power line communication chipset market benefits from ongoing technological development and an increased need for e-activities among users, while constraints such as high costs and regulatory policies restrict growth. Managing all these factors is crucial to taking advantage of growth potential and overcoming market challenges.

List of Broadband Power Line Communication Chipset Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. through these strategies broadband power line communication chipset companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the broadband power line communication chipset companies profiled in this report include-

• Broadcom
• Intel
• Marvell Technology
• Maxim Integrated
• Megachips
• Qualcomm
• Semtech
• ST Microelectronics
• Vango Technologies
• Yitran Technologies

Broadband Power Line Communication Chipset by Segment

The study includes a forecast for the global broadband power line communication chipset market by standards, technology, application, and region.

Broadband Power Line Communication Chipset Market by Standards [Analysis by Value from 2019 to 2031]:

• Homeplug AV
• HomePlug AV1
• HomePlug AV2
• IEEE 1901
• IEEE 1905.1
• G.Hn
• HomePNA
• Others

Broadband Power Line Communication Chipset Market by Technology [Analysis by Value from 2019 to 2031]:

• Standalone
• Hybrid
• Wi-Fi
• Zigbee
• Ethernet
• Others

Broadband Power Line Communication Chipset Market by Application [Analysis by Value from 2019 to 2031]:

• Smart Grids
• Networking
• Lighting
• Security & Surveillance
• Long Haul
• Machine to Machine
• Others

Broadband Power Line Communication Chipset Market by Region [Analysis by Value from 2019 to 2031]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

Country Wise Outlook for the Broadband Power Line Communication Chipset Market

Major players in the market are expanding their operations and forming strategic partnerships to strengthen their positions. The following highlights recent developments by major broadband power line communication chipset producers in key regions: the USA, China, India, Japan, and Germany.

• United States: Progress has been made in developing high-speed PLC chipsets in the U.S., which are faster and more reliable for data transmission. There is an emphasis on integrating these chipsets with smart grids to improve energy management and connectivity.
• China: The PLC chipset market in China is set to witness significant growth, with a strong focus on smart home and industrial application expansion. The country is building high-performance PLC chipsets suitable for large infrastructure and smart city projects.
• Germany: Camp ICC is enhancing its PLC technology by integrating chipsets with IoT solutions for applications in smart buildings and industrial automation. The focus is on improving energy efficiency and network stability to achieve the country's climate goals.
• India: In India, the embedded PLC chip market is growing, focusing on developing affordable solutions for extending rural broadband. The emphasis is on inexpensive chipsets that will improve broadband penetration in rural areas and support the country's digital development.
• Japan: Japan is introducing unique innovations with new designs of PLC chipsets that utilize high bandwidth for data transmission while connecting to improved energy control systems. Developments are targeted at enhancing efficiency and reliability to support high-end technological systems in Japan.

Features of the Global Broadband Power Line Communication Chipset Market

Market Size Estimates: Broadband power line communication chipset market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2019 to 2024) and forecast (2025 to 2031) by various segments and regions.

Segmentation Analysis: Broadband power line communication chipset market size by various segments, such as by standards, technology, application, and region in terms of value ($B).

Regional Analysis: Broadband power line communication chipset market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different standards, technology, application, and regions for the broadband power line communication chipset market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the broadband power line communication chipset market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

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This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the broadband power line communication chipset market by standards (homeplug AV, homeplug AV1, homeplug AV2, IEEE 1901, IEEE 1905.1, G.Hn, homePNA, and others), technology (standalone, hybrid, Wi-Fi, ZigBee, ethernet, and others), application (smart grids, networking, lighting, security & surveillance, long haul, machine to machine, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Broadband Power Line Communication Chipset Market : Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2019 to 2031

• 3.1. Macroeconomic Trends (2019-2024) and Forecast (2025-2031)
• 3.2. Global Broadband Power Line Communication Chipset Market Trends (2019-2024) and Forecast (2025-2031)
• 3.3: Global Broadband Power Line Communication Chipset Market by Standards
  • 3.3.1: Homeplug AV
  • 3.3.2: HomePlug AV1
  • 3.3.3: HomePlug AV2
  • 3.3.4: IEEE 1901
  • 3.3.5: IEEE 1905.1
  • 3.3.6: G.Hn
  • 3.3.7: HomePNA
  • 3.3.8: Others
• 3.4: Global Broadband Power Line Communication Chipset Market by Technology
  • 3.4.1: Standalone
  • 3.4.2: Hybrid
  • 3.4.3: Wi-Fi
  • 3.4.4: Zigbee
  • 3.4.5: Ethernet
  • 3.4.6: Others
• 3.4: Global Broadband Power Line Communication Chipset Market by Application
  • 3.4.1: Smart Grids
  • 3.4.2: Networking
  • 3.4.3: Lighting
  • 3.4.4: Security & Surveillance
  • 3.4.5: Long Haul
  • 3.4.6: Machine to Machine
  • 3.4.7: Others

4. Market Trends and Forecast Analysis by Region from 2019 to 2031

• 4.1: Global Broadband Power Line Communication Chipset Market by Region
• 4.2: North American Broadband Power Line Communication Chipset Market
  • 4.2.1: North American Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
  • 4.2.2: North American Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
• 4.3: European Broadband Power Line Communication Chipset Market
  • 4.3.1: European Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
  • 4.3.2: European Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
• 4.4: APAC Broadband Power Line Communication Chipset Market
  • 4.4.1: APAC Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
  • 4.4.2: APAC Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
• 4.5: ROW Broadband Power Line Communication Chipset Market
  • 4.5.1: ROW Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
  • 4.5.2: ROW Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Standards
  • 6.1.2: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Technology
  • 6.1.3: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Application
  • 6.1.4: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Region
• 6.2: Emerging Trends in the Global Broadband Power Line Communication Chipset Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global Broadband Power Line Communication Chipset Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Broadband Power Line Communication Chipset Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: Broadcom
• 7.2: Intel
• 7.3: Marvell Technology
• 7.4: Maxim Integrated
• 7.5: Megachips
• 7.6: Qualcomm
• 7.7: Semtech
• 7.8: ST Microelectronics
• 7.9: Vango Technologies
• 7.10: Yitran Technologies