放射線硬化エレクトロニクス市場レポート：動向、予測、競合分析 (2031年まで)

世界の放射線硬化エレクトロニクス市場の将来は、宇宙、航空宇宙・防衛、原子力発電所、医療の各市場における機会で有望視されています。世界の放射線硬化エレクトロニクス市場は、2025年から2031年までのCAGRが3.6%で、2031年までに推定22億米ドルに達すると予想されています。この市場の主な促進要因は、情報・監視・偵察（ISR）活動の活発化、軍事・宇宙用アプリケーションに使用されるマルチコアプロセッサの技術進歩、商業衛星における放射線硬化エレクトロニクスの需要の増加です。

• Lucintelの予測では、コンポーネントのカテゴリーでは、電源管理は高エネルギー荷電粒子や電離放射線に対する耐久性に優れているため、予測期間中も最大セグメントであり続け、宇宙アプリケーションでの需要を牽引します。
• アプリケーション・カテゴリーでは、宇宙ミッションの増加とともにISR作戦の数が増加しているため、宇宙が最大のセグメントであり続けると思われます。
• 地域別では、北米が、先端技術の採用の増加、部品の小型化、同地域における放射線硬化部品メーカーの存在により、予測期間中最大の地域であり続けると思われます。

放射線硬化エレクトロニクス市場の戦略的成長機会

放射線硬化エレクトロニクスの戦略的成長機会は、この技術が広く採用され、高信頼性部品への需要が高まるにつれて、さまざまな用途で出現しています。

• 宇宙探査：宇宙探査への関心の高まりは、過酷な環境条件下で活動するミッションに使用される放射線硬化エレクトロニクスの市場を提供します。部品の設計と材料の進歩により、衛星、宇宙探査機、その他の宇宙機器の性能と信頼性が向上しています。
• 防衛用途：軍事予算の増加と、防衛用途における信頼性の高い電子システムの必要性により、放射線硬化エレクトロニクスの市場が拡大しています。高放射線環境下での通信、ナビゲーション、兵器システムに不可欠です。
• 高高度航空：高高度航空および無人航空機（UAV）の成長により、放射線硬化エレクトロニクスの新市場が開かれます。高高度での放射線レベルが高いため、システムの安全性や有効性を損なうことなく放射線に耐える部品が必要とされます。
• 原子力発電所：放射線に耐える特殊性は、原子力発電所で使用される制御システムや監視装置にも利用されています。このような環境では、靭性の向上と性能の向上が不可欠です。
• 医療画像診断：CTスキャナや放射線手術装置などの医療用画像診断システムには、放射線被曝に耐えるよう堅牢化された電子機器が導入されています。これらの製品は、診断結果や患者管理の改善につながる優れた性能を備えています。

放射線耐性エレクトロニクスの戦略的成長機会には、宇宙探査、防衛用途、高高度作業、原子力発電所、医療用画像処理などがあります。これらの機会は、過酷な条件下での信頼性の高いコンポーネントに対するニーズの高まりに対応するものであり、新しいアイデアへの意欲を高め、市場のさらなる成長を促すものです。

放射線硬化エレクトロニクス市場促進要因・課題

放射線硬化エレクトロニクス市場は、技術的、経済的、規制的要因など、成長を促進または阻害するいくつかの要因の影響を受けます。これらの要因は、特定の高信頼性部品の取り込みと構成を決定します。

放射線硬化エレクトロニクス市場を牽引する要因には、以下のようなものがある：

• 技術の進歩：放射線硬化エレクトロニクスの開発は、半導体材料の継続的な開発と放射線遮蔽技術の進歩に影響を受けています。これらの改良により、高放射線環境下での機器の性能、使いやすさ、信頼性が向上します。
• 宇宙探査の増加：宇宙探査や衛星ミッションへの関心の高まりに伴い、放射線硬化エレクトロニクスの需要も増加しています。ミッションを成功させ、長期間の運用を行うためには、宇宙放射線に耐性のある部品が必要です。
• 防衛分野への投資：防衛分野では、より高額な契約の流入により、高信頼性システムへの投資が増加します。放射線環境下での通信システムやナビゲーションシステムなど、軍事用途向けの信頼性の高いコンポーネントへの需要が高まっています。
• 高高度アプリケーションの需要拡大：高高度航空機やUAVの開発により、放射線硬化エレクトロニクスへの要求が高まっています。高高度環境で動作するコンポーネントの信頼性を確保することは、システムの完全性にとって極めて重要です。
• 試験方法の進歩：試験・検証方法の開発により、放射線硬化エレクトロニクスの信頼性が向上しています。試験方法の改善により、高レベルの放射線が存在する環境でもコンポーネントを確実に動作させることができます。

放射線硬化エレクトロニクス市場における課題は以下の通り：

• 高い開発コスト：放射線硬化エレクトロニクスの開発と生産は、しばしば高コストに阻まれます。こうした製造コストはメーカーに影響を与え、先進的な部品が手の届かないものになる可能性があります。
• 技術的複雑さ：放射線硬化エレクトロニクスは、特にエンジニアリングと製造において、設計や使用材料の技術的な難しさに関連する課題に直面しています。部品の性能と信頼性を向上させるためには、こうした複雑性に対処することが不可欠です。
• サプライチェーンの問題：必要不可欠な材料や部品の不足など、サプライチェーンにおける重大な制約が、放射線硬化エレクトロニクスの生産と入手に影響を及ぼす可能性があります。サプライチェーンにおける供給可能性に左右される市場力学では、あらゆる制約を効果的に管理する必要があります。

放射線硬化エレクトロニクス市場は、高い開発コスト、技術的困難、サプライチェーンの問題などの課題に直面しながらも、技術的要因や宇宙開発・防衛産業における関心の高まりによって決定されています。これらの課題に対処することは、技術を発展させ、様々な用途でその効果を発揮するために極めて重要です。

目次

第1章 エグゼクティブサマリー

第2章 世界の放射線硬化エレクトロニクス市場：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 業界の促進要因と課題

第3章 市場動向と予測分析 (2019年～2031年)

• マクロ経済動向 (2019～2024年) と予測 (2025～2031年)
• 世界の放射線硬化エレクトロニクス市場の動向 (2019～2024年) と予測 (2025～2031年)
• 世界の放射線硬化エレクトロニクス市場：コンポーネント別
  • ミックスドシグナルIC
  • プロセッサ・コントローラ
  • メモリ
  • 電源管理
• 世界の放射線硬化エレクトロニクス市場：製造技術別
  • RHBD (Radiation-Hardening by Design)
  • RHBP (Radiation-Hardening by Process)
• 世界の放射線硬化エレクトロニクス市場：製品種類別
  • 市販品（COTS）
  • カスタムメイド
• 世界の放射線硬化エレクトロニクス市場：用途別
  • 宇宙
  • 航空宇宙・防衛
  • 原子力発電所
  • 医療
  • その他

第4章 地域別の市場動向と予測分析 (2019年～2031年)

• 世界の放射線硬化エレクトロニクス市場：地域別
• 北米の放射線硬化エレクトロニクス市場
• 欧州の放射線硬化エレクトロニクス市場
• アジア太平洋の放射線硬化エレクトロニクス市場
• その他地域の放射線硬化エレクトロニクス市場

第5章 競合分析

• 製品ポートフォリオ分析
• 運用統合
• ポーターのファイブフォース分析

第6章 成長機会と戦略分析

• 成長機会分析
  • 世界の放射線硬化エレクトロニクス市場の成長機会：コンポーネント別
  • 世界の放射線硬化エレクトロニクス市場の成長機会：製造技術別
  • 世界の放射線硬化エレクトロニクス市場の成長機会：製品種類別
  • 世界の放射線硬化エレクトロニクス市場の成長機会：用途別
  • 世界の放射線硬化エレクトロニクス市場の成長機会：地域別
• 世界の放射線硬化エレクトロニクス市場の新たな動向
• 戦略的分析
  • 新製品の開発
  • 世界の放射線硬化エレクトロニクス市場の生産能力拡大
  • 世界の放射線硬化エレクトロニクス市場における企業合併・買収 (M&A)、合弁事業
  • 認証とライセンシング

第7章 主要企業のプロファイル

• Microchip Technology
• BAE Systems
• Renesas Electronics Corporation
• Infineon Technologies
• STMicroelectronics
• Xilinx
• Texas Instruments Incorporated
• Honeywell International
• Teledyne Technologies
• TTM Technologies

The future of the global radiation hardened electronics market looks promising with opportunities in the space, aerospace & defense, nuclear power plant, and medical markets. The global radiation hardened electronics market is expected to reach an estimated $2.2 billion by 2031 with a CAGR of 3.6% from 2025 to 2031. The major drivers for this market are the rising intelligence, surveillance, and reconnaissance (ISR) activities, technological advancements in multicore processors used for military and space-grade applications, and the increasing demand for radiation-hardened electronics in commercial satellites.

• Lucintel forecasts that, within the component category, power management will remain the largest segment over the forecast period, as it offers excellent durability against high-energy charged particles and ionizing radiation, which drives its demand in outer space applications.
• Within the application category, space will remain the largest segment due to the rising number of ISR operations along with the increasing number of space missions.
• In terms of regions, North America will remain the largest region over the forecast period due to the growing adoption of advanced technologies, the miniaturization of components, and the presence of rad-hard component manufacturers in the region.

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Emerging Trends in the Radiation Hardened Electronics Market

This emerging trend involves the development of radiation-hardened electronics that designate new high-reliability components for the space and defense industries. These include improving performance, combining new technologies, and increasing cost efficiency.

• Advanced Materials: Radiation-tolerant electronics are usually equipped with new materials like radiation-tolerant semiconductors and insulation materials, which enhance the lifespan of radiation-hardened electronics. Such materials assist in preventing destructive radiation effects and extending the useful life of the electronics in space and military applications.
• Enhanced Manufacturing Techniques: Advanced electronic devices are manufactured using precision fabrication and partial processing, which progressively improve the radiation hardness of the electronic devices. Advanced techniques provide better and tougher components, helping sustain longer lifespans in radiation-rich environments.
• Integration with Space Missions: The growing reliance on radiation-hardened electronics for space missions indicates a trend toward reliability and performance enhancement for efficiency in space exploration. This trend promotes the construction of better electronic systems that can operate in outer space, where conditions cannot be compromised.
• Development of Hybrid Technologies: Interdisciplinary technology that incorporates research and development of radiation-hardened electronic systems, such as artificial intelligence and machine learning, is taking shape. These hybrids are complementary to the operation and flexibility of electronic systems in high-radiation environments, thereby improving overall mission accomplishment.
• Cost Reduction Strategies: There is a growing trend to seek measures that will help limit the pricing of radiation-hardened electronics. Changes in design and construction processes are rendering high-end units cheaper and broadening their application to military and commercial sectors.

It is evident that these trends-advanced materials, enhanced manufacturing processes, integration with space missions, hybrid technologies, and strategies toward cost reduction-are changing the landscape of the radiation-hardened electronics market. They enhance how these components operate, their reliability, and their economic effectiveness in high-radiation environments.

Recent Developments in the Radiation Hardened Electronics Market

The recent highlights of significant developments concerning radiation-hardened electronics focus on current materials and construction, as well as prospects for their use. These advancements have made electronic parts more effective and dependable in harsh radiation environments.

• Improved Semiconductor Materials: Recently, progress made in the area of semiconductors, including radiation-stable silicon and radiation-resistant compound semiconductors, has contributed to improving the resiliency of radiation-hardened electronics. These materials can prevent some radiation damage and enhance product life.
• Advanced Means of Shielding from Radiation: With the invention of affordable materials for manufacturing modules and advanced designs, it becomes easier to shield electronic parts venturing into new horizons. Such capabilities improve the performance of devices and their usage in high-radiation areas suitable for space and defense purposes.
• Enhanced Testing and Verification Methods: Conventional systems of testing and verification for radiation-hardened electronics are evolving, assuring finer performance and reliability. New developments in testing systems and models are used to evaluate the radiation limits of components before use.
• Integration of AI and Automation: Concurrent advancements in artificial intelligence and automation in the design and production of radiation-hardened electronics are improving productivity. AI design tools coupled with automated manufacturing are enhancing the systems and reliability of electronic devices.
• Expansion of Commercial Applications: The uptake of radiation-hardened electronics to cover civilian markets such as high-altitude aviation and satellite communications demonstrates the need for robust components. This trend stimulates innovation in radiation-hardened technologies and cost minimization.

Progress has been made in the field of radiation-hardened electronics through the modification of semiconductor materials, incorporation of radiation shielding techniques, advancement of testing methods, and the use of AI, as well as their commercialization, enhancing component performance and reliability. These developments are essential for the use of high-reliability systems in difficult conditions.

Strategic Growth Opportunities for Radiation Hardened Electronics Market

Strategic growth opportunities in radiation-hardened electronics are emerging in various applications alongside the widespread adoption of the technology and growing demands for high-reliability components.

• Space Exploration: Increased interest in space exploration provides a market for radiation-hardened electronics used in missions operating in extreme environmental conditions. Advancements in the design and materials of components are improving the performance and reliability of satellites, space probes, and other space-bound equipment.
• Defense Applications: Rising military budgets, together with the need for dependable electronic systems in defense applications, increase the market for radiation-hardened electronics. They are essential for communications, navigation, and weapon systems in high-radiation environments.
• High-Altitude Aviation: The growth of high-altitude aviation and unmanned aerial vehicles (UAVs) opens new markets for radiation-hardened electronics. High radiation levels at high altitudes require components that can tolerate this radiation without compromising system safety or effectiveness.
• Nuclear Power Plants: The specialization to withstand radiation is also utilized in control systems and monitoring equipment used in nuclear power plants. The provision of increased toughness and the ability to perform in these settings become imperative.
• Medical Imaging: Electronics ruggedized for radiation bombardment are being deployed within medical imaging systems such as CT scanners and radiosurgery devices. They foster better performance that leads to improved diagnostic results and patient management.

Strategic growth opportunities in radiation-hardened electronics include exploration of space, defense applications, high-altitude operations, nuclear power plants, and medical imaging. These opportunities respond to the growing need for reliable components in harsh conditions, increasing the drive for new ideas and further market growth.

Radiation Hardened Electronics Market Driver and Challenges

The radiation-hardened electronics market is influenced by several factors that drive or impede growth, including technological, economic, and regulatory factors. These factors determine the uptake and composition of certain high-reliability parts.

The factors driving the radiation-hardened electronics market include:

• Technological Advancements: Growth in radiation-hardened electronics is influenced by the continual development of semiconductor materials and advancements in radiation shielding technologies. These improvements increase the performance, usability, and reliability of devices in high-radiation hazards.
• Increased Space Exploration: The growing interest in space exploration and satellite missions includes an increase in the demand for radiation-hardened electronics. There is a clear need for space radiation-tolerant components for successful missions and long-duration operations.
• Defense Sector Investments: An influx of higher-value contracts in the defense sector increases investment in high-reliability systems. There is a rising demand for reliable components for military applications, such as communication and navigation systems in radiation environments.
• Growing Demand for High-Altitude Applications: The development of high-altitude aviation and UAVs has led to an increased requirement for radiation-hardened electronics. Ensuring the reliability of components while operating in high-altitude environments is critical for system integrity.
• Advancements in Testing Methods: The development of testing and verification methods enhances the reliability of radiation-hardened electronics. Improved testing methods ensure that components can operate in environments with high levels of radiation.

Challenges in the radiation-hardened electronics market include:

• High Development Costs: The development and production of radiation-hardened electronics are often hampered by high costs. These manufacturing expenses affect manufacturers and may make advanced components unaffordable.
• Technical Complexity: Radiation-hardened electronics face challenges related to technical difficulties in design and materials used, particularly in engineering and manufacturing. Addressing these complexities is essential for improving component performance and reliability.
• Supply Chain Issues: Critical supply chain constraints, such as a lack of essential materials or components, can affect the production and availability of radiation-hardened electronics. Market dynamics driven by the availability of supplies in the supply chain necessitate effective management of all constraints.

The radiation-hardened electronics market is determined by technological factors and increasing interest in space exploration and defense industries while facing challenges such as high development costs, technical difficulties, and supply chain issues. Addressing these challenges is crucial for advancing technology and its effectiveness in various applications.

List of Radiation Hardened Electronics Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. Through these strategies radiation hardened electronics companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the radiation hardened electronics companies profiled in this report include-

• Microchip Technology
• BAE Systems
• Renesas Electronics Corporation
• Infineon Technologies
• STMicroelectronics
• Xilinx
• Texas Instruments Incorporated
• Honeywell International
• Teledyne Technologies
• TTM Technologies

Radiation Hardened Electronics by Segment

The study includes a forecast for the global radiation hardened electronics market by component, manufacturing technique, product type, application, and region

Radiation Hardened Electronics Market by Component [Analysis by Value from 2019 to 2031]:

• Mixed Signal ICs
• Processors & Controllers
• Memory
• Power Management

Radiation Hardened Electronics Market by Manufacturing Technique [Analysis by Value from 2019 to 2031]:

• Radiation-Hardening by Design (RHBD)
• Radiation-Hardening by Process (RHBP)

Radiation Hardened Electronics Market by Product Type [Analysis by Value from 2019 to 2031]:

• Commercial-off-the-Shelf (COTS)
• Custom Made

Radiation Hardened Electronics Market by Application [Analysis by Value from 2019 to 2031]:

• Space
• Aerospace & Defense
• Nuclear Power Plant
• Medical
• Others

Radiation Hardened Electronics Market by Region [Analysis by Value from 2019 to 2031]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

Country Wise Outlook for the Radiation Hardened Electronics Market

Major players in the market are expanding their operations and forming strategic partnerships to strengthen their positions. The following highlights recent developments by major radiation-hardened electronics producers in key regions: the USA, China, India, Japan, and Germany.

• United States: In the U.S., the development of radiation-hardened electronics is attributed to the increased allocation of resources to space and military activities. This optimization includes enhanced radiation tolerance in microprocessors and memories, as well as improved mechanical structures and manufacturing systems for harsh environment applications.
• China: The development of radiation-hardened electronics in China is focused on increasing the reliability of components for space and military missions. Achievements include the use of modern radiation protection materials and the enhancement of radiation endurance in microelectronics through new semiconductor processing techniques.
• Germany: Collaboration between industry and research entities in Germany has enabled improvements in radiation-hardened electronics. Key advancements include practices that minimize radiation damage to semiconductors and the synthesis of polymers designed for high-radiation environments in avionics and defense.
• India: In India, the primary focus of developments in radiation-hardened electronics has been on components used in space and satellite applications. Recent advancements include low-cost radiation-hardening techniques and international cooperation in specialized space agencies, aiming to enhance the quality and reliability of electronic systems.
• Japan: Japan continues to develop radiation-hardened electronics by coupling advancements in semiconductor technologies and materials. One recent example is the development of radiation-hardened integrated circuits for space missions and applications in extreme altitudes, incorporating novel materials and manufacturing technologies for improved performance and dependability.

Features of the Global Radiation Hardened Electronics Market

Market Size Estimates: Radiation hardened electronics market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2019 to 2024) and forecast (2025 to 2031) by various segments and regions.

Segmentation Analysis: Radiation hardened electronics market size by various segments, such as by component, manufacturing technique, product type, application, and region in terms of value ($B).AV36:AV54

Regional Analysis: Radiation hardened electronics market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different components, manufacturing techniques, product types, applications, and regions for the radiation hardened electronics market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the radiation hardened electronics market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

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This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the radiation hardened electronics market by component (mixed signal ICs, processors & controllers, memory, and power management), manufacturing technique (radiation-hardening by design (RHBD), and radiation-hardening by process (RHBP)), product type (commercial-off-the-shelf (COTS), and custom made), application (space, aerospace & defense, nuclear power plant, medical, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Radiation Hardened Electronics Market : Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2019 to 2031

• 3.1. Macroeconomic Trends (2019-2024) and Forecast (2025-2031)
• 3.2. Global Radiation Hardened Electronics Market Trends (2019-2024) and Forecast (2025-2031)
• 3.3: Global Radiation Hardened Electronics Market by Component
  • 3.3.1: Mixed Signal ICs
  • 3.3.2: Processors & Controllers
  • 3.3.3: Memory
  • 3.3.4: Power Management
• 3.4: Global Radiation Hardened Electronics Market by Manufacturing Technique
  • 3.4.1: Radiation-Hardening by Design (RHBD)
  • 3.4.2: Radiation-Hardening by Process (RHBP)
• 3.5: Global Radiation Hardened Electronics Market by Product Type
  • 3.5.1: Commercial-off-the-Shelf (COTS)
  • 3.5.2: Custom Made
• 3.6: Global Radiation Hardened Electronics Market by Application
  • 3.6.1: Space
  • 3.6.2: Aerospace & Defense
  • 3.6.3: Nuclear Power Plant
  • 3.6.4: Medical
  • 3.6.5: Others

4. Market Trends and Forecast Analysis by Region from 2019 to 2031

• 4.1: Global Radiation Hardened Electronics Market by Region
• 4.2: North American Radiation Hardened Electronics Market
  • 4.2.1: North American Market by Component: Mixed Signal ICs, Processors & Controllers, Memory, and Power Management
  • 4.2.2: North American Market by Application: Space, Aerospace & Defense, Nuclear Power Plant, Medical, and Others
• 4.3: European Radiation Hardened Electronics Market
  • 4.3.1: European Market by Component: Mixed Signal ICs, Processors & Controllers, Memory, and Power Management
  • 4.3.2: European Market by Application: Space, Aerospace & Defense, Nuclear Power Plant, Medical, and Others
• 4.4: APAC Radiation Hardened Electronics Market
  • 4.4.1: APAC Market by Component: Mixed Signal ICs, Processors & Controllers, Memory, and Power Management
  • 4.4.2: APAC Market by Application: Space, Aerospace & Defense, Nuclear Power Plant, Medical, and Others
• 4.5: ROW Radiation Hardened Electronics Market
  • 4.5.1: ROW Market by Component: Mixed Signal ICs, Processors & Controllers, Memory, and Power Management
  • 4.5.2: ROW Market by Application: Space, Aerospace & Defense, Nuclear Power Plant, Medical, and Others

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global Radiation Hardened Electronics Market by Component
  • 6.1.2: Growth Opportunities for the Global Radiation Hardened Electronics Market by Manufacturing Technique
  • 6.1.3: Growth Opportunities for the Global Radiation Hardened Electronics Market by Product Type
  • 6.1.4: Growth Opportunities for the Global Radiation Hardened Electronics Market by Application
  • 6.1.5: Growth Opportunities for the Global Radiation Hardened Electronics Market by Region
• 6.2: Emerging Trends in the Global Radiation Hardened Electronics Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global Radiation Hardened Electronics Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Radiation Hardened Electronics Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: Microchip Technology
• 7.2: BAE Systems
• 7.3: Renesas Electronics Corporation
• 7.4: Infineon Technologies
• 7.5: STMicroelectronics
• 7.6: Xilinx
• 7.7: Texas Instruments Incorporated
• 7.8: Honeywell International
• 7.9: Teledyne Technologies
• 7.10: TTM Technologies