|
市場調査レポート
商品コード
1746488
日本の耐放射線性エレクトロニクス市場レポート：製品タイプ、材料タイプ、技法、コンポーネントタイプ、用途、地域別、2025年～2033年Japan Radiation Hardened Electronics Market Report by Product Type, Material Type, Technique (Radiation Hardening by Design, Radiation Hardening by Process, Radiation Hardening by Software ), Component Type, Application, and Region 2025-2033 |
||||||
カスタマイズ可能
|
|||||||
| 日本の耐放射線性エレクトロニクス市場レポート：製品タイプ、材料タイプ、技法、コンポーネントタイプ、用途、地域別、2025年～2033年 |
|
出版日: 2025年06月02日
発行: IMARC
ページ情報: 英文 115 Pages
納期: 5～7営業日
|
- 全表示
- 概要
- 目次
日本の耐放射線性エレクトロニクス市場規模は、2025～2033年の間に4.5%の成長率（CAGR）を示すと予測されています。民間宇宙プロジェクト数の増加と半導体産業の拡大が主に市場成長を牽引しています。
本レポートで扱う主な質問
- 日本の耐放射線性エレクトロニクス市場はこれまでどのように推移し、今後どのように推移するのか？
- COVID-19が日本の耐放射線性エレクトロニクス市場に与えた影響は？
- 日本の耐放射線性エレクトロニクス市場の製品タイプ別区分は？
- 日本の耐放射線性エレクトロニクス市場の材料タイプ別区分は？
- 日本の耐放射線性エレクトロニクス市場の技法別の区分は？
- 日本の耐放射線性エレクトロニクス市場のコンポーネントタイプ別区分は？
- 日本の耐放射線性エレクトロニクス市場の用途別区分は？
- 日本の耐放射線性エレクトロニクス市場のバリューチェーンにおける様々なステージとは？
- 日本の耐放射線性エレクトロニクスの主要な促進要因と課題は？
- 日本の耐放射線性エレクトロニクス市場の構造と主要プレーヤーは？
- 日本の耐放射線性エレクトロニクス市場における競合の程度は？
目次
第1章 序文
第2章 調査範囲と調査手法
- 調査の目的
- ステークホルダー
- データソース
- 市場推定
- 調査手法
第3章 エグゼクティブサマリー
第4章 日本の耐放射線性エレクトロニクス市場- イントロダクション
- 概要
- 市場力学
- 業界動向
- 競合情報
第5章 日本の耐放射線性エレクトロニクス市場情勢
- 過去および現在の市場動向（2019～2024年）
- 市場予測（2025～2033年）
第6章 日本の耐放射線性エレクトロニクス市場- 製品タイプ別の内訳
- カスタムメイド
- 商用オフザシェルフ
第7章 日本の耐放射線性エレクトロニクス市場- 材料タイプ別の内訳
- シリコン
- 炭化ケイ素
- 窒化ガリウム
- その他
第8章 日本の耐放射線性エレクトロニクス市場- 技法別の内訳
- 設計による放射線耐性強化（RHBD）
- プロセスによる耐放射線性（RHBP）
- ソフトウェアによる放射線耐性強化（RHBS）
第9章 日本の耐放射線性エレクトロニクス市場- コンポーネントタイプ別の内訳
- 電源管理
- 特定用途向け集積回路
- ロジック
- メモリ
- フィールドプログラマブルゲートアレイ
- その他
第10章 日本の耐放射線性エレクトロニクス市場- 用途別の内訳
- 宇宙衛星
- 商用衛星
- 軍隊
- 航空宇宙および防衛
- 原子力発電所
- その他
第11章 日本の耐放射線性エレクトロニクス市場- 競合情勢
- 概要
- 市場構造
- 市場企業のポジショニング
- 主要成功戦略
- 競合ダッシュボード
- 企業評価象限
第12章 主要企業のプロファイル
第13章 日本の耐放射線性エレクトロニクス市場- 業界分析
- 促進要因・抑制要因・機会
- ポーターのファイブフォース分析
- バリューチェーン分析
第14章 付録
Japan radiation hardened electronics market size is projected to exhibit a growth rate (CAGR) of 4.5% during 2025-2033. The rising number of commercial space projects, along with the expanding semiconductor industry, is primarily driving the market growth.
Radiation-hardened electronics encompass a range of electronic elements, packages, and items specifically designed for use in high-altitude environments. These components are crafted from materials such as silicon, silicon carbide, gallium nitride, and hydrogenated amorphous silicon. In line with this, their distinctive feature is their resilience to the detrimental effects of ionizing radiation, high-energy radiation, as well as gamma and neutron radiation typically emitted by nuclear reactors. These specialized electronics are widely deployed in an array of applications including satellites, aircraft, and nuclear power plants, where they serve essential roles as switching regulators, microprocessors, and power supply devices. As a result of their unique properties, they find extensive use in diverse industries, including aviation, space exploration, and military and defense sectors across Japan.
Japan Radiation Hardened Electronics Market Trends:
The market in Japan is predominantly steered by the escalating number of space missions and exploratory endeavors within the country. Concurrently, the surging requirement for communication satellites catering to intelligence, surveillance, and reconnaissance (ISR) operations is fostering market expansion. Radiation-hardened electronics play a pivotal role in safeguarding electronic apparatus against physical harm and malfunction caused by detrimental radiations encountered in outer space, thereby further positively influencing the regional market. Furthermore, the widespread adoption of these electronics in the production of power management devices is contributing positively to market growth. These electronics also find applications in manufacturing diodes, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFET) for various defense and military purposes, which is also acting as another significant growth-inducing factor. Additionally, continuous technological advancements, such as the refinement of highly dependable integrated circuits and enhancements in field-programmable gate array (FPGA) technology, are creating a favorable market landscape. Other factors, including substantial growth within the electronics sector and extensive research and development (R&D) endeavors, are poised to further propel market expansion in the coming years.
Japan Radiation Hardened Electronics Market Segmentation:
Product Type Insights:
- Custom Made
- Commercial-Off-the-Shelf
Material Type Insights:
- Silicon
- Silicon Carbide
- Gallium Nitride
- Others
Technique Insights:
- Radiation Hardening by Design (RHBD)
- Radiation Hardening by Process (RHBP)
- Radiation Hardening by Software (RHBS)
Component Type Insights:
- Power Management
- Application Specific Integrated Circuit
- Logic
- Memory
- Field-Programmable Gate Array
- Others
Application Insights:
- Space Satellites
- Commercial Satellites
- Military
- Aerospace and Defense
- Nuclear Power Plants
- Others
Competitive Landscape:
The market research report has also provided a comprehensive analysis of the competitive landscape. Competitive analysis such as market structure, key player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided.
Key Questions Answered in This Report:
- How has the Japan radiation hardened electronics market performed so far and how will it perform in the coming years?
- What has been the impact of COVID-19 on the Japan radiation hardened electronics market?
- What is the breakup of the Japan radiation hardened electronics market on the basis of product type?
- What is the breakup of the Japan radiation hardened electronics market on the basis of material type?
- What is the breakup of the Japan radiation hardened electronics market on the basis of technique?
- What is the breakup of the Japan radiation hardened electronics market on the basis of component type?
- What is the breakup of the Japan radiation hardened electronics market on the basis of application?
- What are the various stages in the value chain of the Japan radiation hardened electronics market?
- What are the key driving factors and challenges in the Japan radiation hardened electronics?
- What is the structure of the Japan radiation hardened electronics market and who are the key players?
- What is the degree of competition in the Japan radiation hardened electronics market?
Table of Contents
1 Preface
2 Scope and Methodology
- 2.1 Objectives of the Study
- 2.2 Stakeholders
- 2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
- 2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
- 2.5 Forecasting Methodology
3 Executive Summary
4 Japan Radiation Hardened Electronics Market - Introduction
- 4.1 Overview
- 4.2 Market Dynamics
- 4.3 Industry Trends
- 4.4 Competitive Intelligence
5 Japan Radiation Hardened Electronics Market Landscape
- 5.1 Historical and Current Market Trends (2019-2024)
- 5.2 Market Forecast (2025-2033)
6 Japan Radiation Hardened Electronics Market - Breakup by Product Type
- 6.1 Custom Made
- 6.1.1 Overview
- 6.1.2 Historical and Current Market Trends (2019-2024)
- 6.1.3 Market Forecast (2025-2033)
- 6.2 Commercial-Off-the-Shelf
- 6.2.1 Overview
- 6.2.2 Historical and Current Market Trends (2019-2024)
- 6.2.3 Market Forecast (2025-2033)
7 Japan Radiation Hardened Electronics Market - Breakup by Material Type
- 7.1 Silicon
- 7.1.1 Overview
- 7.1.2 Historical and Current Market Trends (2019-2024)
- 7.1.3 Market Forecast (2025-2033)
- 7.2 Silicon Carbide
- 7.2.1 Overview
- 7.2.2 Historical and Current Market Trends (2019-2024)
- 7.2.3 Market Forecast (2025-2033)
- 7.3 Gallium Nitride
- 7.3.1 Overview
- 7.3.2 Historical and Current Market Trends (2019-2024)
- 7.3.3 Market Forecast (2025-2033)
- 7.4 Others
- 7.4.1 Historical and Current Market Trends (2019-2024)
- 7.4.2 Market Forecast (2025-2033)
8 Japan Radiation Hardened Electronics Market - Breakup by Technique
- 8.1 Radiation Hardening by Design (RHBD)
- 8.1.1 Overview
- 8.1.2 Historical and Current Market Trends (2019-2024)
- 8.1.3 Market Forecast (2025-2033)
- 8.2 Radiation Hardening by Process (RHBP)
- 8.2.1 Overview
- 8.2.2 Historical and Current Market Trends (2019-2024)
- 8.2.3 Market Forecast (2025-2033)
- 8.3 Radiation Hardening by Software (RHBS)
- 8.3.1 Overview
- 8.3.2 Historical and Current Market Trends (2019-2024)
- 8.3.3 Market Forecast (2025-2033)
9 Japan Radiation Hardened Electronics Market - Breakup by Component Type
- 9.1 Power Management
- 9.1.1 Overview
- 9.1.2 Historical and Current Market Trends (2019-2024)
- 9.1.3 Market Forecast (2025-2033)
- 9.2 Application Specific Integrated Circuit
- 9.2.1 Overview
- 9.2.2 Historical and Current Market Trends (2019-2024)
- 9.2.3 Market Forecast (2025-2033)
- 9.3 Logic
- 9.3.1 Overview
- 9.3.2 Historical and Current Market Trends (2019-2024)
- 9.3.3 Market Forecast (2025-2033)
- 9.4 Memory
- 9.4.1 Overview
- 9.4.2 Historical and Current Market Trends (2019-2024)
- 9.4.3 Market Forecast (2025-2033)
- 9.5 Field-Programmable Gate Array
- 9.5.1 Overview
- 9.5.2 Historical and Current Market Trends (2019-2024)
- 9.5.3 Market Forecast (2025-2033)
- 9.6 Others
- 9.6.1 Historical and Current Market Trends (2019-2024)
- 9.6.2 Market Forecast (2025-2033)
10 Japan Radiation Hardened Electronics Market - Breakup by Application
- 10.1 Space Satellites
- 10.1.1 Overview
- 10.1.2 Historical and Current Market Trends (2019-2024)
- 10.1.3 Market Forecast (2025-2033)
- 10.2 Commercial Satellites
- 10.2.1 Overview
- 10.2.2 Historical and Current Market Trends (2019-2024)
- 10.2.3 Market Forecast (2025-2033)
- 10.3 Military
- 10.3.1 Overview
- 10.3.2 Historical and Current Market Trends (2019-2024)
- 10.3.3 Market Forecast (2025-2033)
- 10.4 Aerospace and Defense
- 10.4.1 Overview
- 10.4.2 Historical and Current Market Trends (2019-2024)
- 10.4.2 Market Forecast (2025-2033)
- 10.5 Nuclear Power Plants
- 10.5.1 Overview
- 10.5.2 Historical and Current Market Trends (2019-2024)
- 10.5.3 Market Forecast (2025-2033)
- 10.6 Others
- 10.6.1 Historical and Current Market Trends (2019-2024)
- 10.6.2 Market Forecast (2025-2033)
11 Japan Radiation Hardened Electronics Market - Competitive Landscape
- 11.1 Overview
- 11.2 Market Structure
- 11.3 Market Player Positioning
- 11.4 Top Winning Strategies
- 11.5 Competitive Dashboard
- 11.6 Company Evaluation Quadrant
12 Profiles of Key Players
- 12.1 Company A
- 12.1.1 Business Overview
- 12.1.2 Product Portfolio
- 12.1.3 Business Strategies
- 12.1.4 SWOT Analysis
- 12.1.5 Major News and Events
- 12.2 Company B
- 12.2.1 Business Overview
- 12.2.2 Product Portfolio
- 12.2.3 Business Strategies
- 12.2.4 SWOT Analysis
- 12.2.5 Major News and Events
- 12.3 Company C
- 12.3.1 Business Overview
- 12.3.2 Product Portfolio
- 12.3.3 Business Strategies
- 12.3.4 SWOT Analysis
- 12.3.5 Major News and Events
- 12.4 Company D
- 12.4.1 Business Overview
- 12.4.2 Product Portfolio
- 12.4.3 Business Strategies
- 12.4.4 SWOT Analysis
- 12.4.5 Major News and Events
- 12.5 Company E
- 12.5.1 Business Overview
- 12.5.2 Product Portfolio
- 12.5.3 Business Strategies
- 12.5.4 SWOT Analysis
- 12.5.5 Major News and Events
13 Japan Radiation Hardened Electronics Market - Industry Analysis
- 13.1 Drivers, Restraints, and Opportunities
- 13.1.1 Overview
- 13.1.2 Drivers
- 13.1.3 Restraints
- 13.1.4 Opportunities
- 13.2 Porters Five Forces Analysis
- 13.2.1 Overview
- 13.2.2 Bargaining Power of Buyers
- 13.2.3 Bargaining Power of Suppliers
- 13.2.4 Degree of Competition
- 13.2.5 Threat of New Entrants
- 13.2.6 Threat of Substitutes
- 13.3 Value Chain Analysis
