HDI PCB市場：動向、機会、競合分析【2024-2030年】

HDI PCB市場の動向と予測

世界のHDI PCB市場は、2024年から2030年までのCAGRが4.8%で、2030年までに推定208億米ドルに達すると予測されています。この市場の主な促進要因は、家庭用電子機器市場の成長、電子機器の小型化、高性能機器に対する需要の増加です。世界のHDI PCB市場の将来性は、スマートフォン、コンピュータ、通信・データ通信、家電、自動車産業での機会で有望視されています。

• Lucintelは、スマートフォンや通信機器の需要増加により、4～6層が最大セグメントであり続けると予測しています。10層以上のHDI PCB市場は、スマートウェアラブルやコネクテッドデバイスの需要増加により、予測期間中に最も高い成長が見込まれます。
• スマートフォンは、高性能PCBに対する需要の増加や、スマートフォンの大型バッテリ用スペースに対する需要の増加により、最大のエンドユース産業であり続ける。自動車は、カーエレクトロニクスの進歩により、予測期間中に最も高い成長が見込まれます。
• アジア太平洋地域は引き続き最大の市場であり、自動車における電子コンテンツの増加や、家庭用電子機器・通信製品の成長により、予測期間中に最も高い成長が見込まれます。

アジア太平洋地域は引き続きHDI PCB市場最大の市場です。

1.米国：Intel Corporation、Apple Inc.、Qualcomm Incorporatedなどの企業がHDI PCB技術への取り組みを主導しています。米国政府は半導体製造の技術革新促進に力を入れており、スマートフォン、ノートパソコン、車載用電子機器のアプリケーション向けにHDI PCBの研究開発を推進しています。

2.中国：Huawei Technologies Co., Ltd.、Tencent Holdings Limited、Xiaomi Corporationなどの中国企業が、この市場で著名なプレーヤーです。中国政府別半導体産業への支援や「メイド・イン・チャイナ2025」計画などの取り組みが、通信、家電、車載アプリケーション向けHDI PCB技術の採用を後押ししています。

3.ドイツ：ボッシュGmbH、シーメンスAG、インフィニオン・テクノロジーズAGなどの企業が市場で重要な位置を占めています。インダストリー4.0とデジタル化を推進するドイツの政府イニシアティブが、スマート製造と自動車エレクトロニクス向けHDI PCBの技術革新を後押ししています。

4.台湾：Taiwan Semiconductor Manufacturing Company Limited（TSMC）やFoxconn Technology Groupなどの台湾企業は、HDI PCB製造において重要な役割を果たしています。台湾の半導体産業に対する政府の支援と技術研究への投資は、様々な電子機器向けのHDI PCB技術の進歩を加速させています。

5.日本：ソニー株式会社、パナソニック株式会社、キヤノン株式会社などの企業がHDI PCB市場で活躍しています。日本政府の技術研究への投資や企業との協力により、家庭用電子機器、医療機器、自動車システム向けのHDI PCBの開発が促進されています。

HDI PCB市場の新たな動向

業界のダイナミクスに直接的な影響を与える新たな動向として、電子機器の小型化や低損失/高速HDI PCBの需要拡大が挙げられます。

HDI PCB市場の最近の動向

1.家庭用電子機器におけるHDI PCB需要の増加HDI PCBの需要は、小型化、高機能化、高性能化などの動向に後押しされ、家庭用電子機器分野で成長を続けています。スマートフォン、タブレット、ウェアラブル機器、その他のポータブル電子機器に使用されるHDI PCBの注文が急増しています。レーザー穴あけやシーケンシャルラミネートなどの高度なHDI技術の採用により、シグナルインテグリティと信頼性を向上させた超小型PCB設計の製造が可能になっています。

2.HDI PCB生産能力の拡大：大手PCBメーカーは、さまざまな最終用途業界からの需要増に対応するため、HDI PCBの生産能力を拡大しています。各社は新たな製造施設、設備のアップグレード、プロセスの最適化に投資し、生産量の増加と効率の向上を図っています。生産能力の拡大は、高密度で高性能なPCBソリューションに対する市場の需要に対応し、次世代電子機器の開発をサポートすることを目的としています。

3.先進HDI技術への注力：PCBメーカーは、最新の電子機器の進化する要件を満たすために、HDI技術の進歩に注力しています。最近の動向には、レーザー穴あけ、マイクロビア形成、相互接続技術の革新が含まれ、層数の増加、トレース/スペース幅の微細化、シグナルインテグリティの向上を実現しています。このような技術の進歩により、電気的性能、熱管理、信頼性が向上したHDIプリント基板の開発が可能になり、最先端の電子機器の設計・製造をサポートします。

4.車載アプリケーションにおけるHDIプリント基板の台頭：HDIプリント基板は、ADAS（先進運転支援システム）、インフォテインメントシステム、電気自動車（EV）技術の採用増加により、車載アプリケーションで人気を集めています。自動車メーカーはHDIプリント基板を活用して、過酷な車載環境で優れた性能と信頼性を発揮する小型・軽量の電子モジュールを実現しています。HDI技術を使用することで、複雑な機能をより小さなフォームファクターに統合することができ、よりスマートでコネクテッドな自動車の開発をサポートします。

5.5GインフラにおけるHDIプリント基板の需要：5Gネットワークの展開により、基地局、アンテナ、ルーターなどの通信インフラ機器におけるHDI PCBの需要が高まっています。HDI PCBは、5G通信システムの高速、高周波要件をサポートする上で重要な役割を果たし、より高速なデータ伝送、低遅延、より大きなネットワーク容量を可能にします。各メーカーは、次世代ワイヤレスネットワークの厳しい性能基準を満たすために、先進的な材料と設計技術を取り入れ、5Gアプリケーションに最適化されたHDI PCBの生産を拡大しています。

よくある質問

Q1.市場規模は：

A1.世界のHDI PCB市場は、2030年までに推定208億米ドルに達すると予想されています。

Q2.市場の成長予測は：

A2.HDI PCB市場は、2024年から2030年にかけてCAGR 4.8%で成長する見込みです。

Q3.市場の成長に影響を与える主な促進要因は：

A3.この市場の主な促進要因は、家庭用電子機器市場の成長、電子機器の小型化、高性能機器に対する需要の増加です。

Q4.HDI PCBの主な用途や最終使用産業は？

A4.スマートフォンやタブレット、コンピュータがHDI PCB市場の主な最終用途産業です。

Q5.HDI PCB市場の新たな動向は？

A5.業界のダイナミクスに直接影響を与える新たな動向としては、電子機器の小型化、低損失/高速HDIプリント基板に対する需要の高まりが挙げられます。

Q6.HDI PCBの主要企業は？

A6.主要なHDI PCB企業は以下の通りです：

• TTM Technologies, Inc.
• Tripod Technology Corporation
• AT&S
• Kingboard Holdings Ltd.
• CCTC
• DG Shengyi Electronics
• Dynamic Electronics Co. Ltd.
• Gold Circuit Electronics
• Olympic
• DAP
• Unimicron Technology Corp.
• Compeq Manufacturing Co., Ltd.
• Ibiden Co., Ltd.
• Zhen Ding Technology Holding Limited
• Unitech
• Samsung Electro-Mechanics
• Meiko Electronics Co. Ltd

Q7.HDIプリント基板の技術セグメントで、今後最も大きくなるのはどれですか？

A7.Lucintelの予測では、スマートフォンやテレコム、データ通信の需要が増加しているため、4～6層が最大のセグメントであり続けると思われます。10層以上のHDI PCB市場は、スマートウェアラブルやコネクテッドデバイスの需要増加により、予測期間中に最も高い成長が見込まれています。

Q8.HDI PCB市場において、今後5年間で最大の成長が見込まれる地域はどこですか？

A8.アジア太平洋地域は今後5年間も最大地域であり続け、最も高い成長を示すと予想されています。

Q9.レポートのカスタマイズは可能か：

A9.はい、Lucintelは追加費用なしで10％のカスタマイズを提供します。

目次

第1章 エグゼクティブサマリー

第2章 市場の背景と分類

• イントロダクション、背景、分類
• サプライチェーン
• 業界の促進要因と課題

第3章 2018年から2030年までの市場動向と予測分析

• マクロ経済動向（2018～2023年）と予測（2024～2030年）
• 世界のHDI PCB市場の動向（2018-2023）と予測（2024-2030）
• 最終用途産業別HDI PCB市場
  • スマートフォンとタブレット
  • コンピューター
  • 通信/データ通信
  • 家電
  • 自動車
  • その他
• 技術別HDI PCB市場
  • 4～6層HDI PCB
  • 8～10層HDI PCB
  • 10層以上のHDI PCB
• ビルドアップ構造別HDI PCB市場
  • 1+N+1 HDI PCB
  • 2+N+2 HDI PCB
  • 3+N+3 HDI PCB
  • その他

第4章 2018年から2030年までの地域別市場動向と予測分析

• 地域別HDI PCB市場
• 北米のHDI PCB市場
• 欧州のHDI PCB市場
• アジア太平洋のHDI PCB市場
• その他地域のHDI PCB市場

第5章 競合分析

• 製品ポートフォリオ分析
• 地理的範囲
• ポーターのファイブフォース分析

第6章 成長機会と戦略分析

• 成長機会分析
  • 最終用途産業別HDI PCB市場の成長機会
  • 技術別HDI PCB市場の成長機会
  • ビルドアップ構造別HDI PCB市場の成長機会
  • 地域別HDI PCB市場の成長機会
• 世界のHDI PCB市場の新たな動向
• 戦略分析
  • HDI PCB市場における新製品開発
  • 世界のHDI PCB市場における生産能力の拡大
  • 世界のHDI PCB市場における合併と買収
  • 世界のHDI PCB市場の技術開発

第7章 主要企業の企業プロファイル

• TTM Technologies, Inc.
• Tripod Technology Corporation
• AT&S
• Kingboard Holdings Ltd.
• CCTC
• DG Shengyi Electronics
• Dynamic Electronics Co. Ltd.
• Gold Circuit Electronics
• Olympic
• DAP
• Unimicron Technology Corp.
• Compeq Manufacturing Co., Ltd.
• Ibiden Co., Ltd.
• Zhen Ding Technology Holding Limited
• Unitech
• Samsung Electro-Mechanics
• Meiko Electronics Co. Ltd

HDI PCB Market Trends and Forecast

The future of the global high-density interconnect (HDI) PCB market looks promising with opportunities in the smartphone, computer, telecom and datacom, consumer electronics, and automotive industries. The global HDI PCB market is expected to reach an estimated $20.8 billion by 2030 with a CAGR of 4.8% from 2024 to 2030. The major drivers for this market are growth in consumer electronics market, miniaturization of electronic devices, and increasing demand for high performance devices.

• Lucintel forecasts that 4-6 layers will remain the largest segment due to increasing demand in smartphones and telecommunication equipment. The 10+ layer HDI PCB market is expected to witness the highest growth during the forecast period due to the growing demand for smart wearables and connected devices.
• Smartphones will remain the largest end use industry due to the increasing demand for high performance PCB and growing demand for more space in smartphones for larger batteries. Automotive is expected to witness the highest growth over the forecast period due to advancement in automotive electronics.
• Asia Pacific will remain the largest market, and it is also expected to witness the highest growth over the forecast period due to the increasing electronic content in automotive and growth in consumer electronic devices & telecommunication products.

Asia Pacific will remain the largest market in the HDI PCB Market

1. United States: Companies like Intel Corporation, Apple Inc., and Qualcomm Incorporated are leading initiatives in HDI PCB technology. The US government's focus on promoting innovation in semiconductor manufacturing drives research and development in HDI PCBs for applications in smartphones, laptops, and automotive electronics.

2. China: Chinese companies such as Huawei Technologies Co., Ltd., Tencent Holdings Limited, and Xiaomi Corporation are prominent players in the market. China's government support for the semiconductor industry and initiatives like the "Made in China 2025" plan drive the adoption of HDI PCB technology for telecommunications, consumer electronics, and automotive applications.

3. Germany: Companies like Bosch GmbH, Siemens AG, and Infineon Technologies AG are significant in the market. Germany's government initiatives to promote Industry 4.0 and digitalization drive innovation in HDI PCBs for smart manufacturing and automotive electronics.

4. Taiwan: Taiwanese companies such as Taiwan Semiconductor Manufacturing Company Limited (TSMC) and Foxconn Technology Group play a key role in HDI PCB manufacturing. Taiwan's government support for the semiconductor industry and investment in technology research accelerates advancements in HDI PCB technology for various electronic devices.

5. Japan: Companies like Sony Corporation, Panasonic Corporation, and Canon Inc. are active in the HDI PCB market. Japan's government investment in technology research and collaboration with companies promote the development of HDI PCBs for consumer electronics, medical devices, and automotive systems.

Emerging Trends in the HDI PCB Market

Emerging trends, which have a direct impact on the dynamics of the industry, include miniaturization of electronic devices and growing demand for low loss/high-speed HDI PCBs.

A total of 99 figures / charts and 76 tables are provided in this 195-page report to help in your business decisions. Sample figures with insights are shown below.

HDI PCB Market by Segment

The study includes trends and forecast for the global high density interconnect (HDI) PCB market by end use industry, technology, build-up layer count, and region as follows:

By End Use Industry [$M and Thousand Sqm shipment analysis for 2018 - 2030]:

• Smartphones and Tablets
• Computers
• Telecom/Datacom
• Consumer Electronics
• Automotive
• Others

By Technology [$M and Thousand Sqm shipment analysis for 2018 - 2030]:

• 4-6 Layer
• 8-10 Layer
• 10+ Layer

By Build-Up Structure [$M and Thousand Sqm shipment analysis for 2018 - 2030]:

• 1+n+1
• 2+n+2
• 3+n+3
• Others

By Region [$M and Thousand Sqm shipment analysis for 2018 - 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of HDI PCB Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies HDI PCB companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the HDI PCB companies profiled in this report includes.

• TTM Technologies, Inc.
• Tripod Technology Corporation
• AT&S
• Kingboard Holdings Ltd.
• CCTC
• DG Shengyi Electronics
• Dynamic Electronics Co. Ltd.
• Gold Circuit Electronics
• Olympic
• DAP
• Unimicron Technology Corp.
• Compeq Manufacturing Co., Ltd.
• Ibiden Co., Ltd.
• Zhen Ding Technology Holding Limited
• Unitech
• Samsung Electro-Mechanics
• Meiko Electronics Co. Ltd

Recent Developments in the HDI PCB Market

1. Rising Demand for HDI PCBs in Consumer Electronics: The demand for HDI PCBs continues to grow in the consumer electronics sector, driven by trends such as miniaturization, increased functionality, and higher performance requirements. Manufacturers are witnessing a surge in orders for HDI PCBs used in smartphones, tablets, wearable devices, and other portable electronics. The adoption of advanced HDI technologies, including laser drilling and sequential lamination, enables the production of ultra-compact PCB designs with improved signal integrity and reliability.

2. Expansion of HDI PCB Production Capacity: Leading PCB manufacturers are expanding their production capacity for HDI PCBs to meet growing demand from various end-use industries. Companies are investing in new manufacturing facilities, equipment upgrades, and process optimizations to increase output and improve efficiency. The expansion of production capacity is aimed at addressing market demand for high-density, high-performance PCB solutions and supporting the development of next-generation electronic devices.

3. Focus on Advanced HDI Technologies: PCB manufacturers are focusing on advancing HDI technologies to meet the evolving requirements of modern electronic devices. Recent developments include innovations in laser drilling, microvia formation, and interconnection techniques to achieve higher layer counts, finer trace/space widths, and improved signal integrity. These technological advancements enable the development of HDI PCBs with enhanced electrical performance, thermal management, and reliability, supporting the design and production of cutting-edge electronics.

4. Rise of HDI PCBs in Automotive Applications: HDI PCBs are gaining traction in automotive applications, driven by the increasing adoption of advanced driver-assistance systems (ADAS), infotainment systems, and electric vehicle (EV) technology. Automakers are leveraging HDI PCBs to enable compact and lightweight electronic modules that deliver superior performance and reliability in harsh automotive environments. The use of HDI technology allows for the integration of complex functionalities into smaller form factors, supporting the development of smarter and more connected vehicles.

5. Demand for HDI PCBs in 5G Infrastructure: The rollout of 5G networks is fueling demand for HDI PCBs in telecommunications infrastructure equipment, including base stations, antennas, and routers. HDI PCBs play a crucial role in supporting the high-speed, high-frequency requirements of 5G communication systems, enabling faster data transmission, lower latency, and greater network capacity. Manufacturers are ramping up production of HDI PCBs optimized for 5G applications, incorporating advanced materials and design techniques to meet the stringent performance criteria of next-generation wireless networks.

Features of HDI PCB Market

• Market Size Estimates: High Density Interconnect (HDI) PCB market size estimation in terms of value ($M) and Volume (Thousand Sqm)
• Trend and Forecast Analysis: Market trends (2018-2023) and forecast (2024-2030) by various segments and regions.
• Segmentation Analysis: High Density Interconnect (HDI) PCB market size by various segments, such as end use industry, technology, and built-up structure, in terms of value and volume.
• Regional Analysis: High Density Interconnect (HDI) PCB market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
• Growth Opportunities: Analysis on growth opportunities in various end use industries, technologies, built-up structures, and regions for the high density interconnect (HDI) PCB market.
• Strategic Analysis: This includes M&A, new product development, and competitive landscape for the high density interconnects (HDI) PCB market.
• Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the HDI PCB market size?

Answer: The global HDI PCB market is expected to reach an estimated $20.8 billion by 2030.

Q2. What is the growth forecast for HDI PCB market?

Answer: The HDI PCB market is expected to grow at a CAGR of 4.8% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the HDI PCB market?

Answer: The major drivers for this market are growth in the consumer electronics market, miniaturization of electronic devices, and increasing demand for high performance devices.

Q4. What are the major applications or end use industries for HDI PCB?

Answer: Smart phones and tablets, and computers are the major end use industries for HDI PCB market.

Q5. What are the emerging trends in HDI PCB market?

Answer: Emerging trends, which have a direct impact on the dynamics of the industry, include miniaturization of electronic devices and growing demand for low loss/high-speed HDI PCBs.

Q6. Who are the key HDI PCB companies?

Answer: Some of the key HDI PCB companies are as follows:

• TTM Technologies, Inc.
• Tripod Technology Corporation
• AT&S
• Kingboard Holdings Ltd.
• CCTC
• DG Shengyi Electronics
• Dynamic Electronics Co. Ltd.
• Gold Circuit Electronics
• Olympic
• DAP
• Unimicron Technology Corp.
• Compeq Manufacturing Co., Ltd.
• Ibiden Co., Ltd.
• Zhen Ding Technology Holding Limited
• Unitech
• Samsung Electro-Mechanics
• Meiko Electronics Co. Ltd

Q7.Which HDI PCB technology segment will be the largest in future?

Answer: Lucintel forecasts that 4-6 layers will remain the largest segment due to increasing demand in smartphone and telecom and datacom. The 10+ layer HDI PCB market is expected to witness the highest growth during the forecast period due to the growing demand for smart wearables and connected devices.

Q8: In HDI PCB market, which region is expected to be the largest in next 5 years?

Answer: Asia Pacific is expected to remain the largest region and witness the highest growth over next 5 years.

Q9. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

• Q.1 What are some of the most promising potential, high-growth opportunities for the global high density interconnect (HDI) PCB market by end use industry (smartphones and tablets, computers, telecom/datacom, consumer electronics, automotive and others), technology (4-6 layer, 8-10 layer, 10+ layer), build-up layer count (1+n+1, 2+n+2, 3+n+3, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2 Which segments will grow at a faster pace and why?
• Q.3 Which regions will grow at a faster pace and why?
• Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the High Density Interconnect (HDI) PCB market?
• Q.5 What are the business risks and threats to the high density interconnect (HDI) PCB market?
• Q.6 What are the emerging trends in the high density interconnect (HDI) PCB market and the reasons behind them?
• Q.7 What are some changing demands of customers in the high density interconnect (HDI) PCB market?
• Q.8 What are the new developments in the high density interconnect (HDI) PCB market? Which companies are leading these developments?
• Q.9 Who are the major players in the high density interconnect (HDI) PCB market? What strategic initiatives are being implemented by key players for business growth?
• Q.10 What are some of the competitive products and processes in the high density interconnect (HDI) PCB market, and how big of a threat do they pose for loss of market share via material or product substitution?
• Q.11 What M&A activities did take place in the last five years in the high density interconnect (HDI) PCB market?

Table of Contents

1. Executive Summary

2. Market Background and Classifications

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

• 3.1: Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
• 3.2: Global High Density Interconnect (HDI) PCB Market Trends (2018-2023) and Forecast (2024-2030)
• 3.3: Global High Density Interconnect (HDI) PCB Market by End Use Industry
  • 3.3.1: Smartphones and Tablets
  • 3.3.2: Computers
  • 3.3.3: Telecom/Datacom
  • 3.3.4: Consumer Electronics
  • 3.3.5: Automotive
  • 3.3.6: Others
• 3.4: Global High Density Interconnect (HDI) PCB Market by Technology
  • 3.4.1: 4-6 Layer HDI PCBs
  • 3.4.2: 8-10 Layer HDI PCBs
  • 3.4.3: 10+ Layer HDI PCBs
• 3.5: Global High Density Interconnect (HDI) PCB Market by Built-Up Structure
  • 3.5.1: 1+N+1 HDI PCBs
  • 3.5.2: 2+N+2 HDI PCBs
  • 3.5.3: 3+N+3 HDI PCBs
  • 3.5.4: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

• 4.1: Global High Density Interconnect (HDI) PCB Market by Region
• 4.2: North American High Density Interconnect (HDI) PCB Market
  • 4.2.1: Market by End Use Industry
  • 4.2.2: Market by Technology
  • 4.2.3: Market by Built-Up Structure
• 4.3: European High Density Interconnect (HDI) PCB Market
  • 4.3.1: Market by End Use Industry
  • 4.3.2: Market by Technology
  • 4.3.3: Market by Built-Up Structure
• 4.4: APAC High Density Interconnect (HDI) PCB Market
  • 4.4.1: Market by End Use Industry
  • 4.4.2: Market by Technology
  • 4.4.3: Market by Built-Up Structure
• 4.5: ROW High Density Interconnect (HDI) PCB Market
  • 4.5.1: Market by End Use Industry
  • 4.5.2: Market by Technology
  • 4.5.3: Market by Built-Up Structure

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Geographical Reach
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by End Use Industry
  • 6.1.2: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by Technology
  • 6.1.3: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by Built-Up Structure
  • 6.1.4: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by Region
• 6.2: Emerging Trends in the Global High Density Interconnect (HDI) PCB Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development in the Global High Density Interconnect (HDI) PCB Market
  • 6.3.2: Capacity Expansions in the Global High Density Interconnect (HDI) PCB Market
  • 6.3.3: Mergers and Acquisitions in the Global High Density Interconnect (HDI) PCB Market
  • 6.3.4: Technology Development of the Global High Density Interconnect (HDI) PCB Market

7. Company Profiles of Leading Players

• 7.1: TTM Technologies, Inc.
• 7.2: Tripod Technology Corporation
• 7.3: AT&S
• 7.4: Kingboard Holdings Ltd.
• 7.5: CCTC
• 7.6: DG Shengyi Electronics
• 7.7: Dynamic Electronics Co. Ltd.
• 7.8: Gold Circuit Electronics
• 7.9: Olympic
• 7.10: DAP
• 7.11: Unimicron Technology Corp.
• 7.12: Compeq Manufacturing Co., Ltd.
• 7.13: Ibiden Co., Ltd.
• 7.14: Zhen Ding Technology Holding Limited
• 7.15: Unitech
• 7.16: Samsung Electro-Mechanics
• 7.17: Meiko Electronics Co. Ltd