ファンアウトパッケージレポート：2030年までの動向、予測、競合分析

ファンアウトパッケージの動向と予測

世界のファンアウトパッケージ市場は、2024年から2030年までのCAGR 15.7%で、2030年までに推定68億米ドルに達すると予想されています。 この市場の主な原動力として、高性能、高エネルギー効率、薄さ、小ささなどのフォームファクタパッケージの要件により、スマートフォンなどの設置面積に敏感なデバイスでの用途が拡大していることなどが挙げられます。世界のファンアウトパッケージ市場の将来性は有望で、OSAT、ファウンドリ、IDM市場での機会があります。

ファンアウトパッケージ市場に関する洞察

Lucintelは、ウェーハレベル処理の製造能力と、スルーモールド相互接続（トール銅（Cu）ピラー、TPVS（through package vias）、高度なフリップチップパッケージ技術など）を利用した3D構造の開発能力によって小型化の要件を満たすのに役立つため、高密度ファンアウトが予測期間を通じて引き続き最大のセグメントになると予測しています。

この市場では、ファウンドリが引き続き最大のセグメントとなるでしょう。

アジア太平洋は、域内に大手半導体メーカーが存在するため、予測期間中に最も高い成長が見込まれると予想されます。

よくある質問

Q.1ファンアウトパッケージの市場規模はどれくらいですか？

A1.世界のファンアウトパッケージ市場は、2030年までに推定68億米ドルに達すると予想されています。

Q.2ファンアウトパッケージ市場の成長予測は何ですか？

A2.世界のファンアウトパッケージ市場は、2024年から2030年にかけて15.7%のCAGRで成長すると予想されています。

Q.3ファンアウトパッケージ市場の成長に影響を与える主な要因は何ですか？

A3.この市場の主な促進要因として、高性能、高エネルギー効率、薄さ、小ささなどのフォームファクタパッケージの要件により、スマートフォンなどの設置面積に敏感なデバイスでの用途が拡大していることなどが挙げられます。

Q4.市場の主要セグメントは？

A4.ファンアウトパッケージ市場の将来性は有望で、OSAT、ファウンドリ、IDMの分野に市場機会が存在します。

Q5.市場の主要企業は？

A5.主要なファンアウトパッケージ企業は次のとおりです（一部）。

• Taiwan Semiconductor
• Jiangsu Changjiang Electronics
• Samsung Electro-Mechanics
• Powertech Technology
• Amkor Technology
• Advanced Semiconductor
• Nepes Corporation

Q6.今後、最大となる市場セグメントは？

A6.Lucintelは、ウェーハレベル処理の製造能力と、スルーモールド相互接続（トール銅（Cu）ピラー、TPVS（through package vias）、高度なフリップチップパッケージ技術など）を利用した3D構造の開発能力によって小型化の要件を満たすのに役立つため、高密度ファンアウトが予測期間を通じて引き続き最大のセグメントになると予測しています。

Q7.市場において、今後5年間に最大になると予想される地域は？

A7. アジア太平洋は、この地域に大手半導体メーカーが存在するため、予測期間中に最も高い成長が見込まれると予想されます。

Q8.レポートのカスタマイズは可能か？

A8.はい、Lucintelは追加費用なしで10%のカスタマイズを提供します。

目次

第1章 エグゼクティブサマリー

第2章 世界のファンアウトパッケージ市場：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 業界の促進要因と課題

第3章 2018年から2030年までの市場動向と予測分析

• マクロ経済の動向（2018～2023年）と予測（2024～2030年）
• 世界のファンアウトパッケージ市場の動向（2018～2023年）と予測（2024～2030年）
• タイプ別の世界のファンアウトパッケージ市場
  • コアファンアウト
  • 高密度ファンアウト
  • 超高密度ファンアウト
• キャリアタイプ別の世界のファンアウトパッケージ市場
  • 200mm
  • 300mm
  • パネル
• ビジネスモデル別の世界のファンアウトパッケージ市場
  • OSAT
  • ファウンドリ
  • IDM

第4章 2018年から2030年までの地域別の市場動向と予測分析

• 地域別の世界のファンアウトパッケージ市場
• 北米のファンアウトパッケージ市場
• 欧州のファンアウトパッケージ市場
• アジア太平洋のファンアウトパッケージ市場
• その他の地域 (ROW) のファンアウトパッケージ市場

第5章 競合の分析

• 製品ポートフォリオ分析
• 運用上の統合
• ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

• 成長機会分析
  • タイプ別の世界のファンアウトパッケージ市場の成長機会
  • キャリアタイプ別の世界のファンアウトパッケージ市場の成長機会
  • ビジネスモデル別の世界のファンアウトパッケージ市場の成長機会
  • 世界のファンアウトパッケージ市場地域の成長機会
• 世界のファンアウトパッケージ市場の新たな動向
• 戦略的分析
  • 新製品の開発
  • 世界のファンアウトパッケージ市場の生産能力拡大
  • 世界のファンアウトパッケージ市場における合併、買収、合弁事業
  • 認証とライセンシング

第7章 有力企業の企業プロファイル

• Taiwan Semiconductor
• Jiangsu Changjiang Electronics
• Samsung Electro-Mechanics
• Powertech Technology
• Amkor Technology
• Advanced Semiconductor
• Nepes Corporation

Fan Out Packaging Trends and Forecast

The future of the global fan out packaging market looks promising with opportunities in the OSAT, foundary, and IDM markets. The global fan out packaging market is expected to reach an estimated $6.8 billion by 2030 with a CAGR of 15.7% from 2024 to 2030. The major drivers for this market are growing applications in footprint sensitive devices like smartphones, owing to requirement of high performing, energy efficient, thin, and small form factor packages.

A more than 150-page report is developed to help in your business decisions.

Fan Out Packaging by Segment

The study includes a forecast for the global fan out packaging by type, carrier ttype, business model, and region

Fan Out Packaging Market by Type [Shipment Analysis by Value from 2018 to 2030]:

• Core Fan-Out
• High-Density Fan-Out
• Ultra High-density Fan Out

Fan Out Packaging Market by Carrier Type [Shipment Analysis by Value from 2018 to 2030]:

• 200 mm
• 300 mm
• Panel

Fan Out Packaging Market by Business Model [Shipment Analysis by Value from 2018 to 2030]:

• OSAT
• Foundary
• IDM

Fan Out Packaging Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Fan Out Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies fan out packaging companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the fan out packaging companies profiled in this report include-

• Taiwan Semiconductor
• Jiangsu Changjiang Electronics
• Samsung Electro-Mechanics
• Powertech Technology
• Amkor Technology
• Advanced Semiconductor
• Nepes Corporation

Fan Out Packaging Market Insights

Lucintel forecast that high-density fan out will remain the largest segment over the forecast period as it helps in meeting the requirement of miniaturization by fabrication capabilities of wafer-level processing along with its ability to develop 3D structures utilizing through-mold interconnects, such as tall copper (CU) pillars and through package vias (TPVS) and advanced flip chip packaging technologies.

Within this market, foundary will remain the largest segment.

APAC is expected to witness highest growth over the forecast period due to presence of major semiconductor manufacturers in the region.

Features of the Global Fan Out Packaging Market

Market Size Estimates: Fan out packaging market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Fan out packaging market size by type, carrier type, business model, and region in terms of value ($B).

Regional Analysis: Fan out packaging market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, carrier types, business models, and regions for the fan out packaging market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the fan out packaging market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the fan out packaging market size?

Answer: The global fan out packaging market is expected to reach an estimated $6.8 billion by 2030.

Q.2 What is the growth forecast for fan out packaging market?

Answer: The global fan out packaging market is expected to grow with a CAGR of 15.7% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the fan out packaging market?

Answer: The major drivers for this market are growing applications in footprint sensitive devices like smartphones, owing to requirement of high performing, energy efficient, thin, and small form factor packages.

Q4. What are the major segments for fan out packaging market?

Answer: The future of the fan out packaging market looks promising with opportunities in the OSAT, foundary, IDM markets.

Q5. Who are the key fan out packaging market companies?

Answer: Some of the key fan out packaging companies are as follows:

• Taiwan Semiconductor
• Jiangsu Changjiang Electronics
• Samsung Electro-Mechanics
• Powertech Technology
• Amkor Technology
• Advanced Semiconductor
• Nepes Corporation

Q6. Which fan out packaging market segment will be the largest in future?

Answer: Lucintel forecast that high-density fan out will remain the largest segment over the forecast period as it helps in meeting the requirement of miniaturization by fabrication capabilities of wafer-level processing along with its ability to develop 3D structures utilizing through-mold interconnects, such as tall copper (CU) pillars and through package vias (TPVS) and advanced flip chip packaging technologies.

Q7. In fan out packaging market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to presence of major semiconductor manufacturers in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the fan out packaging market by type (core fan-out, high-density fan-out, and ultra high-density fan out), carrier type (200 mm, 300 mm, and panel), business model (OSAT, foundary, and IDM), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Fan Out Packaging Market : Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

• 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
• 3.2. Global Fan Out Packaging Market Trends (2018-2023) and Forecast (2024-2030)
• 3.3: Global Fan Out Packaging Market by Type
  • 3.3.1: Core Fan-Out
  • 3.3.2: High-Density Fan-Out
  • 3.3.3: Ultra High-density Fan Out
• 3.4: Global Fan Out Packaging Market by Carrier Type
  • 3.4.1: 200 mm
  • 3.4.2: 300 mm
  • 3.4.3: Panel
• 3.5: Global Fan Out Packaging Market by Business Model
  • 3.5.1: OSAT
  • 3.5.2: Foundary
  • 3.5.3: IDM

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

• 4.1: Global Fan Out Packaging Market by Region
• 4.2: North American Fan Out Packaging Market
  • 4.2.1: North American Fan Out Packaging Market by Type: Core Fan-Out, High-Density Fan-Out, and Ultra High-density Fan Out
  • 4.2.2: North American Fan Out Packaging Market by Business Model: OSAT, Foundary, and IDM
• 4.3: European Fan Out Packaging Market
  • 4.3.1: European Fan Out Packaging Market by Type: Core Fan-Out, High-Density Fan-Out, and Ultra High-density Fan Out
  • 4.3.2: European Fan Out Packaging Market by Business Model: OSAT, Foundary, and IDM
• 4.4: APAC Fan Out Packaging Market
  • 4.4.1: APAC Fan Out Packaging Market by Type: Core Fan-Out, High-Density Fan-Out, and Ultra High-density Fan Out
  • 4.4.2: APAC Fan Out Packaging Market by Business Model: OSAT, Foundary, and IDM
• 4.5: ROW Fan Out Packaging Market
  • 4.5.1: ROW Fan Out Packaging Market by Type: Core Fan-Out, High-Density Fan-Out, and Ultra High-density Fan Out
  • 4.5.2: ROW Fan Out Packaging Market by Business Model: OSAT, Foundary, and IDM

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global Fan Out Packaging Market by Type
  • 6.1.2: Growth Opportunities for the Global Fan Out Packaging Market by Carrier Type
  • 6.1.3: Growth Opportunities for the Global Fan Out Packaging Market by Business Model
  • 6.1.4: Growth Opportunities for the Global Fan Out Packaging Market Region
• 6.2: Emerging Trends in the Global Fan Out Packaging Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global Fan Out Packaging Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Fan Out Packaging Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: Taiwan Semiconductor
• 7.2: Jiangsu Changjiang Electronics
• 7.3: Samsung Electro-Mechanics
• 7.4: Powertech Technology
• 7.5: Amkor Technology
• 7.6: Advanced Semiconductor
• 7.7: Nepes Corporation