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市場調査レポート
商品コード
1263869
半導体ウエハー研磨・研削装置の世界市場:動向、機会、競合分析(2023年~2028年)Semiconductor Wafer Polishing and Grinding Equipment Market: Trends, Opportunities and Competitive Analysis [2023-2028] |
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半導体ウエハー研磨・研削装置の世界市場:動向、機会、競合分析(2023年~2028年) |
出版日: 2023年04月01日
発行: Lucintel
ページ情報: 英文 150 Pages
納期: 3営業日
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世界の半導体ウエハー研磨・研削装置の市場規模は、2028年に3億3,000万米ドルに達し、2023年~2028年にCAGRで5.0%の成長が予測されています。市場の主な促進要因は、コンシューマーエレクトロニクスの消費の増加、MEMSやIC製造、光学、化合物半導体に対する需要の増加、部品の小型化動向の高まりです。
当レポートでは、世界の半導体ウエハー研磨・研削装置市場について調査分析し、動向と予測、成長機会の分析、企業プロファイルなどを提供しています。
Semiconductor Wafer Polishing and Grinding Equipment Market Trends and Forecast
The future of the global semiconductor wafer polishing and grinding equipment market looks promising with opportunities in the foundry, memory manufacturer, and IDMs industries. The global semiconductor wafer polishing and grinding equipment market is expected to reach an estimated $0.33 billion with a CAGR of 5.0% from 2023 to 2028. The major drivers for this market are rise in the consumption of consumer electronics, increasing demand for MEMS, IC manufacturing, optics, and compound semiconductors, and growing trend for miniaturization of components.
Semiconductor Wafer Polishing and Grinding Equipment Market by Type, and End Use Industry
A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.
Semiconductor Wafer Polishing and Grinding Equipment Market by Segments
Semiconductor Wafer Polishing and Grinding Equipment Market by Segment
Semiconductor Wafer Polishing and Grinding Equipment Market by Type [Value ($B) Shipment Analysis from 2017 to 2028]:
Semiconductor Wafer Polishing Equipment
Semiconductor Wafer Grinding Equipment
Semiconductor Wafer Polishing and Grinding Equipment Market by End Use Industry [Value ($B) Shipment Analysis from 2017 to 2028]:
Foundries
Memory Manufacturers
IDMs
Others
Semiconductor Wafer Polishing and Grinding Equipment Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:
North America
Europe
Asia Pacific
The Rest of the World
List of Semiconductor Wafer Polishing and Grinding Equipment Companies
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies semiconductor wafer polishing and grinding equipment companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the semiconductor wafer polishing and grinding equipment companies profiled in this report include.
Applied Materials
Ebara Corporation
Disco Corporation
Lapmaster
Logitech
Entrepix
Revasum
Axus Technology
Semiconductor Wafer Polishing and Grinding Equipment Market Insights
Lucintel forecast that semiconductor wafer polishing equipment will remain the largest type segment over the forecast period due to rapid expansion in the electronics industry that leads to increasing demand for micro electromechanical systems (MEMS), microchips, and integrated circuits for developing consumer electronic goods, such as smartphones, laptops and desktops..
Within this market, foundries is projected to record the highest growth from 2023 to 2028 due to their extensive utilization for composing integrated circuits, supported by the large-scale integration of wireless technologies, including the Internet of Things (IoT) and artificial intelligence (AI), that helps the manufacturers to develop smart devices.
North American region is expected to witness the highest growth during the forecast period due to increase in demand of power semiconductor ICs for automotive applications and growing investments in electric infrastructure in this region.
Features of the Semiconductor Wafer Polishing and Grinding Equipment Market
Market Size Estimates: Semiconductor wafer polishing and grinding equipment market size estimation in terms of value ($B)
Trend and Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
Segmentation Analysis: Semiconductor wafer polishing and grinding equipment market size by various segments, such as by type, end use industry, and region
Regional Analysis: Semiconductor wafer polishing and grinding equipment market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
Growth Opportunities: Analysis on growth opportunities in different by type, end use industry, and regions for the semiconductor wafer polishing and grinding equipment market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape for the semiconductor wafer polishing and grinding equipment market.
Analysis of competitive intensity of the industry based on Porter's Five Forces model.
FAQ
Q1. What is the semiconductor wafer polishing and grinding equipment market size?
Answer: The global semiconductor wafer polishing and grinding equipment market is expected to reach an estimated $0.3 billion by 2028.
Q2. What is the growth forecast for semiconductor wafer polishing and grinding equipment market?
Answer: The global semiconductor wafer polishing and grinding equipment market is expected to grow with a CAGR of 5.0% from 2023 to 2028.
Q3. What are the major drivers influencing the growth of the semiconductor wafer polishing and grinding equipment market?
Answer: The major drivers for this market are rise in the consumption of consumer electronics, increasing demand for MEMS, IC manufacturing, optics, and compound semiconductors, and growing trend for miniaturization of components.
Q4. What are the major segments for semiconductor wafer polishing and grinding equipment market?
Answer: The future of the global semiconductor wafer polishing and grinding equipment market looks promising with opportunities in the foundry, memory manufacturers, and IDMs industries.
Q5. Who are the key semiconductor wafer polishing and grinding equipment companies?
Answer: Some of the key semiconductor wafer polishing and grinding equipment companies are as follows:
Applied Materials
Ebara Corporation
Disco Corporation
Lapmaster
Logitech
Entrepix
Revasum
Axus Technology
Q6. Which semiconductor wafer polishing and grinding equipment segment will be the largest in future?
Answer: Lucintel forecast that semiconductor wafer polishing equipment will remain the largest type segment over the forecast period due to rapid expansion in the electronics industry that leads to increasing demand for micro electromechanical systems (MEMS), microchips, and integrated circuits for developing consumer electronic goods, such as smartphones, laptops and desktops.
Q7. In semiconductor wafer polishing and grinding equipment market, which region is expected to be the largest in next 5 years?
Answer: North American region is expected to witness the highest growth during the forecast period due to increase in demand of power semiconductor ICs for automotive applications and growing investments in electric infrastructure in this region.
Q8. Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.