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市場調査レポート
商品コード
1384952
次世代メモリの世界市場規模、シェア、産業動向分析レポート:技術別、ウエハーサイズ別、業界別、地域別展望と予測、2023年~2030年Global Next Generation Memory Market Size, Share & Industry Trends Analysis Report By Technology, By Wafer Size (300 mm, and 200 mm), By Vertical, By Regional Outlook and Forecast, 2023 - 2030 |
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次世代メモリの世界市場規模、シェア、産業動向分析レポート:技術別、ウエハーサイズ別、業界別、地域別展望と予測、2023年~2030年 |
出版日: 2023年10月31日
発行: KBV Research
ページ情報: 英文 345 Pages
納期: 即納可能
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次世代メモリ市場規模は2030年までに218億米ドルに達し、予測期間中のCAGRは17.2%の市場成長率で上昇すると予測されています。
KBVカーディナル・マトリックスに掲載された分析によると、サムスン電子は2030年までに218億米ドルに達すると予測されています。Samsung Electronics Co. Ltd.が同市場におけるトップランナーです。Micron Technology, Inc.、Honeywell International, Inc.、Infineon Technologies AGなどの企業は、この市場における主要なイノベーターです。2023年10月、Micron Technology, Inc.は、1B(1-β)プロセスノード技術の製品ポートフォリオを強化するため、16Gb DDR5メモリを発売しました。この新製品は、4相クロック、クロックシンク、高誘電率CMOSデバイス技術を特徴としています。さらに、新製品は性能を50%向上させ、前世代と比較してワット当たりの性能を33%向上させる。
市場成長要因
高性能データ処理への需要の高まり
高性能データ処理に対する需要の急増は、データ集約型アプリケーションの複雑化と、処理要件の増大に対応できるより効率的なメモリ・ソリューションの必要性によってもたらされています。MRAM、PCMなどを含む次世代メモリ技術は、このような需要に対応できる独自の地位を確立しており、さまざまな分野への統合により、いくつかの注目すべき発展がもたらされました。この需要の高まりの顕著な結果の一つは、次世代メモリ業界における技術革新の加速です。次世代メモリ・ソリューションは、インメモリ・コンピューティングに必要な高速データ・アクセスを提供するため、インメモリ・コンピューティングの成功にも不可欠です。結論として、高性能データ処理に対する需要の高まりが、マーケットを変革するきっかけとなっています。
新興テクノロジーの利用拡大
技術の進歩が続き、エッジコンピューティング、モノのインターネット(IoT)、5G、人工知能(AI)などの新しいパラダイムが勢いを増すにつれて、性能と信頼性の要件を満たすことができるメモリ・ソリューションへの需要が高まっています。この相乗効果の最も注目すべき成果のひとつが、次世代メモリー技術とエッジコンピューティングの融合です。エッジコンピューティングでは、データソースに近いネットワークの周辺部で効率的にデータを処理する必要があります。次世代メモリの高速データアクセスと低レイテンシは、エッジデバイスやゲートウェイにとって理想的なパートナーです。エッジコンピューティングが自律走行車、スマートシティ、産業オートメーションなどのアプリケーションに不可欠になるにつれ、次世代メモリ技術はエッジでの迅速なデータ処理とリアルタイムの意思決定を保証します。AIが進化を続け、ヘルスケア、金融、自律システムなどの業界を形成するにつれて、高度なメモリー技術に対する需要はますます高まると思われます。したがって、こうした発展はすべて市場の拡大を後押しすることになります。
市場抑制要因
製造コストの大幅な高騰
MRAMや3D XPointのような次世代メモリの開発および製造には、複雑で特殊なプロセスが必要です。こうしたプロセスには、高度な製造施設や設備、熟練した労働力が必要とされることが多いです。このようなインフラを確立するために必要な初期投資は法外に高額になる可能性があり、中小企業が市場で競争するのは困難です。さらに、高い製造コストは次世代メモリ製品の価格設定に直接影響します。製造コストがかさむと、メーカーはそのコストを消費者に転嫁し、小売価格の上昇を招くことが多いです。価格に敏感なコンシューマー・エレクトロニクス分野では、次世代メモリー技術の採用は、その相対的なコスト高によって妨げられる可能性があります。
技術展望
テクノロジー別に見ると、市場は揮発性と不揮発性に二分されます。2022年の市場では、不揮発性セグメントが最も高い収益シェアを獲得しました。不揮発性技術には、現代の企業にとって不可欠な多くの利点があります。電源がない状態でもデータを保存できることは、最も注目すべき特質の1つです。不揮発性技術により、起動時間の短縮とデータ整合性の向上が可能になり、金融取引やデータの一貫性が重要なデータ・ストレージのようなアプリケーションに不可欠です。不揮発性メモリは、エネルギー効率を改善し、モバイル機器のバッテリー寿命を延ばし、データセンターの運営費を削減するために必要です。
ウエハーサイズの展望
ウエハーサイズによって、市場は200nmと300nmに分けられます。200nmセグメントは、2022年の市場で大きな収益シェアを記録しました。半導体産業は、200mmウエハサイズの使用から大きな利益を得ています。より小さなウエハーを製造する方が一般的に低コストであるため、費用対効果は大きな利点です。これは、次世代メモリ・コンポーネントの性能と品質を犠牲にすることなく、コスト削減と製造プロセスの合理化を目指す企業にとって魅力的です。生産量が少量で十分な場合、200mmウエハーは特殊なアプリケーションやニッチ市場にとって特に魅力的です。その柔軟性により、企業は大規模な生産設備を必要とすることなく、特定の顧客ニーズを満たすことができます。
業界別展望
業界別では、BFSI、家電、政府、通信、情報技術、エンタープライズ・ストレージ、自動車・運輸、その他に区分されます。2022年には、エンタープライズ・ストレージ市場が最大の収益シェアを占める。MRAMやPCMなどの次世代メモリ技術は、NANDフラッシュのような従来のストレージ・ソリューションに比べてデータ・アクセス時間を大幅に短縮します。これは待ち時間の短縮につながり、企業はより迅速にデータにアクセスして処理できるようになります。リアルタイムのデータ分析、高頻度取引、データベース・アプリケーションでは、待ち時間の短縮は画期的なことです。次世代メモリの多くは不揮発性で、電源を切ってもデータを保持します。これはエンタープライズ・ストレージ・システムにおいて、データの完全性を保証し、停電や電力供給停止の際にも重要な情報を保持できる点で有利です。
地域別展望
地域別に見ると、市場は北米、欧州、アジア太平洋、ラテンアメリカ・中東・アフリカで分析されます。アジア太平洋は、2022年の市場で最大の収益シェアを獲得しました。同地域では、ビジネス環境の変化に伴い、次世代メモリ技術が急速に採用されています。アジア太平洋諸国全体でIoTデバイスが急速に発展しているため、電源オフシナリオでもデータを保持できるエネルギー効率の高いメモリソリューションに対する需要が高まっています。同地域におけるスマート・デバイスの普及とハイテクに精通した消費者層が、この需要の直接的な原因となっています。アジア太平洋は、その強固な製造エコシステムにより、半導体製造のホットスポットとなっています。
次世代メモリー市場で展開されている最近の戦略
パートナーシップ、提携、契約:
製品発表と製品拡大:
買収と合併
地理的拡大
The Global Next Generation Memory Market size is expected to reach $21.8 billion by 2030, rising at a market growth of 17.2% CAGR during the forecast period.
Integrating next generation memory technologies brings significant benefits to the forefront of the BFSI industry. These solutions' rapidity and effectiveness are essential for enhancing data analytics and real-time transaction processing capabilities. Therefore, the BFSI sector would generate 1/5th share of the market by 2030. Financial institutions are able to make decisions more quickly and accurately, which is crucial in markets where even milliseconds can have a significant impact. Additionally, data integrity is guaranteed by the non-volatile nature of some next generation memory types, which is crucial for upholding regulatory compliance and preserving trust. Enhancing operational efficiency as well as data security in the BFSI sector is mainly dependent on next generation memory due to the growing volume of financial data and the requirement for strong security measures.
The major strategies followed by the market participants are Product Launches as the key developmental strategy to keep pace with the changing demands of end users. For instance, In October, 2023, Everspin Technologies, Inc. launched the EMxxLX to enhance the high-density STT-MRAM product family. The EMxxLX is an xSPI serial interface for persistent memory. The new product has the features of a clock frequency of 200 MHz and a bandwidth of 400 megabytes per second using eight I/O signals. Additionally, In July, 2023, Samsung Electronics Co. Ltd. launched the Graphics Double Data Rate 7 (GDDR7) DRAM. The new product helps enhance user experiences and provides exceptional graphics performance on game consoles and workstations. Additionally, the new product has applications in AI and automotive vehicles.
Based on the Analysis presented in the KBV Cardinal matrix; Samsung Electronics Co. Ltd. is the forerunner in the Market. Companies such as Micron Technology, Inc., Honeywell International, Inc., Infineon Technologies AG are some of the key innovators in the Market. In October, 2023, Micron Technology, Inc. launched the 16Gb DDR5 memory to enhance its 1B (1-beta) process node technology product portfolio. The new product has the features of 4-phase clocking, clock-sync and high-k CMOS device technology. Additionally, the new product helps to increase performance by 50% and provides an improvement in performance per watt of 33% over the previous generation.
Market Growth Factors
Rising demand for high-performance data processing
The surge in demand for high-performance data processing is driven by the growing complexity of data-intensive applications and the need for more efficient memory solutions that can keep pace with the escalating processing requirements. Next Generation Memory technologies, including MRAM, PCM, and others, are uniquely positioned to meet these demands, and their integration into various sectors has ushered in several notable developments. One prominent consequence of this heightened demand is the acceleration of innovation within the Next Generation Memory industry. Next Generation Memory solutions are also crucial for the success of in-memory computing, as they provide the high-speed data access required for this approach. In conclusion, the growing demand for high-performance data processing has been a catalyst for transformative change within the market.
Increasing use of emerging technologies
As technology continues to advance and new paradigms such as edge computing, the Internet of Things (IoT), 5G, and artificial intelligence (AI) gain momentum, the demand for memory solutions that can meet the performance and reliability requirements grows. One of the most noteworthy outcomes of this synergy is the convergence of Next Generation Memory technologies with edge computing. Edge computing requires efficient data handling at the network's periphery, close to data sources. Next-generation memory's high-speed data access and low latency make it an ideal companion for edge devices and gateways. As edge computing becomes integral to applications like autonomous vehicles, smart cities, and industrial automation, Next Generation Memory technologies ensure rapid data processing and real-time decision-making at the edge. As AI continues to evolve and shape industries such as healthcare, finance, and autonomous systems, the demand for advanced memory technologies will intensify. Therefore, all of these developments will aid in the expansion of the market.
Market Restraining Factors
Significantly high manufacturing costs
The development and production of next-generation memory, such as MRAM and 3D XPoint, involves intricate and specialized processes. These processes often require sophisticated manufacturing facilities, equipment, and a skilled workforce. The initial investment needed to establish such infrastructure can be prohibitively high, making it challenging for smaller players to compete in the market. Moreover, high manufacturing costs directly impact the pricing of Next Generation Memory products. When production expenses are substantial, manufacturers often transfer these costs to consumers, resulting in higher retail prices. In the consumer electronics sector, where price sensitivity is prevalent, the adoption of these technologies may be hampered by their relatively high cost.
Technology Outlook
Based on technology, the market is bifurcated into volatile and non-volatile. The non-volatile segment garnered the highest revenue share in the market in 2022. Non-volatile technology offers a number of benefits that are essential for contemporary enterprises. Their capacity to store data even in the absence of power is one of their most notable qualities. Faster boot times and better data integrity are made possible by non-volatile technology, which is essential for applications like financial transactions and crucial data storage where data consistency is vital. Non-volatile memory is necessary for improving energy efficiency, extending mobile device battery life, and lowering data center operating expenses.
Wafer Size Outlook
On the basis of wafer size, the market is divided into 200 nm and 300 nm. The 200 nm segment recorded a substantial revenue share in the market in 2022. The semiconductor industry benefits significantly from the use of 200 mm wafer size. Cost-effectiveness is a major advantage since producing smaller wafers is typically less expensive. This is appealing to companies looking to cut costs and streamline their manufacturing processes without sacrificing the performance and quality of next generation memory components. When smaller production volumes are adequate, 200 mm wafers are especially appealing for specialized applications and niche markets. Their flexibility enables businesses to meet specific customer needs without requiring large-scale production facilities.
Vertical Outlook
By vertical, the market is segmented into BFSI, consumer electronics, government, telecommunications, information technology, enterprise storage, automotive & transportation, and others. The enterprise storage region witnessed the largest revenue share in the market in 2022. Next Generation memory technologies, such as MRAM and PCM, provide significantly faster data access times compared to traditional storage solutions like NAND flash. This translates to reduced latency, allowing enterprises to access and process data more quickly. In real-time data analysis, high-frequency trading, and database applications, reduced latency is a game-changer. Many next generation memory types are non-volatile, meaning they retain data even when power is removed. This is advantageous in enterprise storage systems, as it guarantees data integrity and preserves critical information in the event of power failures or outages.
Regional Outlook
Region-wise, the market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The Asia Pacific region acquired the maximum revenue share in the market in 2022. Next Generation memory technology is rapidly being adopted in this region due to a number of factors that are in line with the changing business environment in the region. The demand for energy-efficient memory solutions to preserve data in power-off scenarios has increased due to the rapid development of IoT devices throughout Asia Pacific countries. The proliferation of smart devices and the tech-savvy consumer base in the region are the direct causes of this demand. Asia Pacific is a hotspot for the production of semiconductors due to its robust manufacturing ecosystem.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co. Ltd., Micron Technology, Inc., Fujitsu Limited, Toshiba Corporation, Honeywell International, Inc., Microchip Technology, Inc., Everspin Technologies, Inc., Infineon Technologies AG, Kingston Technology Company, Inc., and Intel Corporation.
Recent Strategy Deployed in the Next-generation Memory Market
Partnerships, Collaborations, and Agreements:
Oct-2023: Micron Technology, Inc. joined hands with Qualcomm Technologies, Inc., a company engaged in developing wireless telecommunication products. Under this collaboration, Micron Technology utilized the Snapdragon 8 Gen 3 mobile platform of Qualcomm Technologies to introduce the 5X (LPDDR5X) memory, which has low power but a double data rate. The new product works at a speed grade of 9.6 gigabits per second (Gbps) and offers the fast performance required for operating generative artificial intelligence (AI).
Oct-2023: Fujitsu Limited collaborated with TOPPAN Holdings Inc., a Japanese global printing company. Under this collaboration, the analytical technology of TOPPAN Holdings was amalgamated with the data cleansing technology of Fujitsu within the boundaries of a medical record database. Additionally, this collaboration assisted the companies in conducting analysis of medical big data and provided services for enhancing research and development in healthcare.
Sep-2023: Silicon Storage Technology, Inc., a subsidiary of Microchip Technology, Inc., formed a partnership with GlobalFoundries U.S. Inc., a multinational semiconductor contract manufacturing company. Under this partnership, the SST ESF3 third-generation embedded SuperFlash technology NVM solution was introduced.
Nov-2022: Infineon Technologies AG came into a partnership with Taiwan Semiconductor Manufacturing Company Limited, a Taiwanese multinational semiconductor contract manufacturing company. Under this partnership, the Resistive RAM (RRAM) Non-Volatile Memory (NVM) technology of TSMC was incorporated into the AURIX microcontrollers (MCU) of Infineon Technologies.
May-2022: Samsung Electronics Co. Ltd. teamed up with Red Hat, Inc., an American software company. Under this collaboration, open-source software technologies were developed for storage and memory products. Additionally, the collaboration built an ecosystem for establishing a combination of software and hardware.
Product Launches and Product Expansions:
Oct-2023: Micron Technology, Inc. launched the 16Gb DDR5 memory to enhance its 1B (1-beta) process node technology product portfolio. The new product has the features of 4-phase clocking, clock-sync and high-k CMOS device technology. Additionally, the new product helps to increase performance by 50% and provides an improvement in performance per watt of 33% over the previous generation.
Oct-2023: Everspin Technologies, Inc. launched the EMxxLX to enhance the high-density STT-MRAM product family. The EMxxLX is an xSPI serial interface for persistent memory. The new product has the features of a clock frequency of 200 MHz and a bandwidth of 400 megabytes per second using eight I/O signals.
Sep-2023: Toshiba Electronic Devices & Storage Corporation, a subsidiary of Toshiba Corporation, launched the MG10F Series 22TB HDD, a traditional magnetic recording (CMR) HDD device. The MG10F 22TB offers 10% more capability than the previous generation 20TB model of Toshiba. Additionally, the new product has a variety of applications in both traditional datacentre and cloud-scale use cases.
Jul-2023: Samsung Electronics Co. Ltd. launched the Graphics Double Data Rate 7 (GDDR7) DRAM. The new product helps enhance user experiences and provides exceptional graphics performance on game consoles and workstations. Additionally, the new product has applications in AI and automotive vehicles.
Apr-2023: Infineon Technologies AG introduced the SEMPER X1 LPDDR Flash, a LPDDR Flash memory assisting next-generation automotive E/E architectures. The SEMPER X1 LPDDR Flash offers safe and reliable real-time code execution. Additionally, the new product offers 8 times better performance than the current NOR Flash memory and 20 times quicker transactions for real-time applications.
Feb-2023: Fujitsu Limited unveiled the Fujitsu Web3 Acceleration Platform, a platform offering a variety of service APIs based on high-performance computing and blockchain technologies. The new product provides an opportunity for individuals in start-ups and universities to develop several Web3 applications and services. Additionally, the new product connects users to the Computing as a Service Data e-TRUST modules and the Computing as a Service applications of Fujitsu.
Dec-2022: Samsung Electronics Co., Ltd. introduced the 16-gigabit (Gb) DDR5 DRAM, a technology built using the 12-nanometer (nm)-class process technology. The new product assists in developing the market-wide operations of DDR5 DRAM.
Aug-2022: Microchip Technology Inc. unveiled the SMC 2000 series of Compute Express Link (CXL)-based Smart Memory Controllers to enhance its serial-attached memory controller product portfolio. The new product helps the CPUs, SoCs and GPUs use CXL interfaces for DDR5 and DDR4 memory. Additionally, the new product offers more bandwidth and memory per core and reduces the Total Cost of Ownership (TCO) in the data centre through optimization of application workloads.
Acquisition and Mergers:
Mar-2021: Honeywell International, Inc. completed the acquisition of Fiplex Communications, Inc., a worldwide manufacturer of telecommunication products. Through this acquisition, Honeywell enhanced its communications and building connectivity products.
Dec-2020: Honeywell International, Inc. completed the acquisition of Sparta Systems, a company providing enterprise quality management software (QMS). Through this acquisition, Honeywell solidified its position in the industrial automation and enterprise performance management software markets.
Oct-2020: Microchip Technology Inc. completed the acquisition of Tekron International Limited, a company producing high-precision atomic and GPS clocks. Through this acquisition, Microchip enhanced its product offering and established its position in the smart energy and industrial markets.
Geographical Expansions:
May-2023: Micron Technology, Inc. expanded its geographical footprints in Japan through the introduction of ultraviolet (EUV) technology. Through this geographical expansion, sophisticated patterning technology was used in order to develop the 1-gamma (1γ) node, the next generation of DRAM.
Market Segments covered in the Report:
By Technology
By Wafer Size
By Vertical
By Geography
Companies Profiled
Unique Offerings from KBV Research