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次世代メモリ市場:タイプ別、用途別、技術別、地域別、2024年~2031年

Next-Generation Memory Market By Type (Mass Storage, Embedded Storage), Application (Consumer Electronics, Enterprise Storage, Manufacturing), Technology (Volatile, Hybrid Memory Cube (HMC), DRAM), & Region for 2024-2031


出版日
ページ情報
英文 202 Pages
納期
2~3営業日
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=146.99円
次世代メモリ市場:タイプ別、用途別、技術別、地域別、2024年~2031年
出版日: 2024年08月16日
発行: Verified Market Research
ページ情報: 英文 202 Pages
納期: 2~3営業日
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概要

次世代メモリ市場の評価、2024年~2031年

人工知能(AI)、機械学習(ML)、モノのインターネット(IoT)など、多くの分野におけるデータ駆動型アプリケーションの急速な台頭が、次世代メモリ市場の需要拡大を牽引しています。企業がより良い意思決定、業務効率、顧客体験のためにビッグデータの活用を熱望する中、大容量・高速メモリソリューションの重要性はますます高まっており、2024年には44億9,000万米ドルの売上高を突破し、2031年には約304億1,000万米ドルの評価額に達する見込みです。

クラウド・コンピューティングとモバイル・デバイスの普及が、次世代メモリ・ソリューションの需要を押し上げています。より多くの企業がクラウドプラットフォームに移行するにつれて、巨大なワークロードを処理し、高速なデータ検索を提供できる弾力性のあるメモリアーキテクチャに対する需要が重要になり、2024年から2031年にかけてCAGR 27.03%で市場が成長します。

次世代メモリ市場定義/概要

次世代メモリ(NGM)とは、DRAMやNANDフラッシュといった従来のメモリシステムの制約に対処する改良型メモリ技術を指します。これらの新しいタイプのメモリは、人工知能(AI)、機械学習、ビッグデータ分析、モノのインターネット(IoT)などの現在のアプリケーションの拡大する需要に対応する速度、効率、拡張性の向上を目的としています。

この技術は、業界全体のパフォーマンスと効率を向上させる幅広いアプリケーションに徐々に統合されています。重要な用途のひとつに、より高速なデータ処理が求められるハイパフォーマンス・コンピューティング(HPC)があります。スーパーコンピュータやデータセンターでは、3D NANDや拡張DRAMなどの技術を活用して、リアルタイム分析や高速データアクセスを実現しています。

次世代メモリ(NGM)技術の将来的な応用は、様々な産業におけるデータストレージと処理能力を変化させると予想されます。注目すべきアプリケーションのひとつは、NGMによってデータアクセスと処理が高速化される人工知能(AI)と機械学習です。

高性能データ処理需要の高まりは次世代メモリー市場を牽引するか?

高性能データ処理への需要の高まりは、次世代メモリー市場の主な促進要因です。この動向は、データ出力の指数関数的な増加、データ集約型アプリケーションの普及、人工知能(AI)、機械学習(ML)、モノのインターネット(IoT)などの先端技術の受け入れ拡大によってもたらされています。インターナショナル・データ・コーポレーション(IDC)によると、世界のデータスフィアは2018年の33ゼタバイトから2025年には175ゼタバイトに増加すると予想されており、これはCAGRが61%であることを示しています。

さらに、米国エネルギー省によると、データセンターは現在、米国の全電力の約2%を利用しており、この数字は2030年までに8%に上昇すると予想されています。このことは、データ処理のニーズの高まりに対応するため、よりエネルギー効率の高いメモリ・ソリューションの必要性を強調しています。2020年から2022年にかけて、全米科学財団(NSF)はAIの研究開発活動に5億米ドル以上の資金を提供しました。さらに、米国政府が2019年に発表した米国AIイニシアチブは、AIのイノベーションを刺激することを目的としており、高性能メモリー・ソリューションの需要を高めています。

高い製造コストは次世代メモリー市場の妨げになるか?

製造コストの高騰は、次世代メモリー市場の成長を大きく阻害する可能性があります。メーカーが高性能メモリー・ソリューションを提供するために高度な技術や斬新なプロセスに取り組むと、研究開発、設備、施設に必要な初期資本が多額になる可能性があります。特に、3D NANDや今後の不揮発性メモリのような最先端技術では、製造の複雑さや精密さが製造価格を押し上げます。こうした製造コストの高騰は、消費者や企業の価格を引き上げ、普及を阻害し、市場の拡大を制限する可能性があります。

原材料価格の変動やサプライチェーンの中断は、次世代メモリ分野の製造コスト上昇を促進します。

半導体産業は、シリコン、希土類元素、特殊化学品など、必要不可欠な資源の入手可能性やコストの変動に対して極めて脆弱です。さらに、地政学的な対立や、情勢が複雑化するCOVID-19のような世界のサプライチェーンへの懸念は、製造の遅延やコスト増を引き起こす可能性があります。こうした生産上の問題に対処できなければ、研究開発への投資が妨げられ、最終的にメモリー技術の向上が制限される可能性があります。

目次

第1章 次世代メモリの世界市場:イントロダクション

  • 市場概要
  • 調査範囲
  • 前提条件

第2章 エグゼクティブサマリー

第3章 VERIFIED MARKET RESEARCHの調査手法

  • データマイニング
  • 検証
  • プライマリーインタビュー
  • データソース一覧

第4章 次世代メモリの世界市場展望

  • 概要
  • 市場力学
    • 促進要因
    • 抑制要因
    • 機会
  • ポーターのファイブフォースモデル
  • バリューチェーン分析

第5章 次世代メモリの世界市場:技術別

  • 概要
  • 揮発性
  • 不揮発性

第6章 次世代メモリの世界市場:タイプ別

  • 概要
  • 大容量ストレージ
  • 組み込み型ストレージ

第7章 次世代メモリの世界市場:用途別

  • 概要
  • コンシューマーエレクトロニクス
  • エンタープライズストレージ
  • 製造業
  • IT・通信
  • 航空宇宙・防衛
  • 産業
  • 自動車・運輸
  • その他

第8章 次世代メモリの世界市場:地域別

  • 概要
  • 北米
    • 米国
    • カナダ
    • メキシコ
  • 欧州
    • ドイツ
    • 英国
    • フランス
    • その他欧州
  • アジア太平洋
    • 中国
    • 日本
    • インド
    • その他アジア太平洋地域
  • 世界のその他の地域
    • 中東・アフリカ
    • ラテンアメリカ

第9章 次世代メモリの世界市場:競合情勢

  • 概要
  • 各社の市場ランキング
  • 主な発展戦略

第10章 企業プロファイル

  • Intel
  • Toshiba
  • Fujitsu
  • Micron Technology
  • SK Hynix
  • Western Digital
  • Samsung
  • Everspin
  • Microchip Technology
  • Adesto Technologies

第11章 主な発展

  • 製品上市/開発
  • 合併と買収
  • 事業拡大
  • パートナーシップと提携

第12章 付録

  • 関連調査
目次
Product Code: 3855

Next-Generation Memory Market Valuation - 2024-2031

The fast rise of data-driven applications in many sectors such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT) is driving the expanding demand for the next-generation memory market. As enterprises aspire to use big data for better decision-making, operational efficiency, and customer experiences, high-capacity, high-speed memory solutions have become increasingly important by enabling the market to surpass a revenue of USD 4.49 Billion in 2024 and reach a valuation of aroundUSD 30.41 Billion by 2031.

Cloud computing and the proliferation of mobile devices are driving up demand for next-generation memory solutions. As more businesses migrate to cloud platforms, the demand for resilient memory architectures that can handle huge workloads and deliver fast data retrieval becomes critical by enabling the market to grow at aCAGR of 27.03% from 2024 to 2031.

Next-Generation Memory Market: Definition/ Overview

Next Generation Memory (NGM) refers to improved memory technologies that address the constraints of traditional memory systems such as DRAM and NAND flash. These novel memory types are intended to improve speed, efficiency, and scalability meeting the expanding demands of current applications such as artificial intelligence (AI), machine learning, big data analytics, and the Internet of Things (IoT).

The technologies are progressively being integrated into a wide range of applications improving performance and efficiency across industries. One significant use is high-performance computing (HPC) where the need for faster data processing is critical. Supercomputers and data centers leverage technologies like 3D NAND and enhanced DRAM to provide real-time analytics and fast data access.

The future application of next generation memory (NGM) technologies is expected to alter data storage and processing capacities across a variety of industries. One notable application is in artificial intelligence (AI) and machine learning where NGM will speed up data access and processing.

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Will the Rising Demand for High-Performance Data Processing Drive the Next-Generation Memory Market?

The increasing demand for high-performance data processing is a major driver of the next-generation memory market. This trend is being driven by the exponential increase in data output, the proliferation of data-intensive applications, and the growing acceptance of advanced technologies such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT). According to the International Data Corporation (IDC), the global datasphere is expected to increase from 33 zettabytes in 2018 to 175 zettabytes by 2025 indicating a 61% compound annual growth rate (CAGR).

Furthermore, the US Department of Energy says that data centers currently utilize around 2% of all electricity in the United States with this figure anticipated to rise to 8% by 2030. This emphasizes the need for more energy-efficient memory solutions to meet the increasing need for data processing. Between 2020 and 2022, the National Science Foundation (NSF) funded more than $500 million in AI research and development activities. Furthermore, the US government's American AI Initiative which was announced in 2019 aims to stimulate AI innovation, increasing demand for high-performance memory solutions.

Will High Manufacturing Costs Hamper the Next-Generation Memory Market?

High production costs may severely impede the growth of the next-generation memory market. As manufacturers engage in sophisticated technologies and novel processes to provide high-performance memory solutions, the initial capital required for research and development, equipment, and facilities can be significant. This is especially true for cutting-edge technologies like 3D NAND and upcoming non-volatile memory types where fabrication complexity and precision requirements drive up production prices. These high manufacturing costs can raise prices for consumers and businesses, discouraging widespread adoption and limiting market expansion.

Fluctuating raw material prices and supply chain interruptions drive increased manufacturing costs in the next-generation memory sector.

The semiconductor industry is extremely vulnerable to changes in the availability and cost of essential resources including silicon, rare earth elements, and specialty chemicals. Furthermore, geopolitical conflicts and global supply chain concerns as shown by incidents such as the COVID-19 epidemic can cause delays and increased costs complicating the landscape. If these production issues are not addressed, they may impede investment in R&D, ultimately limiting memory technology improvements.

Category-Wise Acumens

Will the Cost-Efficiency and Faster Memory Solutions Drive the Technology Segment?

The non-volatile memory sector is expected to dominate the memory market due to the exponential development of data generation across numerous industries. With the introduction of big data analytics, Internet of Things (IoT) devices, and cloud computing, enterprises are dealing with an unprecedented volume of data necessitating high-performance and cost-effective memory solutions. Non-volatile memory technologies such as NAND flash and developing alternatives like 3D XPoint are increasingly valued for their ability to maintain data even when power is lost.

The growing popularity of wearables, high-performance computing (HPC), and other consumer gadgets increases the demand for sophisticated non-volatile memory solutions. Wearables, for example, require compact, energy-efficient storage capable of processing health data and user interactions. Similarly, HPC applications demand memory that can handle sophisticated computations and enormous datasets which makes non-volatile systems more appealing.

Will Reliability and Scalability in Enterprise Storage Environments Contribute to the Dominance of the Application Segment within the Market?

Next-generation memory technologies play a critical role in improving enterprise storage systems such as data centers, servers, and cloud storage. These advanced memory technologies such as 3D NAND and non-volatile memory express are intended to provide extraordinary speed and efficiency allowing for quick data access and low latency storage. In today's data-driven world, organizations are bombarded with massive amounts of information that must be effectively managed and retrieved.

The deployment of sophisticated memory technologies improves reliability and scalability in enterprise storage infrastructures. These technologies are designed to resist the rigors of continuous operation providing the durability and performance consistency that businesses seek. Organizations may easily extend their storage capabilities without compromising performance allowing them to react to evolving business needs and effectively manage expanding data workloads.

Country/Region-wise Acumens

Will the Rapid Expansion of Mobile Technology and the Internet of Things (IoT) Drive the Market in the Asia Pacific Region?

The Asia Pacific region dominates the next generation memory market due to its significant presence in semiconductor manufacturing and quick adoption of sophisticated technologies. This dominance is fueled by the region's tremendous expansion in mobile technology and the Internet of Things (IoT) which has created an enormous need for high-performance, energy-efficient memory solutions. Asia Pacific's mobile technology sector is growing at an unparalleled rate. The International Data Corporation (IDC) predicts that smartphone shipments in Asia Pacific will reach 878 million units by 2025, reflecting a 2.9% compound annual growth rate (CAGR) between 2020 and 2025.

According to the Global Mobile Suppliers Association (GSA), by 2023, there will be 233 commercial 5G networks in 87 countries with Asia Pacific leading in installations. As of 2022, China alone had installed approximately 1.43 million 5G base stations covering all prefecture-level cities, according to the Ministry of Industry and Information Technology. This vast 5G infrastructure is fueling the growth of edge computing and AI applications that require high-performance memory. The Korea Information Society Development Institute projects that South Korea's 5G industry will reach USD 73 Billion by 2026, reflecting a 43% CAGR from 2020 to 2026.

Will the Growing Focus on Data Security and Compliance Regulations Drive the Market in the North American Region?

The Asia Pacific region is experiencing the greatest growth in the next generation memory market owing to rapid technical developments and increased data center investments. Countries such as China, Japan, and South Korea have had exceptionally rapid growth. The Asia Pacific region's next generation memory market is being driven by a growing emphasis on data security and regulatory compliance. According to International Association of Privacy Professionals (IAPP) research, 65% of Asia Pacific countries have comprehensive data protection laws in place as of 2023.

According to the Asian Development Bank, the Asia Pacific IoT market is expected to develop at a CAGR of 28.6% between 2021 and 2026, reaching USD 436.77 Billion. This rapid increase in IoT combined with severe data protection rules is driving demand for next-generation memory technologies that provide stronger security features, quicker data processing capabilities, and more energy efficiency.

Competitive Landscape

The Next-Generation Memory Market is a dynamic and competitive space characterized by diverse players vying for market share. These players are on the run for solidifying their presence through the adoption of strategic plans such as collaborations, mergers, acquisitions, and political support. The organizations are focusing on innovating their product line to serve the vast population in diverse regions.

Some of the prominent players operating in the next-generation memory market include:

Samsung

Micron Technology, Inc.

Fujitsu

SK HYNIX INC

Honeywell International, Inc.

Microchip Technology, Inc

Everspin Technologies, Inc

Infineon Technologies AG

Kingston Technology Europe Co LLP

KIOXIA Singapore Pte. Ltd

Latest Developments

In April 2024, Samsung unveiled the Evo Select and Evo Plus microSD memory cards in the United States, touting higher read speeds of up to 160 MB/s, 30 MB/s faster than the previous 2023 models. These improved memory card lines are meant to considerably improve data transfer speeds, meeting consumers' growing demand for quicker and more dependable storage options across multiple devices.

In May 2024, Micron Technology, Inc. stated that it will begin shipping a new high-performance memory for data centers. Their 128GB DDR5 RDIMM has quicker speeds and greater capacity than prior models, with a maximum transfer rate of 5,600 MT/s. This improvement will address the needs of modern data centers, which require efficient and powerful computing.

TABLE OF CONTENTS

1 INTRODUCTION OF GLOBAL NEXT-GENERATION MEMORY MARKET

  • 1.1 Overview of the Market
  • 1.2 Scope of Report
  • 1.3 Assumptions

2 EXECUTIVE SUMMARY

3 RESEARCH METHODOLOGY OF VERIFIED MARKET RESEARCH

  • 3.1 Data Mining
  • 3.2 Validation
  • 3.3 Primary Interviews
  • 3.4 List of Data Sources

4 GLOBAL NEXT-GENERATION MEMORY MARKET OUTLOOK

  • 4.1 Overview
  • 4.2 Market Dynamics
    • 4.2.1 Drivers
    • 4.2.2 Restraints
    • 4.2.3 Opportunities
  • 4.3 Porters Five Force Model
  • 4.4 Value Chain Analysis

5 GLOBAL NEXT-GENERATION MEMORY MARKET, BY TECHNOLOGY

  • 5.1 Overview
  • 5.2 Volatile
  • 5.3 Non-volatile

6 GLOBAL NEXT-GENERATION MEMORY MARKET, BY TYPE

  • 6.1 Overview
  • 6.2 Mass Storage
  • 6.3 Embedded Storage

7 GLOBAL NEXT-GENERATION MEMORY MARKET, BY APPLICATION

  • 7.1 Overview
  • 7.2 Consumer Electronics
  • 7.3 Enterprise Storage
  • 7.4 Manufacturing
  • 7.5 IT and Telecommunication
  • 7.6 Aerospace and Defense
  • 7.7 Industrial
  • 7.8 Automotive and Transportation
  • 7.9 Others

8 GLOBAL NEXT-GENERATION MEMORY MARKET, BY GEOGRAPHY

  • 8.1 Overview
  • 8.2 North America
    • 8.2.1 U.S.
    • 8.2.2 Canada
    • 8.2.3 Mexico
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 U.K.
    • 8.3.3 France
    • 8.3.4 Rest of Europe
  • 8.4 Asia Pacific
    • 8.4.1 China
    • 8.4.2 Japan
    • 8.4.3 India
    • 8.4.4 Rest of Asia Pacific
  • 8.5 Rest of the World
    • 8.5.1 Middle East and Africa
    • 8.5.2 Latin America

9 GLOBAL NEXT-GENERATION MEMORY MARKET COMPETITIVE LANDSCAPE

  • 9.1 Overview
  • 9.2 Company Market Ranking
  • 9.3 Key Development Strategies

10 COMPANY PROFILES

  • 10.1 Intel
    • 10.1.1 Overview
    • 10.1.2 Financial Performance
    • 10.1.3 Product Outlook
    • 10.1.4 Key Developments
  • 10.2 Toshiba
    • 10.2.1 Overview
    • 10.2.2 Financial Performance
    • 10.2.3 Product Outlook
    • 10.2.4 Key Developments
  • 10.3 Fujitsu
    • 10.3.1 Overview
    • 10.3.2 Financial Performance
    • 10.3.3 Product Outlook
    • 10.3.4 Key Developments
  • 10.4 Micron Technology
    • 10.4.1 Overview
    • 10.4.2 Financial Performance
    • 10.4.3 Product Outlook
    • 10.4.4 Key Developments
  • 10.5 SK Hynix
    • 10.5.1 Overview
    • 10.5.2 Financial Performance
    • 10.5.3 Product Outlook
    • 10.5.4 Key Developments
  • 10.6 Western Digital
    • 10.6.1 Overview
    • 10.6.2 Financial Performance
    • 10.6.3 Product Outlook
    • 10.6.4 Key Developments
  • 10.7 Samsung
    • 10.7.1 Overview
    • 10.7.2 Financial Performance
    • 10.7.3 Product Outlook
    • 10.7.4 Key Developments
  • 10.8 Everspin
    • 10.8.1 Overview
    • 10.8.2 Financial Performance
    • 10.8.3 Product Outlook
    • 10.8.4 Key Developments
  • 10.9 Microchip Technology
    • 10.9.1 Overview
    • 10.9.2 Financial Performance
    • 10.9.3 Product Outlook
    • 10.9.4 Key Developments
  • 10.10 Adesto Technologies
    • 10.10.1 Overview
    • 10.10.2 Financial Performance
    • 10.10.3 Product Outlook
    • 10.10.4 Key Developments

11 KEY DEVELOPMENTS

  • 11.1 Product Launches/Developments
  • 11.2 Mergers and Acquisitions
  • 11.3 Business Expansions
  • 11.4 Partnerships and Collaborations

12 Appendix

    • 12.1.1 Related Research