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表紙：メモリICの市場規模、シェア、成長分析、タイプ別、エンドユーザー産業別、地域別 - 産業予測、2025年～2032年
市場調査レポート
商品コード
1772736

メモリICの市場規模、シェア、成長分析、タイプ別、エンドユーザー産業別、地域別 - 産業予測、2025年～2032年

Memory IC Market Size, Share, and Growth Analysis, By Type (DRAM, Flash), By End-user Industry (Consumer Electronics, Automotive), By Region - Industry Forecast 2025-2032

出版日
発行
SkyQuest
ページ情報
英文 179 Pages
納期
3～5営業日
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=148.42円
メモリICの市場規模、シェア、成長分析、タイプ別、エンドユーザー産業別、地域別 - 産業予測、2025年～2032年
出版日: 2025年07月10日
発行: SkyQuest
ページ情報: 英文 179 Pages
納期: 3～5営業日
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  • 概要
  • 目次
概要

メモリICの世界市場規模は2023年に31億米ドルとなり、予測期間（2025年～2032年）のCAGRは7.7%で、2024年の33億4,000万米ドルから2032年までには60億4,000万米ドルに成長する見通しです。

世界のメモリIC市場は、さまざまな分野におけるハイパフォーマンスコンピューティング需要の高まりの影響をますます受けています。データセンターやエッジコンピューティングにおける高度なアプリケーションが登場するにつれ、迅速なデータ処理の必要性が最優先されるようになり、メーカー各社は最先端のアーキテクチャを備えたメモリソリューションの技術革新を促しています。こうした効率化の動きはモバイル機器やネットワークインフラにも浸透し、低遅延と高帯域幅の要件につながります。また、3DスタッキングやMRAMなど、性能とエネルギー消費を改善する新しいタイプのメモリも増加しています。さらに、設計ツールの進歩や業界内の協力的な取り組みにより、持続可能性への懸念に対処しながら、将来のメモリ技術における速度、容量、エネルギー効率のバランスをとりつつ、メモリ集積度の向上と消費電力の削減を目指しています。

目次

イントロダクション

  • 調査の目的
  • 調査範囲
  • 定義

調査手法

  • 情報調達
  • 二次と一次データの方法
  • 市場規模予測
  • 市場の前提条件と制限

エグゼクティブサマリー

  • 世界市場の見通し
  • 供給と需要の動向分析
  • セグメント別機会分析

市場力学と見通し

  • 市場概要
  • 市場規模
  • 市場力学
    • 促進要因と機会
    • 抑制要因と課題
  • ポーターの分析

主要な市場の考察

  • 主要な成功要因
  • 競合の程度
  • 主要な投資機会
  • 市場エコシステム
  • 市場の魅力指数（2024年）
  • PESTEL分析
  • マクロ経済指標
  • バリューチェーン分析
  • 価格分析
  • 技術分析
  • ケーススタディ
  • 顧客購買行動分析

世界のメモリICの市場規模：タイプ別・CAGR（2025年～2032年）

  • 市場概要
  • DRAM
  • Flash
    • NOR
    • NAND
  • その他のタイプ

世界のメモリICの市場規模：エンドユーザー産業別・CAGR（2025年～2032年）

  • 市場概要
  • コンシューマーエレクトロニクス
  • 自動車
  • IT・通信
  • ヘルスケア
  • その他のエンドユーザー産業

世界のメモリICの市場規模・CAGR（2025年～2032年）

  • 北米
    • 米国
    • カナダ
  • 欧州
    • ドイツ
    • スペイン
    • フランス
    • 英国
    • イタリア
    • その他欧州地域
  • アジア太平洋
    • 中国
    • インド
    • 日本
    • 韓国
    • その他アジア太平洋
  • ラテンアメリカ
    • ブラジル
    • その他ラテンアメリカ地域
  • 中東・アフリカ
    • GCC諸国
    • 南アフリカ
    • その他中東・アフリカ

競合情報

  • 上位5社の比較
  • 主要企業の市場ポジショニング（2024年）
  • 主な市場企業が採用した戦略
  • 最近の市場動向
  • 企業の市場シェア分析（2024年）
  • 主要企業の企業プロファイル
    • 企業の詳細
    • 製品ポートフォリオ分析
    • 企業のセグメント別シェア分析
    • 収益の前年比比較（2022年～2024年）

主要企業プロファイル

  • Samsung Electronics（South Korea）
  • SK Hynix（South Korea）
  • Micron Technology（United States）
  • Western Digital（United States）
  • Intel Corporation（United States）
  • Texas Instruments（United States）
  • Kingston Technology（United States）
  • Broadcom Inc.（United States）
  • Infineon Technologies（Germany）
  • STMicroelectronics（Switzerland）
  • Microchip Technology（United States）
  • Renesas Electronics（Japan）
  • Nanya Technology（Taiwan）
  • Winbond Electronics（Taiwan）

結論と提言

目次
Product Code: SQMIG45I2296

Global Memory IC Market size was valued at USD 3.1 billion in 2023 and is poised to grow from USD 3.34 billion in 2024 to USD 6.04 billion by 2032, growing at a CAGR of 7.7% during the forecast period (2025-2032).

The global memory IC market is increasingly influenced by the growing demand for high-performance computing across various sectors. As advanced applications in data centers and edge computing arise, the necessity for rapid data processing becomes paramount, prompting manufacturers to innovate memory solutions with cutting-edge architectures. This drive for efficiency permeates mobile devices and network infrastructure, leading to lower latency and higher bandwidth requirements. The market also sees a rise in novel memory types, such as 3D stacking and MRAM, which improve performance and energy use. Additionally, advancements in design tools and collaborative efforts within the industry aim to enhance memory integration and reduce power consumption, all while addressing sustainability concerns and balancing speed, capacity, and energy efficiency in future memory technologies.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Memory IC market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Memory IC Market Segments Analysis

Global Memory IC Market is segmented by Type, End-user Industry and region. Based on Type, the market is segmented into DRAM, Flash and Other Types. Based on End-user Industry, the market is segmented into Consumer Electronics, Automotive, IT & Telecommunication, Healthcare and Other End-user Industries. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Memory IC Market

The surge in data-intensive applications, especially in areas like artificial intelligence, machine learning, cloud computing, and the Internet of Things, has significantly heightened the need for high-performance memory integrated circuits (ICs). These applications demand rapid and high-capacity memory solutions to enable real-time data processing and storage capabilities. As a result, device manufacturers and infrastructure providers are increasingly investing in advanced memory technologies, including High Bandwidth Memory (HBM) and DDR5, alongside ongoing innovations in memory ICs. This investment trend is driving continuous growth in the global memory IC market across its entire value chain, reflecting a robust demand for enhanced memory solutions.

Restraints in the Global Memory IC Market

The Global Memory IC market faces notable constraints due to the substantial initial investment and technical know-how required for developing and producing advanced memory integrated circuits. The manufacturing facilities necessitate the use of highly specialized equipment, and the production process demands exceptional precision. Consequently, these factors establish high barriers to entry that restrict market participation primarily to a handful of dominant companies, thereby limiting overall competitiveness. This oligopolistic environment hampers the ability of smaller firms to innovate and share advancements, ultimately stifling the proliferation of new technologies and solutions within the industry.

Market Trends of the Global Memory IC Market

The Global Memory IC market is witnessing a transformative trend driven by the burgeoning demand for AI and machine learning applications. As industries increasingly adopt AI technologies, memory architectures are evolving to meet the requisite high-bandwidth and low-latency needs. Advanced options such as High Bandwidth Memory (HBM), GDDR6X, and Processing-In-Memory (PIM) are gaining momentum, particularly in AI accelerators and data centers. Memory IC manufacturers are collaborating with processor designers to create co-packaged modules that reduce energy consumption and enhance real-time inferencing capabilities by minimizing data transfer bottlenecks. This evolution reflects a shift towards more efficient and specialized memory solutions tailored for AI-driven workloads.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Drivers & Opportunities
    • Restraints & Challenges
  • Porters Analysis
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2024
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis
  • Technology Analysis
  • Case Studies
  • Customer Buying Behavior Analysis

Global Memory IC Market Size by Type & CAGR (2025-2032)

  • Market Overview
  • DRAM
  • Flash
    • NOR
    • NAND
  • Other Types

Global Memory IC Market Size by End-user Industry & CAGR (2025-2032)

  • Market Overview
  • Consumer Electronics
  • Automotive
  • IT & Telecommunication
  • Healthcare
  • Other End-user Industries

Global Memory IC Market Size & CAGR (2025-2032)

  • North America (Type, End-user Industry)
    • US
    • Canada
  • Europe (Type, End-user Industry)
    • Germany
    • Spain
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia Pacific (Type, End-user Industry)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • Latin America (Type, End-user Industry)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa (Type, End-user Industry)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2024
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2024
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

  • Samsung Electronics (South Korea)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • SK Hynix (South Korea)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Micron Technology (United States)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Western Digital (United States)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Intel Corporation (United States)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Texas Instruments (United States)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Kingston Technology (United States)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Broadcom Inc. (United States)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Infineon Technologies (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • STMicroelectronics (Switzerland)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Microchip Technology (United States)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Renesas Electronics (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Nanya Technology (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Winbond Electronics (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendations