市場調査レポート
商品コード
1219858

組込み型ダイパッケージング技術の世界市場規模、シェア、産業動向分析レポート:分野別、プラットフォーム別、地域別展望と予測、2022年~2028年

Global Embedded Die Packaging Technology Market Size, Share & Industry Trends Analysis Report By Vertical, By Platform, By Regional Outlook and Forecast, 2022 - 2028

出版日: | 発行: KBV Research | ページ情報: 英文 198 Pages | 納期: 即納可能 即納可能とは

価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=156.87円
組込み型ダイパッケージング技術の世界市場規模、シェア、産業動向分析レポート:分野別、プラットフォーム別、地域別展望と予測、2022年~2028年
出版日: 2023年01月31日
発行: KBV Research
ページ情報: 英文 198 Pages
納期: 即納可能 即納可能とは
  • 全表示
  • 概要
  • 図表
  • 目次
概要

組み込み型ダイパッケージング技術の世界市場規模は、2028年までに2億1410万米ドルに達し、予測期間中に18.6%のCAGRで市場成長すると予測されています。

しかし、組み込み型ダイパッケージングでは、コンポーネントを基板に埋め込むために、多段階の製造プロセスを使用する概念です。有機ラミネート基板の底面には、多数のダイ、MEMS、受動素子などのダイをサイド・バイ・サイドで集積することが可能です。銅メッキされたビアは、部品をつなぐために使用されます。基板は、組み込みパッケージが全体的に配置される場所であり、システム内のスペースを解放することができます。

エンベデッド・ダイ・パッケージング技術は、多段階の製造プロセスを用いて、部品を基板に埋め込みます。有機基板の中央に、ダイ、多数のダイ、またはパッシブが横に並んで配置されることがあります。銅メッキされたビアは、基板上に配置され、システム内のスペースを節約するために、コンポーネントをリンクするために使用されます。このようなストレージの削減効果により、埋め込み型ダイパッケージング技術の需要が高まると予測されます。

組み込み型ダイパッケージング技術の必要性は、技術の改善と開発から生まれます。組み込み技術は、チップサイズ、電気的性能、接続性など、多くの基準を満たすものです。また、小型化により、組み込み部品が組み込まれた状態で何層にも積み重ねられる可能性があるため、より柔軟な設計やより重要な基板レイアウトが可能になります。

COVID-19影響度分析

COVID-19の大流行は、組み込み型ダイパッケージング技術市場に様々な影響を及ぼしています。各国政府によるロックダウンの実施や延長により、生産施設や産業施設が閉鎖され、危機的状況と人手不足が発生しています。そのため、エンベデッドダイパッケージング技術のエコシステムにおける異なる企業の決算に加え、OEM、サプライヤー、アグリゲーター、エンドユーザー、ディストリビューターなどバリューチェーンの異なるセグメントに属する多数の業界専門家の意見を考慮し、市場は2019年から2020年にかけて下落を経験したと判断しています。

市場成長要因

小型電子機器への需要拡大

世界的に、電気製品の小型化は急速に浸透しています。電子機器、携帯機器、軽量化された電子製品は、顧客の間で人気が高まっています。その結果、より少ない電気部品を使用する人が増えています。小型フォームファクターの電気部品は、利用可能なスペースを増やし、最終製品のデザインを向上させるために、電子機器の開発に使用されています。お客さまが求めているのは、小型で機能的なポータブル電子機器です。企業は、ユーザーエクスペリエンスを向上させるために、ほとんどの部品を1つのダイに収まるように小さな回路を作成しています。センサーやプロセッサーを含むほとんどの部品が1つのチップに統合されることで、顧客は機能強化の恩恵を受けることができます。

家電製品の消費増加と5gネットワークの利用

民生用電子機器は、世界中で最も広く使用されている商品の一つです。非商用に使用されるエレクトロニクスは、コンシューマーエレクトロニクスと呼ばれます。家庭部門がより幅広い種類の家電製品を採用するようになったことで、家電業界は驚異的な成長を遂げました。家電製品にさまざまなデジタル技術を組み込むことは、メーカーにとって重要な投資であり、メーカーもまた、顧客に高品質の体験を提供することをますます重要視しています。さらに、大手メーカーが研究開発や技術革新への支出を増やしているため、最先端の機能を備えた新製品が投入されています。

市場抑制要因

高コスト化

組み込み型ダイパッケージング技術は高価であるため、市場拡大の障害となる可能性があります。ダイパッケージングには複雑な手順と高価な装置が必要であり、多額のコストがかかります。シリコンは地球上で2番目に多い材料であるにもかかわらず、ウエハーのパッケージングにはコストがかかります。シリコンを精製して半導体ウエハーやチップにするのだが、その工程が煩雑で、コストがかさみます。この業界は事業者数が少なく、パッケージング技術のコスト上昇によりライバルも少ないため、この市場は乱用されやすいです。

プラットフォームの展望

Embedded Die Packaging Technology市場はプラットフォームによって、Embedded Die in Rigid Board、Embedded Die in Flexible Board、Embedded Die in IC Package Substrateに分けられます。Embedded Die in Flexible Boardセグメントは、2021年に大きな収益シェアを経験しました。プリント基板の製品価値は技術の進歩に伴い上昇しており、さまざまなウェアラブル機器やIoT(Internet of Things)機器に使用されるフレキシブル基板の売上は今後増加すると予想されます。また、各種小型電子機器へのフレキシブル回路の搭載が進んでいます。

業界別の展望

組み込み型ダイパッケージング技術市場は、業種別に、コンシューマーエレクトロニクス、自動車、ヘルスケア、IT・通信、その他に分類されます。2021年には、コンシューマーエレクトロニクス分野が最大の収益シェアに貢献しました。ホームセキュリティシステム、家電製品、時計、プリンターなどのコンシューマーエレクトロニクス製品には、組み込みシステムが搭載され始めています。冷蔵庫、電子レンジ、洗濯機などの家電製品では、機能を付与したり、ユーザーのフィードバックを収集したり、ユーザーの好みに合わせて項目を調節したりするために、シンプルな組込みシステムが使用されています。

地域別展望

組み込み型ダイパッケージング技術市場は、地域によって北米、欧州、アジア太平洋、LAMEAに分類されます。北米地域は、予測期間中に有望な速度で成長しています。これは、高度に発達した通信セクター、IoT利用の増加、自動車セクターの力強い発展によるものです。また、米国には世界最大級の自動車メーカーがあり、電気自動車市場への投資を行っています。アダプティブクルーズコントロールなどの運転支援機能により、統合テクノロジーは運転の快適性を向上させます。

目次

第1章 市場の範囲と調査手法

  • 市場の定義
  • 目的
  • 市場規模
  • セグメンテーション
    • 組込み型ダイパッケージング技術の世界市場、業界別
    • ダイパッケージングテクノロジーの世界市場:プラットフォーム別
    • 組み込み型ダイパッケージングテクノロジーの世界市場、地域別
  • 調査手法

第2章 市場概要

  • イントロダクション
    • 概要説明
      • 市場の構成とシナリオ
  • 市場に影響を与える主な要因
    • 市場促進要因
    • 市場抑制要因

第3章 組み込み型ダイパッケージング技術市場で展開されている戦略

第4章 Embedded Die Packaging Technologyの世界市場:業界別

  • コンシューマーエレクトロニクスの世界市場:地域別
  • IT・通信の世界地域別市場
  • 自動車産業の地域別市場
  • ヘルスケアの世界市場:地域別
  • その他分野の世界市場:地域別

第5章 組込み型ダイパッケージング技術の世界市場:プラットフォーム別

  • ICパッケージ基板への組み込みダイの世界市場:地域別
  • リジッド基板に搭載されたEmbedded Dieの世界市場:地域別
  • フレキシブル基板に搭載されたEmbedded Dieの世界市場:地域別

第6章 ダイパッケージング技術の世界市場:地域別

  • 北米
    • 北米のEmbedded Die Packaging Technologyの国別市場
      • 米国
      • カナダ
      • メキシコ
      • その他北米地域
  • 欧州
    • 欧州の組み込み型ダイパッケージング技術の国別市場
      • ドイツ
      • 英国
      • フランス
      • ロシア
      • スペイン
      • イタリア
      • その他欧州
  • アジア太平洋地域
    • アジア太平洋地域の組み込み型ダイパッケージング技術の国別市場
      • 中国
      • 日本
      • インド
      • 韓国
      • シンガポール
      • マレーシア
      • その他アジア太平洋地域
  • LAMEA
    • LAMEA組み込み型ダイパッケージング技術市場:国別
      • ブラジル
      • アルゼンチン
      • UAE
      • サウジアラビア
      • 南アフリカ
      • ナイジェリア
      • その他のLAMEA

第7章 企業プロファイル

  • General Electric(GE)Co
  • Infineon Technologies AG
  • TDK Corporation
  • Fujikura Ltd.
  • Amkor Technology, Inc.
  • Taiwan Semiconductor Manufacturing Company Limited
  • ASE Group(ASE Technology Holding)
  • Microsemi Corporation(Microchip Technology)
  • Schweizer Electronic AG(Wus Printed Circuit)
  • AT&S Group
図表

LIST OF TABLES

  • TABLE 1 Global Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 2 Global Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 3 Global Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 4 Global Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 5 Global Consumer Electronics Market by Region, 2018 - 2021, USD Thousands
  • TABLE 6 Global Consumer Electronics Market by Region, 2022 - 2028, USD Thousands
  • TABLE 7 Global IT & Telecommunication Market by Region, 2018 - 2021, USD Thousands
  • TABLE 8 Global IT & Telecommunication Market by Region, 2022 - 2028, USD Thousands
  • TABLE 9 Global Automotive Market by Region, 2018 - 2021, USD Thousands
  • TABLE 10 Global Automotive Market by Region, 2022 - 2028, USD Thousands
  • TABLE 11 Global Healthcare Market by Region, 2018 - 2021, USD Thousands
  • TABLE 12 Global Healthcare Market by Region, 2022 - 2028, USD Thousands
  • TABLE 13 Global Others Market by Region, 2018 - 2021, USD Thousands
  • TABLE 14 Global Others Market by Region, 2022 - 2028, USD Thousands
  • TABLE 15 Global Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 16 Global Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 17 Global Embedded Die in IC Package Substrate Market by Region, 2018 - 2021, USD Thousands
  • TABLE 18 Global Embedded Die in IC Package Substrate Market by Region, 2022 - 2028, USD Thousands
  • TABLE 19 Global Embedded Die in Rigid Board Market by Region, 2018 - 2021, USD Thousands
  • TABLE 20 Global Embedded Die in Rigid Board Market by Region, 2022 - 2028, USD Thousands
  • TABLE 21 Global Embedded Die in Flexible Board Market by Region, 2018 - 2021, USD Thousands
  • TABLE 22 Global Embedded Die in Flexible Board Market by Region, 2022 - 2028, USD Thousands
  • TABLE 23 Global Embedded Die Packaging Technology Market by Region, 2018 - 2021, USD Thousands
  • TABLE 24 Global Embedded Die Packaging Technology Market by Region, 2022 - 2028, USD Thousands
  • TABLE 25 North America Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 26 North America Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 27 North America Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 28 North America Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 29 North America Consumer Electronics Market by Country, 2018 - 2021, USD Thousands
  • TABLE 30 North America Consumer Electronics Market by Country, 2022 - 2028, USD Thousands
  • TABLE 31 North America IT & Telecommunication Market by Country, 2018 - 2021, USD Thousands
  • TABLE 32 North America IT & Telecommunication Market by Country, 2022 - 2028, USD Thousands
  • TABLE 33 North America Automotive Market by Country, 2018 - 2021, USD Thousands
  • TABLE 34 North America Automotive Market by Country, 2022 - 2028, USD Thousands
  • TABLE 35 North America Healthcare Market by Country, 2018 - 2021, USD Thousands
  • TABLE 36 North America Healthcare Market by Country, 2022 - 2028, USD Thousands
  • TABLE 37 North America Others Market by Country, 2018 - 2021, USD Thousands
  • TABLE 38 North America Others Market by Country, 2022 - 2028, USD Thousands
  • TABLE 39 North America Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 40 North America Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 41 North America Embedded Die in IC Package Substrate Market by Country, 2018 - 2021, USD Thousands
  • TABLE 42 North America Embedded Die in IC Package Substrate Market by Country, 2022 - 2028, USD Thousands
  • TABLE 43 North America Embedded Die in Rigid Board Market by Country, 2018 - 2021, USD Thousands
  • TABLE 44 North America Embedded Die in Rigid Board Market by Country, 2022 - 2028, USD Thousands
  • TABLE 45 North America Embedded Die in Flexible Board Market by Country, 2018 - 2021, USD Thousands
  • TABLE 46 North America Embedded Die in Flexible Board Market by Country, 2022 - 2028, USD Thousands
  • TABLE 47 North America Embedded Die Packaging Technology Market by Country, 2018 - 2021, USD Thousands
  • TABLE 48 North America Embedded Die Packaging Technology Market by Country, 2022 - 2028, USD Thousands
  • TABLE 49 US Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 50 US Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 51 US Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 52 US Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 53 US Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 54 US Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 55 Canada Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 56 Canada Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 57 Canada Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 58 Canada Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 59 Canada Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 60 Canada Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 61 Mexico Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 62 Mexico Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 63 Mexico Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 64 Mexico Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 65 Mexico Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 66 Mexico Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 67 Rest of North America Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 68 Rest of North America Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 69 Rest of North America Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 70 Rest of North America Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 71 Rest of North America Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 72 Rest of North America Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 73 Europe Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 74 Europe Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 75 Europe Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 76 Europe Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 77 Europe Consumer Electronics Market by Country, 2018 - 2021, USD Thousands
  • TABLE 78 Europe Consumer Electronics Market by Country, 2022 - 2028, USD Thousands
  • TABLE 79 Europe IT & Telecommunication Market by Country, 2018 - 2021, USD Thousands
  • TABLE 80 Europe IT & Telecommunication Market by Country, 2022 - 2028, USD Thousands
  • TABLE 81 Europe Automotive Market by Country, 2018 - 2021, USD Thousands
  • TABLE 82 Europe Automotive Market by Country, 2022 - 2028, USD Thousands
  • TABLE 83 Europe Healthcare Market by Country, 2018 - 2021, USD Thousands
  • TABLE 84 Europe Healthcare Market by Country, 2022 - 2028, USD Thousands
  • TABLE 85 Europe Others Market by Country, 2018 - 2021, USD Thousands
  • TABLE 86 Europe Others Market by Country, 2022 - 2028, USD Thousands
  • TABLE 87 Europe Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 88 Europe Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 89 Europe Embedded Die in IC Package Substrate Market by Country, 2018 - 2021, USD Thousands
  • TABLE 90 Europe Embedded Die in IC Package Substrate Market by Country, 2022 - 2028, USD Thousands
  • TABLE 91 Europe Embedded Die in Rigid Board Market by Country, 2018 - 2021, USD Thousands
  • TABLE 92 Europe Embedded Die in Rigid Board Market by Country, 2022 - 2028, USD Thousands
  • TABLE 93 Europe Embedded Die in Flexible Board Market by Country, 2018 - 2021, USD Thousands
  • TABLE 94 Europe Embedded Die in Flexible Board Market by Country, 2022 - 2028, USD Thousands
  • TABLE 95 Europe Embedded Die Packaging Technology Market by Country, 2018 - 2021, USD Thousands
  • TABLE 96 Europe Embedded Die Packaging Technology Market by Country, 2022 - 2028, USD Thousands
  • TABLE 97 Germany Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 98 Germany Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 99 Germany Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 100 Germany Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 101 Germany Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 102 Germany Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 103 UK Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 104 UK Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 105 UK Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 106 UK Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 107 UK Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 108 UK Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 109 France Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 110 France Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 111 France Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 112 France Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 113 France Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 114 France Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 115 Russia Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 116 Russia Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 117 Russia Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 118 Russia Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 119 Russia Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 120 Russia Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 121 Spain Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 122 Spain Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 123 Spain Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 124 Spain Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 125 Spain Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 126 Spain Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 127 Italy Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 128 Italy Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 129 Italy Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 130 Italy Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 131 Italy Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 132 Italy Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 133 Rest of Europe Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 134 Rest of Europe Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 135 Rest of Europe Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 136 Rest of Europe Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 137 Rest of Europe Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 138 Rest of Europe Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 139 Asia Pacific Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 140 Asia Pacific Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 141 Asia Pacific Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 142 Asia Pacific Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 143 Asia Pacific Consumer Electronics Market by Country, 2018 - 2021, USD Thousands
  • TABLE 144 Asia Pacific Consumer Electronics Market by Country, 2022 - 2028, USD Thousands
  • TABLE 145 Asia Pacific IT & Telecommunication Market by Country, 2018 - 2021, USD Thousands
  • TABLE 146 Asia Pacific IT & Telecommunication Market by Country, 2022 - 2028, USD Thousands
  • TABLE 147 Asia Pacific Automotive Market by Country, 2018 - 2021, USD Thousands
  • TABLE 148 Asia Pacific Automotive Market by Country, 2022 - 2028, USD Thousands
  • TABLE 149 Asia Pacific Healthcare Market by Country, 2018 - 2021, USD Thousands
  • TABLE 150 Asia Pacific Healthcare Market by Country, 2022 - 2028, USD Thousands
  • TABLE 151 Asia Pacific Others Market by Country, 2018 - 2021, USD Thousands
  • TABLE 152 Asia Pacific Others Market by Country, 2022 - 2028, USD Thousands
  • TABLE 153 Asia Pacific Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 154 Asia Pacific Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 155 Asia Pacific Embedded Die in IC Package Substrate Market by Country, 2018 - 2021, USD Thousands
  • TABLE 156 Asia Pacific Embedded Die in IC Package Substrate Market by Country, 2022 - 2028, USD Thousands
  • TABLE 157 Asia Pacific Embedded Die in Rigid Board Market by Country, 2018 - 2021, USD Thousands
  • TABLE 158 Asia Pacific Embedded Die in Rigid Board Market by Country, 2022 - 2028, USD Thousands
  • TABLE 159 Asia Pacific Embedded Die in Flexible Board Market by Country, 2018 - 2021, USD Thousands
  • TABLE 160 Asia Pacific Embedded Die in Flexible Board Market by Country, 2022 - 2028, USD Thousands
  • TABLE 161 Asia Pacific Embedded Die Packaging Technology Market by Country, 2018 - 2021, USD Thousands
  • TABLE 162 Asia Pacific Embedded Die Packaging Technology Market by Country, 2022 - 2028, USD Thousands
  • TABLE 163 China Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 164 China Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 165 China Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 166 China Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 167 China Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 168 China Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 169 Japan Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 170 Japan Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 171 Japan Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 172 Japan Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 173 Japan Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 174 Japan Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 175 India Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 176 India Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 177 India Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 178 India Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 179 India Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 180 India Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 181 South Korea Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 182 South Korea Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 183 South Korea Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 184 South Korea Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 185 South Korea Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 186 South Korea Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 187 Singapore Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 188 Singapore Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 189 Singapore Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 190 Singapore Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 191 Singapore Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 192 Singapore Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 193 Malaysia Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 194 Malaysia Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 195 Malaysia Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 196 Malaysia Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 197 Malaysia Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 198 Malaysia Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 199 Rest of Asia Pacific Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 200 Rest of Asia Pacific Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 201 Rest of Asia Pacific Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 202 Rest of Asia Pacific Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 203 Rest of Asia Pacific Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 204 Rest of Asia Pacific Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 205 LAMEA Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 206 LAMEA Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 207 LAMEA Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 208 LAMEA Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 209 LAMEA Consumer Electronics Market by Country, 2018 - 2021, USD Thousands
  • TABLE 210 LAMEA Consumer Electronics Market by Country, 2022 - 2028, USD Thousands
  • TABLE 211 LAMEA IT & Telecommunication Market by Country, 2018 - 2021, USD Thousands
  • TABLE 212 LAMEA IT & Telecommunication Market by Country, 2022 - 2028, USD Thousands
  • TABLE 213 LAMEA Automotive Market by Country, 2018 - 2021, USD Thousands
  • TABLE 214 LAMEA Automotive Market by Country, 2022 - 2028, USD Thousands
  • TABLE 215 LAMEA Healthcare Market by Country, 2018 - 2021, USD Thousands
  • TABLE 216 LAMEA Healthcare Market by Country, 2022 - 2028, USD Thousands
  • TABLE 217 LAMEA Others Market by Country, 2018 - 2021, USD Thousands
  • TABLE 218 LAMEA Others Market by Country, 2022 - 2028, USD Thousands
  • TABLE 219 LAMEA Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 220 LAMEA Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 221 LAMEA Embedded Die in IC Package Substrate Market by Country, 2018 - 2021, USD Thousands
  • TABLE 222 LAMEA Embedded Die in IC Package Substrate Market by Country, 2022 - 2028, USD Thousands
  • TABLE 223 LAMEA Embedded Die in Rigid Board Market by Country, 2018 - 2021, USD Thousands
  • TABLE 224 LAMEA Embedded Die in Rigid Board Market by Country, 2022 - 2028, USD Thousands
  • TABLE 225 LAMEA Embedded Die in Flexible Board Market by Country, 2018 - 2021, USD Thousands
  • TABLE 226 LAMEA Embedded Die in Flexible Board Market by Country, 2022 - 2028, USD Thousands
  • TABLE 227 LAMEA Embedded Die Packaging Technology Market by Country, 2018 - 2021, USD Thousands
  • TABLE 228 LAMEA Embedded Die Packaging Technology Market by Country, 2022 - 2028, USD Thousands
  • TABLE 229 Brazil Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 230 Brazil Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 231 Brazil Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 232 Brazil Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 233 Brazil Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 234 Brazil Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 235 Argentina Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 236 Argentina Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 237 Argentina Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 238 Argentina Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 239 Argentina Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 240 Argentina Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 241 UAE Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 242 UAE Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 243 UAE Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 244 UAE Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 245 UAE Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 246 UAE Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 247 Saudi Arabia Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 248 Saudi Arabia Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 249 Saudi Arabia Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 250 Saudi Arabia Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 251 Saudi Arabia Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 252 Saudi Arabia Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 253 South Africa Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 254 South Africa Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 255 South Africa Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 256 South Africa Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 257 South Africa Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 258 South Africa Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 259 Nigeria Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 260 Nigeria Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 261 Nigeria Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 262 Nigeria Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 263 Nigeria Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 264 Nigeria Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 265 Rest of LAMEA Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 266 Rest of LAMEA Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 267 Rest of LAMEA Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 268 Rest of LAMEA Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 269 Rest of LAMEA Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 270 Rest of LAMEA Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 271 Key Information - General Electric (GE) Co.
  • TABLE 272 Key Information - Infineon Technologies AG
  • TABLE 273 Key information - TDK Corporation
  • TABLE 274 Key Information - Fujikura Ltd.
  • TABLE 275 Key Information - Amkor Technology, Inc.
  • TABLE 276 Key Information- Taiwan Semiconductor Manufacturing Company Limited
  • TABLE 277 Key Information - ASE Group
  • TABLE 278 Key Information - Microsemi Corporation
  • TABLE 279 Key Information - Schweizer Electronic AG
  • TABLE 280 Key Information - AT&S Group

List of Figures

  • FIG 1 Methodology for the research
  • FIG 2 Global Embedded Die Packaging Technology Market Share by Vertical, 2021
  • FIG 3 Global Embedded Die Packaging Technology Market Share by Vertical, 2028
  • FIG 4 Global Embedded Die Packaging Technology Market by Vertical, 2018 - 2028, USD Thousands
  • FIG 5 Global Embedded Die Packaging Technology Market Share by Platform, 2021
  • FIG 6 Global Embedded Die Packaging Technology Market Share by Platform, 2028
  • FIG 7 Global Embedded Die Packaging Technology Market by Platform, 2018 - 2028, USD Thousands
  • FIG 8 Global Embedded Die Packaging Technology Market Share by Region, 2021
  • FIG 9 Global Embedded Die Packaging Technology Market Share by Region, 2028
  • FIG 10 Global Embedded Die Packaging Technology Market by Region, 2018 - 2028, USD Thousands
  • FIG 11 Swot analysis: General electric (GE) Co.
  • FIG 12 Recent strategies and developments: Infenion Technologies AG
  • FIG 13 Swot analysis: INFINEON TECHNOLOGIES AG
  • FIG 14 Recent strategies and developments: TDK Corporation
目次

The Global Embedded Die Packaging Technology Market size is expected to reach $214.1 Million by 2028, rising at a market growth of 18.6% CAGR during the forecast period.

System-in-package (SiP) solutions using embedded die packaging technology enable a size reduction of around 70% and are natively 3D-compliant. Miniaturization, enhanced electrical and thermal performance, heterogeneous integration, the potential for cost reduction, and effective OEM logistics are some of this technology's benefits.

Additionally, it provides quick turnaround for customized designs, outstanding robustness, and improved package dependability. Packaging with embedded dies is distinct from other kinds of packaging. Typically, the devices in many IC packages are positioned on top of a substrate. The substrate acts as a link between the devices and aboard in a system. There are several definitions for the phrase "embedded packaging."

However, in embedded die packaging, the concept uses a multi-step manufacturing process to embed components into the substrate. The base of an organic laminate substrate may accommodate the side-by-side integration of a die; many dies, MEMS, or passives. Copper-plated vias are used to link the parts. The board is where the embedded package is located overall, freeing up space in the system.

Embedded die packaging technology uses a multi-step manufacturing process to embed the components into the substrate. In the center of an organic substrate, a die, many dies, or a passive may be placed in a side-by-side configuration. Copper-plated vias, which are located on the board and save up space in the system, are used to link the components. The reduced storage benefit is projected to increase demand for embedded die packaging technology.

The need for embedded die packaging technology results from technological improvements and developments. Embedding technologies meet many criteria, including chip size, electrical performance, and connectivity. In addition, miniaturization allows for more flexible design and more significant board layouts because embedded components may be stacked in several layers with embedded components.

COVID-19 Impact Analysis

The COVID-19 pandemic outbreak has mixed effects on the Embedded die packaging technology market. Lockdowns have been imposed and extended by the governments of various countries, which has caused production and industrial facilities to shut, creating a crisis and a labor shortage. Therefore, it is determined that the market experienced a decline between 2019 and 2020 after taking into account the opinions of numerous industry experts from different segments of the value chain, including OEMs, suppliers, aggregators, end users, and distributors, in addition to the financial results of different businesses in the embedded die packaging technology ecosystem.

Market Growth Factors

Increasing demand for smaller electronic devices

Globally, the downsizing of electrical items is gaining ground quickly. Electronic, portable, lightweight, and lightweight electronic products are becoming more popular with customers. As a result, more people are using fewer electric components. Small form factor electrical components are being used in developing electronic devices to increase available space and enhance the final product design. Customers want portable electronic gadgets that are tiny, modest in size, and packed with functionality. Companies are creating tiny circuits to fit most components onto a single die in order to improve user experience. Customers benefit from enhanced functionality when most components, including sensors and processors, are integrated into a single chip.

A rise in consumer electronics consumption and the use of 5g networks

Consumer electronics are one of the most widely used goods worldwide. Electronics for non-commercial usage is referred to as consumer electronics. The consumer electronics industry has grown tremendously due to the household sector's increasing adoption of a more extensive range of consumer electronics. Integrating different digital technologies into consumer electronics devices is receiving significant investment from manufacturers, who also place more and more emphasis on giving customers high-quality experiences. In addition, new products with cutting-edge features are being introduced due to the leading market companies' increasing expenditures in R&D and innovation.

Market Restraining Factors

Associated high costs

The embedded die packaging technique is expensive so it might be a barrier to market expansion. Die packing involves intricate procedures, expensive equipment, and hefty costs. Despite silicon being the second most common material on Earth, wafer packaging is costly. Silicon must be purified before being used to create semiconductor wafers and chips, a complicated procedure that raises costs. Because there are fewer businesses in this industry and fewer rivals due to the growing cost of packaging technologies, this market is vulnerable to abuse.

Platform Outlook

Based on platform, the Embedded Die Packaging Technology Market is divided into Embedded Die in Rigid Board, Embedded Die in Flexible Board, and Embedded Die in IC Package Substrate. The Embedded Die in Flexible Board segment experienced a significant revenue share in 2021. The printed circuit board's product value is rising in line with technological advancements, and sales of flexible boards for use in different wearable and Internet of Things (IoT) devices are anticipated to rise in the future. In addition, flexible circuits are increasingly being embedded for use in several types of small electronic devices.

Vertical Outlook

Based on vertical, the Embedded Die Packaging Technology Market is classified into Consumer Electronics, Automotive, Healthcare, IT & Telecommunications, and Others. The consumer electronics segment contributed the largest revenue share in 2021. Consumer electronics products like home security systems, home appliances, watches, printers, and more are beginning to include embedded systems. Simple embedded systems are used in household appliances like refrigerators, microwaves, and washing machines to give functions, gather user feedback, and regulate items following user preferences.

Regional Outlook

Based on region, the Embedded Die Packaging Technology Market is categorized into North America, Europe, Asia Pacific, and LAMEA. The North American region is growing at the promising rate during the forecast period. This is due to the highly developed telecommunications sector, increasing IoT use, and strong development in the automobile sector. In addition, the United States is home to some of the largest automakers in the world that are making investments in the electric vehicle market. With driver assistance features like adaptive cruise control, integrated technologies improve driving comfort.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include General Electric (GE) Co., Infineon Technologies AG, TDK Corporation, Fujikura Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ASE Group (ASE Technology Holding), Microsemi Corporation (Microchip Technology), Schweizer Electronic AG (Wus Printed Circuit), and AT&S Group.

Strategies Deployed in Embedded Die Packaging Technology Market

Sep-2022: Taiwan Semiconductor Manufacturing Company partnered with Samsung Electronics Co, a South Korean multinational electronics corporation headquartered in Yeongtong-gu, Suwon, South Korea, and Intel Corp, an American multinational corporation and technology company headquartered in Santa Clara, California. Through this partnership, the trio is committed to establishing a single standard for next-gen chip-packaging technologies which is a Chiplet. Moreover, a chipset is a small unit that forms processors and is similar to a Lego block.

Jun-2022: Advanced Semiconductor Engineering, Inc. (ASE Group) unveiled VIPack. It is an evolved packaging platform created to facilitate vertically integrated package solutions. Additionally, pack describes ASE's next generation of 3D heterogeneous integration architecture that expands design rules and reaches performance and ultra-high density.

May-2022: TDK Corporation launched InvenSense IAM-20380HT. It is a high-temperature automotive monolithic 3-axis MotionTracking sensor platform solution for non-safety automotive applications, which contains the DK-20380HT Developer Kit and the IAM-20380HT 3-axis MEMS gyroscope. Additionally, IAM-20380HT is a stand-alone gyroscope in a thin 3 x 3 x 0.75 mm (16-pin LGA) package that can perform over a wide temperature range, delivering reliable and highly accurate measurement data.

Mar-2022: TDK Corporation unveiled FS1412 microPOL (μPOL™) power module. The FS1412 is an element of a new series of μPOL™ DC-DC converters with the smallest available size, increased performance, and ease of use. Moreover, it is helpful in simplified integration for applications such as machine learning, big data, 5G cells, artificial intelligence (AI), computing enterprise, and IoT networking.

Nov-2021: Amkor Technology Inc, expanded its geographical footprints to a smart factory in Bac Ninh, Vietnam. Moreover, Amkor Technology Inc is investing in Bac Ninh to develop its manufacturing impression in the consent of customer requirements for an alternative cost-competitive supply chain solution for Advanced SiP and additional packaging solutions in the future.

Mar-2021: Advanced Semiconductor Engineering, Inc. (ASE) collaborated with Siemens Digital Industries Software, an American computer software company specializing in 3D & 2D Product Lifecycle Management software. Through this collaboration, both organizations have developed two new enablement solutions. Furthermore, ASE would be able to leverage the mutually developed flow to greatly reduce 2.5D/3D IC and FOCoS package assembly planning and verification cycle times by about 30 to 50 percent in each design iteration by embracing the Calibre 3DSTACK technologies and Siemens Xpedition Substrate Integrator.

Sep-2021: Infineon Technologies AG extended its footprint by opening a high-tech chip factory for power electronics on 300-millimeter thin wafers at its Villach site in Austria. Additionally, Infineon accepts that the opportunity to build new capacity in Europe could not be better considering the growing global demand for power semiconductors.

Jun-2019: Infineon Technologies AG took over Cypress Semiconductor Corporation, an American semiconductor design, and manufacturing company. Through this acquisition, Infineon would fasten and strengthen its profitable growth and shift its business on a more comprehensive basis. Moreover, this acquisition is a landmark step in Infineon's strategic development.

Nov-2018: Infineon Technologies AG took over Siltectra GmbH, a start-up based in Dresden. Through this acquisition, Infineon Technologies would be able to extend its portfolio with the fresh material silicon carbide. Moreover, Infineon Technologies' system knowledge of thin wafer technology would be perfectly complemented by the Cold Split technology and the innovative capacity of Siltectra.

May-2018: TDK Corporation took over Faraday Semi LLC, a U.S.-based venture-backed company engaged in the design of advanced power semiconductor Ics. Under this acquisition, TDK Corporation would be able to provide increased efficiency and ease of use at a lower total system cost than what is currently available nowadays.

Scope of the Study

Market Segments covered in the Report:

By Vertical

  • Consumer Electronics
  • IT & Telecommunication
  • Automotive
  • Healthcare
  • Others

By Platform

  • Embedded Die in IC Package Substrate
  • Embedded Die in Rigid Board
  • Embedded Die in Flexible Board

By Geography

  • North America
    • US
    • Canada
    • Mexico
    • Rest of North America
  • Europe
    • Germany
    • UK
    • France
    • Russia
    • Spain
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Singapore
    • Malaysia
    • Rest of Asia Pacific
  • LAMEA
    • Brazil
    • Argentina
    • UAE
    • Saudi Arabia
    • South Africa
    • Nigeria
    • Rest of LAMEA

Companies Profiled

  • General Electric (GE) Co.
  • Infineon Technologies AG
  • TDK Corporation
  • Fujikura Ltd.
  • Amkor Technology, Inc.
  • Taiwan Semiconductor Manufacturing Company Limited
  • ASE Group (ASE Technology Holding)
  • Microsemi Corporation (Microchip Technology)
  • Schweizer Electronic AG (Wus Printed Circuit)
  • AT&S Group

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Table of Contents

Chapter 1. Market Scope & Methodology

  • 1.1 Market Definition
  • 1.2 Objectives
  • 1.3 Market Scope
  • 1.4 Segmentation
    • 1.4.1 Global Embedded Die Packaging Technology Market, by Vertical
    • 1.4.2 Global Embedded Die Packaging Technology Market, by Platform
    • 1.4.3 Global Embedded Die Packaging Technology Market, by Geography
  • 1.5 Methodology for the research

Chapter 2. Market Overview

  • 2.1 Introduction
    • 2.1.1 Overview
      • 2.1.1.1 Market Composition & Scenario
  • 2.2 Key Factors Impacting the Market
    • 2.2.1 Market Drivers
    • 2.2.2 Market Restraints

Chapter 3. Strategies Deployed in Embedded Die Packaging Technology Market

Chapter 4. Global Embedded Die Packaging Technology Market by Vertical

  • 4.1 Global Consumer Electronics Market by Region
  • 4.2 Global IT & Telecommunication Market by Region
  • 4.3 Global Automotive Market by Region
  • 4.4 Global Healthcare Market by Region
  • 4.5 Global Others Market by Region

Chapter 5. Global Embedded Die Packaging Technology Market by Platform

  • 5.1 Global Embedded Die in IC Package Substrate Market by Region
  • 5.2 Global Embedded Die in Rigid Board Market by Region
  • 5.3 Global Embedded Die in Flexible Board Market by Region

Chapter 6. Global Embedded Die Packaging Technology Market by Region

  • 6.1 North America Embedded Die Packaging Technology Market
    • 6.1.1 North America Embedded Die Packaging Technology Market by Vertical
      • 6.1.1.1 North America Consumer Electronics Market by Country
      • 6.1.1.2 North America IT & Telecommunication Market by Country
      • 6.1.1.3 North America Automotive Market by Country
      • 6.1.1.4 North America Healthcare Market by Country
      • 6.1.1.5 North America Others Market by Country
    • 6.1.2 North America Embedded Die Packaging Technology Market by Platform
      • 6.1.2.1 North America Embedded Die in IC Package Substrate Market by Country
      • 6.1.2.2 North America Embedded Die in Rigid Board Market by Country
      • 6.1.2.3 North America Embedded Die in Flexible Board Market by Country
    • 6.1.3 North America Embedded Die Packaging Technology Market by Country
      • 6.1.3.1 US Embedded Die Packaging Technology Market
        • 6.1.3.1.1 US Embedded Die Packaging Technology Market by Vertical
        • 6.1.3.1.2 US Embedded Die Packaging Technology Market by Platform
      • 6.1.3.2 Canada Embedded Die Packaging Technology Market
        • 6.1.3.2.1 Canada Embedded Die Packaging Technology Market by Vertical
        • 6.1.3.2.2 Canada Embedded Die Packaging Technology Market by Platform
      • 6.1.3.3 Mexico Embedded Die Packaging Technology Market
        • 6.1.3.3.1 Mexico Embedded Die Packaging Technology Market by Vertical
        • 6.1.3.3.2 Mexico Embedded Die Packaging Technology Market by Platform
      • 6.1.3.4 Rest of North America Embedded Die Packaging Technology Market
        • 6.1.3.4.1 Rest of North America Embedded Die Packaging Technology Market by Vertical
        • 6.1.3.4.2 Rest of North America Embedded Die Packaging Technology Market by Platform
  • 6.2 Europe Embedded Die Packaging Technology Market
    • 6.2.1 Europe Embedded Die Packaging Technology Market by Vertical
      • 6.2.1.1 Europe Consumer Electronics Market by Country
      • 6.2.1.2 Europe IT & Telecommunication Market by Country
      • 6.2.1.3 Europe Automotive Market by Country
      • 6.2.1.4 Europe Healthcare Market by Country
      • 6.2.1.5 Europe Others Market by Country
    • 6.2.2 Europe Embedded Die Packaging Technology Market by Platform
      • 6.2.2.1 Europe Embedded Die in IC Package Substrate Market by Country
      • 6.2.2.2 Europe Embedded Die in Rigid Board Market by Country
      • 6.2.2.3 Europe Embedded Die in Flexible Board Market by Country
    • 6.2.3 Europe Embedded Die Packaging Technology Market by Country
      • 6.2.3.1 Germany Embedded Die Packaging Technology Market
        • 6.2.3.1.1 Germany Embedded Die Packaging Technology Market by Vertical
        • 6.2.3.1.2 Germany Embedded Die Packaging Technology Market by Platform
      • 6.2.3.2 UK Embedded Die Packaging Technology Market
        • 6.2.3.2.1 UK Embedded Die Packaging Technology Market by Vertical
        • 6.2.3.2.2 UK Embedded Die Packaging Technology Market by Platform
      • 6.2.3.3 France Embedded Die Packaging Technology Market
        • 6.2.3.3.1 France Embedded Die Packaging Technology Market by Vertical
        • 6.2.3.3.2 France Embedded Die Packaging Technology Market by Platform
      • 6.2.3.4 Russia Embedded Die Packaging Technology Market
        • 6.2.3.4.1 Russia Embedded Die Packaging Technology Market by Vertical
        • 6.2.3.4.2 Russia Embedded Die Packaging Technology Market by Platform
      • 6.2.3.5 Spain Embedded Die Packaging Technology Market
        • 6.2.3.5.1 Spain Embedded Die Packaging Technology Market by Vertical
        • 6.2.3.5.2 Spain Embedded Die Packaging Technology Market by Platform
      • 6.2.3.6 Italy Embedded Die Packaging Technology Market
        • 6.2.3.6.1 Italy Embedded Die Packaging Technology Market by Vertical
        • 6.2.3.6.2 Italy Embedded Die Packaging Technology Market by Platform
      • 6.2.3.7 Rest of Europe Embedded Die Packaging Technology Market
        • 6.2.3.7.1 Rest of Europe Embedded Die Packaging Technology Market by Vertical
        • 6.2.3.7.2 Rest of Europe Embedded Die Packaging Technology Market by Platform
  • 6.3 Asia Pacific Embedded Die Packaging Technology Market
    • 6.3.1 Asia Pacific Embedded Die Packaging Technology Market by Vertical
      • 6.3.1.1 Asia Pacific Consumer Electronics Market by Country
      • 6.3.1.2 Asia Pacific IT & Telecommunication Market by Country
      • 6.3.1.3 Asia Pacific Automotive Market by Country
      • 6.3.1.4 Asia Pacific Healthcare Market by Country
      • 6.3.1.5 Asia Pacific Others Market by Country
    • 6.3.2 Asia Pacific Embedded Die Packaging Technology Market by Platform
      • 6.3.2.1 Asia Pacific Embedded Die in IC Package Substrate Market by Country
      • 6.3.2.2 Asia Pacific Embedded Die in Rigid Board Market by Country
      • 6.3.2.3 Asia Pacific Embedded Die in Flexible Board Market by Country
    • 6.3.3 Asia Pacific Embedded Die Packaging Technology Market by Country
      • 6.3.3.1 China Embedded Die Packaging Technology Market
        • 6.3.3.1.1 China Embedded Die Packaging Technology Market by Vertical
        • 6.3.3.1.2 China Embedded Die Packaging Technology Market by Platform
      • 6.3.3.2 Japan Embedded Die Packaging Technology Market
        • 6.3.3.2.1 Japan Embedded Die Packaging Technology Market by Vertical
        • 6.3.3.2.2 Japan Embedded Die Packaging Technology Market by Platform
      • 6.3.3.3 India Embedded Die Packaging Technology Market
        • 6.3.3.3.1 India Embedded Die Packaging Technology Market by Vertical
        • 6.3.3.3.2 India Embedded Die Packaging Technology Market by Platform
      • 6.3.3.4 South Korea Embedded Die Packaging Technology Market
        • 6.3.3.4.1 South Korea Embedded Die Packaging Technology Market by Vertical
        • 6.3.3.4.2 South Korea Embedded Die Packaging Technology Market by Platform
      • 6.3.3.5 Singapore Embedded Die Packaging Technology Market
        • 6.3.3.5.1 Singapore Embedded Die Packaging Technology Market by Vertical
        • 6.3.3.5.2 Singapore Embedded Die Packaging Technology Market by Platform
      • 6.3.3.6 Malaysia Embedded Die Packaging Technology Market
        • 6.3.3.6.1 Malaysia Embedded Die Packaging Technology Market by Vertical
        • 6.3.3.6.2 Malaysia Embedded Die Packaging Technology Market by Platform
      • 6.3.3.7 Rest of Asia Pacific Embedded Die Packaging Technology Market
        • 6.3.3.7.1 Rest of Asia Pacific Embedded Die Packaging Technology Market by Vertical
        • 6.3.3.7.2 Rest of Asia Pacific Embedded Die Packaging Technology Market by Platform
  • 6.4 LAMEA Embedded Die Packaging Technology Market
    • 6.4.1 LAMEA Embedded Die Packaging Technology Market by Vertical
      • 6.4.1.1 LAMEA Consumer Electronics Market by Country
      • 6.4.1.2 LAMEA IT & Telecommunication Market by Country
      • 6.4.1.3 LAMEA Automotive Market by Country
      • 6.4.1.4 LAMEA Healthcare Market by Country
      • 6.4.1.5 LAMEA Others Market by Country
    • 6.4.2 LAMEA Embedded Die Packaging Technology Market by Platform
      • 6.4.2.1 LAMEA Embedded Die in IC Package Substrate Market by Country
      • 6.4.2.2 LAMEA Embedded Die in Rigid Board Market by Country
      • 6.4.2.3 LAMEA Embedded Die in Flexible Board Market by Country
    • 6.4.3 LAMEA Embedded Die Packaging Technology Market by Country
      • 6.4.3.1 Brazil Embedded Die Packaging Technology Market
        • 6.4.3.1.1 Brazil Embedded Die Packaging Technology Market by Vertical
        • 6.4.3.1.2 Brazil Embedded Die Packaging Technology Market by Platform
      • 6.4.3.2 Argentina Embedded Die Packaging Technology Market
        • 6.4.3.2.1 Argentina Embedded Die Packaging Technology Market by Vertical
        • 6.4.3.2.2 Argentina Embedded Die Packaging Technology Market by Platform
      • 6.4.3.3 UAE Embedded Die Packaging Technology Market
        • 6.4.3.3.1 UAE Embedded Die Packaging Technology Market by Vertical
        • 6.4.3.3.2 UAE Embedded Die Packaging Technology Market by Platform
      • 6.4.3.4 Saudi Arabia Embedded Die Packaging Technology Market
        • 6.4.3.4.1 Saudi Arabia Embedded Die Packaging Technology Market by Vertical
        • 6.4.3.4.2 Saudi Arabia Embedded Die Packaging Technology Market by Platform
      • 6.4.3.5 South Africa Embedded Die Packaging Technology Market
        • 6.4.3.5.1 South Africa Embedded Die Packaging Technology Market by Vertical
        • 6.4.3.5.2 South Africa Embedded Die Packaging Technology Market by Platform
      • 6.4.3.6 Nigeria Embedded Die Packaging Technology Market
        • 6.4.3.6.1 Nigeria Embedded Die Packaging Technology Market by Vertical
        • 6.4.3.6.2 Nigeria Embedded Die Packaging Technology Market by Platform
      • 6.4.3.7 Rest of LAMEA Embedded Die Packaging Technology Market
        • 6.4.3.7.1 Rest of LAMEA Embedded Die Packaging Technology Market by Vertical
        • 6.4.3.7.2 Rest of LAMEA Embedded Die Packaging Technology Market by Platform

Chapter 7. Company Profiles

  • 7.1 General Electric (GE) Co.
    • 7.1.1 Company Overview
    • 7.1.2 Financial Analysis
    • 7.1.3 Segmental and Regional Analysis
    • 7.1.4 Research & Development Expense
    • 7.1.5 SWOT Analysis
  • 7.2 Infineon Technologies AG
    • 7.2.1 Company Overview
    • 7.2.2 Financial Analysis
    • 7.2.3 Segmental and Regional Analysis
    • 7.2.4 Research & Development Expense
    • 7.2.5 Recent strategies and developments:
      • 7.2.5.1 Acquisition and Mergers:
      • 7.2.5.2 Geographical Expansions:
    • 7.2.6 SWOT Analysis
  • 7.3 TDK Corporation
    • 7.3.1 Company Overview
    • 7.3.2 Financial Analysis
    • 7.3.3 Regional & Segmental Analysis
    • 7.3.4 Research & Development Expenses
    • 7.3.5 Recent strategies and developments:
      • 7.3.5.1 Product Launches and Product Expansions:
      • 7.3.5.2 Acquisition and Mergers:
  • 7.4 Fujikura Ltd.
    • 7.4.1 Company Overview
    • 7.4.2 Financial Analysis
    • 7.4.3 Segmental and Regional Analysis
    • 7.4.4 Research & Development Expenses
  • 7.5 Amkor Technology, Inc.
    • 7.5.1 Company Overview
    • 7.5.2 Financial Analysis
    • 7.5.3 Regional Analysis
    • 7.5.4 Research & Development Expense
    • 7.5.5 Recent strategies and developments:
      • 7.5.5.1 Geographical Expansions:
  • 7.6 Taiwan Semiconductor Manufacturing Company Limited
    • 7.6.1 Company overview
    • 7.6.2 Financial Analysis
    • 7.6.3 Regional Analysis
    • 7.6.4 Research & Development Expenses
    • 7.6.5 Recent strategies and developments:
      • 7.6.5.1 Partnerships, Collaborations, and Agreements:
  • 7.7 ASE Group (ASE Technology Holding)
    • 7.7.1 Company Overview
    • 7.7.2 Financial Analysis
    • 7.7.3 Segmental and Regional Analysis
    • 7.7.4 Research & Development Expenses
    • 7.7.5 Recent strategies and developments:
      • 7.7.5.1 Partnerships, Collaborations, and Agreements:
      • 7.7.5.2 Product Launches and Product Expansions:
  • 7.8 Microsemi Corporation (Microchip Technology)
    • 7.8.1 Company Overview
    • 7.8.2 Financial Analysis
    • 7.8.3 Segmental and Regional Analysis
    • 7.8.4 Research & Development Expenses
  • 7.9 Schweizer Electronic AG (Wus Printed Circuit)
    • 7.9.1 Company Overview
    • 7.9.2 Financial Analysis
    • 7.9.3 Regional Analysis
    • 7.9.4 Research & Development Expenses
  • 7.10. AT&S Group
    • 7.10.1 Company Overview
    • 7.10.2 Financial Analysis
    • 7.10.3 Segmental and Regional Analysis
    • 7.10.4 Research & Development Expenses