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市場調査レポート
商品コード
1219858
組込み型ダイパッケージング技術の世界市場規模、シェア、産業動向分析レポート:分野別、プラットフォーム別、地域別展望と予測、2022年~2028年Global Embedded Die Packaging Technology Market Size, Share & Industry Trends Analysis Report By Vertical, By Platform, By Regional Outlook and Forecast, 2022 - 2028 |
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組込み型ダイパッケージング技術の世界市場規模、シェア、産業動向分析レポート:分野別、プラットフォーム別、地域別展望と予測、2022年~2028年 |
出版日: 2023年01月31日
発行: KBV Research
ページ情報: 英文 198 Pages
納期: 即納可能
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組み込み型ダイパッケージング技術の世界市場規模は、2028年までに2億1410万米ドルに達し、予測期間中に18.6%のCAGRで市場成長すると予測されています。
しかし、組み込み型ダイパッケージングでは、コンポーネントを基板に埋め込むために、多段階の製造プロセスを使用する概念です。有機ラミネート基板の底面には、多数のダイ、MEMS、受動素子などのダイをサイド・バイ・サイドで集積することが可能です。銅メッキされたビアは、部品をつなぐために使用されます。基板は、組み込みパッケージが全体的に配置される場所であり、システム内のスペースを解放することができます。
エンベデッド・ダイ・パッケージング技術は、多段階の製造プロセスを用いて、部品を基板に埋め込みます。有機基板の中央に、ダイ、多数のダイ、またはパッシブが横に並んで配置されることがあります。銅メッキされたビアは、基板上に配置され、システム内のスペースを節約するために、コンポーネントをリンクするために使用されます。このようなストレージの削減効果により、埋め込み型ダイパッケージング技術の需要が高まると予測されます。
組み込み型ダイパッケージング技術の必要性は、技術の改善と開発から生まれます。組み込み技術は、チップサイズ、電気的性能、接続性など、多くの基準を満たすものです。また、小型化により、組み込み部品が組み込まれた状態で何層にも積み重ねられる可能性があるため、より柔軟な設計やより重要な基板レイアウトが可能になります。
COVID-19影響度分析
COVID-19の大流行は、組み込み型ダイパッケージング技術市場に様々な影響を及ぼしています。各国政府によるロックダウンの実施や延長により、生産施設や産業施設が閉鎖され、危機的状況と人手不足が発生しています。そのため、エンベデッドダイパッケージング技術のエコシステムにおける異なる企業の決算に加え、OEM、サプライヤー、アグリゲーター、エンドユーザー、ディストリビューターなどバリューチェーンの異なるセグメントに属する多数の業界専門家の意見を考慮し、市場は2019年から2020年にかけて下落を経験したと判断しています。
市場成長要因
小型電子機器への需要拡大
世界的に、電気製品の小型化は急速に浸透しています。電子機器、携帯機器、軽量化された電子製品は、顧客の間で人気が高まっています。その結果、より少ない電気部品を使用する人が増えています。小型フォームファクターの電気部品は、利用可能なスペースを増やし、最終製品のデザインを向上させるために、電子機器の開発に使用されています。お客さまが求めているのは、小型で機能的なポータブル電子機器です。企業は、ユーザーエクスペリエンスを向上させるために、ほとんどの部品を1つのダイに収まるように小さな回路を作成しています。センサーやプロセッサーを含むほとんどの部品が1つのチップに統合されることで、顧客は機能強化の恩恵を受けることができます。
家電製品の消費増加と5gネットワークの利用
民生用電子機器は、世界中で最も広く使用されている商品の一つです。非商用に使用されるエレクトロニクスは、コンシューマーエレクトロニクスと呼ばれます。家庭部門がより幅広い種類の家電製品を採用するようになったことで、家電業界は驚異的な成長を遂げました。家電製品にさまざまなデジタル技術を組み込むことは、メーカーにとって重要な投資であり、メーカーもまた、顧客に高品質の体験を提供することをますます重要視しています。さらに、大手メーカーが研究開発や技術革新への支出を増やしているため、最先端の機能を備えた新製品が投入されています。
市場抑制要因
高コスト化
組み込み型ダイパッケージング技術は高価であるため、市場拡大の障害となる可能性があります。ダイパッケージングには複雑な手順と高価な装置が必要であり、多額のコストがかかります。シリコンは地球上で2番目に多い材料であるにもかかわらず、ウエハーのパッケージングにはコストがかかります。シリコンを精製して半導体ウエハーやチップにするのだが、その工程が煩雑で、コストがかさみます。この業界は事業者数が少なく、パッケージング技術のコスト上昇によりライバルも少ないため、この市場は乱用されやすいです。
プラットフォームの展望
Embedded Die Packaging Technology市場はプラットフォームによって、Embedded Die in Rigid Board、Embedded Die in Flexible Board、Embedded Die in IC Package Substrateに分けられます。Embedded Die in Flexible Boardセグメントは、2021年に大きな収益シェアを経験しました。プリント基板の製品価値は技術の進歩に伴い上昇しており、さまざまなウェアラブル機器やIoT(Internet of Things)機器に使用されるフレキシブル基板の売上は今後増加すると予想されます。また、各種小型電子機器へのフレキシブル回路の搭載が進んでいます。
業界別の展望
組み込み型ダイパッケージング技術市場は、業種別に、コンシューマーエレクトロニクス、自動車、ヘルスケア、IT・通信、その他に分類されます。2021年には、コンシューマーエレクトロニクス分野が最大の収益シェアに貢献しました。ホームセキュリティシステム、家電製品、時計、プリンターなどのコンシューマーエレクトロニクス製品には、組み込みシステムが搭載され始めています。冷蔵庫、電子レンジ、洗濯機などの家電製品では、機能を付与したり、ユーザーのフィードバックを収集したり、ユーザーの好みに合わせて項目を調節したりするために、シンプルな組込みシステムが使用されています。
地域別展望
組み込み型ダイパッケージング技術市場は、地域によって北米、欧州、アジア太平洋、LAMEAに分類されます。北米地域は、予測期間中に有望な速度で成長しています。これは、高度に発達した通信セクター、IoT利用の増加、自動車セクターの力強い発展によるものです。また、米国には世界最大級の自動車メーカーがあり、電気自動車市場への投資を行っています。アダプティブクルーズコントロールなどの運転支援機能により、統合テクノロジーは運転の快適性を向上させます。
List of Figures
The Global Embedded Die Packaging Technology Market size is expected to reach $214.1 Million by 2028, rising at a market growth of 18.6% CAGR during the forecast period.
System-in-package (SiP) solutions using embedded die packaging technology enable a size reduction of around 70% and are natively 3D-compliant. Miniaturization, enhanced electrical and thermal performance, heterogeneous integration, the potential for cost reduction, and effective OEM logistics are some of this technology's benefits.
Additionally, it provides quick turnaround for customized designs, outstanding robustness, and improved package dependability. Packaging with embedded dies is distinct from other kinds of packaging. Typically, the devices in many IC packages are positioned on top of a substrate. The substrate acts as a link between the devices and aboard in a system. There are several definitions for the phrase "embedded packaging."
However, in embedded die packaging, the concept uses a multi-step manufacturing process to embed components into the substrate. The base of an organic laminate substrate may accommodate the side-by-side integration of a die; many dies, MEMS, or passives. Copper-plated vias are used to link the parts. The board is where the embedded package is located overall, freeing up space in the system.
Embedded die packaging technology uses a multi-step manufacturing process to embed the components into the substrate. In the center of an organic substrate, a die, many dies, or a passive may be placed in a side-by-side configuration. Copper-plated vias, which are located on the board and save up space in the system, are used to link the components. The reduced storage benefit is projected to increase demand for embedded die packaging technology.
The need for embedded die packaging technology results from technological improvements and developments. Embedding technologies meet many criteria, including chip size, electrical performance, and connectivity. In addition, miniaturization allows for more flexible design and more significant board layouts because embedded components may be stacked in several layers with embedded components.
COVID-19 Impact Analysis
The COVID-19 pandemic outbreak has mixed effects on the Embedded die packaging technology market. Lockdowns have been imposed and extended by the governments of various countries, which has caused production and industrial facilities to shut, creating a crisis and a labor shortage. Therefore, it is determined that the market experienced a decline between 2019 and 2020 after taking into account the opinions of numerous industry experts from different segments of the value chain, including OEMs, suppliers, aggregators, end users, and distributors, in addition to the financial results of different businesses in the embedded die packaging technology ecosystem.
Market Growth Factors
Increasing demand for smaller electronic devices
Globally, the downsizing of electrical items is gaining ground quickly. Electronic, portable, lightweight, and lightweight electronic products are becoming more popular with customers. As a result, more people are using fewer electric components. Small form factor electrical components are being used in developing electronic devices to increase available space and enhance the final product design. Customers want portable electronic gadgets that are tiny, modest in size, and packed with functionality. Companies are creating tiny circuits to fit most components onto a single die in order to improve user experience. Customers benefit from enhanced functionality when most components, including sensors and processors, are integrated into a single chip.
A rise in consumer electronics consumption and the use of 5g networks
Consumer electronics are one of the most widely used goods worldwide. Electronics for non-commercial usage is referred to as consumer electronics. The consumer electronics industry has grown tremendously due to the household sector's increasing adoption of a more extensive range of consumer electronics. Integrating different digital technologies into consumer electronics devices is receiving significant investment from manufacturers, who also place more and more emphasis on giving customers high-quality experiences. In addition, new products with cutting-edge features are being introduced due to the leading market companies' increasing expenditures in R&D and innovation.
Market Restraining Factors
Associated high costs
The embedded die packaging technique is expensive so it might be a barrier to market expansion. Die packing involves intricate procedures, expensive equipment, and hefty costs. Despite silicon being the second most common material on Earth, wafer packaging is costly. Silicon must be purified before being used to create semiconductor wafers and chips, a complicated procedure that raises costs. Because there are fewer businesses in this industry and fewer rivals due to the growing cost of packaging technologies, this market is vulnerable to abuse.
Platform Outlook
Based on platform, the Embedded Die Packaging Technology Market is divided into Embedded Die in Rigid Board, Embedded Die in Flexible Board, and Embedded Die in IC Package Substrate. The Embedded Die in Flexible Board segment experienced a significant revenue share in 2021. The printed circuit board's product value is rising in line with technological advancements, and sales of flexible boards for use in different wearable and Internet of Things (IoT) devices are anticipated to rise in the future. In addition, flexible circuits are increasingly being embedded for use in several types of small electronic devices.
Vertical Outlook
Based on vertical, the Embedded Die Packaging Technology Market is classified into Consumer Electronics, Automotive, Healthcare, IT & Telecommunications, and Others. The consumer electronics segment contributed the largest revenue share in 2021. Consumer electronics products like home security systems, home appliances, watches, printers, and more are beginning to include embedded systems. Simple embedded systems are used in household appliances like refrigerators, microwaves, and washing machines to give functions, gather user feedback, and regulate items following user preferences.
Regional Outlook
Based on region, the Embedded Die Packaging Technology Market is categorized into North America, Europe, Asia Pacific, and LAMEA. The North American region is growing at the promising rate during the forecast period. This is due to the highly developed telecommunications sector, increasing IoT use, and strong development in the automobile sector. In addition, the United States is home to some of the largest automakers in the world that are making investments in the electric vehicle market. With driver assistance features like adaptive cruise control, integrated technologies improve driving comfort.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include General Electric (GE) Co., Infineon Technologies AG, TDK Corporation, Fujikura Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ASE Group (ASE Technology Holding), Microsemi Corporation (Microchip Technology), Schweizer Electronic AG (Wus Printed Circuit), and AT&S Group.
Strategies Deployed in Embedded Die Packaging Technology Market
Sep-2022: Taiwan Semiconductor Manufacturing Company partnered with Samsung Electronics Co, a South Korean multinational electronics corporation headquartered in Yeongtong-gu, Suwon, South Korea, and Intel Corp, an American multinational corporation and technology company headquartered in Santa Clara, California. Through this partnership, the trio is committed to establishing a single standard for next-gen chip-packaging technologies which is a Chiplet. Moreover, a chipset is a small unit that forms processors and is similar to a Lego block.
Jun-2022: Advanced Semiconductor Engineering, Inc. (ASE Group) unveiled VIPack. It is an evolved packaging platform created to facilitate vertically integrated package solutions. Additionally, pack describes ASE's next generation of 3D heterogeneous integration architecture that expands design rules and reaches performance and ultra-high density.
May-2022: TDK Corporation launched InvenSense IAM-20380HT. It is a high-temperature automotive monolithic 3-axis MotionTracking sensor platform solution for non-safety automotive applications, which contains the DK-20380HT Developer Kit and the IAM-20380HT 3-axis MEMS gyroscope. Additionally, IAM-20380HT is a stand-alone gyroscope in a thin 3 x 3 x 0.75 mm (16-pin LGA) package that can perform over a wide temperature range, delivering reliable and highly accurate measurement data.
Mar-2022: TDK Corporation unveiled FS1412 microPOL (μPOL™) power module. The FS1412 is an element of a new series of μPOL™ DC-DC converters with the smallest available size, increased performance, and ease of use. Moreover, it is helpful in simplified integration for applications such as machine learning, big data, 5G cells, artificial intelligence (AI), computing enterprise, and IoT networking.
Nov-2021: Amkor Technology Inc, expanded its geographical footprints to a smart factory in Bac Ninh, Vietnam. Moreover, Amkor Technology Inc is investing in Bac Ninh to develop its manufacturing impression in the consent of customer requirements for an alternative cost-competitive supply chain solution for Advanced SiP and additional packaging solutions in the future.
Mar-2021: Advanced Semiconductor Engineering, Inc. (ASE) collaborated with Siemens Digital Industries Software, an American computer software company specializing in 3D & 2D Product Lifecycle Management software. Through this collaboration, both organizations have developed two new enablement solutions. Furthermore, ASE would be able to leverage the mutually developed flow to greatly reduce 2.5D/3D IC and FOCoS package assembly planning and verification cycle times by about 30 to 50 percent in each design iteration by embracing the Calibre 3DSTACK technologies and Siemens Xpedition Substrate Integrator.
Sep-2021: Infineon Technologies AG extended its footprint by opening a high-tech chip factory for power electronics on 300-millimeter thin wafers at its Villach site in Austria. Additionally, Infineon accepts that the opportunity to build new capacity in Europe could not be better considering the growing global demand for power semiconductors.
Jun-2019: Infineon Technologies AG took over Cypress Semiconductor Corporation, an American semiconductor design, and manufacturing company. Through this acquisition, Infineon would fasten and strengthen its profitable growth and shift its business on a more comprehensive basis. Moreover, this acquisition is a landmark step in Infineon's strategic development.
Nov-2018: Infineon Technologies AG took over Siltectra GmbH, a start-up based in Dresden. Through this acquisition, Infineon Technologies would be able to extend its portfolio with the fresh material silicon carbide. Moreover, Infineon Technologies' system knowledge of thin wafer technology would be perfectly complemented by the Cold Split technology and the innovative capacity of Siltectra.
May-2018: TDK Corporation took over Faraday Semi LLC, a U.S.-based venture-backed company engaged in the design of advanced power semiconductor Ics. Under this acquisition, TDK Corporation would be able to provide increased efficiency and ease of use at a lower total system cost than what is currently available nowadays.
Market Segments covered in the Report:
By Vertical
By Platform
By Geography
Companies Profiled
Unique Offerings from KBV Research