Product Code: A01936
The embedded die packaging technology market was valued at $69.18 million in 2021 and is estimated to reach $370.69 million by 2031, exhibiting a CAGR of 18.3% from 2022 to 2031. Embedded die packaging is an enhanced technology designed to be used directly onto a printed circuit board (PCB) laminated substrate and facilitates size reduction, power saving, & improves the overall efficiency of the system on a large scale.
The scope of the report discusses the potential opportunities for the key players to enter the embedded die packaging technology market. Furthermore, it provides an in-depth analysis of the market, outlining current trends, key driving factors, and key areas of investment. The report includes Porter's five forces analysis to understand the competitive scenario of the industry and role of each stakeholder in the value chain. Moreover, it features the strategies adopted by key market players to maintain their foothold in the market.
The embedded die packaging technology market is segmented on the basis of platform, industry vertical, and region. By platform, the market is divided into embedded die in IC package substrate, embedded die in rigid board, and embedded die in flexible board. On the basis of industry vertical, the market is segmented into consumer electronics, IT and telecommunication, automotive, healthcare, and others. By region, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
The growth of global embedded die packaging technology is majorly driven by the surge in demand for consumer electronics and 5G network technology coupled with the impending need for circuit miniaturization in microelectronic devices. Moreover, the advantages over other packaging technologies are expected to drive market growth. However, high initial cost acts as prime restraint of the global embedded die packaging technology market. On the contrary, the rise in trends related to Internet of Things (IoT) solution is anticipated to provide lucrative opportunities for the embedded die packaging technology industry during the forecast period.
The key players operating in the embedded die packaging technology market are: Amkor Technology, Taiwan Semiconductor Manufacturing Company, ASE Group, AT & S, General Electric, Infineon, Fujikura, MicroSemi, TDK-Epcos, and Schweizer. These key players adopt several strategies such as new product launch, acquisition, partnership, collaboration and joint venture to increase their market share in the global embedded die packaging technology market during the forecast period.
Key Benefits For Stakeholders
- This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the embedded die packaging technology market analysis from 2021 to 2031 to identify the prevailing embedded die packaging technology market opportunities.
- The market research is offered along with information related to key drivers, restraints, and opportunities.
- Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
- In-depth analysis of the embedded die packaging technology market segmentation assists to determine the prevailing market opportunities.
- Major countries in each region are mapped according to their revenue contribution to the global market.
- Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
- The report includes the analysis of the regional as well as global embedded die packaging technology market trends, key players, market segments, application areas, and market growth strategies.
Key Market Segments
By Platform
- Embedded Die in IC Package Substrate
- Embedded Die in Rigid Board
- Embedded Die in Flexible Board
By Industry Vertical
- Consumer Electronics
- IT and Telecommunication
- Automotive
- Healthcare
- Others
By Region
- North America
- Europe
- UK
- Germany
- France
- Rest of Europe
- Asia-Pacific
- China
- Japan
- Taiwan
- India
- South Korea
- Rest of Asia-Pacific
- LAMEA
- Latin America
- Middle East
- Africa
Key Market Players
- Amkor Technology Inc.
- ASE GROUP
- Fujikura
- General Electric
- Microsemi
- SCHWEIZER ELECTRONIC AG
- Taiwan Semiconductor Manufacturing Company Limited
- AT&S Group
- Infenion Technologies AG
- TDK Corporation
TABLE OF CONTENTS
CHAPTER 1: INTRODUCTION
- 1.1. Report description
- 1.2. Key market segments
- 1.3. Key benefits to the stakeholders
- 1.4. Research Methodology
- 1.4.1. Primary research
- 1.4.2. Secondary research
- 1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
CHAPTER 3: MARKET OVERVIEW
- 3.1. Market definition and scope
- 3.2. Key findings
- 3.2.1. Top impacting factors
- 3.2.2. Top investment pockets
- 3.3. Porter's five forces analysis
- 3.3.1. Moderate bargaining power of suppliers
- 3.3.2. Moderate bargaining power of buyers
- 3.3.3. Moderate threat of substitutes
- 3.3.4. Moderate threat of new entrants
- 3.3.5. Moderate intensity of rivalry
- 3.4. Market dynamics
- 3.4.1. Drivers
- 3.4.1.1. Impending need for circuit miniaturization in microelectronic devices
- 3.4.1.2. Advantages over other packaging technologies
- 3.4.1.3. Increase in demand for consumer electronics and 5G network technology
- 3.4.2. Restraints
- 3.4.2.1. High initial cost
- 3.4.3. Opportunities
- 3.4.3.1. Rise in trend of Internet of Things (IoT)
- 3.5. COVID-19 Impact Analysis on the market
CHAPTER 4: EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM
- 4.1. Overview
- 4.1.1. Market size and forecast
- 4.2. Embedded Die in IC Package Substrate
- 4.2.1. Key market trends, growth factors and opportunities
- 4.2.2. Market size and forecast, by region
- 4.2.3. Market share analysis by country
- 4.3. Embedded Die in Rigid Board
- 4.3.1. Key market trends, growth factors and opportunities
- 4.3.2. Market size and forecast, by region
- 4.3.3. Market share analysis by country
- 4.4. Embedded Die in Flexible Board
- 4.4.1. Key market trends, growth factors and opportunities
- 4.4.2. Market size and forecast, by region
- 4.4.3. Market share analysis by country
CHAPTER 5: EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL
- 5.1. Overview
- 5.1.1. Market size and forecast
- 5.2. Consumer Electronics
- 5.2.1. Key market trends, growth factors and opportunities
- 5.2.2. Market size and forecast, by region
- 5.2.3. Market share analysis by country
- 5.3. IT and Telecommunication
- 5.3.1. Key market trends, growth factors and opportunities
- 5.3.2. Market size and forecast, by region
- 5.3.3. Market share analysis by country
- 5.4. Automotive
- 5.4.1. Key market trends, growth factors and opportunities
- 5.4.2. Market size and forecast, by region
- 5.4.3. Market share analysis by country
- 5.5. Healthcare
- 5.5.1. Key market trends, growth factors and opportunities
- 5.5.2. Market size and forecast, by region
- 5.5.3. Market share analysis by country
- 5.6. Others
- 5.6.1. Key market trends, growth factors and opportunities
- 5.6.2. Market size and forecast, by region
- 5.6.3. Market share analysis by country
CHAPTER 6: EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY REGION
- 6.1. Overview
- 6.1.1. Market size and forecast By Region
- 6.2. North America
- 6.2.1. Key trends and opportunities
- 6.2.2. Market size and forecast, by Platform
- 6.2.3. Market size and forecast, by Industry Vertical
- 6.2.4. Market size and forecast, by country
- 6.2.4.1. U.S.
- 6.2.4.1.1. Key market trends, growth factors and opportunities
- 6.2.4.1.2. Market size and forecast, by Platform
- 6.2.4.1.3. Market size and forecast, by Industry Vertical
- 6.2.4.2. Canada
- 6.2.4.2.1. Key market trends, growth factors and opportunities
- 6.2.4.2.2. Market size and forecast, by Platform
- 6.2.4.2.3. Market size and forecast, by Industry Vertical
- 6.2.4.3. Mexico
- 6.2.4.3.1. Key market trends, growth factors and opportunities
- 6.2.4.3.2. Market size and forecast, by Platform
- 6.2.4.3.3. Market size and forecast, by Industry Vertical
- 6.3. Europe
- 6.3.1. Key trends and opportunities
- 6.3.2. Market size and forecast, by Platform
- 6.3.3. Market size and forecast, by Industry Vertical
- 6.3.4. Market size and forecast, by country
- 6.3.4.1. UK
- 6.3.4.1.1. Key market trends, growth factors and opportunities
- 6.3.4.1.2. Market size and forecast, by Platform
- 6.3.4.1.3. Market size and forecast, by Industry Vertical
- 6.3.4.2. Germany
- 6.3.4.2.1. Key market trends, growth factors and opportunities
- 6.3.4.2.2. Market size and forecast, by Platform
- 6.3.4.2.3. Market size and forecast, by Industry Vertical
- 6.3.4.3. France
- 6.3.4.3.1. Key market trends, growth factors and opportunities
- 6.3.4.3.2. Market size and forecast, by Platform
- 6.3.4.3.3. Market size and forecast, by Industry Vertical
- 6.3.4.4. Rest of Europe
- 6.3.4.4.1. Key market trends, growth factors and opportunities
- 6.3.4.4.2. Market size and forecast, by Platform
- 6.3.4.4.3. Market size and forecast, by Industry Vertical
- 6.4. Asia-Pacific
- 6.4.1. Key trends and opportunities
- 6.4.2. Market size and forecast, by Platform
- 6.4.3. Market size and forecast, by Industry Vertical
- 6.4.4. Market size and forecast, by country
- 6.4.4.1. China
- 6.4.4.1.1. Key market trends, growth factors and opportunities
- 6.4.4.1.2. Market size and forecast, by Platform
- 6.4.4.1.3. Market size and forecast, by Industry Vertical
- 6.4.4.2. Japan
- 6.4.4.2.1. Key market trends, growth factors and opportunities
- 6.4.4.2.2. Market size and forecast, by Platform
- 6.4.4.2.3. Market size and forecast, by Industry Vertical
- 6.4.4.3. Taiwan
- 6.4.4.3.1. Key market trends, growth factors and opportunities
- 6.4.4.3.2. Market size and forecast, by Platform
- 6.4.4.3.3. Market size and forecast, by Industry Vertical
- 6.4.4.4. India
- 6.4.4.4.1. Key market trends, growth factors and opportunities
- 6.4.4.4.2. Market size and forecast, by Platform
- 6.4.4.4.3. Market size and forecast, by Industry Vertical
- 6.4.4.5. South Korea
- 6.4.4.5.1. Key market trends, growth factors and opportunities
- 6.4.4.5.2. Market size and forecast, by Platform
- 6.4.4.5.3. Market size and forecast, by Industry Vertical
- 6.4.4.6. Rest of Asia-Pacific
- 6.4.4.6.1. Key market trends, growth factors and opportunities
- 6.4.4.6.2. Market size and forecast, by Platform
- 6.4.4.6.3. Market size and forecast, by Industry Vertical
- 6.5. LAMEA
- 6.5.1. Key trends and opportunities
- 6.5.2. Market size and forecast, by Platform
- 6.5.3. Market size and forecast, by Industry Vertical
- 6.5.4. Market size and forecast, by country
- 6.5.4.1. Latin America
- 6.5.4.1.1. Key market trends, growth factors and opportunities
- 6.5.4.1.2. Market size and forecast, by Platform
- 6.5.4.1.3. Market size and forecast, by Industry Vertical
- 6.5.4.2. Middle East
- 6.5.4.2.1. Key market trends, growth factors and opportunities
- 6.5.4.2.2. Market size and forecast, by Platform
- 6.5.4.2.3. Market size and forecast, by Industry Vertical
- 6.5.4.3. Africa
- 6.5.4.3.1. Key market trends, growth factors and opportunities
- 6.5.4.3.2. Market size and forecast, by Platform
- 6.5.4.3.3. Market size and forecast, by Industry Vertical
CHAPTER 7: COMPETITIVE LANDSCAPE
- 7.1. Introduction
- 7.2. Top winning strategies
- 7.3. Product Mapping of Top 10 Player
- 7.4. Competitive Dashboard
- 7.5. Competitive Heatmap
- 7.6. Top player positioning, 2021
CHAPTER 8: COMPANY PROFILES
- 8.1. Amkor Technology Inc.
- 8.1.1. Company overview
- 8.1.2. Key Executives
- 8.1.3. Company snapshot
- 8.1.4. Operating business segments
- 8.1.5. Product portfolio
- 8.1.6. Business performance
- 8.1.7. Key strategic moves and developments
- 8.2. ASE GROUP
- 8.2.1. Company overview
- 8.2.2. Key Executives
- 8.2.3. Company snapshot
- 8.2.4. Operating business segments
- 8.2.5. Product portfolio
- 8.2.6. Business performance
- 8.2.7. Key strategic moves and developments
- 8.3. AT&S Group
- 8.3.1. Company overview
- 8.3.2. Key Executives
- 8.3.3. Company snapshot
- 8.3.4. Operating business segments
- 8.3.5. Product portfolio
- 8.3.6. Business performance
- 8.3.7. Key strategic moves and developments
- 8.4. Fujikura
- 8.4.1. Company overview
- 8.4.2. Key Executives
- 8.4.3. Company snapshot
- 8.4.4. Operating business segments
- 8.4.5. Product portfolio
- 8.4.6. Business performance
- 8.4.7. Key strategic moves and developments
- 8.5. General Electric
- 8.5.1. Company overview
- 8.5.2. Key Executives
- 8.5.3. Company snapshot
- 8.5.4. Operating business segments
- 8.5.5. Product portfolio
- 8.5.6. Business performance
- 8.6. Infenion Technologies AG
- 8.6.1. Company overview
- 8.6.2. Key Executives
- 8.6.3. Company snapshot
- 8.6.4. Operating business segments
- 8.6.5. Product portfolio
- 8.6.6. Business performance
- 8.6.7. Key strategic moves and developments
- 8.7. Microsemi
- 8.7.1. Company overview
- 8.7.2. Key Executives
- 8.7.3. Company snapshot
- 8.7.4. Operating business segments
- 8.7.5. Product portfolio
- 8.7.6. Business performance
- 8.8. SCHWEIZER ELECTRONIC AG
- 8.8.1. Company overview
- 8.8.2. Key Executives
- 8.8.3. Company snapshot
- 8.8.4. Operating business segments
- 8.8.5. Product portfolio
- 8.8.6. Business performance
- 8.8.7. Key strategic moves and developments
- 8.9. Taiwan Semiconductor Manufacturing Company Limited
- 8.9.1. Company overview
- 8.9.2. Key Executives
- 8.9.3. Company snapshot
- 8.9.4. Operating business segments
- 8.9.5. Product portfolio
- 8.9.6. Business performance
- 8.9.7. Key strategic moves and developments
- 8.10. TDK Corporation
- 8.10.1. Company overview
- 8.10.2. Key Executives
- 8.10.3. Company snapshot
- 8.10.4. Operating business segments
- 8.10.5. Product portfolio
- 8.10.6. Business performance
- 8.10.7. Key strategic moves and developments