組み込みダイパッケージング技術市場レポート：2030年までの動向、予測、競合分析

組み込みダイパッケージング技術市場の動向と予測

世界の組み込みダイパッケージング技術市場は、2024年から2030年までのCAGRが27.1%で、2030年までに推定8億2,000万米ドルに達すると予測されています。この市場の主な促進要因は、マイクロエレクトロニクスデバイスにおける回路微細化の要求の高まり、専門サービスにおける自律型ロボットの採用の高まり、世界のコンシューマーエレクトロニクスと5Gネットワーク技術の需要の増加です。世界の組み込みダイ・パッケージング技術市場の将来は、民生用電子機器、IT・通信、自動車、ヘルスケア市場におけるビジネスチャンスで有望視されています。

組み込みダイパッケージング技術市場の洞察

Lucintel社の予測では、フレキシブル基板へのダイ埋め込みが予測期間中に最も高い成長を遂げる見込みです。

この市場において、民生用電子機器が最大のセグメントであり続けると思われます。

北米は予測期間中に最も高い成長が見込まれます。

本レポートでは、以下の11の主要な質問に回答しています：

• Q.1.市場セグメントのうち、最も有望かつ高成長な機会は何か？
• Q.2.どのセグメントがより速いペースで成長するのか、またその理由は？
• Q.3.今後成長が加速すると思われる地域とその理由は？
• Q.4.市場力学に影響を与える主な要因は何か？市場における主な課題とビジネスリスクは？
• Q.5.この市場におけるビジネスリスクと競合の脅威は？
• Q.6.この市場における新たな動向とその理由は？
• Q.7.市場における顧客の需要の変化にはどのようなものがありますか？
• Q.8.この市場における新たな開発と、その開発をリードしている企業は？
• Q.9.この市場における主要企業は？主要企業は事業成長のためにどのような戦略的取り組みを進めているのか？
• Q.10.この市場における競合製品にはどのようなものがあり、材料や製品の代替による市場シェア低下の脅威はどの程度ありますか？
• Q.11.過去5年間にどのようなM&Aが行われ、業界にどのような影響を与えましたか？

目次

第1章 エグゼクティブサマリー

第2章 世界の組み込みダイパッケージング技術市場：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 業界の促進要因と課題

第3章 2018年から2030年までの市場動向と予測分析

• マクロ経済動向（2018～2023年）と予測（2024～2030年）
• 世界の組み込みダイパッケージング技術市場動向（2018～2023年）と予測（2024～2030年）
• プラットフォーム別の世界の組み込みダイパッケージング技術市場
  • ICパッケージ基板に埋め込まれたダイ
  • リジッドボードに埋め込まれたダイ
  • フレキシブル基板に埋め込まれたダイ
• 最終用途産業別の世界の組み込みダイパッケージング技術市場
  • 家電
  • IT・通信
  • 自動車
  • ヘルスケア
  • その他

第4章 2018年から2030年までの地域別の市場動向と予測分析

• 地域別の世界の組み込みダイパッケージング技術市場
• 北米の組み込みダイパッケージング技術市場
• 欧州の組み込みダイパッケージング技術市場
• その他地域組み込みダイパッケージング技術市場

第5章 競合の分析

• 製品ポートフォリオ分析
• 運用上の統合
• ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

• 成長機会分析
  • プラットフォーム別の世界の組み込みダイパッケージング技術市場の成長機会
  • 最終用途産業別の世界の組み込みダイパッケージング技術市場の成長機会
  • 世界の組み込みダイパッケージング技術市場地域の成長機会
• 世界の組み込みダイパッケージング技術市場の新たな動向
• 戦略的分析
  • 新製品の開発
  • 世界のエンベデッド・ダイ・パッケージング技術市場の能力拡大
  • 世界の組み込みダイパッケージング技術市場における合併、買収、合弁事業
  • 認証とライセンシング

第7章 有力企業の企業プロファイル

• Amkor Technology
• TDK Corporation
• Microsemi
• ASE Group
• AT&S
• General Electric
• Taiwan Semiconductor
• Infenion Technologies
• Schweizer Electronic
• Fujikura

Embedded Die Packaging Technology Market Trends and Forecast

The future of the global embedded die packaging technology market looks promising with opportunities in the consumer electronic, it and telecommunication, automotive, and healthcare markets. The global embedded die packaging technology market is expected to reach an estimated $0.82 billion by 2030 with a CAGR of 27.1% from 2024 to 2030. The major drivers for this market are growing requirement for circuit miniaturization in the microelectronic devices, rising adoption of autonomous robots for professional services, and increase in demand for consumer electronics and 5G network technology across the globe.

A more than 150-page report is developed to help in your business decisions.

Embedded Die Packaging Technology Market by Segment

The study includes a forecast for the global embedded die packaging technology market by platform, end use industry, and region.

Embedded Die Packaging Technology Market by Platform [Shipment Analysis by Value from 2018 to 2030]:

• Embedded Die in IC Package Substrate
• Embedded Die in Rigid Board
• Embedded Die in Flexible Board

Embedded Die Packaging Technology Market by End Use Industry [Shipment Analysis by Value from 2018 to 2030]:

• Consumer Electronics
• IT and Telecommunication
• Automotive
• Healthcare
• Others

Embedded Die Packaging Technology Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Embedded Die Packaging Technology Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies embedded die packaging technology companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the embedded die packaging technology companies profiled in this report include-

• Amkor Technology
• TDK Corporation
• Microsemi
• ASE Group
• AT&S
• General Electric
• Taiwan Semiconductor
• Infenion Technologies
• Schweizer Electronic
• Fujikura

Embedded Die Packaging Technology Market Insights

Lucintel forecasts that embedded die in flexible board is expected to witness highest growth over the forecast period.

Within this market, consumer electronics will remain the largest segment.

North America is expected to witness highest growth over the forecast period.

Features of the Global Embedded Die Packaging Technology Market

Market Size Estimates: Embedded die packaging technology market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Embedded die packaging technology market size by platform, end use industry, and region. in terms of value ($B).

Regional Analysis: Embedded die packaging technology market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different platforms, end use industries, and region.s for the embedded die packaging technology market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the embedded die packaging technology market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1. What is the embedded die packaging technology market size?

Answer: The global embedded die packaging technology market is expected to reach an estimated $0.82 billion by 2030.

Q.2. What is the growth forecast for the embedded die packaging technology market?

Answer: The global embedded die packaging technology market is expected to grow with a CAGR of 27.1% from 2024 to 2030.

Q.3. What are the major drivers influencing the growth of the embedded die packaging technology market?

Answer: The major drivers for this market are growing requirement for circuit miniaturization in the microelectronic devices, rising adoption of autonomous robots for professional services, and increase in demand for consumer electronics and 5G network technology across the globe.

Q.4. What are the major segments for the embedded die packaging technology market?

Answer: The future of the global embedded die packaging technology market looks promising with opportunities in the consumer electronic, it and telecommunication, automotive, and healthcare markets.

Q.5. Who are the key embedded die packaging technology market companies?

Answer: Some of the key embedded die packaging technology companies are as follows:

• Amkor Technology
• TDK Corporation
• Microsemi
• ASE Group
• AT&S
• General Electric
• Taiwan Semiconductor
• Infenion Technologies
• Schweizer Electronic
• Fujikura

Q.6. Which embedded die packaging technology market segment will be the largest in future?

Answer: Lucintel forecasts that embedded die in flexible board is expected to witness highest growth over the forecast period.

Q.7. In embedded die packaging technology market, which region is expected to be the largest in next 5 years?

Answer: North America is expected to witness highest growth over the forecast period.

Q.8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the embedded die packaging technology market by platform (embedded die in IC package substrate, embedded die in rigid board, and embedded die in flexible board), by end use industry (consumer electronics, IT and telecommunication, automotive, healthcare, and others), and region. (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Embedded Die Packaging Technology Market : Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

• 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
• 3.2. Global Embedded Die Packaging Technology Market Trends (2018-2023) and Forecast (2024-2030)
• 3.3: Global Embedded Die Packaging Technology Market by Platform
  • 3.3.1: Embedded Die in IC Package Substrate
  • 3.3.2: Embedded Die in Rigid Board
  • 3.3.3: Embedded Die in Flexible Board
• 3.4: Global Embedded Die Packaging Technology Market by End Use Industry
  • 3.4.1: Consumer Electronics
  • 3.4.2: IT and Telecommunication
  • 3.4.3: Automotive
  • 3.4.4: Healthcare
  • 3.4.5: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

• 4.1: Global Embedded Die Packaging Technology Market by Region
• 4.2: North American Embedded Die Packaging Technology Market
  • 4.2.1: North American Embedded Die Packaging Technology Market by Platform: Embedded Die in IC Package Substrate, Embedded Die in Rigid Board, and Embedded Die in Flexible Board
  • 4.2.2: North American Embedded Die Packaging Technology Market by End Use Industry: Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Others
• 4.3: European Embedded Die Packaging Technology Market
  • 4.3.1: European Embedded Die Packaging Technology Market by Platform: Embedded Die in IC Package Substrate, Embedded Die in Rigid Board, and Embedded Die in Flexible Board
  • 4.3.2: European Embedded Die Packaging Technology Market by End Use Industry: Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Others
  • 4.4.1: APAC Embedded Die Packaging Technology Market by Platform: Embedded Die in IC Package Substrate, Embedded Die in Rigid Board, and Embedded Die in Flexible Board
  • 4.4.2: APAC Embedded Die Packaging Technology Market by End Use Industry: Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Others
• 4.5: ROW Embedded Die Packaging Technology Market
  • 4.5.1: ROW Embedded Die Packaging Technology Market by Platform: Embedded Die in IC Package Substrate, Embedded Die in Rigid Board, and Embedded Die in Flexible Board\
  • 4.5.2: ROW Embedded Die Packaging Technology Market by End Use Industry: Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Others

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global Embedded Die Packaging Technology Market by Platform
  • 6.1.2: Growth Opportunities for the Global Embedded Die Packaging Technology Market by End Use Industry
  • 6.1.3: Growth Opportunities for the Global Embedded Die Packaging Technology Market Region
• 6.2: Emerging Trends in the Global Embedded Die Packaging Technology Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global Embedded Die Packaging Technology Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Embedded Die Packaging Technology Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: Amkor Technology
• 7.2: TDK Corporation
• 7.3: Microsemi
• 7.4: ASE Group
• 7.5: AT&S
• 7.6: General Electric
• 7.7: Taiwan Semiconductor
• 7.8: Infenion Technologies
• 7.9: Schweizer Electronic
• 7.10: Fujikura