サンプル依頼リスト カート
  • English
  • Traditional Chinese
  • Simplified Chinese
デフォルト表紙
市場調査レポート
商品コード
1730697

組み込み型ダイパッケージング技術市場：プラットフォーム別、用途別、最終用途産業別、国別、地域別 - 産業分析、市場規模、市場シェア、2025年～2032年の予測

Embedded Die Packaging Technology Market, By Platform, By Application, By End-Use Industry, By Country, and By Region - Industry Analysis, Market Size, Market Share & Forecast from 2025-2032

出版日
ページ情報
英文 303 Pages
納期
2～3営業日
カスタマイズ可能
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=145.06円
組み込み型ダイパッケージング技術市場：プラットフォーム別、用途別、最終用途産業別、国別、地域別 - 産業分析、市場規模、市場シェア、2025年～2032年の予測
出版日: 2025年05月04日
発行: AnalystView Market Insights
ページ情報: 英文 303 Pages
納期: 2～3営業日
GIIご利用のメリット
  • 全表示
  • 概要
  • 目次
概要

レポートハイライト

組み込み型ダイパッケージング技術市場規模は2024年に1億292万米ドルとなり、2025年から2032年にかけてCAGR 11.90%で拡大

組み込み型ダイパッケージング技術市場-市場力学

電気性能向上へのニーズの高まりと車載電子機器からの需要増が市場需要を促進する見込み

組み込み型ダイパッケージング技術は、電気性能の向上や自動車、産業用システムでの需要が高まっており、市場の成長を後押ししています。組み込み型ダイパッケージング技術は、半導体およびエレクトロニクス産業で大きな勢いを増しています。半導体ダイを基板に直接埋め込むこのパッケージング手法は、電気性能の向上、デバイスサイズの縮小、設計の柔軟性向上を実現します。半導体デバイスがより複雑で高速になるにつれて、シグナルインテグリティが重要な関心事となっています。従来のパッケージングでは、相互接続が長くなることが多く、寄生容量やインダクタンスが発生し、信号遅延や電力損失につながります。組み込み型ダイパッケージングでは、このような相互接続の長さを短縮し、信号遅延とノイズを低減することで電気的性能を大幅に改善します。

車載エレクトロニクス市場は、電気自動車（EV）、自律走行、インフォテインメント・システムの台頭によって急速に拡大しています。これらのアプリケーションでは、優れた信頼性、長寿命、広い温度範囲や振動などの過酷な環境に対する耐性を備えた高性能エレクトロニクスが求められます。組み込み型ダイパッケージングは、パワーモジュール、LEDドライバ、インバータなどのアプリケーションで重要な、堅牢な機械的完全性と省スペース設計により、この市場に適しています。さらに、熱的・電気的特性の改善により、自動車のミッションクリティカルなシステムの有力な候補となっています。

組み込み型ダイパッケージング技術市場-主要インサイト

リサーチアナリストの分析によると、世界市場は予測期間（2025-2032年）に約11.90%のCAGRで年間成長すると推定されます。

プラットフォームセグメント別では、IoT、ウェアラブルデバイスなどの高い需要により、ICパッケージ基板セグメントが2024年の主要プラットフォームセグメントでした。

用途別では、エレクトロニクス分野でのパワーモジュールの需要が高いことから、高密度パワーモジュール分野が2024年の主要材料分野となりました。

エンドユーザー産業別では、主に高度なポータブルデバイスの需要が高いことから、2024年にはコンシューマーエレクトロニクスセグメントがエンドユーザー産業をリードしています。

地域別では、アジア太平洋地域が、中国、日本などでの高い生産量により、2024年に収益を生み出す主要地域となりました。

組み込み型ダイパッケージング技術市場-セグメンテーション分析：

組み込み型ダイパッケージング技術の世界市場は、プラットフォーム別、用途別、最終用途産業別、地域別に区分されます。

プラットフォーム別では、フレキシブルダイボード、リジッドダイボード、ICパッケージ基板の3つに分類されます。ICパッケージ基板セグメントが最大のシェアを占めると予想される一方、フレキシブルダイボードセグメントは複数のダイボードを柔軟にパッケージングできるため、最も速い速度で成長すると予想されます。

市場は用途別に高密度パワーモジュール、ウェアラブルデバイス、医療機器、IoTセンサー、その他の5つに分類されます。高密度パワーモジュール分野が最大のシェアを占めると予想されます。高周波・高速デバイスの需要増がパワーモジュールの採用を後押しし、セグメント成長を押し上げています。

同市場は、最終用途産業別に民生用エレクトロニクス、自動車、IT・通信、ヘルスケア、その他の5つに分類されます。最終用途産業分野では、民生用電子機器分野が最も高いシェアを占めています。ポータブル電子機器や高度なウェアラブル機器に対する需要の高まりが、市場の需要を拡大しています。

組み込み型ダイパッケージング技術市場-地域別インサイト

組み込み型ダイパッケージング技術市場は、北米、ラテンアメリカ、欧州、アジア太平洋、中東アフリカの各地域に広がっています。アジア太平洋地域は、世界の組み込み型ダイ・パッケージング技術市場で最大のシェアを占めています。中国、日本の強力なエレクトロニクス製造拠点と成長する自動車部門が、この地域に新たな成長機会をもたらしています。メイド・イン・チャイナ2025のような取り組みや、TSMC、ASEグループのようなトップメーカーの存在が、この地域の成長を力強いものにしています。ラテンアメリカや中東・アフリカなどの新興市場も大きな成長が見込まれています。しかし、限られた半導体製造が市場の成長を妨げています。

組み込み型ダイパッケージング技術市場-競合情勢：

組み込み型ダイパッケージング技術産業は競争が激しいです。組み込み型ダイパッケージングは、業界全体を変革するソリューションとして台頭しつつあります。そのため、この分野の新製品開発は、性能の向上、小型化、熱管理の改善、複数のコンポーネントを単一のコンパクトなパッケージに統合することに重点が置かれています。市場開発企業は、組み込み型ダイパッケージングの新技術やソリューションの開発に余念がないです。例えば、サムスンは薄型チップを埋め込む多層ビルドアップ基板の開発を行いました。同様に、TTM Technologiesは、航空宇宙・防衛エレクトロニクス向けのマルチダイ組込みPCBに注力し、カスタム組込みモジュール設計のためにOEMと協力しています。

目次

第1章 組み込み型ダイパッケージング技術市場概要

  • 調査範囲
  • 市場推定年数

第2章 エグゼクティブサマリー

  • 市場内訳
  • 競合考察

第3章 組み込み型ダイパッケージング技術の主要市場動向

  • 市場促進要因
  • 市場抑制要因
  • 市場機会
  • 市場の将来動向

第4章 組み込み型ダイパッケージング技術産業の調査

  • PEST分析
  • ポーターのファイブフォース分析
  • 成長見通しマッピング
  • 規制枠組み分析

第5章 組み込み型ダイパッケージング技術市場： COVID-19の影響分析

  • COVID-19以前の影響分析
  • COVID-19後の影響分析

第6章 組み込み型ダイパッケージング技術市場情勢

  • 組み込み型ダイパッケージング技術市場シェア分析、2024年
  • 主要メーカー別内訳データ
    • ベテラン選手の分析
    • 新興企業の分析

第7章 組み込み型ダイパッケージング技術市場- プラットフォーム別

  • 概要
    • プラットフォーム別セグメントシェア分析
    • フレキシブルダイボード
    • リジッドダイボード
    • ICパッケージ基板

第8章 組み込み型ダイパッケージング技術市場- アプリケーション別

  • 概要
    • アプリケーション別セグメントシェア分析
    • 高密度パワーモジュール
    • ウェアラブルデバイス
    • 医療機器
    • IoTセンサー
    • その他

第9章 組み込み型ダイパッケージング技術市場- 最終用途産業別

  • 概要
    • 最終用途産業別セグメントシェア分析
    • 家電
    • 自動車
    • ITおよび通信
    • ヘルスケア
    • その他

第10章 組み込み型ダイパッケージング技術市場-地域

  • イントロダクション
  • 北米
    • 概要
    • 北米の主要メーカー
    • 米国
    • カナダ
  • 欧州
    • 概要
    • 欧州の主要メーカー
    • ドイツ
    • イタリア
    • 英国
    • フランス
    • ロシア
    • オランダ
    • スウェーデン
    • ポーランド
    • その他
  • アジア太平洋（APAC）
    • 概要
    • アジア太平洋地域の主要メーカー
    • インド
    • 中国
    • 日本
    • 韓国
    • オーストラリア
    • タイ
    • インドネシア
    • フィリピン
    • その他
  • ラテンアメリカ
    • 概要
    • ラテンアメリカの主要メーカー
    • ブラジル
    • メキシコ
    • アルゼンチン
    • コロンビア
    • その他
  • 中東およびアフリカ
    • 概要
    • 中東およびアフリカの主要メーカー
    • サウジアラビア
    • アラブ首長国連邦
    • イスラエル
    • トルコ
    • アルジェリア
    • エジプト
    • その他

第11章 主要ベンダー分析- 組み込み型ダイパッケージング技術業界

  • 競合ダッシュボード
  • 企業プロファイル
    • ASE Technology Holding Co., Ltd.
    • Amkor Technology, Inc.
    • AT&S（Austria Technologie &Systemtechnik AG）
    • Taiwan Semiconductor Manufacturing Company（TSMC）
    • TDK Corporation
    • General Electric
    • Fujikura Ltd.
    • Infineon Technologies AG
    • Microchip Technology Inc.
    • Schweizer Electronic AG
    • Toshiba Corporation
    • Fujitsu Limited
    • STMicroelectronics
    • Siliconware Precision Industries Co., Ltd.
    • Shinko Electric Industries Co., Ltd.
    • Others

第12章 アナリストの全方位展望

目次
Product Code: ANV5069

REPORT HIGHLIGHT

Embedded Die Packaging Technology Market size was valued at USD 102.92 Million in 2024, expanding to a CAGR of 11.90% from 2025 to 2032.

Embedded Die Packaging Technology is an advanced semiconductor packaging method where a semiconductor die (or chip) is embedded directly into a substrate or package material, rather than being mounted on top of it like in traditional packaging. This technique is part of the broader trend toward system miniaturization and heterogeneous integration in electronics.

Embedded Die Packaging Technology Market- Market Dynamics

The growing need for enhanced electrical performance and rising demand from automotive electronics are expected to propel market demand

The growing demand for embedded die packaging technology in enhancing electrical performance & automotive, industrial systems are boosting market growth. Embedded Die Packaging Technology is gaining significant momentum in the semiconductor and electronics industries. This packaging method, which involves embedding semiconductors dies directly into substrates, offers enhanced electrical performance, reduced device size, and greater design flexibility. As semiconductor devices become more complex and faster, signal integrity becomes a critical concern. Traditional packaging often results in longer interconnecting, which introduces parasitic capacitance and inductance, leading to signal delay and power loss. Embedded die packaging shortens these interconnect lengths, significantly improving electrical performance by reducing signal latency and noise.

The automotive electronics market is rapidly expanding, driven by the rise of electric vehicles (EVs), autonomous driving, and infotainment systems. These applications require high-performance electronics with excellent reliability, longevity, and resistance to harsh environments such as wide temperature ranges and vibrations. Embedded die packaging is well-suited for this market due to its robust mechanical integrity and space-saving design, which is crucial in applications like power modules, LED drivers, and inverters. Moreover, its improved thermal and electrical characteristics make it a strong candidate for mission-critical systems in vehicles.

Embedded Die Packaging Technology Market- Key Insights

As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 11.90% over the forecast period (2025-2032)

Based on Platform segmentation, the IC packaged substrate segment was the leading Platform segment in 2024, owing to high demand from IoT, wearable devices, etc.

Based on Application segmentation, the high-density power modules segment was the leading material segment in 2024, owing to high demand for power modules in electronics sector

Based on End-Use Industry segmentation, the consumer electronics segment was the leading End-Use Industry segment in 2024, mainly due to high demand for advanced portable devices.

On the basis of the region, Asia Pacific was the leading revenue generator in 2024, owing to the high production across China, Japan, etc.

Embedded Die Packaging Technology Market- Segmentation Analysis:

The Global Embedded Die Packaging Technology Market is segmented on the basis of Platform, By Application, End-Use Industry, and Region.

The market is divided into three categories based on Platform: flexible die board, rigid die board, and IC packaged substrate. The IC packaged substrate segment is expected to hold the largest share while the flexible die board segment is expected to grow at the fastest rate as they offer flexibility in packaging multiple die boards.

The market is divided into five categories based on Application: high-density power modules, wearable devices, medical devices, IoT sensors, and others. The high-density power modules segment is expected to hold the largest share. The increasing demand for high-frequency and high-speed devices is boosting the adoption of power modules, which is boosting segment growth.

The market is divided into five categories based on End-Use Industry: consumer electronics, automotive, IT & telecommunication, healthcare, and others. The consumer electronics segment holds the highest share of the end-use industry segment. Rising demand for portable electronics, advanced wearable devices is proliferating market demand.

Embedded Die Packaging Technology Market- Geographical Insights

Across the globe, the Embedded Die Packaging Technology market is widespread in the regions of North America, Latin America, Europe, Asia Pacific, and the Middle East and Africa. Asia Pacific holds the largest share in the global Embedded Die Packaging Technology market. Strong electronics manufacturing hubs across China, Japan, and growing automotive sector is making new growth opportunities in the region. Initiatives like Made in China 2025, and the presence of top manufacturers like TSMC, ASE Group is making strong regional growth. Emerging markets such as Latin America and the Middle East & Africa is also expected to grow at a significant rate. However, limited semiconductor fabrication is hindering market growth.

Embedded Die Packaging Technology Market- Competitive Landscape:

The Embedded Die Packaging Technology industry is highly competitive. Embedded die packaging is emerging as a transformative solution across industries. Thus, new product development in this space focuses on increasing performance, reducing size, improving thermal management, and integrating multiple components into a single compact package. Market players indulge in developing new tech & solutions for embedded die packaging. For instance, Samsung made the development of multi-layer build-up substrates embedding thin chips. Similarly, TTM Technologies focus on multi-die embedded PCBs for aerospace and defense electronics and collaborated with OEMs for custom embedded module design.

Recent Developments:

In 2024, Amkor Technology made investment in the development of multi-die embedded packages for AI and machine learning processors. With aim of targeting 5G and AI edge services.

In 2024, Infineon Technologies introduced a power module called HybridPACK Drive G2 for electric vehicle inverters.

SCOPE OF THE REPORT

The scope of this report covers the market by its major segments, which include as follows:

GLOBAL EMBEDDED DIE PACKAGING TECHNOLOGY MARKET KEY PLAYERS

  • ASE Technology Holding Co., Ltd.
  • Amkor Technology, Inc.
  • AT&S (Austria Technologie & Systemtechnik AG)
  • Taiwan Semiconductor Manufacturing Company (TSMC)
  • TDK Corporation
  • General Electric
  • Fujikura Ltd.
  • Infineon Technologies AG
  • Microchip Technology Inc.
  • Schweizer Electronic AG
  • Toshiba Corporation
  • Fujitsu Limited
  • STMicroelectronics
  • Siliconware Precision Industries Co., Ltd.
  • Shinko Electric Industries Co., Ltd.
  • Others

GLOBAL EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM- MARKET ANALYSIS, 2019-2032

  • Flexible die board
  • Rigid die board
  • IC packaged substrate

GLOBAL EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY APPLICATION- MARKET ANALYSIS, 2019-2032

  • High-density power modules
  • Wearable devices
  • Medical devices
  • IoT sensors
  • Others

GLOBAL EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY END-USE INDUSTRY- MARKET ANALYSIS, 2019-2032

  • Consumer electronics
  • Automotive
  • IT & telecommunications
  • Healthcare
  • Others

GLOBAL EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY REGION- MARKET ANALYSIS, 2019-2032

  • North America
  • The U.S.
  • Canada
  • Europe
  • Germany
  • France
  • Italy
  • Spain
  • United Kingdom
  • Russia
  • Netherlands
  • Sweden
  • Poland
  • Rest of Europe
  • Asia Pacific
  • India
  • China
  • South Korea
  • Japan
  • Australia
  • Thailand
  • Indonesia
  • Philippines
  • Rest of APAC
  • Latin America
  • Brazil
  • Mexico
  • Argentina
  • Colombia
  • Rest of LATAM
  • The Middle East and Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Turkey
  • Algeria
  • Egypt
  • Rest of MEA

Table of Contents

1. Embedded Die Packaging Technology Market Overview

  • 1.1. Study Scope
  • 1.2. Market Estimation Years

2. Executive Summary

  • 2.1. Market Snippet
    • 2.1.1. Embedded Die Packaging Technology Market Snippet by Platform
    • 2.1.2. Embedded Die Packaging Technology Market Snippet by Application
    • 2.1.3. Embedded Die Packaging Technology Market Snippet by End-Use Industry
    • 2.1.4. Embedded Die Packaging Technology Market Snippet by Country
    • 2.1.5. Embedded Die Packaging Technology Market Snippet by Region
  • 2.2. Competitive Insights

3. Embedded Die Packaging Technology Key Market Trends

  • 3.1. Embedded Die Packaging Technology Market Drivers
    • 3.1.1. Impact Analysis of Market Drivers
  • 3.2. Embedded Die Packaging Technology Market Restraints
    • 3.2.1. Impact Analysis of Market Restraints
  • 3.3. Embedded Die Packaging Technology Market Opportunities
  • 3.4. Embedded Die Packaging Technology Market Future Trends

4. Embedded Die Packaging Technology Industry Study

  • 4.1. PEST Analysis
  • 4.2. Porter's Five Forces Analysis
  • 4.3. Growth Prospect Mapping
  • 4.4. Regulatory Framework Analysis

5. Embedded Die Packaging Technology Market: COVID-19 Impact Analysis

  • 5.1. Pre-COVID-19 Impact Analysis
  • 5.2. Post-COVID-19 Impact Analysis
    • 5.2.1. Top Performing Segments
    • 5.2.2. Marginal Growth Segments
    • 5.2.3. Top Looser Segments
    • 5.2.4. Marginal Loss Segments

6. Embedded Die Packaging Technology Market Landscape

  • 6.1. Embedded Die Packaging Technology Market Share Analysis, 2024
  • 6.2. Breakdown Data, by Key Manufacturer
    • 6.2.1. Established Players' Analysis
    • 6.2.2. Emerging Players' Analysis

7. Embedded Die Packaging Technology Market - By Platform

  • 7.1. Overview
    • 7.1.1. Segment Share Analysis, By Platform, 2024 & 2032 (%)
    • 7.1.2. Flexible die board
    • 7.1.3. Rigid die board
    • 7.1.4. IC packaged substrate

8. Embedded Die Packaging Technology Market - By Application

  • 8.1. Overview
    • 8.1.1. Segment Share Analysis, By Application, 2024 & 2032 (%)
    • 8.1.2. High-density power modules
    • 8.1.3. Wearable devices
    • 8.1.4. Medical devices
    • 8.1.5. IoT sensors
    • 8.1.6. Others

9. Embedded Die Packaging Technology Market - By End-Use Industry

  • 9.1. Overview
    • 9.1.1. Segment Share Analysis, By End-Use Industry, 2024 & 2032 (%)
    • 9.1.2. Consumer electronics
    • 9.1.3. Automotive
    • 9.1.4. IT & telecommunications
    • 9.1.5. Healthcare
    • 9.1.6. Others

10. Embedded Die Packaging Technology Market- By Geography

  • 10.1. Introduction
    • 10.1.1. Segment Share Analysis, By Geography, 2024 & 2032 (%)
  • 10.2. North America
    • 10.2.1. Overview
    • 10.2.2. Embedded Die Packaging Technology Key Manufacturers in North America
    • 10.2.3. North America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.2.4. North America Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
    • 10.2.5. North America Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 10.2.6. North America Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.2.7. U.S.
      • 10.2.7.1. Overview
      • 10.2.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.2.7.3. U.S. Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.2.7.4. U.S. Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.2.7.5. U.S. Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.2.8. Canada
      • 10.2.8.1. Overview
      • 10.2.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.2.8.3. Canada Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.2.8.4. Canada Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.2.8.5. Canada Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
  • 10.3. Europe
    • 10.3.1. Overview
    • 10.3.2. Embedded Die Packaging Technology Key Manufacturers in Europe
    • 10.3.3. Europe Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.3.4. Europe Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
    • 10.3.5. Europe Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 10.3.6. Europe Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.3.7. Germany
      • 10.3.7.1. Overview
      • 10.3.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.7.3. Germany Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.3.7.4. Germany Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.3.7.5. Germany Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.3.8. Italy
      • 10.3.8.1. Overview
      • 10.3.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.8.3. Italy Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.3.8.4. Italy Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.3.8.5. Italy Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.3.9. United Kingdom
      • 10.3.9.1. Overview
      • 10.3.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.9.3. United Kingdom Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.3.9.4. United Kingdom Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.3.9.5. United Kingdom Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.3.10. France
      • 10.3.10.1. Overview
      • 10.3.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.10.3. France Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.3.10.4. France Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.3.10.5. France Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.3.11. Russia
      • 10.3.11.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.11.2. Russia Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.3.11.3. Russia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.3.11.4. Russia Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.3.12. Netherlands
      • 10.3.12.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.12.2. Netherlands Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.3.12.3. Netherlands Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.3.12.4. Netherlands Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.3.13. Sweden
      • 10.3.13.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.13.2. Sweden Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.3.13.3. Sweden Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.3.13.4. Sweden Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.3.14. Poland
      • 10.3.14.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.14.2. Poland Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.3.14.3. Poland Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.3.14.4. Poland Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.3.15. Rest of Europe
      • 10.3.15.1. Overview
      • 10.3.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.15.3. Rest of the Europe Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.3.15.4. Rest of the Europe Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.3.15.5. Rest of the Europe Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
  • 10.4. Asia Pacific (APAC)
    • 10.4.1. Overview
    • 10.4.2. Embedded Die Packaging Technology Key Manufacturers in Asia Pacific
    • 10.4.3. Asia Pacific Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.4.4. Asia Pacific Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
    • 10.4.5. Asia Pacific Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 10.4.6. Asia Pacific Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.4.7. India
      • 10.4.7.1. Overview
      • 10.4.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.7.3. India Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.4.7.4. India Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.4.7.5. India Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.4.8. China
      • 10.4.8.1. Overview
      • 10.4.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.8.3. China Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.4.8.4. China Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.4.8.5. China Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.4.9. Japan
      • 10.4.9.1. Overview
      • 10.4.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.9.3. Japan Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.4.9.4. Japan Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.4.9.5. Japan Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.4.10. South Korea
      • 10.4.10.1. Overview
      • 10.4.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.10.3. South Korea Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.4.10.4. South Korea Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.4.10.5. South Korea Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.4.11. Australia
      • 10.4.11.1. Overview
      • 10.4.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.11.3. Australia Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.4.11.4. Australia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.4.11.5. Australia Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.4.12. Thailand
      • 10.4.12.1. Overview
      • 10.4.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.12.3. Thailand Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.4.12.4. Thailand Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.4.12.5. Thailand Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.4.13. Indonesia
      • 10.4.13.1. Overview
      • 10.4.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.13.3. Indonesia Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.4.13.4. Indonesia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.4.13.5. Indonesia Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.4.14. Philippines
      • 10.4.14.1. Overview
      • 10.4.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.14.3. Philippines Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.4.14.4. Philippines Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.4.14.5. Philippines Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.4.15. Rest of APAC
      • 10.4.15.1. Overview
      • 10.4.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.15.3. Rest of APAC Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.4.15.4. Rest of APAC Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.4.15.5. Rest of APAC Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
  • 10.5. Latin America
    • 10.5.1. Overview
    • 10.5.2. Embedded Die Packaging Technology Key Manufacturers in Latin America
    • 10.5.3. Latin America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.5.4. Latin America Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
    • 10.5.5. Latin America Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 10.5.6. Latin America Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.5.7. Brazil
      • 10.5.7.1. Overview
      • 10.5.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.7.3. Brazil Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.5.7.4. Brazil Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.5.7.5. Brazil Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.5.8. Mexico
      • 10.5.8.1. Overview
      • 10.5.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.8.3. Mexico Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.5.8.4. Mexico Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.5.8.5. Mexico Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.5.9. Argentina
      • 10.5.9.1. Overview
      • 10.5.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.9.3. Argentina Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.5.9.4. Argentina Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.5.9.5. Argentina Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.5.10. Colombia
      • 10.5.10.1. Overview
      • 10.5.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.10.3. Colombia Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.5.10.4. Colombia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.5.10.5. Colombia Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.5.11. Rest of LATAM
      • 10.5.11.1. Overview
      • 10.5.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.11.3. Rest of LATAM Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.5.11.4. Rest of LATAM Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.5.11.5. Rest of LATAM Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
  • 10.6. Middle East and Africa
    • 10.6.1. Overview
    • 10.6.2. Embedded Die Packaging Technology Key Manufacturers in Middle East and Africa
    • 10.6.3. Middle East and Africa Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.6.4. Middle East and Africa Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
    • 10.6.5. Middle East and Africa Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 10.6.6. Middle East and Africa Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.6.7. Saudi Arabia
      • 10.6.7.1. Overview
      • 10.6.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.7.3. Saudi Arabia Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.6.7.4. Saudi Arabia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.6.7.5. Saudi Arabia Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.6.8. United Arab Emirates
      • 10.6.8.1. Overview
      • 10.6.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.8.3. United Arab Emirates Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.6.8.4. United Arab Emirates Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.6.8.5. United Arab Emirates Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.6.9. Israel
      • 10.6.9.1. Overview
      • 10.6.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.9.3. Israel Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.6.9.4. Israel Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.6.9.5. Israel Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.6.10. Turkey
      • 10.6.10.1. Overview
      • 10.6.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.10.3. Turkey Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.6.10.4. Turkey Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.6.10.5. Turkey Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.6.11. Algeria
      • 10.6.11.1. Overview
      • 10.6.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.11.3. Algeria Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.6.11.4. Algeria Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.6.11.5. Algeria Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.6.12. Egypt
      • 10.6.12.1. Overview
      • 10.6.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.12.3. Egypt Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.6.12.4. Egypt Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.6.12.5. Egypt Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)
    • 10.6.13. Rest of MEA
      • 10.6.13.1. Overview
      • 10.6.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.13.3. Rest of MEA Market Size and Forecast, By Platform, 2019 - 2032 (US$ Million)
      • 10.6.13.4. Rest of MEA Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 10.6.13.5. Rest of MEA Market Size and Forecast, By End-Use Industry, 2019 - 2032 (US$ Million)

11. Key Vendor Analysis- Embedded Die Packaging Technology Industry

  • 11.1. Competitive Dashboard
  • 11.2. Company Profiles
    • 11.2.1. ASE Technology Holding Co., Ltd.
    • 11.2.2. Amkor Technology, Inc.
    • 11.2.3. AT&S (Austria Technologie & Systemtechnik AG)
    • 11.2.4. Taiwan Semiconductor Manufacturing Company (TSMC)
    • 11.2.5. TDK Corporation
    • 11.2.6. General Electric
    • 11.2.7. Fujikura Ltd.
    • 11.2.8. Infineon Technologies AG
    • 11.2.9. Microchip Technology Inc.
    • 11.2.10. Schweizer Electronic AG
    • 11.2.11. Toshiba Corporation
    • 11.2.12. Fujitsu Limited
    • 11.2.13. STMicroelectronics
    • 11.2.14. Siliconware Precision Industries Co., Ltd.
    • 11.2.15. Shinko Electric Industries Co., Ltd.
    • 11.2.16. Others

12. 360 Degree Analyst View

13. Appendix

  • 13.1. Research Methodology
  • 13.2. References
  • 13.3. Abbreviations
  • 13.4. Disclaimer
  • 13.5. Contact Us