PCB封止材の市場：製品、材料、硬化タイプ、粘度、用途別-2025-2030年の世界予測

PCB封止材市場の2023年の市場規模は47億8,000万米ドルで、2024年には51億5,000万米ドルに成長し、CAGRは7.89%、2030年には81億4,000万米ドルに達すると予測されています。

プリント基板（PCB）封止市場は、技術革新と産業上の必要性の合流点にあります。急速に進化する今日のエレクトロニクス情勢において、封止プロセスは単なる保護手段ではなく、電子アセンブリの信頼性、性能、寿命を支える重要な要素です。メーカー各社は、デリケートな回路を湿気やほこり、機械的ストレスなどの環境要因から保護し、過酷な条件下でもデバイスが期待どおりの性能を発揮できるよう、封止に依存しています。

世界の産業がより高い精度と耐久性を追求するにつれ、封止技術はますます高度化し、さまざまな用途に合わせた新しい材料と方法が統合されています。この製造分野では現在、さまざまな保護ソリューションを模索する研究開発が活発化しています。高性能のコンフォーマルコーティングから堅牢な接着剤まで、今日利用可能な製品群は、ハイテク産業が直面する課題に対する深い理解を反映しています。

本レポートでは、まずPCB封止の包括的な意義について説明します。熱管理の強化、優れた耐薬品性、機械的堅牢性の向上など、業界の原動力となる魅力的なメリットを探ります。この考察は、進化する業界動向の中で組み立てられており、経験豊富な専門家と新規参入者の両方が、なぜPCB封止がエレクトロニクス製造の要であるのかを理解できるようになっています。

PCB封止材市場の変革

現在の市場環境では、PCB封止のルールが大きく変わりつつあります。新たな革新的ソリューションは、小型化、高信頼性、高性能化の世界の推進を背景としています。各業界が高度な機能性と環境耐性との微妙なバランスに取り組む中、メーカー各社は特定の技術要件に正面から対応する斬新な封止アプローチを採用しつつあります。

最近のシフトは、カプセル化の精度と一貫性を高める自動製造プロセスの採用拡大に向けたダイナミックな動きに顕著に表れています。さらに、材料科学における技術的進歩が、極端な温度変化や腐食環境に対応する特殊な配合の開発に拍車をかけています。この進化は、信頼性と拡張性が生産サイクルにおいて譲れない要素となっている厳しい市場要求によって拍車がかかっています。

さらに、持続可能で環境に優しいプロセスへの世界の移行は、カプセル化セグメントにも影響を及ぼしています。メーカーは現在、高性能な製品を提供するだけでなく、生産工程が厳しい環境基準を満たすようにすることが課題となっています。これは研究開発の限界を押し広げ、品質、環境コンプライアンス、費用対効果のバランスをとるイノベーションを刺激します。各社がデジタル技術と予測分析を生産ラインに統合してカプセル化プロセスを最適化し、最終製品の品質を向上させることで、業界は戦略的再編成に立ち向かっています。

主要セグメントの洞察- 詳細分析

PCB封止市場は微妙なセグメンテーションに富んでおり、その成長軌道と市場ダイナミクスを調査するには多角的なアプローチが必要です。製品の観点からは、コンフォーマルコーティング、コネクトボンディング、ダム＆フィル、グロブトップ、アンダーフィルなど、多様な保護ソリューションを掘り下げて分析しています。これらの製品固有のカテゴリは、さまざまな封止方法がより広範なエレクトロニクス製造プロセスをどのようにサポートするかについての重要な洞察を提供します。

材料の観点から分析すると、この市場はアクリル、エポキシ、ポリウレタン、シリコーンなど幅広いスペクトルで特徴付けられます。それぞれの材料は、柔軟性、接着性、耐熱性、化学的安定性などの面で貢献し、独自の特性をもたらしています。これらの材料は、特定のアプリケーションのニーズに合わせて封止プロセスを調整し、各PCBアセンブリがその運用上の要求に応じて最適な保護を受けられるようにする上で不可欠です。

この分析ではさらに、封止サイクルの重要な側面である硬化プロセスについても検証しています。硬化タイプに基づく市場セグメンテーションには、熱硬化、室温硬化、UV硬化プロセスが含まれます。各方法は、さまざまな生産環境とターンアラウンドタイムに独自に対応し、処理速度とエネルギー効率の面で明確な利点を提供します。硬化タイプの探求は、生産量目標と品質基準の両方を満たすために、企業がどのように生産技術を適応させているかを浮き彫りにします。

粘度ベースのセグメンテーションを深く掘り下げると、カプセル化プロセスにおける材料の流動制御の重要性が明らかになります。高粘度、低粘度、中粘度の製剤を含むカテゴリーを検討しました。封止剤の粘度は、アプリケーションの適合性と最終製品の信頼性を決定する上で重要な役割を果たし、それによって封止モジュールの全体的な性能に影響を与えます。これらの特性を注意深く制御することで、プリント基板のレイアウトの複雑さに関係なく、プリント基板を均一に保護することができます。

こうした技術的側面に加え、市場は用途によっても区分されます。航空宇宙・防衛、自動車、家電、ヘルスケア、産業機器、通信など、さまざまな産業分野がPCB封止ソリューションの需要を牽引しています。航空宇宙・防衛分野は、航空電子工学、通信システム、宇宙探査、無人航空機、兵器システムなどのサブカテゴリーにわたって複雑に分析されています。これらのサブセグメントではそれぞれ、耐久性と性能のユニークなバランスが求められており、ニーズに合わせた封止ソリューションの必要性が高まっています。

同様に、自動車分野では、ADAS（先進運転支援システム）、電気自動車部品、エンジン制御ユニット、インフォテインメントシステム、照明システムに重点が置かれています。これらの用途は、信頼性が性能と安全性の両面で重要な傾向を示しています。民生用電子機器では、カプセル化市場はさらにスマートホームデバイス、スマートフォンおよびタブレット、ウェアラブルデバイスに分類されます。このように、多面的なセグメンテーション分析は市場の包括的な姿を示し、製品タイプ、材料特性、硬化プロセス、粘度パラメータ、最終用途のニーズ間の相互作用を示しながら、消費者行動、用途別要件、将来の成長見通しに関する明確な洞察を利害関係者に提供します。

目次

第1章 序文

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場の概要

第5章 市場洞察

• 市場力学
  • 促進要因
    • 自動化デバイスやスマートデバイスの導入が世界中で増加
    • 電気自動車やハイブリッド車の普及により、PCB保護の強化の必要性が高まっている
    • 持続可能なカプセル化ソリューションに関する規制要件の強化
  • 抑制要因
    • カスタマイズされたソリューションの拡張性が限られているため、さまざまな業界での広範な適用が妨げられている
  • 機会
    • PCB封止材プロセスにおけるスマート診断と障害検出のためのAIと機械学習の採用
    • ナノテクノロジー主導のPCB封止材強化のための調査への投資の増加
  • 課題
    • カプセル化材料のリサイクル性と環境廃棄に関する懸念の高まり
• 市場セグメンテーション分析
  • 製品：導電性を維持するためのコンフォーマルコーティングの利用
  • 素材：長時間の日光に対して紫外線安定性を提供するアクリルコーティングの使用が増加しています。
  • 硬化タイプ：硬化時間が短く、精度が高いため、UV硬化カプセル化法が普及しています。
  • 粘度：強力な接着性と優れた保護性により、高粘度封止材の需要が高まっています。
  • 用途：航空宇宙および防衛におけるPCB封止材の採用により、ナビゲーションおよび制御システムの安定した動作が保証されます。
• ポーターのファイブフォース分析
• PESTEL分析
  • 政治的
  • 経済
  • 社会
  • 技術的
  • 法律上
  • 環境

第6章 PCB封止材の市場：製品別

• コンフォーマルコーティング
• 接続ボンディング
• ダムと埋め立て
• グロブトップ
• アンダーフィル

第7章 PCB封止材の市場：素材別

• アクリル
• エポキシ
• ポリウレタン
• シリコーン

第8章 PCB封止材の市場硬化タイプ別

• 熱硬化
• 室温硬化
• UV硬化

第9章 PCB封止材の市場粘度別

• 高粘度
• 低粘度
• 中粘度

第10章 PCB封止材の市場：用途別

• 航空宇宙および防衛
  • 航空電子機器
  • 通信システム
  • 宇宙探査
  • 無人航空機
  • 兵器システム
• 自動車
  • 先進運転支援システム
  • 電気自動車部品
  • エンジン制御ユニット
  • インフォテインメントシステム
  • 照明システム
• 家電
  • スマートホームデバイス
  • スマートフォンとタブレット
  • ウェアラブルデバイス
• ヘルスケア
• 産業機器
• 通信

第11章 南北アメリカのPCB封止材の市場

• アルゼンチン
• ブラジル
• カナダ
• メキシコ
• 米国

第12章 アジア太平洋地域のPCB封止材の市場

• オーストラリア
• 中国
• インド
• インドネシア
• 日本
• マレーシア
• フィリピン
• シンガポール
• 韓国
• 台湾
• タイ
• ベトナム

第13章 欧州・中東・アフリカのPCB封止材の市場

• デンマーク
• エジプト
• フィンランド
• フランス
• ドイツ
• イスラエル
• イタリア
• オランダ
• ナイジェリア
• ノルウェー
• ポーランド
• カタール
• ロシア
• サウジアラビア
• 南アフリカ
• スペイン
• スウェーデン
• スイス
• トルコ
• アラブ首長国連邦
• 英国

第14章 競合情勢

• 市場シェア分析, 2023
• FPNVポジショニングマトリックス, 2023
• 競合シナリオ分析
• 戦略分析と提言

企業一覧

• 3M Company
• AI Technology, Inc.
• Chase Corporation
• Compagnie de Saint-Gobain S.A.
• Dow Inc
• Dymax Corporation
• Elantas GmbH by Altana AG
• Exxon Mobil Corporation
• H.B. Fuller Company
• Henkel AG & Co. KGaA
• Huntsman International LLC
• Illinois Tool Works Inc.
• MacDermid Alpha Electronics Solutions
• Master Bond Inc.
• Momentive Performance Materials Inc. by KCC CORPORATION
• Nagase & Co., Ltd
• Nordson Corporation
• Panacol-Elosol GmbH by Hoenle Group
• Parker Hannifin Corporation
• Robnor ResinLab Ltd
• Saudi Basic Industries Corporation
• Scheugenpflug GmbH
• Sika AG
• Wacker Chemie AG
• Wurth Elektronik eiSos GmbH & Co. KG by Kisling AG

LIST OF FIGURES

• FIGURE 1. PCB ENCAPSULATION MARKET MULTI-CURRENCY
• FIGURE 2. PCB ENCAPSULATION MARKET MULTI-LANGUAGE
• FIGURE 3. PCB ENCAPSULATION MARKET RESEARCH PROCESS
• FIGURE 4. PCB ENCAPSULATION MARKET SIZE, 2023 VS 2030
• FIGURE 5. GLOBAL PCB ENCAPSULATION MARKET SIZE, 2018-2030 (USD MILLION)
• FIGURE 6. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 7. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 8. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2023 VS 2030 (%)
• FIGURE 9. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 10. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2023 VS 2030 (%)
• FIGURE 11. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 12. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2023 VS 2030 (%)
• FIGURE 13. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 14. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2023 VS 2030 (%)
• FIGURE 15. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 16. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
• FIGURE 17. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 18. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 19. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 20. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY STATE, 2023 VS 2030 (%)
• FIGURE 21. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 22. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 23. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 24. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 25. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 26. PCB ENCAPSULATION MARKET SHARE, BY KEY PLAYER, 2023
• FIGURE 27. PCB ENCAPSULATION MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

• TABLE 1. PCB ENCAPSULATION MARKET SEGMENTATION & COVERAGE
• TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
• TABLE 3. GLOBAL PCB ENCAPSULATION MARKET SIZE, 2018-2030 (USD MILLION)
• TABLE 4. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 5. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 6. PCB ENCAPSULATION MARKET DYNAMICS
• TABLE 7. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 8. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY CONFORMAL COATINGS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 9. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY CONNECT BONDING, BY REGION, 2018-2030 (USD MILLION)
• TABLE 10. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY DAM & FILL, BY REGION, 2018-2030 (USD MILLION)
• TABLE 11. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY GLOB TOP, BY REGION, 2018-2030 (USD MILLION)
• TABLE 12. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY UNDERFILL, BY REGION, 2018-2030 (USD MILLION)
• TABLE 13. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 14. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY ACRYLIC, BY REGION, 2018-2030 (USD MILLION)
• TABLE 15. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY EPOXY, BY REGION, 2018-2030 (USD MILLION)
• TABLE 16. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY POLYURETHANES, BY REGION, 2018-2030 (USD MILLION)
• TABLE 17. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY SILICONE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 18. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 19. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY HEAT CURE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 20. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY ROOM TEMPERATURE CURE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 21. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY UV-CURE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 22. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 23. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY HIGH VISCOSITY, BY REGION, 2018-2030 (USD MILLION)
• TABLE 24. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY LOW VISCOSITY, BY REGION, 2018-2030 (USD MILLION)
• TABLE 25. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY MEDIUM VISCOSITY, BY REGION, 2018-2030 (USD MILLION)
• TABLE 26. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 27. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 28. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY AVIONICS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 29. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY COMMUNICATION SYSTEMS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 30. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY SPACE EXPLORATION, BY REGION, 2018-2030 (USD MILLION)
• TABLE 31. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY UNMANNED AERIAL VEHICLES, BY REGION, 2018-2030 (USD MILLION)
• TABLE 32. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY WEAPON SYSTEMS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 33. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 34. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 35. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY ADVANCED DRIVER-ASSISTANCE SYSTEMS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 36. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY ELECTRIC VEHICLE COMPONENTS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 37. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY ENGINE CONTROL UNITS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 38. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY INFOTAINMENT SYSTEMS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 39. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY LIGHTING SYSTEMS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 40. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 41. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 42. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY SMART HOME DEVICES, BY REGION, 2018-2030 (USD MILLION)
• TABLE 43. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY SMARTPHONES & TABLETS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 44. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY WEARABLE DEVICES, BY REGION, 2018-2030 (USD MILLION)
• TABLE 45. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 46. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY HEALTHCARE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 47. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY INDUSTRIAL EQUIPMENT, BY REGION, 2018-2030 (USD MILLION)
• TABLE 48. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY TELECOMMUNICATIONS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 49. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 50. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 51. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 52. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 53. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 54. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 55. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 56. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 57. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 58. ARGENTINA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 59. ARGENTINA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 60. ARGENTINA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 61. ARGENTINA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 62. ARGENTINA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 63. ARGENTINA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 64. ARGENTINA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 65. ARGENTINA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 66. BRAZIL PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 67. BRAZIL PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 68. BRAZIL PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 69. BRAZIL PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 70. BRAZIL PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 71. BRAZIL PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 72. BRAZIL PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 73. BRAZIL PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 74. CANADA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 75. CANADA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 76. CANADA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 77. CANADA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 78. CANADA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 79. CANADA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 80. CANADA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 81. CANADA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 82. MEXICO PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 83. MEXICO PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 84. MEXICO PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 85. MEXICO PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 86. MEXICO PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 87. MEXICO PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 88. MEXICO PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 89. MEXICO PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 90. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 91. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 92. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 93. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 94. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 95. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 96. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 97. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 98. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
• TABLE 99. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 100. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 101. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 102. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 103. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 104. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 105. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 106. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 107. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 108. AUSTRALIA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 109. AUSTRALIA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 110. AUSTRALIA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 111. AUSTRALIA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 112. AUSTRALIA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 113. AUSTRALIA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 114. AUSTRALIA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 115. AUSTRALIA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 116. CHINA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 117. CHINA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 118. CHINA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 119. CHINA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 120. CHINA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 121. CHINA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 122. CHINA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 123. CHINA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 124. INDIA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 125. INDIA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 126. INDIA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 127. INDIA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 128. INDIA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 129. INDIA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 130. INDIA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 131. INDIA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 132. INDONESIA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 133. INDONESIA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 134. INDONESIA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 135. INDONESIA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 136. INDONESIA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 137. INDONESIA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 138. INDONESIA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 139. INDONESIA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 140. JAPAN PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 141. JAPAN PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 142. JAPAN PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 143. JAPAN PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 144. JAPAN PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 145. JAPAN PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 146. JAPAN PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 147. JAPAN PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 148. MALAYSIA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 149. MALAYSIA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 150. MALAYSIA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 151. MALAYSIA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 152. MALAYSIA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 153. MALAYSIA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 154. MALAYSIA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 155. MALAYSIA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 156. PHILIPPINES PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 157. PHILIPPINES PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 158. PHILIPPINES PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 159. PHILIPPINES PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 160. PHILIPPINES PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 161. PHILIPPINES PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 162. PHILIPPINES PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 163. PHILIPPINES PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 164. SINGAPORE PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 165. SINGAPORE PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 166. SINGAPORE PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 167. SINGAPORE PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 168. SINGAPORE PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 169. SINGAPORE PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 170. SINGAPORE PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 171. SINGAPORE PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 172. SOUTH KOREA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 173. SOUTH KOREA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 174. SOUTH KOREA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 175. SOUTH KOREA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 176. SOUTH KOREA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 177. SOUTH KOREA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 178. SOUTH KOREA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 179. SOUTH KOREA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 180. TAIWAN PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 181. TAIWAN PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 182. TAIWAN PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 183. TAIWAN PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 184. TAIWAN PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 185. TAIWAN PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 186. TAIWAN PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 187. TAIWAN PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 188. THAILAND PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 189. THAILAND PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 190. THAILAND PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 191. THAILAND PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 192. THAILAND PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 193. THAILAND PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 194. THAILAND PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 195. THAILAND PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 196. VIETNAM PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 197. VIETNAM PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 198. VIETNAM PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 199. VIETNAM PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 200. VIETNAM PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 201. VIETNAM PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 202. VIETNAM PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 203. VIETNAM PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 204. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 205. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 206. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 207. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 208. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 209. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 210. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 211. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 212. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 213. DENMARK PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 214. DENMARK PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 215. DENMARK PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 216. DENMARK PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 217. DENMARK PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 218. DENMARK PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 219. DENMARK PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 220. DENMARK PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 221. EGYPT PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 222. EGYPT PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 223. EGYPT PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 224. EGYPT PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 225. EGYPT PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 226. EGYPT PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 227. EGYPT PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 228. EGYPT PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 229. FINLAND PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 230. FINLAND PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 231. FINLAND PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 232. FINLAND PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 233. FINLAND PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 234. FINLAND PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 235. FINLAND PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 236. FINLAND PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 237. FRANCE PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 238. FRANCE PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 239. FRANCE PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 240. FRANCE PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 241. FRANCE PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 242. FRANCE PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 243. FRANCE PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 244. FRANCE PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 245. GERMANY PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 246. GERMANY PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 247. GERMANY PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 248. GERMANY PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 249. GERMANY PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 250. GERMANY PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 251. GERMANY PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 252. GERMANY PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 253. ISRAEL PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 254. ISRAEL PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 255. ISRAEL PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 256. ISRAEL PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 257. ISRAEL PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 258. ISRAEL PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 259. ISRAEL PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 260. ISRAEL PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 261. ITALY PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 262. ITALY PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 263. ITALY PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 264. ITALY PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 265. ITALY PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 266. ITALY PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 267. ITALY PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 268. ITALY PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 269. NETHERLANDS PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 270. NETHERLANDS PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 271. NETHERLANDS PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 272. NETHERLANDS PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 273. NETHERLANDS PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 274. NETHERLANDS PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 275. NETHERLANDS PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 276. NETHERLANDS PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 277. NIGERIA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 278. NIGERIA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 279. NIGERIA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 280. NIGERIA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 281. NIGERIA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 282. NIGERIA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 283. NIGERIA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 284. NIGERIA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 285. NORWAY PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 286. NORWAY PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 287. NORWAY PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 288. NORWAY PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 289. NORWAY PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 290. NORWAY PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 291. NORWAY PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 292. NORWAY PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 293. POLAND PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 294. POLAND PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 295. POLAND PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 296. POLAND PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 297. POLAND PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 298. POLAND PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 299. POLAND PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 300. POLAND PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 301. QATAR PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 302. QATAR PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 303. QATAR PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 304. QATAR PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 305. QATAR PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 306. QATAR PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 307. QATAR PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 308. QATAR PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 309. RUSSIA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 310. RUSSIA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 311. RUSSIA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 312. RUSSIA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 313. RUSSIA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 314. RUSSIA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 315. RUSSIA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 316. RUSSIA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 317. SAUDI ARABIA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 318. SAUDI ARABIA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 319. SAUDI ARABIA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 320. SAUDI ARABIA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 321. SAUDI ARABIA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 322. SAUDI ARABIA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 323. SAUDI ARABIA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 324. SAUDI ARABIA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 325. SOUTH AFRICA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 326. SOUTH AFRICA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 327. SOUTH AFRICA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 328. SOUTH AFRICA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 329. SOUTH AFRICA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 330. SOUTH AFRICA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 331. SOUTH AFRICA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 332. SOUTH AFRICA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 333. SPAIN PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 334. SPAIN PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 335. SPAIN PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 336. SPAIN PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 337. SPAIN PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 338. SPAIN PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 339. SPAIN PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 340. SPAIN PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 341. SWEDEN PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 342. SWEDEN PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 343. SWEDEN PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 344. SWEDEN PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 345. SWEDEN PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 346. SWEDEN PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 347. SWEDEN PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
• TABLE 348. SWEDEN PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
• TABLE 349. SWITZERLAND PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
• TABLE 350. SWITZERLAND PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 351. SWITZERLAND PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
• TABLE 352. SWITZERLAND PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
• TABLE 353. SWITZERLAND PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 354. SWITZERLAND PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
• TABLE 355. SWITZERLAND PCB ENCAPS

The PCB Encapsulation Market was valued at USD 4.78 billion in 2023 and is projected to grow to USD 5.15 billion in 2024, with a CAGR of 7.89%, reaching USD 8.14 billion by 2030.

The printed circuit board (PCB) encapsulation market stands at the confluence of technology innovation and industrial necessity. In today's rapidly evolving electronics landscape, the encapsulation process is not merely a protective measure but a critical element that underpins the reliability, performance, and longevity of electronic assemblies. Manufacturers rely on encapsulation to safeguard delicate circuitry from environmental hazards such as moisture, dust, and mechanical stress, ensuring that devices perform as expected even under extreme conditions.

As global industries push toward higher precision and durability, encapsulation technologies have become ever more advanced, integrating novel materials and methods tailored to diverse applications. This realm of manufacturing is now experiencing intensified research and development efforts that explore various protective solutions. From high-performance conformal coatings to robust bonding agents, the portfolio available today reflects a deep understanding of the challenges faced in high-tech industries.

This report begins by framing the overarching significance of PCB encapsulation. It explores the compelling benefits that drive the industry, including enhanced thermal management, superior chemical resistance, and improved mechanical robustness. The discussion is framed within the context of evolving industry trends, ensuring that both seasoned professionals and new entrants understand why PCB encapsulation is a cornerstone in the electronics manufacturing narrative.

Transformative Shifts in the PCB Encapsulation Landscape

In the current market landscape, transformative shifts are redefining the rules of engagement for PCB encapsulation. Emerging innovative solutions are set against the backdrop of a global push for miniaturization, higher reliability, and increased performance. As industries grapple with the delicate balance between advanced functionality and environmental resilience, manufacturers are embracing novel encapsulation approaches that address specific technical requirements head-on.

Recent shifts are evident in the dynamic movement towards increased adoption of automated fabrication processes, which enhance precision and consistency in encapsulation. Furthermore, technological breakthroughs in material science have spurred the development of specialized formulations that cater to extreme temperature variations and corrosive environments. This evolution has been spurred by rigorous market demands, where reliability and scalability have become non-negotiable factors in the production cycle.

Additionally, the global transition towards sustainable and eco-friendly processes is also making its mark on the encapsulation segment. Manufacturers are now tasked with the challenge of not only delivering high-performance products but also ensuring that production processes meet stringent environmental standards. This pushes the boundaries of R&D, stimulating innovations that balance quality, environmental compliance, and cost-effectiveness. The industry is witnessing a strategic realignment, as companies integrate digital technologies and predictive analytics into their production lines to optimize encapsulation processes and improve end-product quality.

Key Segmentation Insights - An In-Depth Analysis

The market for PCB encapsulation is rich with nuanced segmentation, demanding a multi-dimensional approach to study its growth trajectory and market dynamics. From the product perspective, the market analysis delves into various protective solutions such as conformal coatings, connect bonding, dam and fill, glob top, and underfill, all of which cater to diverse technical requirements and operational scenarios. These product-specific categories offer critical insights into how different encapsulation methods support the broader electronics manufacturing process.

When analyzed from a material standpoint, the market is characterized by a broad spectrum that includes acrylic, epoxy, polyurethanes, and silicone. Each material brings its own unique set of properties to the table, contributing to aspects such as flexibility, adhesion, thermal resistance, and chemical stability. These materials prove indispensable in tailoring encapsulation processes to specific application needs, ensuring that each PCB assembly receives optimal protection according to its operational demands.

The analysis further examines the curing process, a vital aspect of the encapsulation cycle. The market segmentation based on curing type includes heat cure, room temperature cure, and UV-cure processes. Each method caters uniquely to varying production environments and turnaround times, and offers distinct advantages in terms of processing speed and energy efficiency. The exploration of curing types highlights how companies are adapting production techniques to meet both production volume targets and quality benchmarks.

A deep dive into viscosity-based segmentation reveals the importance of controlling the material flow during the encapsulation process. Examined categories include high, low, and medium viscosity formulations. The viscosity of the encapsulant plays a key role in determining application suitability and final product reliability, thereby influencing the overall performance of the encapsulated module. Carefully controlling these properties ensures that PCBs are uniformly protected, irrespective of the complexity of their layout.

In addition to these technical facets, the market is also segmented based on application. Various industrial segments including aerospace and defense, automotive, consumer electronics, healthcare, industrial equipment, and telecommunications are driving demand for PCB encapsulation solutions. The aerospace and defense segment is intricately analyzed across subcategories such as avionics, communication systems, space exploration, unmanned aerial vehicles, and weapon systems. Each of these subsegments demands a unique balance of durability and performance, reinforcing the need for tailored encapsulation solutions.

Similarly, within the automotive sphere, the focus extends to advanced driver-assistance systems, electric vehicle components, engine control units, infotainment systems, and lighting systems. These applications underscore a critical trend where reliability is critical to both performance and safety. For consumer electronics, the encapsulation market is further dissected into smart home devices, smartphones and tablets, and wearable devices, reflecting evolving user expectations and the drive for higher integration densities. The multifaceted segmentation analysis thus presents a comprehensive picture of the market, providing stakeholders with clear insights on consumer behavior, application-specific requirements, and future growth prospects while showcasing the interplay between product type, material characteristics, curing process, viscosity parameters, and end-application needs.

Based on Product, market is studied across Conformal Coatings, Connect Bonding, Dam & Fill, Glob Top, and Underfill.

Based on Material, market is studied across Acrylic, Epoxy, Polyurethanes, and Silicone.

Based on Curing Type, market is studied across Heat Cure, Room Temperature Cure, and UV-Cure.

Based on Viscosity, market is studied across High Viscosity, Low Viscosity, and Medium Viscosity.

Based on Application, market is studied across Aerospace & Defense, Automotive, Consumer Electronics, Healthcare, Industrial Equipment, and Telecommunications. The Aerospace & Defense is further studied across Avionics, Communication Systems, Space Exploration, Unmanned Aerial Vehicles, and Weapon Systems. The Automotive is further studied across Advanced Driver-Assistance Systems, Electric Vehicle Components, Engine Control Units, Infotainment Systems, and Lighting Systems. The Consumer Electronics is further studied across Smart Home Devices, Smartphones & Tablets, and Wearable Devices.

Key Regional Insights - A Global Perspective

The PCB encapsulation market exhibits significant regional variations that are reflective of broader economic trends and localized industrial efficiencies. Analyzing the market from a global perspective unveils nuanced differences among diverse regions. In the Americas, mature industrial infrastructures, strong innovation ecosystems, and high-end manufacturing capabilities create a fertile landscape for advanced encapsulation technologies. This region benefits from both a deep reservoir of technical expertise and a well-established network of suppliers and end-users.

Turning attention to the Europe, Middle East & Africa region, a unique confluence of high regulatory standards and rigorous quality checks underlines the uptick in demand for sophisticated encapsulation solutions. In these markets, stringent environmental regulations and an emphasis on product reliability drive the adoption of cutting-edge encapsulation techniques. The region's commitment to sustainable manufacturing further fuels the development of next-generation encapsulation materials and processes that meet stringent safety and performance criteria.

In the dynamic Asia-Pacific market, rapid industrialization, coupled with large-scale production capabilities and a continuously evolving consumer electronics sector, plays a vital role in shaping the demand for PCB encapsulation. Here, the vast production scales and accelerated technological adoption result in an environment where cost-effective yet high-quality encapsulation solutions are in high demand. The diverse industrial footprint in this region, spanning from high-tech consumer devices to critical industrial equipment, reinforces the need for encapsulation strategies that are both robust and versatile.

Together, these regional insights underscore a global market that, while varied, is united by a shared trajectory toward enhanced performance and sustainability in electronics manufacturing. Each region brings distinct competitive advantages to the table, contributing to the overall evolution of encapsulation technologies and presenting unique opportunities for business growth and innovation.

Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across Arizona, California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

Key Companies Insights - Industry Leaders in Focus

A critical element influencing the PCB encapsulation market is the presence and strategic initiatives of key industry players. The ecosystem is populated by innovation-driven organizations that continuously push the boundaries of what encapsulation materials and processes can achieve. Among these notable companies, 3M Company stands out with its robust portfolio of advanced materials and sustainable practices. Meanwhile, AI Technology, Inc. and Chase Corporation contribute significantly through agile product development and tailored customer solutions.

Compagnie de Saint-Gobain S.A. and Dow Inc have demonstrated strong capabilities in scaling production to meet the exponential demand for high-quality encapsulation, while Dymax Corporation adds value with its rapid-curing solutions tailored for advanced applications. Elantas GmbH by Altana AG and Exxon Mobil Corporation further enhance the market competitive landscape by offering innovative chemistries that improve the durability and flexibility of encapsulation applications.

H.B. Fuller Company, alongside Henkel AG & Co. KGaA, is recognized for their commitment to quality and reliability, underpinning the development of products that satisfy both performance and regulatory benchmarks. Huntsman International LLC joins this league by offering specialized formulations designed for critical industrial and consumer applications. Illinois Tool Works Inc. and MacDermid Alpha Electronics Solutions reinforce the market through sustained research and the integration of cutting-edge technologies into encapsulation practices.

Master Bond Inc., as well as Momentive Performance Materials Inc. by KCC CORPORATION, contribute to the expansion of the market through their relentless pursuit of innovative, high-performance solutions. Nagase & Co., Ltd and Nordson Corporation further position themselves as pioneers by introducing new methods that streamline production processes without compromising quality. Panacol-Elosol GmbH by Hoenle Group and Parker Hannifin Corporation are at the forefront of driving localized excellence while Robnor ResinLab Ltd and Saudi Basic Industries Corporation give the market a competitive edge with their unique product mixes and specialized materials.

In addition, companies such as Scheugenpflug GmbH and Sika AG exhibit strong global influence through comprehensive study and consistent technology updates, ensuring that encapsulation processes meet evolving industry standards. Complementary to these efforts are Wacker Chemie AG and Wurth Elektronik eiSos GmbH & Co. KG by Kisling AG, whose progressive approaches in materials science and production methodologies serve as benchmarks for innovation and quality across the global supply chain. The collective contributions of these leading companies have not only catalyzed technological advancements in PCB encapsulation but have also set new standards in performance, manufacturing efficiency, and sustainability.

The report delves into recent significant developments in the PCB Encapsulation Market, highlighting leading vendors and their innovative profiles. These include 3M Company, AI Technology, Inc., Chase Corporation, Compagnie de Saint-Gobain S.A., Dow Inc, Dymax Corporation, Elantas GmbH by Altana AG, Exxon Mobil Corporation, H.B. Fuller Company, Henkel AG & Co. KGaA, Huntsman International LLC, Illinois Tool Works Inc., MacDermid Alpha Electronics Solutions, Master Bond Inc., Momentive Performance Materials Inc. by KCC CORPORATION, Nagase & Co., Ltd, Nordson Corporation, Panacol-Elosol GmbH by Hoenle Group, Parker Hannifin Corporation, Robnor ResinLab Ltd, Saudi Basic Industries Corporation, Scheugenpflug GmbH, Sika AG, Wacker Chemie AG, and Wurth Elektronik eiSos GmbH & Co. KG by Kisling AG. Actionable Recommendations for Industry Leaders

For industry leaders aiming to consolidate their position in the PCB encapsulation market, strategic initiatives must be rooted in a thorough understanding of both technical parameters and market dynamics. Companies should invest in research and development to explore advanced material formulations that cater to a broad spectrum of application requirements, including those demanding high thermal resistance, enhanced adhesion, and robust chemical stability. Integrating state-of-the-art curing processes-whether through heat, room temperature, or UV-based methods-can significantly reduce production times while enhancing product reliability.

Strategic partnerships and collaborations, particularly those that bridge technological innovation with manufacturing expertise, are essential. To fully harness the potential of novel encapsulation solutions, companies need to focus on digital integration, leveraging advanced analytics and process automation to optimize production workflows. Embracing predictive maintenance techniques and real-time monitoring can offer insights into process efficiencies, thereby curbing production downtimes and minimizing inefficiencies.

Furthermore, diversification across key market segments is highly recommended. By tailoring offerings to specific industries such as aerospace and defense, automotive, consumer electronics, healthcare, industrial equipment, and telecommunications, industry players can address targeted needs and drive specialized growth. Given the layered nature of segmentation-from product types to curing techniques and viscosity profiles-it is imperative that companies adopt a multi-dimensional strategy that connects technical advancements with end-user requirements.

Investment in sustainable practices, especially in regions with strict regulatory frameworks, should also be prioritized. Leaders must balance profitability with environmental responsibility by implementing eco-friendly packaging solutions and minimizing waste throughout the production cycle. Such initiatives not only bolster a company's reputation but also open avenues for compliance with evolving international standards. Overall, a forward-thinking, agile approach underpinned by technological innovation and market diversification will enable industry leaders to navigate competitive pressures while capitalizing on emerging opportunities.

Conclusion - Summarizing the Strategic Landscape

In conclusion, the PCB encapsulation market is at a pivotal juncture characterized by rapid advancements and evolving industry demands. The comprehensive exploration provided herein outlines the multifaceted nature of market segmentation, spanning a diverse array of product types, material compositions, curing processes, viscosity specifications, and application areas. Each of these dimensions offers vital insights into how encapsulation technologies are adapting to meet both current and future challenges.

The dynamic shifts across regional markets emphasize the global nature of innovation and quality control within the encapsulation domain. Whether in the mature infrastructures of the Americas, the regulated environments of Europe, the diverse markets of the Middle East and Africa, or the expansive production capabilities in the Asia-Pacific, the interplay of local and global factors continues to reshape the encapsulation landscape. Meanwhile, the leadership demonstrated by key companies in the market serves as a testament to the relentless pursuit of excellence, driving innovations that support the growth and resilience of the electronics manufacturing sector.

This report underlines that the fusion of technology, strategic market participation, and operational excellence forms the backbone of future market growth. It is a clarion call for stakeholders to harness the power of data-driven decision-making, invest in cutting-edge R&D, and consolidate efforts to anticipate and adapt to an industry in constant flux. The insights provided herein not only encapsulate the current state of the market but also serve as a roadmap for sustaining long-term competitive advantage.

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Growing adoption of automated and smart devices globally
    • 5.1.1.2. Rising trend of electric vehicles and hybrid vehicles propelling the need for enhanced PCB protection

• 5.1.1.3. Increasing regulatory requirements regarding sustainable encapsulation solutions
• 5.1.2. Restraints
  • 5.1.2.1. Limited scalability of customized solutions obstructs widespread application in diverse industries
• 5.1.3. Opportunities
  • 5.1.3.1. Adopting AI and machine learning for smart diagnostics and fault detection in PCB encapsulation processes

• 5.1.3.2. Increasing investments in research for nanotechnology-driven PCB encapsulation enhancements
• 5.1.4. Challenges
  • 5.1.4.1. Rising recyclability and environmental disposal concerns of encapsulation materials
• 5.2. Market Segmentation Analysis
  • 5.2.1. Product: Utilization of conformal coatings for maintaining electrical conductivity
  • 5.2.2. Material: Increasing usage of acrylic coatings as it offers UV stability to prolonged sunlight
  • 5.2.3. Curing Type: Growing of UV-cure encapsulation method due to its fast curing time and high precision
  • 5.2.4. Viscosity: Rising demad of high-viscosity encapsulants due to its strong adhesive properties and superior protection
  • 5.2.5. Application: Adoption of PCB encapsulation in aerospace & defense to ensure stable operation of navigation and control systems
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. PCB Encapsulation Market, by Product

• 6.1. Introduction
• 6.2. Conformal Coatings
• 6.3. Connect Bonding
• 6.4. Dam & Fill
• 6.5. Glob Top
• 6.6. Underfill

7. PCB Encapsulation Market, by Material

• 7.1. Introduction
• 7.2. Acrylic
• 7.3. Epoxy
• 7.4. Polyurethanes
• 7.5. Silicone

8. PCB Encapsulation Market, by Curing Type

• 8.1. Introduction
• 8.2. Heat Cure
• 8.3. Room Temperature Cure
• 8.4. UV-Cure

9. PCB Encapsulation Market, by Viscosity

• 9.1. Introduction
• 9.2. High Viscosity
• 9.3. Low Viscosity
• 9.4. Medium Viscosity

10. PCB Encapsulation Market, by Application

• 10.1. Introduction
• 10.2. Aerospace & Defense
  • 10.2.1. Avionics
  • 10.2.2. Communication Systems
  • 10.2.3. Space Exploration
  • 10.2.4. Unmanned Aerial Vehicles
  • 10.2.5. Weapon Systems
• 10.3. Automotive
  • 10.3.1. Advanced Driver-Assistance Systems
  • 10.3.2. Electric Vehicle Components
  • 10.3.3. Engine Control Units
  • 10.3.4. Infotainment Systems
  • 10.3.5. Lighting Systems
• 10.4. Consumer Electronics
  • 10.4.1. Smart Home Devices
  • 10.4.2. Smartphones & Tablets
  • 10.4.3. Wearable Devices
• 10.5. Healthcare
• 10.6. Industrial Equipment
• 10.7. Telecommunications

11. Americas PCB Encapsulation Market

• 11.1. Introduction
• 11.2. Argentina
• 11.3. Brazil
• 11.4. Canada
• 11.5. Mexico
• 11.6. United States

12. Asia-Pacific PCB Encapsulation Market

• 12.1. Introduction
• 12.2. Australia
• 12.3. China
• 12.4. India
• 12.5. Indonesia
• 12.6. Japan
• 12.7. Malaysia
• 12.8. Philippines
• 12.9. Singapore
• 12.10. South Korea
• 12.11. Taiwan
• 12.12. Thailand
• 12.13. Vietnam

13. Europe, Middle East & Africa PCB Encapsulation Market

• 13.1. Introduction
• 13.2. Denmark
• 13.3. Egypt
• 13.4. Finland
• 13.5. France
• 13.6. Germany
• 13.7. Israel
• 13.8. Italy
• 13.9. Netherlands
• 13.10. Nigeria
• 13.11. Norway
• 13.12. Poland
• 13.13. Qatar
• 13.14. Russia
• 13.15. Saudi Arabia
• 13.16. South Africa
• 13.17. Spain
• 13.18. Sweden
• 13.19. Switzerland
• 13.20. Turkey
• 13.21. United Arab Emirates
• 13.22. United Kingdom

14. Competitive Landscape

• 14.1. Market Share Analysis, 2023
• 14.2. FPNV Positioning Matrix, 2023
• 14.3. Competitive Scenario Analysis
  • 14.3.1. Amber Enterprises partners with Korea Circuit to enhance PCB manufacturing in india
  • 14.3.2. Henkel expanded in India by scaling up its operations by providing advanced adhesives and packaging solutions
  • 14.3.3. Astute Group has launched Astute PCB solutions to provide specialized sourcing services
  • 14.3.4. Dow unveiled the DOWSIL CC-8000 series dual-curable silicone conformal coatings
  • 14.3.5. QMS expands manufacturing capabilities to enhance PCB encapsulation processes
  • 14.3.6. Henkel unveils advanced potting solutions to enhance durability and energy efficiency in automotive electronics
  • 14.3.7. Panacol launched the Vitralit BL UC series epoxy adhesives
  • 14.3.8. Henkel unveiled a solvent-free and UV-curable conformal coating
  • 14.3.9. Swancor enhanced PCB recyclability with eco-friendly epoxy hardener utilizing waste plastics
  • 14.3.10. Robnor ResinLab launched bio-based epoxy resin with sustainability and high thermal conductivity
• 14.4. Strategy Analysis & Recommendation
  • 14.4.1. Sika AG
  • 14.4.2. Dow Inc.
  • 14.4.3. Chase Corporation
  • 14.4.4. Henkel AG & Co. KGaA

Companies Mentioned

• 1. 3M Company
• 2. AI Technology, Inc.
• 3. Chase Corporation
• 4. Compagnie de Saint-Gobain S.A.
• 5. Dow Inc
• 6. Dymax Corporation
• 7. Elantas GmbH by Altana AG
• 8. Exxon Mobil Corporation
• 9. H.B. Fuller Company
• 10. Henkel AG & Co. KGaA
• 11. Huntsman International LLC
• 12. Illinois Tool Works Inc.
• 13. MacDermid Alpha Electronics Solutions
• 14. Master Bond Inc.
• 15. Momentive Performance Materials Inc. by KCC CORPORATION
• 16. Nagase & Co., Ltd
• 17. Nordson Corporation
• 18. Panacol-Elosol GmbH by Hoenle Group
• 19. Parker Hannifin Corporation
• 20. Robnor ResinLab Ltd
• 21. Saudi Basic Industries Corporation
• 22. Scheugenpflug GmbH
• 23. Sika AG
• 24. Wacker Chemie AG
• 25. Wurth Elektronik eiSos GmbH & Co. KG by Kisling AG