電子基板レベルアンダーフィルおよびカプセル化の世界市場

電子基板レベルアンダーフィルおよびカプセル化の世界市場は2030年までに4億430万米ドルに達する見込み

2024年に3億3,300万米ドルと推定される電子基板レベルアンダーフィルおよびカプセル化の世界市場は、2024年から2030年にかけてCAGR 3.3%で成長し、2030年には4億430万米ドルに達すると予測されます。本レポートで分析したセグメントの1つであるアンダーフィルタイプは、CAGR 2.7％を記録し、分析期間終了時には2億5,810万米ドルに達すると予測されます。ゴブトップカプセルタイプセグメントの成長率は、分析期間でCAGR 4.5％と推定されます。

米国市場は9,070万米ドルと推定される一方、中国はCAGR 6.0％で成長すると予測される

米国の電子基板レベルアンダーフィルおよびカプセル化市場は、2024年には9,070万米ドルと推定されます。世界第2位の経済大国である中国は、2030年までに7,950万米ドルの市場規模に達すると予測され、分析期間2024-2030年のCAGRは6.0%です。その他の注目すべき地域別市場としては、日本とカナダがあり、分析期間中のCAGRはそれぞれ1.3％と2.5％と予測されています。欧州では、ドイツがCAGR 1.9%で成長すると予測されています。

世界の電子基板レベルアンダーフィルおよびカプセル化市場- 主要動向と促進要因まとめ

PCBとマイクロエレクトロニクスのアセンブリでアンダーフィルと封止ソリューションが重要な理由とは？

電子基板レベルのアンダーフィルおよびカプセル化材料は、半導体パッケージおよびプリント回路基板（PCB）の機械的完全性、熱安定性、および長期信頼性を確保するために不可欠です。電子機器の小型化、高性能化に伴い、特にボールグリッドアレイ（BGA）、チップスケールパッケージ（CSP）、フリップチップ構成では、はんだ接合部、相互接続部、ダイ表面にかかる応力が増大しています。

アンダーフィル材は通常、はんだ接合部の補強、熱膨張係数（CTE）の不一致の緩和、機械的衝撃の吸収を目的としてチップと基板の間に塗布されるエポキシ系配合物です。封止材は、オーバーモールドやポッティングに使用され、湿気、化学薬品、粒子汚染から保護します。これらの材料は、自動車、航空宇宙、産業、または民生グレードの環境にさらされる電子機器の動作寿命を延ばします。

スマートフォン、自動車用ECU、ウェアラブル電子機器など、熱サイクル、振動、落下衝撃を受けるデバイスでは、アンダーフィルや封止材が物理的な緩衝材や熱経路の役割を果たします。2.5D/3DICやシステムインパッケージ（SiP）のような先進パッケージングアーキテクチャでは、アンダーフィルソリューションは複数のダイやインターポーザー層にわたる内部応力負荷を管理するのに役立ち、半導体パッケージングに不可欠なものとなっています。

どのような材料イノベーションとアプリケーション技術がこのセグメントを形成しているのか？

アンダーフィルとカプセル化における材料イノベーションは、熱伝導性の向上、硬化温度の低下、流動特性の強化、ディスペンス周期の高速化に重点を置いています。従来のキャピラリーアンダーフィルシステムは、ノーフローアンダーフィル、プレアプライドアンダーフィル（PAUF）、リワーク可能なバリエーションへと進化し、多様なプロセスフローや組立ラインの制約に対応できるようになりました。

アルミナ、窒化ホウ素、銀フレークなどの充填材を使用した熱伝導性アンダーフィルは、ハイパワーデバイスやRFモジュールでますます使用されるようになっています。これらの配合は、低粘度と高熱放散性を兼ね備えており、迅速な硬化と最小限のボイド形成を可能にします。UV硬化およびスナップキュアシステムは、サイクルタイムが重要な性能指標となる高スループット製造環境で採用されています。

封止材は、エポキシ、シリコーン、ポリウレタンの特性を組み合わせたハイブリッド樹脂システムへと移行しており、課題となっている基板への柔軟性と接着性が向上しています。MEMSデバイスや光学センサーでは、アウトガスの少ない低応力で光学的に透明な封止材が主流になりつつあります。モバイル機器や民生用電子機器では、ジェット・ディスペンスやステンシル印刷による大量生産が一般的になっています。

需要を牽引する最終用途セグメントと包装動向は？

半導体産業は依然としてアンダーフィルと封止ソリューションの最大の消費者です。鋳造メーカーやOSAT（半導体組立・テストアウトソーシングプロバイダー）は、フリップチップパッケージング、ウエハーレベルCSP、新興の3D積層アーキテクチャでこれらの材料を使用しています。TSMC、ASE、Amkorのような大手企業は、AIチップ、RFフロントエンドモジュール、ロジック・メモリ統合用のカスタムアンダーフィルを指定しています。

コンシューマーエレクトロニクスは、スマートフォン、ウェアラブル端末、タブレット端末、ゲーム機器などを含む、第2位の最終用途セグメントです。デバイスの薄型化・高密度化に伴い、熱的・機械的信頼性がユーザーエクスペリエンスや保証サイクルの中心となっています。高度な封止材は、水の浸入や熱劣化から保護するために使用され、特にIP規格のデバイスに使用されています。

車載エレクトロニクスは、ECU、センサー、パワーモジュールの増加により急速に成長している分野です。アンダーフィル材料は、過酷な車載環境における耐振動性と熱サイクル耐久性を確保するために不可欠です。主な用途には、ADASプロセッサー、インフォテインメント・システム、EVのバッテリー制御ユニットなどがあります。産業用オートメーション、医療用エレクトロニクス、航空宇宙用途は、さらに需要を多様化しています。

アンダーフィルとカプセル化市場の成長を加速させている要因とは？

電子基板レベルアンダーフィルおよびカプセル化市場の成長は、エレクトロニクスの小型化、半導体の高電力密度化、過酷な環境下での信頼性要件、パッケージング技術における異種集積の台頭など、いくつかの要因によって牽引されています。

まず、電子機器の小型化、軽量化、多機能化の推進により、より堅牢な保護材料が必要となります。はんだ接合部のピッチが狭くなり、部品の積層が増加するにつれて、特に落下試験や熱サイクルでの早期故障を回避するために、アンダーフィルによる機械的補強が重要になります。

第二に、5G、自動車、高性能コンピューティングで使用されるパワー半導体やRF部品はかなりの熱を発生します。熱伝導性を向上させたアンダーフィルと封止材は、この熱を効率的に放散させ、ホットスポットの不具合を防止し、特に限られたPCBレイアウトにおいて長期的な信頼性を確保するのに役立ちます。

第三に、自動車や航空宇宙分野では信頼性の閾値が高まっています。これらの環境におけるデバイスは、大きな温度変化、振動、腐食剤への暴露に耐えなければなりません。AEC-Q100やMIL-STD-883のような業界固有の規格を満たすために、高温安定で化学的に不活性な封止材やリワーク可能なアンダーフィルが求められています。

最後に、ファンアウト・ウエハーレベル・パッケージング（FOWLP）、システム・イン・パッケージ（SiP）、チップレット・アーキテクチャーの出現により、材料エンジニアは高度にカスタマイズ可能で、低CTE、ボイドフリーのアンダーフィルを開発する必要に迫られています。ロジック、メモリ、アナログブロックを1つのモジュールに混載するこれらのアーキテクチャは、信号の忠実性と物理的整合性を確保するため、精密な材料成膜に大きく依存しています。

セグメント

製品タイプ（アンダーフィルタイプ、GOBトップカプセル化タイプ）、材料（石英／シリコーン材料、アルミナベース材料、エポキシベース材料、ウレタンベース材料、アクリルベース材料、その他材料）、基板タイプ（チップスケールパッケージ基板、ボールグリッドアレイ基板、フリップチップ基板）

調査対象企業の例（計41社）

• Ablestik Laboratories
• AI Technology Inc.
• Advanced Technology & Materials Co., Ltd.
• Dow Inc.
• Dupont Electronics & Imaging
• Henkel AG & Co. KGaA
• Hitachi Chemical Co., Ltd.
• JSR Corporation
• Kyocera Corporation
• LORD Corporation
• Nagase ChemteX Corporation
• Namics Corporation
• NuSil Technology LLC
• Panacol-Elosol GmbH
• Sika AG
• Shin-Etsu Chemical Co., Ltd.
• Sumitomo Bakelite Company, Limited
• Techsil Ltd
• Trelleborg AB
• UMC Electronics Co., Ltd.

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当社は、有効な専門家コンテンツとAIツールにより、市場情報と競合情報を変革しています。

Global Industry Analystsは、LLMや業界固有のSLMを照会する一般的な規範に従う代わりに、ビデオ記録、ブログ、検索エンジン調査、膨大な量の企業、製品/サービス、市場データなど、世界中の専門家から収集したコンテンツのリポジトリを構築しました。

関税影響係数

Global Industry Analystsは、本社の国、製造拠点、輸出入（完成品とOEM）に基づく企業の競争力の変化を予測しています。この複雑で多面的な市場力学は、売上原価（COGS）の増加、収益性の低下、サプライチェーンの再構築など、ミクロおよびマクロの市場力学の中でも特に競合他社に影響を与える見込みです。

目次

第1章 調査手法

第2章 エグゼクティブサマリー

• 市場概要
• 主要企業
• 市場動向と促進要因
• 世界市場の見通し

第3章 市場分析

• 米国
• カナダ
• 日本
• 中国
• 欧州
• フランス
• ドイツ
• イタリア
• 英国
• スペイン
• ロシア
• その他欧州
• アジア太平洋
• オーストラリア
• インド
• 韓国
• その他アジア太平洋地域
• ラテンアメリカ
• アルゼンチン
• ブラジル
• メキシコ
• その他ラテンアメリカ
• 中東
• イラン
• イスラエル
• サウジアラビア
• アラブ首長国連邦
• その他中東
• アフリカ

第4章 競合

Global Electronic Board Level Underfill and Encapsulation Market to Reach US$404.3 Million by 2030

The global market for Electronic Board Level Underfill and Encapsulation estimated at US$333.0 Million in the year 2024, is expected to reach US$404.3 Million by 2030, growing at a CAGR of 3.3% over the analysis period 2024-2030. Underfills Type, one of the segments analyzed in the report, is expected to record a 2.7% CAGR and reach US$258.1 Million by the end of the analysis period. Growth in the Gob Top Encapsulations Type segment is estimated at 4.5% CAGR over the analysis period.

The U.S. Market is Estimated at US$90.7 Million While China is Forecast to Grow at 6.0% CAGR

The Electronic Board Level Underfill and Encapsulation market in the U.S. is estimated at US$90.7 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$79.5 Million by the year 2030 trailing a CAGR of 6.0% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 1.3% and 2.5% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 1.9% CAGR.

Global Electronic Board Level Underfill and Encapsulation Market - Key Trends & Drivers Summarized

Why Are Underfill and Encapsulation Solutions Crucial in PCB and Microelectronics Assembly?

Electronic board-level underfill and encapsulation materials are critical to ensuring the mechanical integrity, thermal stability, and long-term reliability of semiconductor packages and printed circuit boards (PCBs). As electronic devices become more compact and powerful, the stresses exerted on solder joints, interconnects, and die surfaces intensify, particularly in ball grid arrays (BGAs), chip-scale packages (CSPs), and flip-chip configurations.

Underfill materials are typically epoxy-based formulations applied between the chip and substrate to reinforce solder joints, mitigate coefficient of thermal expansion (CTE) mismatch, and absorb mechanical shock. Encapsulation compounds-used for overmolding or potting-offer protection from moisture, chemicals, and particulate contamination. These materials extend the operational life of electronics exposed to automotive, aerospace, industrial, or consumer-grade environments.

In devices subject to thermal cycling, vibration, or drop impact-such as smartphones, automotive ECUs, and wearable electronics-underfill and encapsulants serve as a physical buffer and a thermal path. In advanced packaging architectures like 2.5D/3D ICs and system-in-package (SiP), underfill solutions help manage internal stress loads across multiple dies and interposer layers, making them indispensable in semiconductor packaging.

What Material Innovations and Application Techniques Are Reshaping the Segment?

Material innovations in underfill and encapsulation are focused on improving thermal conductivity, lowering curing temperatures, enhancing flow characteristics, and enabling faster dispense cycles. Conventional capillary underfill systems have evolved into no-flow underfills, pre-applied underfills (PAUF), and reworkable variants to suit diverse process flows and assembly line constraints.

Thermally conductive underfills with filler materials like alumina, boron nitride, and silver flakes are increasingly used in high-power devices and RF modules. These formulations combine low viscosity with high heat dissipation, allowing for rapid curing and minimal void formation. UV-curable and snap-cure systems are being adopted for high-throughput manufacturing environments where cycle time is a key performance metric.

Encapsulation materials are transitioning toward hybrid resin systems combining epoxy, silicone, and polyurethane characteristics for better flexibility and adhesion on challenging substrates. For MEMS devices and optical sensors, low-stress, optically clear encapsulants with low outgassing profiles are becoming mainstream. Jet-dispensing and stencil printing techniques are now common for volume production in mobile and consumer electronics.

Which End-Use Segments and Packaging Trends Are Driving Demand?

The semiconductor industry remains the largest consumer of underfill and encapsulation solutions. Foundries and OSATs (Outsourced Semiconductor Assembly and Test providers) use these materials in flip-chip packaging, wafer-level CSPs, and emerging 3D-stacked architectures. Leading players like TSMC, ASE, and Amkor are specifying custom underfills for AI chips, RF front-end modules, and logic-memory integration.

Consumer electronics is the second-largest end-use segment, encompassing smartphones, wearables, tablets, and gaming devices. As devices become thinner and more densely packed, thermal and mechanical reliability become central to user experience and warranty cycles. Advanced encapsulants are used to safeguard against water ingress and thermal degradation-especially in IP-rated devices.

Automotive electronics is a rapidly growing segment, driven by the increasing number of ECUs, sensors, and power modules. Underfill materials are essential for ensuring vibration resistance and thermal cycling endurance in harsh automotive environments. Key applications include ADAS processors, infotainment systems, and battery control units in EVs. Industrial automation, medical electronics, and aerospace applications further diversify demand.

What Factors Are Accelerating Growth in the Underfill and Encapsulation Market?

The growth in the electronic board level underfill and encapsulation market is driven by several factors including miniaturization of electronics, increasing power density in semiconductors, reliability requirements in harsh environments, and the rise of heterogeneous integration in packaging technologies.

First, the push toward smaller, lighter, and multifunctional electronic devices necessitates more robust protective materials. As solder joint pitch narrows and component stacking increases, mechanical reinforcement via underfill becomes critical to avoid premature failures, especially during drop tests and thermal cycles.

Second, power semiconductors and RF components used in 5G, automotive, and high-performance computing generate substantial heat. Underfill and encapsulants with enhanced thermal conductivity help dissipate this heat efficiently, preventing hot-spot failures and ensuring long-term reliability-especially in confined PCB layouts.

Third, the automotive and aerospace sectors are increasing reliability thresholds. Devices in these environments must endure wide temperature swings, vibrations, and exposure to corrosive agents. High-temperature stable, chemically inert encapsulants and reworkable underfills are being demanded to meet industry-specific standards such as AEC-Q100 and MIL-STD-883.

Lastly, the emergence of fan-out wafer-level packaging (FOWLP), system-in-package (SiP), and chiplet architectures is pushing material engineers to develop highly customizable, low-CTE, and void-free underfills. These architectures, which blend logic, memory, and analog blocks on a single module, rely heavily on precision material deposition to ensure signal fidelity and physical integrity.

SCOPE OF STUDY:

The report analyzes the Electronic Board Level Underfill and Encapsulation market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Product Type (Underfills Type, Gob Top Encapsulations Type); Material (Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material, Other Materials); Board Type (Chip Scale Package Board, Ball Grid array Board, Flip Chips Board)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 41 Featured) -

• Ablestik Laboratories
• AI Technology Inc.
• Advanced Technology & Materials Co., Ltd.
• Dow Inc.
• Dupont Electronics & Imaging
• Henkel AG & Co. KGaA
• Hitachi Chemical Co., Ltd.
• JSR Corporation
• Kyocera Corporation
• LORD Corporation
• Nagase ChemteX Corporation
• Namics Corporation
• NuSil Technology LLC
• Panacol-Elosol GmbH
• Sika AG
• Shin-Etsu Chemical Co., Ltd.
• Sumitomo Bakelite Company, Limited
• Techsil Ltd
• Trelleborg AB
• UMC Electronics Co., Ltd.

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TARIFF IMPACT FACTOR

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TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

• 1. MARKET OVERVIEW
  • Influencer Market Insights
  • World Market Trajectories
  • Tariff Impact on Global Supply Chain Patterns
  • Electronic Board Level Underfill and Encapsulation - Global Key Competitors Percentage Market Share in 2025 (E)
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
• 2. FOCUS ON SELECT PLAYERS
• 3. MARKET TRENDS & DRIVERS
  • Rise in High-Density Chip Packaging Drives Demand for Underfill and Encapsulation Materials
  • Growth in Mobile and Wearable Electronics Throws Spotlight on Board-Level Mechanical Protection
  • Increased Use of Flip-Chip and BGA Components Strengthens Business Case for Capillary Underfill
  • Expansion of 5G and High-Frequency Applications Spurs Innovation in Low-Dielectric Encapsulants
  • OEM Focus on Product Miniaturization Encourages Development of Thin and Conformal Coatings
  • Increased Use of High-Performance Processors in Consumer Electronics Drives Thermal Cycling Protection
  • Integration With SMT and Wafer-Level Packaging Technologies Expands Adoption in Advanced PCBs
  • Use in Harsh Environment Applications Spurs Demand for Moisture and Chemical Resistant Formulations
  • Growing EV and Power Electronics Segments Fuel Demand for High-Voltage Underfill Materials
  • Development of Reworkable and UV-Curable Underfill Systems Supports Cost-Effective Manufacturing
  • Increased Importance of Reliability in Medical and Aerospace Electronics Boosts Encapsulation Standards
  • Emergence of AI and Edge Computing Devices Strengthens Need for Stress-Absorbing Materials
  • OEM and OSAT Partnerships Accelerate Commercialization of Custom Underfill Chemistries
  • Surge in Chiplet and 3D IC Architectures Expands Scope of Multi-Component Encapsulation
  • Stringent Thermal Shock and Drop Test Requirements Propel Focus on Mechanical Shock Absorption
  • Regulatory Push for Lead-Free and Halogen-Free Materials Encourages Eco-Friendly Encapsulant Development
  • Expansion of Smart Cards and RFID Devices Fuels Use in Secure Microelectronic Modules
  • Material Innovation in Epoxy Resins and Silicones Enhances Long-Term Reliability
  • Shift Toward Automation in Assembly Processes Drives Demand for Dispense-Friendly Formulations
  • Increasing PCB Complexity in Automotive Electronics Promotes Advanced Encapsulation Strategies
• 4. GLOBAL MARKET PERSPECTIVE
  • TABLE 1: World Electronic Board Level Underfill and Encapsulation Market Analysis of Annual Sales in US$ Thousand for Years 2014 through 2030
  • TABLE 2: World Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 3: World Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 4: World 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2014, 2025 & 2030
  • TABLE 5: World Recent Past, Current & Future Analysis for Underfills Type by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 6: World Historic Review for Underfills Type by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 7: World 16-Year Perspective for Underfills Type by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 8: World Recent Past, Current & Future Analysis for Gob Top Encapsulations Type by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 9: World Historic Review for Gob Top Encapsulations Type by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 10: World 16-Year Perspective for Gob Top Encapsulations Type by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 11: World Recent Past, Current & Future Analysis for Ball Grid array Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 12: World Historic Review for Ball Grid array Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 13: World 16-Year Perspective for Ball Grid array Board by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 14: World Recent Past, Current & Future Analysis for Flip Chips Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 15: World Historic Review for Flip Chips Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 16: World 16-Year Perspective for Flip Chips Board by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 17: World Recent Past, Current & Future Analysis for Chip Scale Package Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 18: World Historic Review for Chip Scale Package Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 19: World 16-Year Perspective for Chip Scale Package Board by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 20: World Recent Past, Current & Future Analysis for Quartz / Silicone Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 21: World Historic Review for Quartz / Silicone Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 22: World 16-Year Perspective for Quartz / Silicone Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 23: World Recent Past, Current & Future Analysis for Alumina Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 24: World Historic Review for Alumina Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 25: World 16-Year Perspective for Alumina Based Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 26: World Recent Past, Current & Future Analysis for Epoxy Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 27: World Historic Review for Epoxy Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 28: World 16-Year Perspective for Epoxy Based Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 29: World Recent Past, Current & Future Analysis for Urethane Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 30: World Historic Review for Urethane Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 31: World 16-Year Perspective for Urethane Based Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 32: World Recent Past, Current & Future Analysis for Acrylic Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 33: World Historic Review for Acrylic Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 34: World 16-Year Perspective for Acrylic Based Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 35: World Recent Past, Current & Future Analysis for Other Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 36: World Historic Review for Other Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 37: World 16-Year Perspective for Other Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030

III. MARKET ANALYSIS

• UNITED STATES
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
  • TABLE 38: USA Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 39: USA Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 40: USA 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 41: USA Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 42: USA Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 43: USA 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 44: USA Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 45: USA Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 46: USA 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• CANADA
  • TABLE 47: Canada Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 48: Canada Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 49: Canada 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 50: Canada Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 51: Canada Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 52: Canada 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 53: Canada Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 54: Canada Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 55: Canada 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• JAPAN
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
  • TABLE 56: Japan Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 57: Japan Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 58: Japan 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 59: Japan Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 60: Japan Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 61: Japan 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 62: Japan Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 63: Japan Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 64: Japan 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• CHINA
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
  • TABLE 65: China Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 66: China Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 67: China 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 68: China Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 69: China Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 70: China 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 71: China Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 72: China Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 73: China 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• EUROPE
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
  • TABLE 74: Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 75: Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 76: Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2014, 2025 & 2030
  • TABLE 77: Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 78: Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 79: Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 80: Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 81: Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 82: Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 83: Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 84: Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 85: Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• FRANCE
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
  • TABLE 86: France Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 87: France Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 88: France 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 89: France Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 90: France Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 91: France 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 92: France Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 93: France Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 94: France 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• GERMANY
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
  • TABLE 95: Germany Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 96: Germany Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 97: Germany 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 98: Germany Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 99: Germany Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 100: Germany 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 101: Germany Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 102: Germany Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 103: Germany 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• ITALY
  • TABLE 104: Italy Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 105: Italy Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 106: Italy 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 107: Italy Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 108: Italy Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 109: Italy 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 110: Italy Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 111: Italy Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 112: Italy 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• UNITED KINGDOM
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
  • TABLE 113: UK Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 114: UK Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 115: UK 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 116: UK Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 117: UK Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 118: UK 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 119: UK Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 120: UK Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 121: UK 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• SPAIN
  • TABLE 122: Spain Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 123: Spain Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 124: Spain 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 125: Spain Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 126: Spain Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 127: Spain 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 128: Spain Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 129: Spain Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 130: Spain 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• RUSSIA
  • TABLE 131: Russia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 132: Russia Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 133: Russia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 134: Russia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 135: Russia Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 136: Russia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 137: Russia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 138: Russia Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 139: Russia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• REST OF EUROPE
  • TABLE 140: Rest of Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 141: Rest of Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 142: Rest of Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 143: Rest of Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 144: Rest of Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 145: Rest of Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 146: Rest of Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 147: Rest of Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 148: Rest of Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• ASIA-PACIFIC
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
  • TABLE 149: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 150: Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 151: Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2014, 2025 & 2030
  • TABLE 152: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 153: Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 154: Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 155: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 156: Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 157: Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 158: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 159: Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 160: Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• AUSTRALIA
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
  • TABLE 161: Australia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 162: Australia Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 163: Australia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 164: Australia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 165: Australia Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 166: Australia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 167: Australia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 168: Australia Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 169: Australia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• INDIA
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
  • TABLE 170: India Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 171: India Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 172: India 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 173: India Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 174: India Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 175: India 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 176: India Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 177: India Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 178: India 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• SOUTH KOREA
  • TABLE 179: South Korea Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 180: South Korea Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 181: South Korea 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 182: South Korea Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 183: South Korea Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 184: South Korea 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 185: South Korea Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 186: South Korea Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 187: South Korea 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• REST OF ASIA-PACIFIC
  • TABLE 188: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 189: Rest of Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 190: Rest of Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 191: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 192: Rest of Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 193: Rest of Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 194: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 195: Rest of Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 196: Rest of Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• LATIN AMERICA
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
  • TABLE 197: Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 198: Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 199: Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2014, 2025 & 2030
  • TABLE 200: Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 201: Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 202: Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 203: Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 204: Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 205: Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 206: Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 207: Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 208: Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• ARGENTINA
  • TABLE 209: Argentina Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 210: Argentina Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 211: Argentina 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 212: Argentina Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 213: Argentina Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 214: Argentina 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 215: Argentina Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 216: Argentina Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 217: Argentina 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• BRAZIL
  • TABLE 218: Brazil Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 219: Brazil Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 220: Brazil 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 221: Brazil Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 222: Brazil Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 223: Brazil 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 224: Brazil Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 225: Brazil Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 226: Brazil 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• MEXICO
  • TABLE 227: Mexico Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 228: Mexico Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 229: Mexico 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 230: Mexico Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 231: Mexico Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 232: Mexico 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 233: Mexico Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 234: Mexico Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 235: Mexico 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• REST OF LATIN AMERICA
  • TABLE 236: Rest of Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 237: Rest of Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 238: Rest of Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 239: Rest of Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 240: Rest of Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 241: Rest of Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 242: Rest of Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 243: Rest of Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 244: Rest of Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• MIDDLE EAST
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
  • TABLE 245: Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 246: Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 247: Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2014, 2025 & 2030
  • TABLE 248: Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 249: Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 250: Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 251: Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 252: Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 253: Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 254: Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 255: Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 256: Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• IRAN
  • TABLE 257: Iran Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 258: Iran Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 259: Iran 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 260: Iran Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 261: Iran Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 262: Iran 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 263: Iran Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 264: Iran Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 265: Iran 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• ISRAEL
  • TABLE 266: Israel Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 267: Israel Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 268: Israel 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 269: Israel Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 270: Israel Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 271: Israel 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 272: Israel Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 273: Israel Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 274: Israel 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• SAUDI ARABIA
  • TABLE 275: Saudi Arabia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 276: Saudi Arabia Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 277: Saudi Arabia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 278: Saudi Arabia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 279: Saudi Arabia Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 280: Saudi Arabia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 281: Saudi Arabia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 282: Saudi Arabia Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 283: Saudi Arabia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• UNITED ARAB EMIRATES
  • TABLE 284: UAE Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 285: UAE Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 286: UAE 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 287: UAE Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 288: UAE Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 289: UAE 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 290: UAE Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 291: UAE Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 292: UAE 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• REST OF MIDDLE EAST
  • TABLE 293: Rest of Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 294: Rest of Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 295: Rest of Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 296: Rest of Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 297: Rest of Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 298: Rest of Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 299: Rest of Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 300: Rest of Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 301: Rest of Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• AFRICA
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
  • TABLE 302: Africa Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 303: Africa Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 304: Africa 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 305: Africa Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 306: Africa Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 307: Africa 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 308: Africa Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 309: Africa Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 310: Africa 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030

IV. COMPETITION