デフォルト表紙
市場調査レポート
商品コード
1598759

アンダーフィル材市場:材料別、用途別-2025-2030年の世界予測

Underfill Materials Market by Material (Capillary Underfill, Molded Underfill, No Flow Underfill), Application (Ball Grid Array, Chip Scale Packaging, Flip Chips) - Global Forecast 2025-2030


出版日
発行
360iResearch
ページ情報
英文 189 Pages
納期
即日から翌営業日
カスタマイズ可能
適宜更新あり
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=146.99円
アンダーフィル材市場:材料別、用途別-2025-2030年の世界予測
出版日: 2024年10月31日
発行: 360iResearch
ページ情報: 英文 189 Pages
納期: 即日から翌営業日
GIIご利用のメリット
  • 全表示
  • 概要
  • 図表
  • 目次
概要

アンダーフィル材市場は、2023年に9億8,476万USDと評価され、2024年には10億2,418万USDに達すると予測され、CAGR 7.02%で成長し、2030年には15億8,433万USDに達すると予測されています。

アンダーフィル材は、マイクロエレクトロニクスにおいて、機械的支持を確保し、信頼性を高め、環境ストレスや熱膨張のミスマッチからデリケートな部品を保護するために極めて重要です。電子デバイスの小型化の動向に伴い、これらの材料は主にチップスケールパッケージング、フリップチップアプリケーション、先進パッケージング技術などの分野に応用されています。最終用途は、家電、自動車、通信、軍事などさまざまな分野に及んでおり、その多用途性と広範な影響を反映しています。より高性能でコンパクトなデバイスへの需要が、アンダーフィル材の採用を後押ししています。この市場の主な成長要因としては、民生用電子機器需要の高まり、5G導入による通信インフラの進歩、電気自動車や自律走行車によるカーエレクトロニクス分野の急成長などが挙げられます。さらに、環境に優しく高性能なアンダーフィル・ソリューションの革新に向けた研究開発への投資が増加していることも、新たな機会をもたらしています。企業は、生体適合性や生分解性材料に注力し、消費者の持続可能性へのシフトに対応することで、これらを活用することができます。しかし、先進的なアンダーフィル材の高コストや、その統合と応用プロセスに伴う複雑さなど、市場は課題も抱えており、普及の妨げとなっています。業界の急速な進化には一貫した技術的進歩が必要であるため、継続的な技術革新と異業種間のコラボレーションが大きな利益をもたらす可能性があります。技術革新の可能性のある分野としては、熱伝導性と安定性を向上させた材料の開発や、組み立て工程の効率を向上させるための硬化時間の短縮などが挙げられます。さらに、極端な温度や機械的ストレスに耐えうる新しい組成を探求することで、新たな市場の道が開けるかもしれないです。全体として、競合情勢の中で競争力を維持し、リーダーシップを発揮するためには、革新的な研究に投資し、環境に配慮した手法を取り入れることで、企業はその限界を乗り越えなければならないです。

主な市場の統計
基準年[2023] 9億8,476万米ドル
予想年[2024] 10億2,418万米ドル
予測年[2030] 15億8,433万米ドル
CAGR(%) 7.02%

市場力学:急速に進化するアンダーフィル材市場の主要市場インサイトを公開

アンダーフィル材市場は、需要と供給のダイナミックな相互作用によって変貌を遂げています。このような市場力学の進化を理解することで、企業は十分な情報に基づいた投資決定、戦略的決定の精緻化、そして新たなビジネスチャンスの獲得に備えることができます。これらの動向を包括的に把握することで、企業は政治的、地理的、技術的、社会的、経済的な領域にわたる様々なリスクを軽減することができ、また、消費者行動とそれが製造コストや購買動向に与える影響をより明確に理解することができます。

  • 市場促進要因
    • 電子機器の小型化に対する世界の注目の高まり
    • 半導体製造への投資とイニシアチブの高まり
    • 航空宇宙・自動車分野での電子部品展開の増加
  • 市場抑制要因
    • 高品質なアンダーフィル材の開発・生産コストの高さ
  • 市場機会
    • 持続可能性への取り組みに対応した環境に優しいアンダーフィル材料の開発
    • アンダーフィル材料の組成と製造手順における新規製品の発売と技術革新
  • 市場の課題
    • アンダーフィル材に関連する技術的限界

ポーターの5つの力:アンダーフィル材市場をナビゲートする戦略ツール

ポーターの5つの力フレームワークは、アンダーフィル材市場の競合情勢を理解するための重要なツールです。ポーターのファイブフォース・フレームワークは、企業の競争力を評価し、戦略的機会を探るための明確な手法を提供します。このフレームワークは、企業が市場内の勢力図を評価し、新規事業の収益性を判断するのに役立ちます。これらの洞察により、企業は自社の強みを活かし、弱みに対処し、潜在的な課題を回避することができ、より強靭な市場でのポジショニングを確保することができます。

PESTLE分析:アンダーフィル材市場における外部からの影響の把握

外部マクロ環境要因は、アンダーフィル材市場の業績ダイナミクスを形成する上で極めて重要な役割を果たします。政治的、経済的、社会的、技術的、法的、環境的要因の分析は、これらの影響をナビゲートするために必要な情報を提供します。PESTLE要因を調査することで、企業は潜在的なリスクと機会をよりよく理解することができます。この分析により、企業は規制、消費者の嗜好、経済動向の変化を予測し、先を見越した積極的な意思決定を行う準備ができます。

市場シェア分析アンダーフィル材市場における競合情勢の把握

アンダーフィル材市場の詳細な市場シェア分析により、ベンダーの業績を包括的に評価することができます。企業は、収益、顧客ベース、成長率などの主要指標を比較することで、競争上のポジショニングを明らかにすることができます。この分析により、市場の集中、断片化、統合の動向が明らかになり、ベンダーは競争が激化する中で自社の地位を高める戦略的意思決定を行うために必要な知見を得ることができます。

FPNVポジショニング・マトリックスアンダーフィル材市場におけるベンダーのパフォーマンス評価

FPNVポジショニングマトリックスは、アンダーフィル材市場においてベンダーを評価するための重要なツールです。このマトリックスにより、ビジネス組織はベンダーのビジネス戦略と製品満足度に基づき評価することで、目標に沿った十分な情報に基づいた意思決定を行うことができます。4つの象限によってベンダーを明確かつ正確にセグメント化し、戦略目標に最適なパートナーやソリューションを特定することができます。

戦略分析と推奨アンダーフィル材市場における成功への道筋を描く

アンダーフィル材市場の戦略分析は、世界市場でのプレゼンス強化を目指す企業にとって不可欠です。主要なリソース、能力、業績指標を検討することで、企業は成長機会を特定し、改善に取り組むことができます。このアプローチにより、競合情勢における課題を克服し、新たなビジネスチャンスを活かして長期的な成功を収めるための体制を整えることができます。

本レポートでは、主要な注目分野を網羅した市場の包括的な分析を提供しています:

1.市場の浸透度:現在の市場環境の詳細なレビュー、主要企業による広範なデータ、市場でのリーチと全体的な影響力の評価。

2.市場の開拓度:新興市場における成長機会を特定し、既存分野における拡大可能性を評価し、将来の成長に向けた戦略的ロードマップを提供します。

3.市場の多様化:最近の製品発売、未開拓の地域、業界の主要な進歩、市場を形成する戦略的投資を分析します。

4.競合の評価と情報:競合情勢を徹底的に分析し、市場シェア、事業戦略、製品ポートフォリオ、認証、規制当局の承認、特許動向、主要企業の技術進歩などを検証します。

5.製品開発およびイノベーション:将来の市場成長を促進すると期待される最先端技術、研究開発活動、製品イノベーションをハイライトしています。

また、利害関係者が十分な情報を得た上で意思決定できるよう、重要な質問にも答えています:

1.現在の市場規模と今後の成長予測は?

2.最高の投資機会を提供する製品、セグメント、地域はどこか?

3.市場を形成する主な技術動向と規制の影響とは?

4.主要ベンダーの市場シェアと競合ポジションは?

5.ベンダーの市場参入・撤退戦略の原動力となる収益源と戦略的機会は何か?

目次

第1章 序文

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場の概要

第5章 市場洞察

  • 市場力学
    • 促進要因
      • 世界中で電子機器の小型化への注目が高まる
      • 半導体製造への投資と取り組みの増加
      • 航空宇宙および自動車分野における電子部品の導入増加
    • 抑制要因
      • 高品質のアンダーフィル材の開発と生産には高いコストがかかる
    • 機会
      • 持続可能性の取り組みに対応する環境に優しいアンダーフィル材料の開発
      • アンダーフィル材の組成と製造手順における新しい製品の発売と革新
    • 課題
      • アンダーフィル材に関連する技術的な制限
  • 市場セグメンテーション分析
  • ポーターのファイブフォース分析
  • PESTEL分析
    • 政治的
    • 経済
    • 社交
    • 技術的
    • 法律上
    • 環境

第6章 アンダーフィル材市場:素材別

  • キャピラリーアンダーフィル
  • 成形アンダーフィル
  • フローアンダーフィルなし

第7章 アンダーフィル材市場:用途別

  • ボールグリッドアレイ
  • チップスケールパッケージング
  • フリップチップ

第8章 南北アメリカのアンダーフィル材市場

  • アルゼンチン
  • ブラジル
  • カナダ
  • メキシコ
  • 米国

第9章 アジア太平洋地域のアンダーフィル材市場

  • オーストラリア
  • 中国
  • インド
  • インドネシア
  • 日本
  • マレーシア
  • フィリピン
  • シンガポール
  • 韓国
  • 台湾
  • タイ
  • ベトナム

第10章 欧州・中東・アフリカのアンダーフィル材市場

  • デンマーク
  • エジプト
  • フィンランド
  • フランス
  • ドイツ
  • イスラエル
  • イタリア
  • オランダ
  • ナイジェリア
  • ノルウェー
  • ポーランド
  • カタール
  • ロシア
  • サウジアラビア
  • 南アフリカ
  • スペイン
  • スウェーデン
  • スイス
  • トルコ
  • アラブ首長国連邦
  • 英国

第11章 競合情勢

  • 市場シェア分析2023
  • FPNVポジショニングマトリックス, 2023
  • 競合シナリオ分析
  • 戦略分析と提言

企業一覧

  • AI Technology, Inc.
  • AIM Metals & Alloys LP
  • Bondline Electronic Adhesives, Inc.
  • CAPLINQ Corporation
  • Chemtronics International Ltd
  • Dycotec Materials Ltd
  • Epoxy Technology Inc
  • Essemtec AG
  • H.B. Fuller Company
  • Henkel AG & Co. KGaA
  • Hitachi Chemical Company
  • Indium Corporation
  • MacDermid Alpha Electronics Solutions
  • Master Bond, Inc.
  • NAGASE(EUROPA)GmbH
  • Namics Corporation
  • Nordson Corporation
  • Panasonic Corporation
  • Parker Hannifin Corporation
  • Shenzhen Cooteck Electronic Material Technology Co., Ltd
  • SOMAR Corporation
  • Sumitomo Bakelite Co., Ltd.
  • Won Chemical Co.,Ltd.
  • YINCAE Advanced Materials, LLC
  • Zymet, Inc.
図表

LIST OF FIGURES

  • FIGURE 1. UNDERFILL MATERIALS MARKET RESEARCH PROCESS
  • FIGURE 2. UNDERFILL MATERIALS MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL UNDERFILL MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. AMERICAS UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 11. AMERICAS UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. UNITED STATES UNDERFILL MATERIALS MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 13. UNITED STATES UNDERFILL MATERIALS MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. ASIA-PACIFIC UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 15. ASIA-PACIFIC UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. EUROPE, MIDDLE EAST & AFRICA UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 17. EUROPE, MIDDLE EAST & AFRICA UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. UNDERFILL MATERIALS MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 19. UNDERFILL MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. UNDERFILL MATERIALS MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL UNDERFILL MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. UNDERFILL MATERIALS MARKET DYNAMICS
  • TABLE 7. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY CAPILLARY UNDERFILL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY MOLDED UNDERFILL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY NO FLOW UNDERFILL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY BALL GRID ARRAY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY CHIP SCALE PACKAGING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY FLIP CHIPS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. AMERICAS UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 16. AMERICAS UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 17. AMERICAS UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 18. ARGENTINA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 19. ARGENTINA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 20. BRAZIL UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 21. BRAZIL UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 22. CANADA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 23. CANADA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 24. MEXICO UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 25. MEXICO UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 26. UNITED STATES UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 27. UNITED STATES UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 28. UNITED STATES UNDERFILL MATERIALS MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 29. ASIA-PACIFIC UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 30. ASIA-PACIFIC UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 31. ASIA-PACIFIC UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 32. AUSTRALIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 33. AUSTRALIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 34. CHINA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 35. CHINA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 36. INDIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 37. INDIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 38. INDONESIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 39. INDONESIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 40. JAPAN UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 41. JAPAN UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 42. MALAYSIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 43. MALAYSIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 44. PHILIPPINES UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 45. PHILIPPINES UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 46. SINGAPORE UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 47. SINGAPORE UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 48. SOUTH KOREA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 49. SOUTH KOREA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 50. TAIWAN UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 51. TAIWAN UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 52. THAILAND UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 53. THAILAND UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 54. VIETNAM UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 55. VIETNAM UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 56. EUROPE, MIDDLE EAST & AFRICA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 57. EUROPE, MIDDLE EAST & AFRICA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 58. EUROPE, MIDDLE EAST & AFRICA UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 59. DENMARK UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 60. DENMARK UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 61. EGYPT UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 62. EGYPT UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 63. FINLAND UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 64. FINLAND UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 65. FRANCE UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 66. FRANCE UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 67. GERMANY UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 68. GERMANY UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 69. ISRAEL UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 70. ISRAEL UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 71. ITALY UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 72. ITALY UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 73. NETHERLANDS UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 74. NETHERLANDS UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 75. NIGERIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 76. NIGERIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 77. NORWAY UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 78. NORWAY UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 79. POLAND UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 80. POLAND UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 81. QATAR UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 82. QATAR UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 83. RUSSIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 84. RUSSIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 85. SAUDI ARABIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 86. SAUDI ARABIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 87. SOUTH AFRICA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 88. SOUTH AFRICA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 89. SPAIN UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 90. SPAIN UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 91. SWEDEN UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 92. SWEDEN UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 93. SWITZERLAND UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 94. SWITZERLAND UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 95. TURKEY UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 96. TURKEY UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 97. UNITED ARAB EMIRATES UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 98. UNITED ARAB EMIRATES UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 99. UNITED KINGDOM UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 100. UNITED KINGDOM UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 101. UNDERFILL MATERIALS MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 102. UNDERFILL MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023
目次
Product Code: MRR-C002B1C9975E

The Underfill Materials Market was valued at USD 984.76 million in 2023, expected to reach USD 1,024.18 million in 2024, and is projected to grow at a CAGR of 7.02%, to USD 1,584.33 million by 2030.

Underfill materials are crucial in microelectronics for ensuring mechanical support, enhancing reliability, and protecting delicate components from environmental stress and thermal expansion mismatches. Necessitated by the growing trend towards miniaturization in electronic devices, these materials are primarily applied in areas such as chip-scale packaging, flip-chip applications, and advanced packaging technologies. The end-use scope spans across various sectors including consumer electronics, automotive, telecommunications, and military sectors, reflecting their versatility and wide-reaching impact. The demand for higher performance, more compact devices drives the adoption of underfill materials. Key growth factors in this market include the rising consumer electronics demand, advancements in telecommunication infrastructure with 5G implementation, and the burgeoning automotive electronics sector driven by electric and autonomous vehicles. Additionally, the increasing investments in research and development to innovate environmentally friendly and high-performance underfill solutions present fresh opportunities. Companies can capitalize on these by focusing on biocompatible and biodegradable materials, meeting the consumer shift towards sustainability. However, the market does face challenges, including the high cost of advanced underfill materials and the complexities associated with their integration and application processes, which can hinder widespread adoption. The industry's rapid evolution requires consistent technological advancements; hence, continuous innovation and cross-industry collaborations can present significant benefits. Potential areas for innovation include developing materials with enhanced thermal conductivity and stability, alongside reduced curing times to improve efficiency in the assembly processes. Additionally, exploring new compositions that can withstand extreme temperatures and mechanical stresses could open new market avenues. Overall, while the market for underfill materials is vibrant and poised for growth, businesses must navigate its limitations by investing in innovative research and embracing environmentally friendly practices to sustain competitiveness and leadership in this evolving landscape.

KEY MARKET STATISTICS
Base Year [2023] USD 984.76 million
Estimated Year [2024] USD 1,024.18 million
Forecast Year [2030] USD 1,584.33 million
CAGR (%) 7.02%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Underfill Materials Market

The Underfill Materials Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Growing focus on miniaturization of electronic devices worldwide
    • Rising investments and initiatives for semiconductor manufacturing
    • Increasing deployment of electronic components across aerospace and automotive sectors
  • Market Restraints
    • High cost of development and production of high-quality underfill materials
  • Market Opportunities
    • Development of eco-friendly underfills materials to meet sustainability initiatives
    • Novel product launches and innovations in underfill material composition and manufacturing procedures
  • Market Challenges
    • Technical limitations associated with underfill materials

Porter's Five Forces: A Strategic Tool for Navigating the Underfill Materials Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Underfill Materials Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Underfill Materials Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Underfill Materials Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Underfill Materials Market

A detailed market share analysis in the Underfill Materials Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Underfill Materials Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Underfill Materials Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Underfill Materials Market

A strategic analysis of the Underfill Materials Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Underfill Materials Market, highlighting leading vendors and their innovative profiles. These include AI Technology, Inc., AIM Metals & Alloys LP, Bondline Electronic Adhesives, Inc., CAPLINQ Corporation, Chemtronics International Ltd, Dycotec Materials Ltd, Epoxy Technology Inc, Essemtec AG, H.B. Fuller Company, Henkel AG & Co. KGaA, Hitachi Chemical Company, Indium Corporation, MacDermid Alpha Electronics Solutions, Master Bond, Inc., NAGASE (EUROPA) GmbH, Namics Corporation, Nordson Corporation, Panasonic Corporation, Parker Hannifin Corporation, Shenzhen Cooteck Electronic Material Technology Co., Ltd, SOMAR Corporation, Sumitomo Bakelite Co., Ltd., Won Chemical Co.,Ltd., YINCAE Advanced Materials, LLC, and Zymet, Inc..

Market Segmentation & Coverage

This research report categorizes the Underfill Materials Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Material, market is studied across Capillary Underfill, Molded Underfill, and No Flow Underfill.
  • Based on Application, market is studied across Ball Grid Array, Chip Scale Packaging, and Flip Chips.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Growing focus on miniaturization of electronic devices worldwide
      • 5.1.1.2. Rising investments and initiatives for semiconductor manufacturing
      • 5.1.1.3. Increasing deployment of electronic components across aerospace and automotive sectors
    • 5.1.2. Restraints
      • 5.1.2.1. High cost of development and production of high-quality underfill materials
    • 5.1.3. Opportunities
      • 5.1.3.1. Development of eco-friendly underfills materials to meet sustainability initiatives
      • 5.1.3.2. Novel product launches and innovations in underfill material composition and manufacturing procedures
    • 5.1.4. Challenges
      • 5.1.4.1. Technical limitations associated with underfill materials
  • 5.2. Market Segmentation Analysis
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Underfill Materials Market, by Material

  • 6.1. Introduction
  • 6.2. Capillary Underfill
  • 6.3. Molded Underfill
  • 6.4. No Flow Underfill

7. Underfill Materials Market, by Application

  • 7.1. Introduction
  • 7.2. Ball Grid Array
  • 7.3. Chip Scale Packaging
  • 7.4. Flip Chips

8. Americas Underfill Materials Market

  • 8.1. Introduction
  • 8.2. Argentina
  • 8.3. Brazil
  • 8.4. Canada
  • 8.5. Mexico
  • 8.6. United States

9. Asia-Pacific Underfill Materials Market

  • 9.1. Introduction
  • 9.2. Australia
  • 9.3. China
  • 9.4. India
  • 9.5. Indonesia
  • 9.6. Japan
  • 9.7. Malaysia
  • 9.8. Philippines
  • 9.9. Singapore
  • 9.10. South Korea
  • 9.11. Taiwan
  • 9.12. Thailand
  • 9.13. Vietnam

10. Europe, Middle East & Africa Underfill Materials Market

  • 10.1. Introduction
  • 10.2. Denmark
  • 10.3. Egypt
  • 10.4. Finland
  • 10.5. France
  • 10.6. Germany
  • 10.7. Israel
  • 10.8. Italy
  • 10.9. Netherlands
  • 10.10. Nigeria
  • 10.11. Norway
  • 10.12. Poland
  • 10.13. Qatar
  • 10.14. Russia
  • 10.15. Saudi Arabia
  • 10.16. South Africa
  • 10.17. Spain
  • 10.18. Sweden
  • 10.19. Switzerland
  • 10.20. Turkey
  • 10.21. United Arab Emirates
  • 10.22. United Kingdom

11. Competitive Landscape

  • 11.1. Market Share Analysis, 2023
  • 11.2. FPNV Positioning Matrix, 2023
  • 11.3. Competitive Scenario Analysis
  • 11.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. AI Technology, Inc.
  • 2. AIM Metals & Alloys LP
  • 3. Bondline Electronic Adhesives, Inc.
  • 4. CAPLINQ Corporation
  • 5. Chemtronics International Ltd
  • 6. Dycotec Materials Ltd
  • 7. Epoxy Technology Inc
  • 8. Essemtec AG
  • 9. H.B. Fuller Company
  • 10. Henkel AG & Co. KGaA
  • 11. Hitachi Chemical Company
  • 12. Indium Corporation
  • 13. MacDermid Alpha Electronics Solutions
  • 14. Master Bond, Inc.
  • 15. NAGASE (EUROPA) GmbH
  • 16. Namics Corporation
  • 17. Nordson Corporation
  • 18. Panasonic Corporation
  • 19. Parker Hannifin Corporation
  • 20. Shenzhen Cooteck Electronic Material Technology Co., Ltd
  • 21. SOMAR Corporation
  • 22. Sumitomo Bakelite Co., Ltd.
  • 23. Won Chemical Co.,Ltd.
  • 24. YINCAE Advanced Materials, LLC
  • 25. Zymet, Inc.