市場調査レポート
商品コード
1465122

半導体・ICパッケージング材料市場:タイプ、技術、最終用途別-2024-2030年の世界予測

Semiconductor & IC Packaging Materials Market by Type (Bonding wires, Ceramic Packages, Die Attach Materials), Technology (Dual Flat No-leads, Dual-in-line, Grid Array), End-use - Global Forecast 2024-2030

出版日: | 発行: 360iResearch | ページ情報: 英文 186 Pages | 納期: 即日から翌営業日

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価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=160.56円
半導体・ICパッケージング材料市場:タイプ、技術、最終用途別-2024-2030年の世界予測
出版日: 2024年04月17日
発行: 360iResearch
ページ情報: 英文 186 Pages
納期: 即日から翌営業日
ご注意事項 :
本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
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  • 概要
  • 図表
  • 目次
概要

半導体・ICパッケージング材料市場規模は、2023年に384億4,000万米ドルと推定され、2024年には421億6,000万米ドルに達し、CAGR 10.35%で2030年には766億4,000万米ドルに達すると予測されています。

半導体・集積回路(IC)パッケージング材料には、電子回路や半導体を封入・保護するために使用される幅広い物質や部品が含まれます。これらの材料は物理的なシールドとして機能し、放熱、電気絶縁、半導体の信頼性と性能の向上において重要な役割を果たしています。その用途の拡大は、主に民生用電子機器、通信機器、車載用電子機器の需要の急増によってもたらされています。技術が進歩し、電子機器がより小型で高性能になるにつれ、効率的で耐久性があり、耐熱性のあるパッケージング材料の必要性が高まっています。しかし、この業界は、特に一部の包装材料が環境に与える影響や、ますます高温になる過酷な使用条件に耐える材料の追求といった課題に直面しています。これらの欠点に対処するには、より持続可能な材料や、廃棄物を減らし性能を高める革新的なパッケージング技術を発見するための継続的な研究開発が必要です。とはいえ、5G技術、モノのインターネット(IoT)、人工知能(AI)の登場、電気自動車(EV)の普及拡大が、さらなる成長に拍車をかけると予想されます。さらに、より高い演算能力を備えたデバイスの小型化に向けた動きは、こうした動向に対応できる先進パッケージング・ソリューションに対する需要の高まりを示唆しています。環境に優しい高熱伝導性材料の開発など、材料科学における革新は、技術環境の進化するニーズに対応し、業界拡大の新たな道を開く用意があります。

主な市場の統計
基準年[2023] 384億4,000万米ドル
予測年[2024] 421億6,000万米ドル
予測年 [2030] 766億4,000万米ドル
CAGR(%) 10.35%

タイプセラミック・パッケージの高性能・高信頼性アプリケーションへの適性

ボンディングワイヤとは、多くの場合、金、アルミニウム、銅から作られる細い金属ワイヤのことで、半導体デバイス内の電気的接続に使用されます。半導体の機能において重要な役割を果たし、チップ内およびチップと外部との間の電気信号や電力の流れを円滑にします。セラミック・パッケージは、半導体チップを封入する保護ケースで、湿気、温度変化、物理的ストレスなどの環境要因から高レベルの保護を提供します。セラミックは優れた熱絶縁性と電気絶縁性を持つため、高性能で信頼性の高いアプリケーションに適しています。アタッチ材は、半導体ダイ(またはチップ)を基板またはパッケージに結合するために使用される接着剤または金属合金です。機械的支持と熱管理の両方にとって重要であり、ダイがしっかりと固定されていることを保証すると同時に、チップからの熱放散を促進します。

封止樹脂は、半導体チップとその内部接続を封止し、保護するために使用されるポリマーです。リードフレームは半導体パッケージ内の金属構造で、シリコンチップと外部回路を機械的に支持し、電気的に接続します。リードフレームは、チップとの間で電力と信号を分配するために不可欠であり、デバイスの全体的な性能において重要な役割を果たします。有機基板は、半導体デバイスが構築されるベース層として機能します。有機ポリマーから作られ、様々な電子部品をサポートするように設計されたこれらの基板は、半導体パッケージ内の相互接続のためのプラットフォームを提供し、最終製品の電気的性能と集積度に影響を与えます。ボールグリッドアレイ(BGA)パッケージに使用されるはんだボールは、半導体パッケージとプリント回路基板(PCB)間の電気的接続を形成するはんだの小さな球体です。はんだボールは、チップパッケージとその外部環境との間に信頼性の高い物理的・電気的インターフェースを確立するために不可欠です。サーマルインターフェイス材料(TIM)は、半導体デバイスとそのヒートシンクの間に挿入され、熱伝導を促進する物質です。チップから放熱部品への熱伝達効率を向上させることで、TIMは半導体デバイスの動作温度を管理し、安全な動作限界内に保つという極めて重要な役割を果たします。

最終用途優れた電気絶縁性と優れた熱管理のため、民生用電子機器に普及

航空宇宙・防衛分野では、使用される半導体パッケージング材料は、高放射線、極端な温度、機械的ストレスなどの過酷な条件に耐える必要があります。航空宇宙・防衛用途の半導体の寿命と信頼性を確保するために、高性能セラミックと堅牢な化合物材料が一般的に利用されています。これらの材料は、ナビゲーション、通信、監視システムにおいて重要な機能を実現します。自動車産業は、自動車に使用される電子部品の増加とともに変貌を遂げています。自動車分野のパッケージング材料は、多くの場合過酷な環境下で、自動車の寿命を通じて高い信頼性を確保しなければならないです。使用される材料は、振動、高温、湿気に耐えなければなりません。耐久性と耐熱性で知られるシリコーンやアドバンスト・ポリマーが広く使われています。スマートフォン、ノートパソコン、ウェアラブル端末などの家電製品では、軽量・コンパクトで効率的な設計を可能にする半導体パッケージング材料が求められています。ここでは、スペースを最小限に抑えながら性能を高めることが重視されています。電気絶縁性に優れ、熱管理にも優れたエポキシ樹脂やプラスチックコンパウンドが好まれます。ヘルスケア分野では、半導体は診断機器からウェアラブルヘルスモニターまで、幅広いアプリケーションに使用されています。ヘルスケア機器の包装材料は、生体適合性、滅菌適合性、信頼性に関する厳しい基準を満たす必要があります。医療機器に使用される半導体を保護し、その性能を向上させるためには、人体に安全で、医療環境下で確実に動作する特殊なポリマーやセラミックスが鍵となります。IT・通信分野では、データ処理と通信の高速化への要求が、先進半導体パッケージング材料の必要性を高めています。これらの材料は、過熱を防ぐために効率的に熱を放散しながら、高速信号伝送をサポートする必要があります。炭化ケイ素や先端ポリマーを含む高熱伝導性材料は、こうしたニーズを満たすために使用され、データセンター、サーバー、通信機器の信頼性の高い効率的な運用を保証しています。

地域別インサイト

南北アメリカでは、先進の研究開発能力と大手半導体メーカーの存在により、米国が半導体パッケージング材料市場で主導的な役割を果たしています。同地域では、より高性能で小型のエネルギー効率の高いデバイスへの需要に後押しされ、より洗練されたパッケージング・ソリューションへのシフトが進んでいます。シリコン、プラスチック、ガラスなどの材料が、高度な複合材料とともに多用されています。再生可能エネルギーや電気自動車への投資の増加も、この地域における半導体パッケージング材料の需要を形成しています。EMEA地域は、国によって経済的・技術的成熟度が異なるため、多様なシナリオを示しています。欧州は、高信頼性半導体パッケージを要求する堅調な自動車および産業部門を特徴とする最前線にあります。過酷な環境に耐える先進パッケージング技術が特に求められています。中東とアフリカは成長しているとはいえ、世界市場の中では小さなセグメントだが、通信とインフラ整備への投資で急速に発展しています。アジア太平洋地域は、中国、韓国、台湾、日本を含む国々に牽引され、半導体・ICパッケージング材料にとって最もダイナミックで急成長している地域です。これらの国々は世界最大級の電子機器メーカーを抱え、幅広いパッケージング材料の需要を牽引しています。この地域の市場は、スマートフォン、タブレット、その他のポータブルデバイスを含むコンシューマーエレクトロニクスの生産量が多いという特徴があり、費用対効果が高く、かつ高性能の革新的なパッケージングソリューションが必要とされています。

FPNVポジショニング・マトリックス

FPNVポジショニングマトリックスは、半導体・ICパッケージング材料市場の評価において極めて重要です。事業戦略や製品満足度に関連する主要指標を調査し、ベンダーの包括的な評価を提供します。この綿密な分析により、ユーザーは各自の要件に沿った十分な情報に基づいた意思決定を行うことができます。評価に基づき、ベンダーは成功の度合いが異なる4つの象限に分類されます:フォアフロント(F)、パスファインダー(P)、ニッチ(N)、バイタル(V)です。

市場シェア分析

市場シェア分析は、半導体・ICパッケージング材料市場におけるベンダーの現状について、洞察に満ちた詳細な調査を提供する包括的なツールです。全体的な収益、顧客基盤、その他の主要指標についてベンダーの貢献度を綿密に比較・分析することで、企業の業績や市場シェア争いの際に直面する課題について理解を深めることができます。さらに、この分析により、調査対象基準年に観察された累積、断片化の優位性、合併の特徴などの要因を含む、この分野の競合特性に関する貴重な考察が得られます。このような詳細レベルの拡大により、ベンダーはより多くの情報に基づいた意思決定を行い、市場で競争優位に立つための効果的な戦略を考案することができます。

本レポートは、以下の側面に関する貴重な洞察を提供しています:

1.市場の浸透度:主要企業が提供する市場に関する包括的な情報を提示しています。

2.市場の開拓度:有利な新興市場を深く掘り下げ、成熟市場セグメントにおける浸透度を分析しています。

3.市場の多様化:新製品の発売、未開拓の地域、最近の開発、投資に関する詳細な情報を提供します。

4.競合の評価と情報:市場シェア、戦略、製品、認証、規制状況、特許状況、主要企業の製造能力について徹底的な評価を行います。

5.製品開発およびイノベーション:将来の技術、研究開発活動、画期的な製品開発に関する知的洞察を提供します。

本レポートは、以下のような主要な質問に対応しています:

1.半導体・ICパッケージング材料市場の市場規模および予測は?

2.半導体・ICパッケージング材料市場の予測期間中に投資を検討すべき製品、セグメント、用途、分野は何か?

3.半導体・ICパッケージング材料市場の技術動向と規制枠組みは?

4.半導体・ICパッケージング材料市場における主要ベンダーの市場シェアは?

5.半導体・ICパッケージング材料市場への参入に適した形態や戦略的手段は?

目次

第1章 序文

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場の概要

第5章 市場洞察

  • 市場力学
    • 促進要因
      • 民生用電子機器向け半導体およびICパッケージング材料の需要増加
      • 革新的な包装材料を支える技術の絶え間ない進歩
      • 電子機器分野における小型化と高密度化の進展
    • 抑制要因
      • 半導体業界のアウトソーシングとテストにおける知的財産権の懸念
    • 機会
      • 先進技術との統合
      • 5Gと自動運転車の導入
    • 課題
      • 材料の使用と廃棄に関する環境規制の強化
  • 市場セグメンテーション分析
    • タイプ:高性能、高信頼性アプリケーション向けセラミックパッケージの適合性
    • 最終用途:優れた電気絶縁性と良好な熱管理を備えた民生用電子機器の普及
  • 市場ディスラプション分析
  • ポーターのファイブフォース分析
  • バリューチェーンとクリティカルパス分析
  • 価格分析
  • 技術分析
  • 特許分析
  • 貿易分析
  • 規制枠組みの分析

第6章 半導体・ICパッケージング材料市場:タイプ別

  • ボンディングワイヤ
  • セラミックパッケージ
  • ダイアタッチ材料
  • カプセル化樹脂
  • リードフレーム
  • 有機基質
  • はんだボール
  • 熱伝導材料

第7章 半導体・ICパッケージング材料市場:技術別

  • デュアルフラットノーリード
  • デュアルインライン
  • グリッド配列
  • クワッドフラットノーリード
  • クアッドフラットパッケージ
  • 小型アウトラインパッケージ

第8章 半導体・ICパッケージング材料市場:最終用途別

  • 航空宇宙および防衛
  • 自動車
  • 家電
  • ヘルスケア
  • ITおよび通信

第9章 南北アメリカの半導体・ICパッケージング材料市場

  • アルゼンチン
  • ブラジル
  • カナダ
  • メキシコ
  • 米国

第10章 アジア太平洋地域の半導体・ICパッケージング材料市場

  • オーストラリア
  • 中国
  • インド
  • インドネシア
  • 日本
  • マレーシア
  • フィリピン
  • シンガポール
  • 韓国
  • 台湾
  • タイ
  • ベトナム

第11章 欧州・中東・アフリカの半導体・ICパッケージング材料市場

  • デンマーク
  • エジプト
  • フィンランド
  • フランス
  • ドイツ
  • イスラエル
  • イタリア
  • オランダ
  • ナイジェリア
  • ノルウェー
  • ポーランド
  • カタール
  • ロシア
  • サウジアラビア
  • 南アフリカ
  • スペイン
  • スウェーデン
  • スイス
  • トルコ
  • アラブ首長国連邦
  • 英国

第12章 競合情勢

  • 市場シェア分析2023
  • FPNVポジショニングマトリックス, 2023
  • 競合シナリオ分析
    • アムコーとアップル、最大規模の先進半導体パッケージング施設建設に向け戦略的提携
    • レゾナック、シリコンバレーに新パッケージングソリューションセンターを開設し、半導体イノベーションの基盤を築く
    • 半導体パッケージングにおける戦略的拡大と革新
  • 戦略分析と提言

第13章 競争力のあるポートフォリオ

  • 主要企業プロファイル
  • 主要製品ポートフォリオ
図表

LIST OF FIGURES

  • FIGURE 1. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET RESEARCH PROCESS
  • FIGURE 2. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2023 VS 2030 (%)
  • FIGURE 5. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET DYNAMICS
  • FIGURE 7. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2023 VS 2030 (%)
  • FIGURE 8. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 9. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2023 VS 2030 (%)
  • FIGURE 10. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 11. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2023 VS 2030 (%)
  • FIGURE 12. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 13. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 14. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 15. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 16. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 17. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 18. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 19. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 20. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 21. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 22. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2018-2023 (USD MILLION)
  • TABLE 4. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2024-2030 (USD MILLION)
  • TABLE 5. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 6. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 7. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 8. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 9. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BONDING WIRES, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 10. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BONDING WIRES, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 11. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CERAMIC PACKAGES, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 12. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CERAMIC PACKAGES, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 13. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH MATERIALS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 14. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH MATERIALS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 15. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULATION RESINS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 16. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULATION RESINS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 17. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEADFRAMES, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 18. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEADFRAMES, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 19. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ORGANIC SUBSTRATE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 20. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ORGANIC SUBSTRATE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 21. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALLS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 22. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALLS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 23. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY THERMAL INTERFACE MATERIALS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 24. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY THERMAL INTERFACE MATERIALS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 25. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 26. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 27. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DUAL FLAT NO-LEADS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 28. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DUAL FLAT NO-LEADS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 29. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DUAL-IN-LINE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 30. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DUAL-IN-LINE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 31. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY GRID ARRAY, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 32. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY GRID ARRAY, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 33. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY QUAD FLAT NO-LEADS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 34. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY QUAD FLAT NO-LEADS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 35. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY QUAD FLAT PACKAGES, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 36. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY QUAD FLAT PACKAGES, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 37. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMALL OUTLINE PACKAGE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 38. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMALL OUTLINE PACKAGE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 39. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 40. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 41. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AEROSPACE & DEFENSE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 42. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AEROSPACE & DEFENSE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 43. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 44. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 45. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 46. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 47. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 48. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 49. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IT & TELECOMMUNICATION, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 50. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IT & TELECOMMUNICATION, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 51. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 52. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 53. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 54. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 55. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 56. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 57. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2023 (USD MILLION)
  • TABLE 58. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024-2030 (USD MILLION)
  • TABLE 59. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 60. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 61. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 62. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 63. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 64. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 65. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 66. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 67. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 68. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 69. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 70. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 71. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 72. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 73. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 74. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 75. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 76. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 77. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 78. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 79. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 80. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 81. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 82. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 83. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 84. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 85. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 86. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 87. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 88. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 89. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2018-2023 (USD MILLION)
  • TABLE 90. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2024-2030 (USD MILLION)
  • TABLE 91. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 92. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 93. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 94. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 95. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 96. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 97. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2023 (USD MILLION)
  • TABLE 98. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024-2030 (USD MILLION)
  • TABLE 99. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 100. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 101. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 102. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 103. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 104. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 105. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 106. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 107. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 108. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 109. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 110. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 111. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 112. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 113. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 114. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 115. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 116. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 117. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 118. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 119. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 120. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 121. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 122. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 123. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 124. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 125. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 126. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 127. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 128. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 129. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 130. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 131. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 132. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 133. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 134. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 135. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 136. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 137. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 138. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 139. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 140. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 141. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 142. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 143. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 144. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 145. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 146. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 147. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 148. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 149. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 150. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 151. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 152. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 153. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 154. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 155. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 156. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 157. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 158. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 159. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 160. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 161. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 162. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 163. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 164. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 165. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 166. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 167. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 168. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 169. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 170. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 171. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 172. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 173. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 174. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 175. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 176. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 177. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2023 (USD MILLION)
  • TABLE 178. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024-2030 (USD MILLION)
  • TABLE 179. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 180. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 181. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 182. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 183. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 184. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 185. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 186. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 187. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 188. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 189. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 190. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 191. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 192. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 193. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 194. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 195. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 196. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 197. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 198. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 199. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 200. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 201. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 202. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 203. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 204. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 205. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 206. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 207. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 208. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 209. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 210. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 211. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 212. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 213. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 214. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 215. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 216. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 217. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 218. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 219. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 220. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 221. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 222. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 223. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 224. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 225. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 226. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 227. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 228. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 229. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 230. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 231. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 232. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 233. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 234. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 235. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 236. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 237. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 238. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 239. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 240. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 241. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 242. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 243. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 244. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 245. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 246. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 247. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 248. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 249. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 250. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 251. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 252. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 253. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 254. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 255. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 256. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 257. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 258. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 259. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 260. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 261. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 262. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 263. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 264. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 265. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 266. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 267. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 268. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 269. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 270. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 271. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 272. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 273. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 274. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 275. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 276. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 277. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 278. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 279. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 280. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 281. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 282. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 283. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 284. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 285. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 286. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 287. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 288. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 289. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 290. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 291. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 292. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 293. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 294. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 295. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 296. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 297. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 298. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARK
目次
Product Code: MRR-7A22CB0E5917

[186 Pages Report] The Semiconductor & IC Packaging Materials Market size was estimated at USD 38.44 billion in 2023 and expected to reach USD 42.16 billion in 2024, at a CAGR 10.35% to reach USD 76.64 billion by 2030.

Semiconductor and Integrated Circuit (IC) packaging materials include a broad range of substances and components used to encase and protect electronic circuits or semiconductors. These materials serve as a physical shield and play critical roles in heat dissipation, electrical insulation, and enhancing the reliability and performance of the semiconductors. The expansion in their use is primarily driven by the burgeoning demand for consumer electronics, telecommunications equipment, and automotive electronics. As technology advances and electronic devices become more compact and powerful, the need for efficient, durable, and heat-resistant packaging materials has escalated. However, the industry faces challenges, notably concerning the environmental impact of some packaging materials and the quest for materials that can withstand increasingly high temperatures and harsh operating conditions. Addressing these disadvantages requires ongoing research and development to discover more sustainable materials and innovative packaging techniques that reduce waste and enhance performance. Nevertheless, the advent of 5G technology, the Internet of Things (IoT), artificial intelligence (AI), and the increasing adoption of electric vehicles (EVs) are expected to spur further growth. Moreover, the drive towards miniaturized devices with higher computing power signals a growing demand for advanced packaging solutions that can accommodate these trends. Innovations in materials science, such as the development of eco-friendly and high thermal conductivity materials, are poised to open new avenues for industry expansion, catering to the evolving needs of the technology landscape.

KEY MARKET STATISTICS
Base Year [2023] USD 38.44 billion
Estimated Year [2024] USD 42.16 billion
Forecast Year [2030] USD 76.64 billion
CAGR (%) 10.35%

Type: Suitability of ceramic packages for high-performance and high-reliability applications

Bonding wires are thin metal wires, often made from gold, aluminum, or copper, used to create electrical connections within a semiconductor device. They play a critical role in the functionality of the semiconductor, facilitating the flow of electrical signals and power within the chip and between the chip and the outside world. Ceramic packages are protective casings used to enclose semiconductor chips, offering high levels of protection against environmental factors such as moisture, temperature changes, and physical stress. Ceramics are preferred for their excellent thermal and electrical insulation properties, making them suitable for high-performance and high-reliability applications. Attach materials are adhesives or metal alloys used to bind the semiconductor die (or chip) to the substrate or package. They are crucial for both mechanical support and thermal management, ensuring the die remains firmly in place while also facilitating heat dissipation away from the chip.

Encapsulation resins are polymers used to encapsulate and protect the semiconductor chip and its internal connections. Leadframes are the metal structures within a semiconductor package that provide mechanical support and electrical connections between the silicon chip & the external circuitry. They are essential for the distribution of power and signals to and from the chip, playing a significant role in the device's overall performance. An organic substrate acts as the base layer upon which semiconductor devices are built. Made from organic polymers and designed to support various electronic components, these substrates offer a platform for interconnections within the semiconductor package, influencing the electrical performance and integration level of the final product. Solder balls, used in ball grid array (BGA) packaging, are tiny spheres of solder that form the electrical connections between the semiconductor package and the printed circuit board (PCB). They are critical for establishing a reliable physical and electrical interface between the chip package and its external environment. Thermal interface materials (TIMs) are substances inserted between the semiconductor device and its heat sink to enhance thermal conduction. By improving heat transfer efficiency from the chip to the heat-dissipating components, TIMs play a pivotal role in managing the operational temperature of semiconductor devices, ensuring they remain within safe operating limits.

End-use: Proliferation in consumer electronics for excellent electrical insulation and good thermal management

In the Aerospace & Defense sector, Semiconductor packaging materials used need to withstand extreme conditions, such as high radiation, extreme temperatures, and mechanical stress. High-performance ceramics and robust compound materials are commonly utilized to ensure the longevity and reliability of semiconductors in aerospace and defense applications. These materials enable crucial functions in navigation, communication, and surveillance systems. The automotive industry is witnessing a transformation with the increase in electronic components used in vehicles. Packaging materials in the automotive sector must ensure high reliability over the vehicle's lifespan, often in harsh environments. Materials used must resist vibrations, high temperatures, and moisture. Silicones and advanced polymers, known for their durability and heat resistance, are widely used. Consumer electronics, including smartphones, laptops, and wearables, demand semiconductor packaging materials that allow for lightweight, compact, and efficient designs. The focus here is on enhancing performance while minimizing space. Epoxy resins and plastic compounds, offering excellent electrical insulation and good thermal management, are preferred. In the healthcare sector, semiconductors are used in a wide array of applications, from diagnostic equipment to wearable health monitors. Packaging materials in healthcare devices must meet stringent criteria for biocompatibility, sterilization compatibility, and reliability. Specialized polymers and ceramics, safe for human exposure and capable of operating reliably in medical environments, are key to protecting and enhancing the performance of semiconductors in medical devices. In IT & telecommunications, the demand for faster data processing and communication drives the need for advanced semiconductor packaging materials. These materials must support high-speed signal transmission while dissipating heat efficiently to prevent overheating. High thermal conductivity materials including silicon carbide and advanced polymers are used to meet these needs, ensuring reliable and efficient operation of data centers, servers, and telecommunication equipment.

Regional Insights

In the Americas, the United States plays a leading role in the semiconductor packaging materials market in the face of advanced R&D capabilities and the presence of major semiconductor manufacturers. The region is experiencing a shift towards more sophisticated packaging solutions, driven by the demand for higher performance and smaller, more energy-efficient devices. Materials such as silicon, plastic, and glass, along with advanced composites, are heavily used. Increased investment in renewable energy & electric vehicles is also shaping the demand for semiconductor packaging materials in this region. The EMEA region presents a diverse scenario due to its varied economic and technological maturity across countries. Europe is at the forefront, characterized by its robust automotive and industrial sectors, which demand high-reliability semiconductor packages. Advanced packaging technologies that can withstand harsh environments are particularly in demand. The Middle East and Africa, though growing, represent a smaller segment of the global market but are rapidly evolving with investments in telecommunications and infrastructure development. The Asia Pacific region showcases the most dynamic and fastest-growing landscape for semiconductor and IC packaging materials, led by countries including China, South Korea, Taiwan, and Japan. These countries host some of the world's largest electronics manufacturers, driving the demand for a wide range of packaging materials. The region's market is characterized by a high volume of consumer electronics production, including smartphones, tablets, and other portable devices, requiring innovative packaging solutions that are cost-effective yet high-performing.

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the Semiconductor & IC Packaging Materials Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Semiconductor & IC Packaging Materials Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the Semiconductor & IC Packaging Materials Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Advanced Semiconductor Engineering Inc, AMETEK Electronic Components & Packaging, Amtech Microelectronics, Inc., ASE Group, California Fine Wire Co., Canatu Oy, Ceramtec GmbH, Chipbond Technology Corporation, Chipmos Technologies Inc., Deca Technologies, FlipChip International LLC, Fujitsu Semiconductor Limited, Henkel AG & Co. KGaA, Intel Corporation, Interconnect Systems Inc. (ISI), Kyocera Chemical Corporation, Microchip Technology, Powertech Technology, Inc., Samsung Electronics Co. Ltd, Siemens AG, Sumitomo Chemical Co., Ltd., Taiwan Semiconductor Manufacturing Company, Tianshui Huatian Technology Co., Ltd., Toray Industries, Inc., Unisem Berhad, and UTAC Group.

Market Segmentation & Coverage

This research report categorizes the Semiconductor & IC Packaging Materials Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Type
    • Bonding wires
    • Ceramic Packages
    • Die Attach Materials
    • Encapsulation Resins
    • Leadframes
    • Organic substrate
    • Solder Balls
    • Thermal Interface Materials
  • Technology
    • Dual Flat No-leads
    • Dual-in-line
    • Grid Array
    • Quad Flat no-leads
    • Quad Flat Packages
    • Small Outline Package
  • End-use
    • Aerospace & Defense
    • Automotive
    • Consumer Electronics
    • Healthcare
    • IT & Telecommunication
  • Region
    • Americas
      • Argentina
      • Brazil
      • Canada
      • Mexico
      • United States
        • California
        • Florida
        • Illinois
        • New York
        • Ohio
        • Pennsylvania
        • Texas
    • Asia-Pacific
      • Australia
      • China
      • India
      • Indonesia
      • Japan
      • Malaysia
      • Philippines
      • Singapore
      • South Korea
      • Taiwan
      • Thailand
      • Vietnam
    • Europe, Middle East & Africa
      • Denmark
      • Egypt
      • Finland
      • France
      • Germany
      • Israel
      • Italy
      • Netherlands
      • Nigeria
      • Norway
      • Poland
      • Qatar
      • Russia
      • Saudi Arabia
      • South Africa
      • Spain
      • Sweden
      • Switzerland
      • Turkey
      • United Arab Emirates
      • United Kingdom

The report offers valuable insights on the following aspects:

1. Market Penetration: It presents comprehensive information on the market provided by key players.

2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.

3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.

4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.

5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

1. What is the market size and forecast of the Semiconductor & IC Packaging Materials Market?

2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Semiconductor & IC Packaging Materials Market?

3. What are the technology trends and regulatory frameworks in the Semiconductor & IC Packaging Materials Market?

4. What is the market share of the leading vendors in the Semiconductor & IC Packaging Materials Market?

5. Which modes and strategic moves are suitable for entering the Semiconductor & IC Packaging Materials Market?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Rising demand for semiconductor and IC packaging materials for consumer electronics
      • 5.1.1.2. Relentless advancement in technology supporting innovative packaging materials
      • 5.1.1.3. Growing miniaturization and densification in electronic sector
    • 5.1.2. Restraints
      • 5.1.2.1. IP Concerns of semiconductor industry in outsourcing and testing
    • 5.1.3. Opportunities
      • 5.1.3.1. Integration with advance technologies
      • 5.1.3.2. Adoption of 5G and autonomous vehicles
    • 5.1.4. Challenges
      • 5.1.4.1. Increasing environmental regulations regarding the use and disposal of materials
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Type: Suitability of ceramic packages for high-performance and high-reliability applications
    • 5.2.2. End-use: Proliferation in consumer electronics for excellent electrical insulation and good thermal management
  • 5.3. Market Disruption Analysis
  • 5.4. Porter's Five Forces Analysis
    • 5.4.1. Threat of New Entrants
    • 5.4.2. Threat of Substitutes
    • 5.4.3. Bargaining Power of Customers
    • 5.4.4. Bargaining Power of Suppliers
    • 5.4.5. Industry Rivalry
  • 5.5. Value Chain & Critical Path Analysis
  • 5.6. Pricing Analysis
  • 5.7. Technology Analysis
  • 5.8. Patent Analysis
  • 5.9. Trade Analysis
  • 5.10. Regulatory Framework Analysis

6. Semiconductor & IC Packaging Materials Market, by Type

  • 6.1. Introduction
  • 6.2. Bonding wires
  • 6.3. Ceramic Packages
  • 6.4. Die Attach Materials
  • 6.5. Encapsulation Resins
  • 6.6. Leadframes
  • 6.7. Organic substrate
  • 6.8. Solder Balls
  • 6.9. Thermal Interface Materials

7. Semiconductor & IC Packaging Materials Market, by Technology

  • 7.1. Introduction
  • 7.2. Dual Flat No-leads
  • 7.3. Dual-in-line
  • 7.4. Grid Array
  • 7.5. Quad Flat no-leads
  • 7.6. Quad Flat Packages
  • 7.7. Small Outline Package

8. Semiconductor & IC Packaging Materials Market, by End-use

  • 8.1. Introduction
  • 8.2. Aerospace & Defense
  • 8.3. Automotive
  • 8.4. Consumer Electronics
  • 8.5. Healthcare
  • 8.6. IT & Telecommunication

9. Americas Semiconductor & IC Packaging Materials Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific Semiconductor & IC Packaging Materials Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa Semiconductor & IC Packaging Materials Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. Market Share Analysis, 2023
  • 12.2. FPNV Positioning Matrix, 2023
  • 12.3. Competitive Scenario Analysis
    • 12.3.1. Amkor and Apple Forge Strategic Alliance to Build Largest Advanced Semiconductor Packaging Facility
    • 12.3.2. Resonac Sets Foundation for Semiconductor Innovation with New Packaging Solution Center in Silicon Valley
    • 12.3.3. Strategic Expansion and Innovation in Semiconductor Packaging
  • 12.4. Strategy Analysis & Recommendation

13. Competitive Portfolio

  • 13.1. Key Company Profiles
  • 13.2. Key Product Portfolio