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1474071

半導体・ICパッケージング材料の世界市場-2024-2031年

Global Semiconductor and IC Packaging Materials Market - 2024-2031
出版日: | 発行: DataM Intelligence | ページ情報: 英文 195 Pages | 納期: 約2営業日

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半導体・ICパッケージング材料の世界市場-2024-2031年
出版日: 2024年05月02日
発行: DataM Intelligence
ページ情報: 英文 195 Pages
納期: 約2営業日
ご注意事項 :
本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
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  • 概要
  • 目次
概要

概要

世界の半導体・ICパッケージング材料市場は、2023年に431億米ドルに達し、2031年には937億米ドルに達すると予測され、予測期間2024-2031年のCAGRは10.2%で成長する見込みです。

電子ハードウェアの成長には、低レイテンシと消費電力を維持しながら、優れた性能、速度、帯域幅を実現できる計算能力が必要です。先進パッケージング技術は、このようなさまざまな性能期待と高度な異種集積要件を満たすのに理想的に適合しているため、企業は高速コンピューティング、人工知能、5Gの移り変わる需要を活用することができます。

主要な半導体パッケージングベンダーは、高性能コンピューティング、IoT、5Gデバイスの需要増加により、大幅な収益成長を遂げています。データセンター、インフラ、PC/ノートPC、ストレージからなるAmkorのコンピューティング部門は、総売上高の20%を占め、2022年第2四半期の18%から上昇しました。政府主導による自動車の電動化へのシフトが加速し、市場の需要を牽引しています。

2023年には、北米が世界の半導体・ICパッケージング材料市場の約35%を占め、支配的な地域になると予想されます。同地域での投資拡大が半導体パッケージング材料の需要を押し上げるとみられます。例えば、Texas Instrumentsは2022年2月、米国での半導体チップ製造に2031年まで数十億米ドルを投資すると発表しました。Texas Instrumentsは2025年まで米国での半導体チップ製造に年間35億米ドルを投資する意向を発表しました。

ダイナミクス

高性能半導体の技術進歩

半導体・IC基質、ボンディングワイヤー、ダイアタッチ材料、セラミックパッケージングはすべて、あらゆる電子機器に不可欠な部品です。これらの材料は、より高速で信頼性が高く、消費電力が少ない高性能集積回路の開発に役立っています。

半導体の急速な技術革新が市場の需要を押し上げています。2021年12月、インド政府はコロナウィルスの壊滅的な結果を受け、半導体産業を強化するために100億米ドルの奨励計画を承認しました。この要因は半導体・ICパッケージング材料の使用を促進し、市場成長を後押しすると思われます。

コンシューマーエレクトロニクスの需要増加

デジタル化の進展と技術革新の結果、コンシューマーエレクトロニクスの需要が高まっています。電気機器の小型化により、集積回路をマルチチップモジュールに組み込む必要があります。半導体・ICパッケージング材料は、信頼性と性能を向上させながら、フォームファクターの縮小を可能にすることで貢献しています。

さらに、画期的な技術とパッケージングシステムの運用効率向上に対する大手企業の継続的な研究開発投資は、市場を前進させます。例えば、2021年5月、Intelは先進3Dパッケージングと製造技術であるFoverosをサポートするため、Rio Rancho施設に35億米ドルを投資すると発表しました。これらの要因は、半導体・ICパッケージング材料市場の需要に影響を与えると思われます。

高コスト

原材料の高コストと集積回路製造の複雑なプロセスは、市場開発を制限する重要な要因です。半導体・ICパッケージング材料のコストが高いため、その使用が制限され、市場にマイナスの影響を与えます。また、ICは複雑であるため、ウエハー製造コストは著しく高いです。

自動車、コンシューマーエレクトロニクス、ヘルスケア、IT・通信、航空宇宙・防衛など幅広い産業に対応する半導体パッケージングユニットの設計、開発、実装には多額の初期投資が必要です。多様なチップや集積回路を複雑なパターンでパッケージングするため、全体的なコストは影響を受け、半導体・ICパッケージング材料市場の拡大には限界があります。

目次

第1章 調査手法と調査範囲

第2章 定義と概要

第3章 エグゼクティブサマリー

第4章 市場力学

  • 影響要因
    • 促進要因
      • 高性能半導体の技術進歩
      • コンシューマーエレクトロニクス需要の高まり
    • 抑制要因
      • コスト高
    • 機会
    • 影響分析

第5章 産業分析

  • ポーターのファイブフォース分析
  • サプライチェーン分析
  • 価格分析
  • 規制分析
  • ロシア・ウクライナ戦争の影響分析
  • DMIの見解

第6章 COVID-19分析

第7章 タイプ別

  • 有機基質
  • ボンディングワイヤー
  • リードフレーム
  • セラミックパッケージ
  • ダイアタッチ材料
  • サーマルインターフェース材料
  • はんだボール
  • 封止樹脂
  • その他

第8章 技術別

  • グリッドアレイ
  • ウエハーレベルパッケージング
  • スモールアウトラインパッケージ（SOP）
  • フラットノーリードパッケージ
  • デュアルインラインパッケージ
  • 3Dパッケージング
  • その他

第9章 エンドユーザー別

  • コンシューマーエレクトロニクス
  • 自動車
  • ヘルスケア
  • IT・通信
  • 航空宇宙・防衛
  • その他

第10章 地域別

  • 北米
    • 米国
    • カナダ
    • メキシコ
  • 欧州
    • ドイツ
    • 英国
    • フランス
    • イタリア
    • ロシア
    • その他欧州
  • 南米
    • ブラジル
    • アルゼンチン
    • その他南米
  • アジア太平洋
    • 中国
    • インド
    • 日本
    • オーストラリア
    • その他アジア太平洋地域
  • 中東・アフリカ

第11章 競合情勢

  • 競合シナリオ
  • 市況/シェア分析
  • M&A分析

第12章 企業プロファイル

  • Intel
    • 会社概要
    • 製品ポートフォリオと説明
    • 財務概要
    • 主な発展
  • Amkor Technology
  • Deca Technologies
  • Siemens
  • Samsung
  • Advanced Semiconductor Engineering Inc
  • Taiwan Semiconductor Manufacturing Company
  • Microchip Technology
  • Synapse Electronique
  • FlipChip International LLC

第13章 付録

目次
Product Code: MA8411

Overview

Global Semiconductor and IC Packaging Materials Market reached US$ 43.1 billion in 2023 and is expected to reach US$ 93.7 billion by 2031, growing with a CAGR of 10.2% during the forecast period 2024-2031.

The growth of electronic hardware needs the use of computational power capable of delivering great performance, speed and bandwidth while maintaining low latency and power consumption. Advance packaging technologies are ideally adapted to fulfill these different performance expectations and the advanced heterogeneous integration requirements, thus allowing enterprises to capitalize on the shifting demands of high-speed computing, artificial intelligence and 5G.

Major semiconductor packaging vendors are seeing significant revenue growth due to increased demand for high-performance computing, IoT and 5G devices. Amkor's computing division, consisting of data center, infrastructure, PC/laptop and storage, accounted for 20% of total sales, up from 18% in the second quarter of 2022. Government-implemented initiatives accelerate the shift toward car electrification, driving market demand.

In 2023, North America is expected to be the dominant region with about 35% of the global semiconductor and IC packaging materials market. Growing investments in the region are likely to drive up demand for semiconductor packaging materials. For example, Texas Instruments announced in February 2022 that it will invest billions of dollars in semiconductor chip manufacture in U.S. through 2031. Texas Instruments announced intentions to invest US$ 3.5 billion per year in semiconductor chip manufacturing in U.S. until 2025.

Dynamics

Technological Advancements for High-Performance Semiconductors

The semiconductor sector is expected to increase significantly during the forecast period. semiconductor and IC substrates, bonding wires, die attach materials and ceramic packaging are all essential components of any electronic device. The materials aid in the development of high-performance integrated circuits that are faster, more reliable and require less power.

Rapid technological breakthroughs in semiconductors boost market demand. In December 2021, the Indian government authorized a US$ 10 billion incentive plan to strengthen the semiconductor industry following the coronavirus's devastating consequences. The factors would encourage the usage of semiconductor and IC packaging materials, which would boost market growth.

Rising Demand for Consumer Electronics

Consumer electronics are in high demand as a result of growing digitization and technical breakthroughs. Miniaturization of electrical equipment necessitates the incorporation of integrated circuits into multi-chip modules. Semiconductor & IC packaging materials contribute by allowing for a reduced form factor with increased reliability and performance.

Furthermore, leading players' ongoing R&D investments in breakthrough technologies and improved operational efficiency of packaging systems propel the market forward. For example, in May 2021, Intel announced a US$ 3.5 billion investment in its Rio Rancho facility to support Foveros, an advanced 3D packaging and manufacturing technology. The factors will impact the semiconductor and integrated circuit packaging materials market demand.

High Costs

The raw materials high costs and the intricate process of integrated circuit production are important factors that limit market development. High cost of semiconductor and IC packaging materials limits their usage which negatively affects the market. Also, the wafer manufacturing cost is significantly higher because of the complexities of ICs.

A significant initial investment is required in the design, development and implementation of semiconductor packaging units to cater to a wide range of industries like automotive, consumer electronics, healthcare, IT & telecommunications and aerospace & defense. The overall cost gets affected by the packaging of diverse chips and integrated circuits with complicated patterning resulting in limited expansion of the semiconductor and IC packaging materials market.

Segment Analysis

The global semiconductor and IC packaging materials market is segmented based on type, technology, end-user and region.

Rising Consumer Electronics Drives the Segment Growth

Wafer-level packaging is expected to be the dominant segment with over 30% of the market during the forecast period 2024-2031. The increasing need for consumer electronics, the requirement for high-performance computing and the benefits of wafer-level packaging, including as energy efficiency, ultra-thinness and compact form factor, are driving the segment's growth.

In July 2021, JCET Group announced the formal launch of XDFOITM, a unique technology for ultra-high-density wafer-level packaging that will provide cost-effective options with maximum integration, high-density connectivity and excellent durability for a variety of chipsets. Such improvements would accelerate the expansion of the wafer-level packaging segment, increasing market demand.

Geographical Penetration

Rising Demand for High-Performance ICs in Asia-Pacific

Asia-Pacific is the dominant region in the global semiconductor and IC packaging materials market covering more than 35% of the market. The rising semiconductor sector, demand for high-performance integrated circuits and ongoing R&D initiatives by leading manufacturers are driving market expansion in this region. Taiwan Semiconductor Manufacturing Co. revealed in September 2021 that it was working on a new advanced small-outline packaging technology for the development of miniaturized systems.

Japan also has a large presence in the semiconductor and electronics industries, as it is home to some of the most important integrated circuit chip manufacturers. According to WSTS, Japan's semiconductor sector income increased by 14.2% in 2022 and is predicted to rise higher in the next years. The nation's packaging demand is increasing mostly because of the country's tremendous improvements in the semiconductor and integrated chip industries.

Competitive Landscape

The major global players in the market include Intel, Amkor Technology, Deca Technologies, Siemens, Samsung, Advanced Semiconductor Engineering Inc, Taiwan Semiconductor Manufacturing Company, Microchip Technology, Synapse Electronique and FlipChip International LLC.

COVID-19 Impact Analysis

The COVID-19 epidemic compelled manufacturing industries to rethink their traditional production procedures, primarily driving digital change and smart manufacturing practices throughout production lines. In accordance to the Semiconductor Industry Association, global semiconductor sales are estimated to reach US$ 515.1 billion in 2023. Semiconductors are critical components of electrical gadgets and the sector is extremely competitive.

The year-on-year drop rate in 2023 was 10.3%, with a rapid recovery projected in 2024. Notable semiconductor chip manufacturers include Intel and Samsung Electronics, with Intel producing US$ 58.4 billion and Samsung producing US$ 65.6 billion in semiconductor sales in 2022, putting them among the greatest businesses in terms of semiconductor sector revenues.

Russia-Ukraine War Impact

The Russia-Ukraine conflict has the potential to worsen semiconductor supply chain concerns and chip shortages that have plagued the industry. The greatest threat is to the supply of certain raw materials required in semiconductor manufacture, such as neon and palladium. With Ukraine as a major source of rare gases like neon, used in the manufacture of semiconductor fab lasers and Russia as a significant supplier of rare metals like palladium, there are concerns about the load on semiconductor chip supply chains.

Ukrainian enterprises, such as Cryoin, play an important role in the semiconductor supply chain. The companies produce specialty gases such as neon, helium, xenon and krypton, as well as their isotopes. The lack of semiconductors will have a domino effect and businesses such as the automotive sector, electrical appliances, cell phones and more will face an increase in costs and a collapse in production.

By Type

  • Organic Substrates
  • Bonding Wires
  • Leadframes
  • Ceramic Packages
  • Die Attach Materials
  • Thermal Interface Materials
  • Solder Balls
  • Encapsulation Resins
  • Others

By Technology

  • Grid Array
  • Wafer-level Packaging
  • Small-outline Package (SOP)
  • Flat no-leads Packages
  • Dual In-line Packages
  • 3D Packaging
  • Others

By End-User

  • Consumer Electronics
  • Automotive
  • Healthcare
  • IT & Telecommunication
  • Aerospace and Defense
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • France
    • Italy
    • Russia
    • Rest of Europe
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Asia-Pacific
    • China
    • India
    • Japan
    • Australia
    • Rest of Asia-Pacific
  • Middle East and Africa

Key Developments

  • In June 2021, Samsung revealed an updated collection of chipsets for its next-generation 5G solutions and products, which include Compact Macro, Massive MIMO radios and baseband units, which was commercially available in 2022.
  • In February 2021, Siemens Digital Industries Software and Advanced Semiconductor Engineering, Inc. recently revealed their collaboration to analyze complicated integrated circuit package assemblies that interact in a single system.

Why Purchase the Report?

  • To visualize the global semiconductor and IC packaging materials market segmentation based on type, technology, end-user and region, as well as understand key commercial assets and players.
  • Identify commercial opportunities by analyzing trends and co-development.
  • Excel data sheet with numerous data points of semiconductor and IC packaging materials market-level with all segments.
  • PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
  • Product mapping available as excel consisting of key products of all the major players.

The global semiconductor and IC packaging materials market report would provide approximately 62 tables, 65 figures and 195 pages.

Target Audience 2024

  • Manufacturers/ Buyers
  • Industry Investors/Investment Bankers
  • Research Professionals
  • Emerging Companies

Table of Contents

1.Methodology and Scope

  • 1.1.Research Methodology
  • 1.2.Research Objective and Scope of the Report

2.Definition and Overview

3.Executive Summary

  • 3.1.Snippet by Type
  • 3.2.Snippet by Technology
  • 3.3.Snippet by End-User
  • 3.4.Snippet by Region

4.Dynamics

  • 4.1.Impacting Factors
    • 4.1.1.Drivers
      • 4.1.1.1.Technological Advancements for High-Performance Semiconductors
      • 4.1.1.2.Rising Demand for Consumer Electronics
    • 4.1.2.Restraints
      • 4.1.2.1.High Costs
    • 4.1.3.Opportunity
    • 4.1.4.Impact Analysis

5.Industry Analysis

  • 5.1.Porter's Five Force Analysis
  • 5.2.Supply Chain Analysis
  • 5.3.Pricing Analysis
  • 5.4.Regulatory Analysis
  • 5.5.Russia-Ukraine War Impact Analysis
  • 5.6.DMI Opinion

6.COVID-19 Analysis

  • 6.1.Analysis of COVID-19
    • 6.1.1.Scenario Before COVID-19
    • 6.1.2.Scenario During COVID-19
    • 6.1.3.Scenario Post COVID-19
  • 6.2.Pricing Dynamics Amid COVID-19
  • 6.3.Demand-Supply Spectrum
  • 6.4.Government Initiatives Related to the Market During Pandemic
  • 6.5.Manufacturers Strategic Initiatives
  • 6.6.Conclusion

7.By Type

  • 7.1.Introduction
    • 7.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 7.1.2.Market Attractiveness Index, By Type
  • 7.2.Organic Substrates*
    • 7.2.1.Introduction
    • 7.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 7.3.Bonding Wires
  • 7.4.Leadframes
  • 7.5.Ceramic Packages
  • 7.6.Die Attach Materials
  • 7.7.Thermal Interface Materials
  • 7.8.Solder Balls
  • 7.9.Encapsulation Resins
  • 7.10.Others

8.By Technology

  • 8.1.Introduction
    • 8.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
    • 8.1.2.Market Attractiveness Index, By Technology
  • 8.2.Grid Array*
    • 8.2.1.Introduction
    • 8.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 8.3.Wafer-level Packaging
  • 8.4.Small-outline Package (SOP)
  • 8.5.Flat no-leads Packages
  • 8.6.Dual In-line Packages
  • 8.7.3D Packaging
  • 8.8.Others

9.By End-User

  • 9.1.Introduction
    • 9.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 9.1.2.Market Attractiveness Index, By End-User
  • 9.2.Consumer Electronics*
    • 9.2.1.Introduction
    • 9.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 9.3.Automotive
  • 9.4.Healthcare
  • 9.5.IT & Telecommunication
  • 9.6.Aerospace and Defense
  • 9.7.Others

10.By Region

  • 10.1.Introduction
    • 10.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
    • 10.1.2.Market Attractiveness Index, By Region
  • 10.2.North America
    • 10.2.1.Introduction
    • 10.2.2.Key Region-Specific Dynamics
    • 10.2.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.2.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
    • 10.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.2.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.2.6.1.U.S.
      • 10.2.6.2.Canada
      • 10.2.6.3.Mexico
  • 10.3.Europe
    • 10.3.1.Introduction
    • 10.3.2.Key Region-Specific Dynamics
    • 10.3.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.3.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
    • 10.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.3.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.3.6.1.Germany
      • 10.3.6.2.UK
      • 10.3.6.3.France
      • 10.3.6.4.Italy
      • 10.3.6.5.Russia
      • 10.3.6.6.Rest of Europe
  • 10.4.South America
    • 10.4.1.Introduction
    • 10.4.2.Key Region-Specific Dynamics
    • 10.4.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.4.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
    • 10.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.4.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.4.6.1.Brazil
      • 10.4.6.2.Argentina
      • 10.4.6.3.Rest of South America
  • 10.5.Asia-Pacific
    • 10.5.1.Introduction
    • 10.5.2.Key Region-Specific Dynamics
    • 10.5.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.5.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
    • 10.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.5.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.5.6.1.China
      • 10.5.6.2.India
      • 10.5.6.3.Japan
      • 10.5.6.4.Australia
      • 10.5.6.5.Rest of Asia-Pacific
  • 10.6.Middle East and Africa
    • 10.6.1.Introduction
    • 10.6.2.Key Region-Specific Dynamics
    • 10.6.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.6.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
    • 10.6.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

11.Competitive Landscape

  • 11.1.Competitive Scenario
  • 11.2.Market Positioning/Share Analysis
  • 11.3.Mergers and Acquisitions Analysis

12.Company Profiles

  • 12.1.Intel*
    • 12.1.1.Company Overview
    • 12.1.2.Product Portfolio and Description
    • 12.1.3.Financial Overview
    • 12.1.4.Key Developments
  • 12.2.Amkor Technology
  • 12.3.Deca Technologies
  • 12.4.Siemens
  • 12.5.Samsung
  • 12.6.Advanced Semiconductor Engineering Inc
  • 12.7.Taiwan Semiconductor Manufacturing Company
  • 12.8.Microchip Technology
  • 12.9.Synapse Electronique
  • 12.10.FlipChip International LLC

LIST NOT EXHAUSTIVE

13.Appendix

  • 13.1.About Us and Services
  • 13.2.Contact Us