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市場調査レポート
商品コード
1266893
サブ100nmリソグラフィ:市場分析と戦略的問題Sub-100nm Lithography: Market Analysis and Strategic Issues |
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サブ100nmリソグラフィ:市場分析と戦略的問題 |
出版日: 2024年03月01日
発行: Information Network
ページ情報: 英文
納期: 2~3営業日
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当レポートでは、サブ100nmリソグラフィ市場について調査分析し、リソグラフィの問題と動向、市場予測などの情報を提供しています。
Lithography tools are essential if chipmakers are to follow their shrinkage roadmap. Intel, Samsung and TSMC have all set out shrinkage roadmaps for 5nm nodes and below, aiming to deliver chips with superior performance at a lower cost.
ASML is the dominant leader in the semiconductor lithography sector, with Nikon and Canon its chief competitors, and the only manufacturer of EUV lithography.
Chipmakers remain committed to their leading-edge roadmap: ASML's main business drivers are chipmakers' leading-edge roadmaps, which detail the timeline for the development of smaller and more complex semiconductors. We believe chipmakers will increasingly use ASML's extreme ultraviolet lithography (EUV) tool in their manufacturing processes. Our research has found that the main buyers of EUV this year and next year will be TSMC, Samsung and, potentially, Intel: all three are still committed to their roadmaps.
Foundry / logic some customers are leveraging EUV to reduce the number of steps for specific layer; however other layers continue to add additional steps. For DRAM, our conversation highlighted that more complex patterning schemes (vs. foundry / logic) should result in EUV adoption targeted at very specific layers that can provide cost reductions. We note that this will be more vendor dependent and based on design schemes.