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モールド相互接続デバイス（MID）の世界市場

Molded Interconnect Device (MID)

出版日
ページ情報
英文 223 Pages
納期
即日から翌営業日
適宜更新あり
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=145.41円
モールド相互接続デバイス（MID）の世界市場
出版日: 2025年07月02日
発行: Global Industry Analysts, Inc.
ページ情報: 英文 223 Pages
納期: 即日から翌営業日
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  • 概要
  • 目次
概要

モールド相互接続デバイス（MID）の世界市場は2030年までに57億米ドルに到達

2024年に26億米ドルと推定されるモールド相互接続デバイス（MID）の世界市場は、分析期間2024-2030年にCAGR 13.9%で成長し、2030年には57億米ドルに達すると予測されます。本レポートで分析したセグメントの1つであるアンテナ＆接続モジュールは、CAGR13.9％を記録し、分析期間終了時には19億米ドルに達すると予測されます。コネクタ＆スイッチ分野の成長率は、分析期間中CAGR 12.8％と推定されます。

米国市場は6億6,810万米ドル、中国はCAGR 17.9％で成長予測

米国のモールド相互接続デバイス（MID）市場は、2024年に6億6,810万米ドルと推定されます。世界第2位の経済大国である中国は、2030年までに14億米ドルの市場規模に達すると予測され、分析期間2024-2030年のCAGRは17.9%です。その他の注目すべき地域別市場としては、日本とカナダがあり、分析期間中のCAGRはそれぞれ9.5％と11.4％と予測されています。欧州では、ドイツがCAGR 10.6%で成長すると予測されています。

世界のモールド相互接続デバイス（MID）市場- 主要動向と促進要因まとめ

モールド相互接続デバイス（MID）とは何か、なぜ革命的なのか？

モールド相互接続デバイス（MID）は、熱可塑性プラスチック成形品に機械的機能と電気的機能を一体化した汎用性の高い部品です。この技術により、プラスチック基板に直接回路を組み込むことができ、プラスチックハウジングと電子配線をコンパクトで軽量な一つの部品にまとめることができます。MIDは、信頼性と性能を向上させながら小型化を促進することができるため、スマートフォン、車載センサー、ヘルスケア機器など、さまざまなハイテク・アプリケーションでますます使用されるようになっています。複数の機能を統合することで、製品のサイズと重量が軽減されるだけでなく、組み立て工程が簡素化され、必要な部品点数が減り、最終的には全体的な製造コストが削減されます。

技術の進歩はMID産業をどのように形成しているか？

技術の進歩は、MIDの能力と用途を拡大する上で重要な役割を果たしています。3D成形プロセスとレーザーダイレクトストラクチャリング（LDS）における革新は、特に大きな変革をもたらしています。例えば、LDS技術は、3次元表面上に複雑な回路経路をより高精度に形成することを可能にし、設計の柔軟性とMID技術の恩恵を受けられる製品タイプを大幅に拡大します。さらに、高導電性ポリマー複合材料の開発やメッキ技術の向上など、材料科学の進歩はMIDの電気的性能と耐久性を高めています。こうした技術改良により、より複雑で信頼性の高いデバイスを幅広い産業分野で製造できるようになりました。

成形相互接続デバイスの採用に影響を与えている市場動向とは？

MIDの採用は、エレクトロニクス市場で進行中の小型化と集積化の動向に大きな影響を受けています。デバイスが小型化し、デバイスの機能性に対する消費者の期待が高まるにつれ、メーカーはこれらの要求を満たすためにMID技術に目を向けています。この動向は、より薄型で機能満載のデバイスを求め続けているコンシューマー・エレクトロニクス分野で顕著です。自動車業界では、特に高度な安全システムやインフォテインメント・システムなど、1台あたりの電子部品搭載量が増加しているため、複雑な回路を狭いスペースに組み込むことができるMIDのニーズが高まっています。さらに、医療分野では、スペースと信頼性が重要な医療用ウェアラブルやインプラントのコンパクトな統合ソリューションにMIDが利用されています。

モールド相互接続デバイス市場の成長の原動力は？

成型相互接続デバイス市場の成長は、技術革新、業界の需要、消費者行動のダイナミックな相互作用を反映するいくつかの要因によってもたらされます。3Dプリンティングとレーザー構造化技術の進歩により、MIDの応用範囲が広がり、小型電子デバイスの設計と製造に不可欠なものとなっています。また、より持続可能な製造プロセスを求める動きも、従来の回路基板や電子アセンブリに関連する廃棄物や環境への影響を削減するMIDを後押ししています。さらに、高機能でありながら小型でエネルギー効率の高い電子製品に対する消費者の需要の高まりが、MID市場の継続的な成長を促しています。自動車、家電、ヘルスケアなどの業界は特に重要で、MIDが提供する統合能力と設計の柔軟性にますます依存するようになり、製品提供の革新と強化が進んでいます。これらの要因が総合的に、現代の技術情勢におけるモールド相互接続デバイス市場の急成長と拡大を裏付けています。

セグメント

タイプ（アンテナ＆コネクティビティモジュール、コネクタ＆スイッチ、センサ、照明、その他のタイプ）、エンドユーズ（家電、通信、医療、自動車、産業、その他のエンドユーズ）

調査対象企業の例（注目の46社）

  • 2E Mechatronic GmbH & Co. KG
  • HARTING AG & Co. KG
  • JOHNAN Corporation
  • LPKF Laser & Electronics AG
  • MID Solutions GmbH
  • Molex LLC
  • Multiple Dimensions AG
  • TE Connectivity Ltd.

AIインテグレーション

Global Industry Analystsは、有効な専門家コンテンツとAIツールにより、市場情報と競合情報を変革しています。

Global Industry Analystsは、LLMや業界固有のSLMを照会する一般的な規範に従う代わりに、ビデオ記録、ブログ、検索エンジン調査、膨大な量の企業、製品/サービス、市場データなど、世界中の専門家から収集したコンテンツのリポジトリを構築しました。

関税影響係数

Global Industry Analystsは、本社の国、製造拠点、輸出入（完成品とOEM）に基づく企業の競争力の変化を予測しています。この複雑で多面的な市場力学は、売上原価（COGS）の増加、収益性の低下、サプライチェーンの再構築など、ミクロおよびマクロの市場力学の中でも特に競合他社に影響を与える見込みです。

目次

第1章 調査手法

第2章 エグゼクティブサマリー

  • 市場概要
  • 主要企業
  • 市場動向と促進要因
  • 世界市場の見通し

第3章 市場分析

  • 米国
  • カナダ
  • 日本
  • 中国
  • 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • スペイン
  • ロシア
  • その他欧州
  • アジア太平洋
  • オーストラリア
  • インド
  • 韓国
  • その他アジア太平洋地域
  • ラテンアメリカ
  • アルゼンチン
  • ブラジル
  • メキシコ
  • その他ラテンアメリカ
  • 中東
  • イラン
  • イスラエル
  • サウジアラビア
  • アラブ首長国連邦
  • その他中東
  • アフリカ

第4章 競合

目次
Product Code: MCP13437

Global Molded Interconnect Device (MID) Market to Reach US$5.7 Billion by 2030

The global market for Molded Interconnect Device (MID) estimated at US$2.6 Billion in the year 2024, is expected to reach US$5.7 Billion by 2030, growing at a CAGR of 13.9% over the analysis period 2024-2030. Antennae & Connectivity Modules, one of the segments analyzed in the report, is expected to record a 13.9% CAGR and reach US$1.9 Billion by the end of the analysis period. Growth in the Connectors & Switches segment is estimated at 12.8% CAGR over the analysis period.

The U.S. Market is Estimated at US$668.1 Million While China is Forecast to Grow at 17.9% CAGR

The Molded Interconnect Device (MID) market in the U.S. is estimated at US$668.1 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$1.4 Billion by the year 2030 trailing a CAGR of 17.9% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 9.5% and 11.4% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 10.6% CAGR.

Global Molded Interconnect Device (MID) Market - Key Trends & Drivers Summarized

What Is a Molded Interconnect Device (MID) and Why Is It Revolutionary?

A Molded Interconnect Device (MID) is a highly versatile component that integrates both mechanical and electrical functions within a single molded thermoplastic unit. This technology allows for the incorporation of circuitry directly onto plastic substrates, combining the plastic housing and electronic interconnects into one compact and lightweight part. MIDs are increasingly used in various high-tech applications such as smartphones, automotive sensors, and healthcare devices due to their ability to facilitate miniaturization while enhancing reliability and performance. The integration of multiple functions not only reduces the size and weight of the product but also simplifies assembly processes, reduces the number of components required, and ultimately, cuts overall manufacturing costs.

How Are Technological Advancements Shaping the MID Industry?

Technological advancements play a crucial role in expanding the capabilities and applications of MIDs. Innovations in 3D molding processes and laser direct structuring (LDS) have particularly been transformative. LDS technology, for example, allows for greater precision in creating intricate circuit paths on three-dimensional surfaces, vastly increasing the design flexibility and the types of products that can benefit from MID technology. Additionally, advancements in materials science, including the development of highly conductive polymer composites and improved plating techniques, enhance the electrical performance and durability of MIDs. These technological improvements enable the production of more complex and reliable devices across a broader range of industries.

What Market Trends Are Influencing the Adoption of Molded Interconnect Devices?

The adoption of MIDs is heavily influenced by the ongoing trends in miniaturization and integration within the electronics market. As devices become smaller and consumer expectations for device functionality increase, manufacturers are turning to MID technology to meet these demands. This trend is evident in the consumer electronics sector, where there is a continuous push for thinner, more feature-packed devices. In the automotive industry, the increasing electronic content per vehicle, particularly for advanced safety and infotainment systems, drives the need for MIDs that can incorporate complex circuitry into tight spaces. Additionally, the medical sector utilizes MIDs for compact, integrated solutions in medical wearables and implants, where space and reliability are critical.

What Drives the Growth in the Molded Interconnect Devices Market?

The growth in the molded interconnect devices market is driven by several factors, reflecting the dynamic interplay of technological innovation, industry demands, and consumer behavior. Advances in 3D printing and laser structuring technologies have broadened the scope of MID applications, making them indispensable in the design and manufacture of compact electronic devices. The push for more sustainable manufacturing processes also favors MIDs, as they reduce the waste and environmental impact associated with traditional circuit boards and electronic assemblies. Furthermore, the increasing consumer demand for sophisticated, yet smaller and energy-efficient electronic products stimulates continuous growth in the MID market. Industries such as automotive, consumer electronics, and healthcare are particularly pivotal, as they increasingly rely on the integration capabilities and design flexibility offered by MIDs to innovate and enhance product offerings. These factors collectively underscore the burgeoning reliance on and expansion of the molded interconnect devices market in the modern technological landscape.

SCOPE OF STUDY:

The report analyzes the Molded Interconnect Device (MID) market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Type (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting, Other Types); End-Use (Consumer Electronics, Telecommunications, Medical, Automotive, Industrial, Other End-Uses)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 46 Featured) -

  • 2E Mechatronic GmbH & Co. KG
  • HARTING AG & Co. KG
  • JOHNAN Corporation
  • LPKF Laser & Electronics AG
  • MID Solutions GmbH
  • Molex LLC
  • Multiple Dimensions AG
  • TE Connectivity Ltd.

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TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • Tariff Impact on Global Supply Chain Patterns
    • Global Economic Update
    • Molded Interconnect Device (MID) - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Advancements in 3D Molding Technologies Propel the Growth of Molded Interconnect Devices (MIDs)
    • Increasing Demand for Miniaturization in Consumer Electronics Spurs Adoption of MIDs
    • Expansion of Automotive Applications Drives Innovations in MID Technology
    • Integration of MIDs in Medical Devices Enhances Functionality and Compactness
    • Rise of IoT and Connected Devices Boosts Market Opportunities for MIDs
    • Technological Convergence in Multi-Functional Devices Amplifies Use of Molded Interconnect Devices
    • Growing Environmental Regulations Promote Development of Eco-Friendly MID Materials
    • Adoption of MID Technology in Smart Wearables Generates Market Growth
    • Advancements in Laser Direct Structuring (LDS) Techniques Expand MID Capabilities
    • Increasing Role of MIDs in Aerospace and Defense for Lightweight Solutions
    • Consumer Demand for Sleek, Integrated Interfaces Strengthens Market for MIDs
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Molded Interconnect Device (MID) Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 3: World 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2025 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for Antennae & Connectivity Modules by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 5: World 6-Year Perspective for Antennae & Connectivity Modules by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 6: World Recent Past, Current & Future Analysis for Connectors & Switches by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 7: World 6-Year Perspective for Connectors & Switches by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 9: World 6-Year Perspective for Sensors by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for Lighting by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 11: World 6-Year Perspective for Lighting by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 12: World Recent Past, Current & Future Analysis for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 13: World 6-Year Perspective for Other Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 15: World 6-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 16: World Recent Past, Current & Future Analysis for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 17: World 6-Year Perspective for Telecommunications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 18: World Recent Past, Current & Future Analysis for Medical by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 19: World 6-Year Perspective for Medical by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 21: World 6-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 22: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 23: World 6-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 24: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 25: World 6-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 26: USA Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 27: USA 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 28: USA Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 29: USA 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • CANADA
    • TABLE 30: Canada Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 31: Canada 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 32: Canada Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Canada 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • JAPAN
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 34: Japan Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 35: Japan 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 36: Japan Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 37: Japan 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • CHINA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 38: China Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 39: China 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 40: China Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 41: China 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • EUROPE
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 42: Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 43: Europe 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2025 & 2030
    • TABLE 44: Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 45: Europe 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 46: Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 47: Europe 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • FRANCE
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 48: France Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 49: France 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 50: France Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 51: France 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • GERMANY
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 52: Germany Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 53: Germany 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 54: Germany Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 55: Germany 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • ITALY
    • TABLE 56: Italy Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Italy 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 58: Italy Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 59: Italy 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • UNITED KINGDOM
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 60: UK Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 61: UK 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 62: UK Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 63: UK 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • SPAIN
    • TABLE 64: Spain Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 65: Spain 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 66: Spain Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 67: Spain 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • RUSSIA
    • TABLE 68: Russia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Russia 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 70: Russia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 71: Russia 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • REST OF EUROPE
    • TABLE 72: Rest of Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 73: Rest of Europe 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 74: Rest of Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 75: Rest of Europe 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • ASIA-PACIFIC
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 76: Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 77: Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2025 & 2030
    • TABLE 78: Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 79: Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 80: Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • AUSTRALIA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
    • TABLE 82: Australia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 83: Australia 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 84: Australia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 85: Australia 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • INDIA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
    • TABLE 86: India Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 87: India 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 88: India Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 89: India 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • SOUTH KOREA
    • TABLE 90: South Korea Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 91: South Korea 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 92: South Korea Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 93: South Korea 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • REST OF ASIA-PACIFIC
    • TABLE 94: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 95: Rest of Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 96: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 97: Rest of Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • LATIN AMERICA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
    • TABLE 98: Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 99: Latin America 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2025 & 2030
    • TABLE 100: Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 101: Latin America 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 102: Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 103: Latin America 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • ARGENTINA
    • TABLE 104: Argentina Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 105: Argentina 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 106: Argentina Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 107: Argentina 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • BRAZIL
    • TABLE 108: Brazil Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 109: Brazil 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 110: Brazil Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 111: Brazil 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • MEXICO
    • TABLE 112: Mexico Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 113: Mexico 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 114: Mexico Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 115: Mexico 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • REST OF LATIN AMERICA
    • TABLE 116: Rest of Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 117: Rest of Latin America 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 118: Rest of Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 119: Rest of Latin America 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • MIDDLE EAST
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
    • TABLE 120: Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 121: Middle East 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2025 & 2030
    • TABLE 122: Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 123: Middle East 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 124: Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 125: Middle East 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • IRAN
    • TABLE 126: Iran Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 127: Iran 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 128: Iran Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 129: Iran 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • ISRAEL
    • TABLE 130: Israel Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 131: Israel 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 132: Israel Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 133: Israel 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • SAUDI ARABIA
    • TABLE 134: Saudi Arabia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 135: Saudi Arabia 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 136: Saudi Arabia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 137: Saudi Arabia 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • UNITED ARAB EMIRATES
    • TABLE 138: UAE Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 139: UAE 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 140: UAE Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 141: UAE 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • REST OF MIDDLE EAST
    • TABLE 142: Rest of Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 143: Rest of Middle East 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 144: Rest of Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 145: Rest of Middle East 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • AFRICA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
    • TABLE 146: Africa Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 147: Africa 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 148: Africa Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 149: Africa 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030

IV. COMPETITION