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SiCウエハー研磨の世界市場-2024-2031年

Global SiC Wafer Polishing Market - 2024-2031

出版日: | 発行: DataM Intelligence | ページ情報: 英文 187 Pages | 納期: 約2営業日

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SiCウエハー研磨の世界市場-2024-2031年
出版日: 2024年05月02日
発行: DataM Intelligence
ページ情報: 英文 187 Pages
納期: 約2営業日
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本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
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概要

概要

SiCウエハー研磨の世界市場は、2023年に3億米ドルに達し、2031年には38億米ドルに達すると予測され、予測期間2024-2031年のCAGRは37.3%で成長します。

パワーエレクトロニクス、自動車、通信、再生可能エネルギーなど様々な産業でSiCベースの半導体デバイスの採用が増加しており、予測期間中の市場成長を後押ししています。SiCウエハは、その優れた電気特性と耐久性により、高性能パワーエレクトロニクス、高周波部品、センサーの製造に不可欠です。世界の電気自動車導入の急増は、SiCウエハーと研磨基板の需要を促進しています。SiCベースのパワーエレクトロニクスは、その効率性と高速スイッチング機能により、電気自動車のドライブトレインや充電インフラにとって極めて重要です。

北米は、持続可能な輸送を求める消費者の環境規制に後押しされ、米国とカナダで電気自動車の採用が増加しているため、市場を独占している地域です。SiCウエハは、電気自動車のドライブトレインに使用されるインバータやコンバータなどのパワーエレクトロニクス部品の製造において重要な役割を果たしています。この地域の優れたSiCウエハーサービスに対する需要は、拡大するEV産業が後押ししています。北米では、風力エネルギーや太陽エネルギーのような再生可能エネルギーに多大な財源が投入されています。SiCベースのパワーエレクトロニクスは、温度変化に対する耐性が優れているため、再生可能エネルギーシステムに適しています。北米では、再生可能エネルギー産業の発展に伴い、電力変換やエネルギー管理を含む用途でSiCウエハーの需要がますます高まっています。

ダイナミクス

世界の電気自動車(EV)普及の高まり

先進のパワーエレクトロニクスコンポーネントは、電気自動車の推進システム、バッテリー管理、充電インフラにとって極めて重要です。SiCベースのパワーデバイスは、従来のシリコンベースのものと比較して、効率の向上、スイッチングインスタンスの高速化、熱性能の向上など、いくつかの利点があります。高出力・高周波パワーモジュール、インバーター、車載充電器の製造に使用されるSiCウエハーと研磨部品は、電気自動車の利用が増加するにつれて需要が高まっています。Virta Globalのデータによると、2021年には世界で67億5,000万台のEVが販売され、2022年にはEVの販売台数が100億台増加します。2022年のEV販売台数は約138億台で、中国が圧倒的に多いです。

電気自動車の全体的な効率と航続距離は、SiCベースのパワーエレクトロニクスを使用することで向上します。SiCウエハーはパワーコンバーターやインバーターに使用され、回生ブレーキを改善し、電力変換時のエネルギー損失を低減し、効率を犠牲にすることなく、より高い動作温度を可能にします。EV市場におけるSiCベースのソリューションの成長は、このような効率性の利点によって牽引されており、これは航続距離の延長、バッテリー寿命の向上、車両性能の向上につながります。

パワーエレクトロニクスと半導体デバイスにおけるSiCウエハーの採用拡大

低スイッチング損失、高熱伝導性、高ブレークアップ電圧など、SiCウエハーの優れた特性により、SiCウエハーはパワーエレクトロニクス分野で人気があります。これらの特性により、SiCベースのパワーデバイスは非常に効率的で、より高い温度と電力密度で機能することができます。パワーエレクトロニクスにおけるSiCウエハーの使用は、産業界がますます電力効率の高いソリューションを求めるようになるにつれて、これらのデバイスの最高の効率と信頼性を保証するための正確な研磨の必要性を高めています。自動車産業、特にEVやHEVは、車載充電インフラ、バッテリー管理システム、ドライブトレインにおいて、SiCベースのパワーエレクトロニクスに大きく依存しています。

SiCベースのパワーデバイスは、風力発電やエネルギー貯蔵を含むシステム向けに効率的なエネルギー変換とパワーコンディショニングを提供するため、再生可能エネルギー部門にとって有益です。SiCウエハーは、再生可能エネルギーシステムの電力供給において、より高い変換効率、より低い損失、より高い信頼性を提供します。さまざまな用途に使用される研磨SiCウエハーのニーズは、世界の再生可能エネルギープロジェクトの拡大によって高まっています。

高い初期投資

研磨パッド、計測機器、化学的機械的平坦化装置など、SiCウエハー研磨に必要な機械や装置は、多額の財政投資を必要とします。半導体産業が要求する表面平滑性と平坦性を正確に達成するためには、専門的な工具が不可欠です。SiCウエハー研磨には、コンタミネーションを防ぎ、プロセスの再現性を保証するために、湿度とパーティクルレベルを調整したクリーンルーム条件が頻繁に要求されます。クリーンルーム設備の維持・設置には、空調システム、ろ過装置、継続的なクリーンルームのメンテナンスなどが含まれ、初期投資費用は増加します。

また、SiCウエハー研磨に使用される研磨材や研磨パッドは消耗品であり、ランニングコストの要因となります。業界標準とプロセス要件を満たす高品質の材料と消耗品を調達することは、研磨設備の初期投資と継続的な運用コストを増加させる。SiCウエハー研磨装置の運転には、材料科学、半導体製造、研磨技術、および計測の専門知識を持つ熟練した技術者、エンジニア、およびオペレーターが必要です。人材を育成し、高度な研磨装置の操作と保守ができる有能な労働力を構築することは、追加的なコストと人的資本への投資を意味します。

目次

第1章 調査手法と調査範囲

第2章 定義と概要

第3章 エグゼクティブサマリー

第4章 市場力学

  • 影響要因
    • 促進要因
      • 世界の電気自動車(EV)普及の高まり
      • パワーエレクトロニクスおよび半導体デバイスにおけるSiCウエハーの採用拡大
    • 抑制要因
      • 高い初期投資
    • 機会
    • 影響分析

第5章 産業分析

  • ポーターのファイブフォース分析
  • サプライチェーン分析
  • 価格分析
  • 規制分析
  • ロシア・ウクライナ戦争の影響分析
  • DMIの見解

第6章 COVID-19分析

第7章 プロセス別

  • 機械
  • 化学機械
  • 電解研磨
  • 化学
  • プラズマアシスト
  • その他

第8章 製品別

  • 研磨パウダー
  • 研磨パッド
  • ダイヤモンドスラリー
  • コロイダルシリカ懸濁液

第9章 用途別

  • パワーエレクトロニクス
  • LED
  • センサー・検出器
  • RF・マイクロ波デバイス

第10章 地域別

  • 北米
    • 米国
    • カナダ
    • メキシコ
  • 欧州
    • ドイツ
    • 英国
    • フランス
    • イタリア
    • スペイン
    • その他欧州
  • 南米
    • ブラジル
    • アルゼンチン
    • その他南米
  • アジア太平洋
    • 中国
    • インド
    • 日本
    • オーストラリア
    • その他アジア太平洋地域
  • 中東・アフリカ

第11章 競合情勢

  • 競合シナリオ
  • 市況/シェア分析
  • M&A分析

第12章 企業プロファイル

  • Kemnet International
    • 会社概要
    • 製品ポートフォリオと説明
    • 財務概要
    • 主な発展
  • Entegris
  • Ijin Diamond
  • Fujimi Corporation
  • Saint-Gobain
  • JSR Corporation
  • Engis Corporation
  • Ferro Corporation
  • M
  • DuPont Incorporated

第13章 付録

目次
Product Code: ICT8394

Overview

Global SiC Wafer Polishing Market reached US$ 0.3 Billion in 2023 and is expected to reach US$ 3.8 Billion by 2031, growing with a CAGR of 37.3% during the forecast period 2024-2031.

The rising adoption of SiC-based semiconductor devices in various industries like power electronics, automotive, telecommunications and renewable energy help to boost market growth over the forecast period. SiC wafers are essential for manufacturing high-performance power electronics, Radio Frequency components and sensors due to their superior electrical properties and durability. The surge in electric vehicle adoption globally is fueling the demand for SiC wafers and polished substrates. SiC-based power electronics are crucial for EV drivetrains and charging infrastructure due to their efficiency and fast-switching capabilities.

Growing merger and acquisition strategies by the major key players help to boost market growth over the forecast period. For instance, on December 02, 2021, Soitec, acquired NovaSiC which helps to strengthen SiC wafer technology. The acquisition allows Soitec to drive the development of semiconductors for power supply systems in electromobility and industrial applications, a press release reads. The acquisition of NovaSiC and the integration of its expertise in wafering, polishing and reclaiming brings the latest technology building block for Soitec to deliver an optimal final product and prepare the industrialization phase of our SmartSiC product line.

North America is the dominating region in the market due to the growing adoption of electric vehicles is on the rise in U.S. and Canada driven by consumer environmental regulations for sustainable transportation. SiC wafers play an important role in manufacturing power electronics components like inverters and converters used in EV drivetrains. The demand in the region for superior SiC wafer services is fueled by the expanding EV industry. Significant financial resources like wind and solar energy, have been poured into renewable energy sources in North America. Because of their remarkable resistance to temperature changes, SiC-based power electronics are a good fit for renewable energy systems. SiC wafers are growing increasingly in demand in North America for applications involving power conversion and energy management as the renewable energy industry develops.

Dynamics

Rise in Electric Vehicle (EV) Adoption Globally

Advanced power electronics components are crucial to the propulsion systems, battery management and charging infrastructure of electric vehicles. Compared to their conventional silicon-based counterparts, SiC-based power devices provide several benefits, such as increased efficiency, faster switching instances and better thermal performance. SiC wafers and polished components, which are used for producing high-power and high-frequency power modules, inverters and onboard chargers, are becoming increasingly in demand as EV usage rises. According to the data given by Virta Global in 2021, 6.75 Billion EVs were sold globally and in 2022, EV sales increased by 10 Billion. China is a dominating region in the sales of EV accounted around sales of around 13.8 Billion cars in 2022.

The overall efficiency and range of electric automobiles are enhanced using SiC-based power electronics. SiC wafers are used in power converters and inverters to improve regenerative braking, lower energy losses during power conversion and allow for greater operating temperatures without sacrificing efficiency. The growth of SiC-based solutions in the EV market is being driven by these efficiency benefits, which translate into longer driving ranges, better battery life and greater vehicle performance.

Growing Adoption of SiC Wafers in Power Electronics and Semiconductor Devices

Due to its remarkable qualities, which include low switching losses, high thermal conductivity and high breakup voltage, SiC wafers are popular in power electronics. Because of these characteristics, SiC-based power devices are very efficient and can function at greater temperatures and power densities. The use of SiC wafers in power electronics increases the need for accurate polishing to guarantee the best efficiency and reliability of these devices as industries demand increasingly power-efficient solutions. The automobile industry and EVs and HEVs in particular, is significantly dependent on SiC-based power electronics for its onboard charging infrastructure, battery management systems and drivetrains.

SiC-based power devices are beneficial to the renewable energy sector because they offer efficient energy conversion and power conditioning for systems including wind and energy storage. SiC wafers offer greater conversion efficiencies, lower losses and increased reliability in power supply for renewable energy systems. The need for polished SiC wafers intended for various applications has been driven by the expansion of renewable energy projects globally.

High Initial Investment

The machinery and equipment needed for SiC wafer polishing, such as as polishing pads, metrology instruments and Chemical-Mechanical Planarization systems, interest a substantial financial investment. The specialist tools are essential for achieving precisely the surface smoothness and flatness demanded by the semiconductor industry. Cleanroom conditions with regulated humidity and particle levels are frequently required for the polishing of SiC wafers to prevent contamination and guarantee process repeatability. The initial investment expenses increase with the maintenance and establishment of cleanroom facilities, which include HVAC systems, filtration units and ongoing cleanroom maintenance.

Abrasives and polishing pads used in SiC wafer polishing are consumables that contribute to operational expenses. Procuring high-quality materials and consumables that meet industry standards and process requirements adds to the initial investment and ongoing operational costs for polishing facilities. Operating SiC wafer polishing equipment requires skilled technicians, engineers and operators with expertise in materials science, semiconductor manufacturing, polishing techniques and metrology. Training personnel and building a qualified workforce capable of operating and maintaining sophisticated polishing systems represent additional costs and investment in human capital.

Segment Analysis

The global SiC wafer polishing market is segmented based on process, product, application and region.

Growing Adoption of Mechanical SiC Wafer Polishing process Globally

Based on the Process, the SiC wafer polishing market is segmented into mechanical, chemical-mechanical, electropolishing, chemical, plasma-assisted and others.

Mechanical polishing processes, such as chemical-mechanical planarization and grinding, result in superior surface quality compared to other polishing methods. The mechanical action removes surface defects and contaminants, producing smooth, uniform and defect-free SiC wafer surfaces. High-quality surfaces are essential for semiconductor device fabrication and electronic components. Mechanical polishing techniques offer precise control over material removal rates, surface flatness, roughness parameters and thickness uniformity. Manufacturers can achieve tight tolerances and specifications required for SiC wafers used in high-performance semiconductor devices, Micro-Electro-Mechanical Systems, sensors, power electronics and photonic applications. The ability to control polishing parameters enhances product quality and reliability.

The growing major key player's demand for the Mechanical SiC Wafer Polishing method helps to boost segment growth over the ofrecast period. F0r instance, on July 06, 2023, Revasum announced the launch of a 200 mm conversion kit for their flagship 6EZ silicon carbide (SiC) chemical mechanical polishing (CMP) platform. The 6EZ has proven its value in high-volume manufacturing of 150mm SiC substrates and a 200mm conversion kit has now been fully tested and released, giving customers the option of upgrading 6EZ systems in the field.

Geographical Penetration

North America is Dominating the Hardware Products Market

Innovation in technology focuses on North America, particularly in the semiconductor and materials industries. Leading businesses, academic institutions and research centres that propel the development of SiC wafer polishing technologies are based in the area. Global demand for SiC wafers with superior quality and performance is met by constant innovation. With a concentration on power electronics, RF devices and high-frequency applications, North America has a strong semiconductor field. High-power and high-frequency semiconductors utilized in data centers, renewable energy systems, automobile electronics and aerospace applications are made possible by SiC wafers. The need for SiC wafer polishing services is fueled by the existence of significant OEMs and semiconductor firms in North America.

Growing product launches by the major key players in the region help to boost regional segment growth over the forecast period. For instance, on February 21, 2023, Amtech Systems, Inc. booked the 20th new OnTrak double-sided wafer scrubber system sold into SiC manufacturing applications. The product booking came from an existing Entrepix OnTrak customer in North America. The new OnTrak double-sided scrubber is suitable for compound semiconductor applications with configurations for 100-200mm wafers and accommodation for even smaller wafers with custom-designed carriers.

Competitive Landscape

The major global players in the market include Kemnet International, Entegris, Ijin Diamond, Fujimi Corporation, Saint-Gobain, JSR Corporation, Engis Corporation, Ferro Corporation, 3M and DuPont Incorporated.

COVID-19 Impact Analysis

The globally epidemic of health Global supply chains, particularly those about minerals and semiconductor manufacture, were impacted by the COVID-19 epidemic. The disruption resulted in difficulties in obtaining components and raw materials required for SiC wafer polishing operations. The distribution and fabrication of SiC wafers were impacted by lower capacity for production. The demand for SiC wafers and associated items fluctuated as a result of the pandemic. Demand decreased as a result of manufacturing firms cutting back on activities as a result of lockdowns. However, the demand for SiC wafers for applications including power electronics, renewable energy and telecommunications showed indications of revival as sectors adjusted to remote labor and digitalization trends increased.

The pandemic's impact varied across different end-user industries of SiC wafers.For instance, SiC wafer sales for automotive electronics and power modules were first impacted by a decline in demand in the automobile sector. However, as these sectors adapted to remote work, digital connection and sustainable energy solutions, the demand for SiC wafers surged in areas including data centers, telecommunications and renewable energy. During the pandemic, certain semiconductor manufacturers revamped their manufacturing processes to concentrate on vital parts and technology required for medical equipment, healthcare devices and pandemic response initiatives. The supply of SiC wafers for non-essential applications and production volumes were momentarily impacted by this change in manufacturing priorities.

Russia-Ukraine War Impact Analysis

One of the major producers of raw materials and minerals such as silicon carbide, is Ukraine. Supply networks might be disrupted by the war, which could cause shortages or delays in the availability of SiC wafers for polishing. The operations and production schedules of businesses in the SiC wafer polishing sector may be impacted by this interruption. Price volatility in raw materials specifically silicon carbide caused by supply chain disruptions. Price fluctuations for raw materials can have an effect on SiC wafer polishing firms' manufacturing costs, which could result in changes to product pricing and profit margins.

Customers, producers and investors in the SiC wafer polishing industry are hesitant due to the instability and unpredictability brought on by the conflict between Ukraine and Russia. Market growth is impacted if businesses postpone plans for growth, research and development expenditures or the introduction of new products until the geopolitical environment stabilizes. The European and Eurasian markets, respectively, include Russia and Ukraine. Any disruptions in these regions can influence the regional demand for SiC wafer polishing products. Changes in regional demand patterns can affect market dynamics, competition and pricing strategies for SiC wafer polishing companies operating in these areas.

By Process

  • Mechanical
  • Chemical-Mechanical
  • Electropolishing
  • Chemical
  • Plasma-Assisted
  • Others

By Product

  • Abrasive Powders
  • Polishing Pads
  • Diamond Slurries
  • Colloidal Silica Suspensions

By Application

  • Power Electronics
  • LED
  • Sensors and Detectors
  • RF and Microwave Devices

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • France
    • Italy
    • Spain
    • Rest of Europe
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Asia-Pacific
    • China
    • India
    • Japan
    • Australia
    • Rest of Asia-Pacific
  • Middle East and Africa

Key Developments

  • On May 22, 2020, Sumitomo Electric Industries, Ltd. launched a SiC 150mm diameter single crystal substrate CrystEra for power devices. The new product is used in the production of Sumitomo SiC epitaxial wafer EpiEra. Semiconductor devices are used for various applications such as power transmission, automotive, train, solar power, home appliances and other sectors.
  • On March 28, 2022, Showa Denko launched mass production of 6-inch sic single crystal wafers in the market with a diameter of 6 inches which are used as materials for SiC epitaxial wafers to be installed and processed into SiC-based power semiconductors.
  • On December 02, 2021, Soitec, a manufacturer and designer of semiconductor materials acquired NovaSiC, a technology company specialized in polishing and reclaiming wafers on silicon carbide, to accelerate the company's technology development and strengthen its positioning on the industrial and automotive markets.

Why Purchase the Report?

  • To visualize the global SiC wafer polishing market segmentation based on process, product, application and region, as well as understand key commercial assets and players.
  • Identify commercial opportunities by analyzing trends and co-development.
  • Excel data sheet with numerous data points of SiC wafer polishing market-level with all segments.
  • PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
  • Product mapping available as excel consisting of key products of all the major players.

The global SiC wafer polishing market report would provide approximately 62 tables, 57 figures and 187 Pages.

Target Audience 2024

  • Manufacturers/ Buyers
  • Industry Investors/Investment Bankers
  • Research Professionals
  • Emerging Companies

Table of Contents

1.Methodology and Scope

  • 1.1.Research Methodology
  • 1.2.Research Objective and Scope of the Report

2.Definition and Overview

3.Executive Summary

  • 3.1.Snippet by Process
  • 3.2.Snippet by Product
  • 3.3.Snippet by Application
  • 3.4.Snippet by Region

4.Dynamics

  • 4.1.Impacting Factors
    • 4.1.1.Drivers
      • 4.1.1.1.Rise in Electric Vehicle (EV) Adoption Globally
      • 4.1.1.2.Growing Adoption of SiC Wafers in Power Electronics and Semiconductor Devices
    • 4.1.2.Restraints
      • 4.1.2.1.High Initial Investment
    • 4.1.3.Opportunity
    • 4.1.4.Impact Analysis

5.Industry Analysis

  • 5.1.Porter's Five Force Analysis
  • 5.2.Supply Chain Analysis
  • 5.3.Pricing Analysis
  • 5.4.Regulatory Analysis
  • 5.5.Russia-Ukraine War Impact Analysis
  • 5.6.DMI Opinion

6.COVID-19 Analysis

  • 6.1.Analysis of COVID-19
    • 6.1.1.Scenario Before COVID-19
    • 6.1.2.Scenario During COVID-19
    • 6.1.3.Scenario Post COVID-19
  • 6.2.Pricing Dynamics Amid COVID-19
  • 6.3.Demand-Supply Spectrum
  • 6.4.Government Initiatives Related to the Market During Pandemic
  • 6.5.Manufacturers Strategic Initiatives
  • 6.6.Conclusion

7.By Process

  • 7.1.Introduction
    • 7.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
    • 7.1.2.Market Attractiveness Index, By Process
  • 7.2.Mechanical*
    • 7.2.1.Introduction
    • 7.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 7.3.Chemical-Mechanical
  • 7.4.Electropolishing
  • 7.5.Chemical
  • 7.6.Plasma-Assisted
  • 7.7.Others

8.By Product

  • 8.1.Introduction
    • 8.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
    • 8.1.2.Market Attractiveness Index, By Product
  • 8.2.Abrasive Powders*
    • 8.2.1.Introduction
    • 8.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 8.3.Polishing Pads
  • 8.4.Diamond Slurries
  • 8.5.Colloidal Silica Suspensions

9.By Application

  • 9.1.Introduction
    • 9.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 9.1.2.Market Attractiveness Index, By Application
  • 9.2.Power Electronics*
    • 9.2.1.Introduction
    • 9.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 9.3.LED
  • 9.4.Sensors and Detectors
  • 9.5.RF and Microwave Devices

10.By Region

  • 10.1.Introduction
    • 10.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
    • 10.1.2.Market Attractiveness Index, By Region
  • 10.2.North America
    • 10.2.1.Introduction
    • 10.2.2.Key Region-Specific Dynamics
    • 10.2.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
    • 10.2.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
    • 10.2.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.2.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.2.6.1.U.S.
      • 10.2.6.2.Canada
      • 10.2.6.3.Mexico
  • 10.3.Europe
    • 10.3.1.Introduction
    • 10.3.2.Key Region-Specific Dynamics
    • 10.3.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
    • 10.3.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
    • 10.3.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.3.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.3.6.1.Germany
      • 10.3.6.2.UK
      • 10.3.6.3.France
      • 10.3.6.4.Italy
      • 10.3.6.5.Spain
      • 10.3.6.6.Rest of Europe
  • 10.4.South America
    • 10.4.1.Introduction
    • 10.4.2.Key Region-Specific Dynamics
    • 10.4.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
    • 10.4.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
    • 10.4.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.4.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.4.6.1.Brazil
      • 10.4.6.2.Argentina
      • 10.4.6.3.Rest of South America
  • 10.5.Asia-Pacific
    • 10.5.1.Introduction
    • 10.5.2.Key Region-Specific Dynamics
    • 10.5.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
    • 10.5.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
    • 10.5.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.5.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.5.6.1.China
      • 10.5.6.2.India
      • 10.5.6.3.Japan
      • 10.5.6.4.Australia
      • 10.5.6.5.Rest of Asia-Pacific
  • 10.6.Middle East and Africa
    • 10.6.1.Introduction
    • 10.6.2.Key Region-Specific Dynamics
    • 10.6.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
    • 10.6.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
    • 10.6.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application

11.Competitive Landscape

  • 11.1.Competitive Scenario
  • 11.2.Market Positioning/Share Analysis
  • 11.3.Mergers and Acquisitions Analysis

12.Company Profiles

  • 12.1.Kemnet International*
    • 12.1.1.Company Overview
    • 12.1.2.Product Portfolio and Description
    • 12.1.3.Financial Overview
    • 12.1.4.Key Developments
  • 12.2.Entegris
  • 12.3.Ijin Diamond
  • 12.4.Fujimi Corporation
  • 12.5.Saint-Gobain
  • 12.6.JSR Corporation
  • 12.7.Engis Corporation
  • 12.8.Ferro Corporation
  • 12.9.3M
  • 12.10.DuPont Incorporated

LIST NOT EXHAUSTIVE

13.Appendix

  • 13.1.About Us and Services
  • 13.2.Contact Us