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市場調査レポート
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1333999

SiCウエハ研磨の世界市場 (～2028年)：製品タイプ (研磨粉・研磨パッド・ダイヤモンドスラリー・コロイダルシリカ懸濁液)・用途・プロセス・地域別

SiC Wafer Polishing Market by Product Type (Abrasive Powders, Polishing Pads, Diamond Slurries, Colloidal Silica Suspensions), application, Process, & Region (North America, Europe, APAC, South America, MEA) - Global Forecast 2028
出版日: | 発行: MarketsandMarkets | ページ情報: 英文 169 Pages | 納期: 即納可能 即納可能とは

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価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=156.76円
SiCウエハ研磨の世界市場 (～2028年)：製品タイプ (研磨粉・研磨パッド・ダイヤモンドスラリー・コロイダルシリカ懸濁液)・用途・プロセス・地域別
出版日: 2023年08月10日
発行: MarketsandMarkets
ページ情報: 英文 169 Pages
納期: 即納可能 即納可能とは
  • 全表示
  • 概要
  • 目次
概要

SiCウエハ研磨の市場規模は、2023年の4億米ドルから、予測期間中は37.5％のCAGRで推移し、2028年には22億米ドルの規模に成長すると予測されています。

パワーエレクトロニクス、自動車、航空宇宙、通信分野でのSiCウエハ需要の増加が市場拡大の推進因子となっています。SiCウエハは、高い熱伝導率やワイドバンドギャップなどの優れた特性を備えており、より高い効率と性能を必要とする先端デバイスに不可欠です。さらに、再生可能エネルギーシステムや電気自動車へのSiCベースデバイスの採用が拡大していることも、高品質研磨ウエハの需要に拍車をかけています。

製品タイプ別で見ると、ダイヤモンドスラリーSiCウエハ研磨遠心分離機の部門が予測期間中に最も急成長する見通しです。ダイヤモンド粒子の硬度と鋭さは、SiCウエハの課題に取り組む上で非常に効果的であり、正確な材料除去と卓越した表面平滑性をもたらします。SiCベースのパワーエレクトロニクス、オプトエレクトロニクス、高周波デバイスの需要が急増し続ける中、メーカーは高度で信頼性の高い研磨ソリューションを求めています。ダイヤモンドスラリー製品はこのような要求に応え、材料除去率の優れた制御と優れた平坦化を実現し、デバイスの性能と歩留まりの向上につなげています。

プロセス別では、化学機械研磨 (CMP) の部門が予測期間中、最大の成長を示す見通しです。CMPは化学反応と機械的磨耗を組み合わせることで、高性能半導体デバイスに必要とされる優れた平坦化と表面平滑性を提供します。また、多様なSiC基板に対応し、ウエハサイズの大型化にも対応できるため、半導体業界の高度な用途への要求に応えることができます。さらに、SiCウエハからキズや不純物を除去するCMPの有効性は、信頼性の高い高品質なデバイスを製造するための好ましい方法となっています。

地域別では、アジア太平洋地域が予測期間中に最大のCAGRを示す見通しです。中国、日本、韓国、台湾などの国々は世界の半導体製造で重要な役割を果たしており、エレクトロニクスと半導体産業の主要なハブであることから、SiCウエハ研磨の主要市場の一つとなっています。パワーエレクトロニクス、RF部品、LEDといったSiCベースのデバイスに対する需要の高まりが、高品質な研磨SiCウエハに対するニーズを後押しし、研磨市場の拡大を促進しています。

当レポートでは、世界のSiCウエハ研磨の市場を調査し、市場概要、市場影響因子および市場機会の分析、技術・特許の動向、ケーススタディ、関連法規制、市場規模の推移・予測、各種区分・地域/主要国別の詳細分析、競合環境、主要企業のプロファイルなどをまとめています。

目次

第1章 イントロダクション

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 重要考察

第5章 市場概要

  • 市場力学
    • 促進要因
    • 抑制要因
    • 機会
    • 課題
  • ポーターのファイブフォース分析

第6章 産業動向

  • 景気後退の影響
  • バリューチェーン分析
  • マクロ経済指標
  • 法規制
  • 貿易分析
  • 特許分析
  • 顧客の事業に影響を与える動向/ディスラプション
  • エコシステム/マーケットマップ
  • 技術分析
  • 主要なステークホルダーと購入基準

第7章 SiCウエハ研磨市場：製品別

  • 研磨粉
  • 研磨パッド
  • ダイヤモンドスラリー
  • コロイダルシリカ懸濁液
  • その他

第8章 SiCウエハ研磨市場：プロセス別

  • 機械研磨
  • 化学機械研磨 (CMP)
  • 電解研磨
  • 化学研磨
  • プラズマ支援研磨
  • その他

第9章 SiCウエハ研磨市場：用途別

  • パワーエレクトロニクス
  • 発光ダイオード (LED)
  • センサー・検出器
  • RF・マイクロ波デバイス
  • その他

第10章 SiCウエハ研磨市場：地域別

  • 欧州
  • アジア太平洋
  • 北米
  • その他の地域

第11章 競合情勢

  • 主要企業の採用戦略
  • 市場シェア分析
  • 企業の製品フットプリント分析
  • 企業評価クアドラント
  • 競合ベンチマーキング
  • スタートアップ/中小企業の評価クアドラント
  • 競合シナリオと動向

第12章 企業プロファイル

  • 主要企業
    • ENTEGRIS
    • SAINT-GOBAIN
    • KEMET INTERNATIONAL LIMITED
    • ILJIN DIAMOND CO., LTD.
    • DUPONT INCORPORATED
    • FUJIBO HOLDINGS, INC.
    • FUJIFILM HOLDINGS AMERICA CORPORATION
    • ENGIS CORPORATION
    • SKC
    • FERRO CORPORATION
    • 3M
    • JSR CORPORATION
  • その他の企業
    • PUREON
    • LAPMASTER WOLTERS
    • LOGITECH LTD.
    • ADVANCED ABRASIVES CORPORATION
    • ALLIED HIGH TECH PRODUCTS
    • ACE NANOCHEM CO., LTD.
    • SHANGHAI XINANNA ELECTRONIC TECHNOLOGY CO., LTD
    • AGC INC.
    • FUJIMI INCORPORATED
    • LAM PLAN SAS
    • NITTA DUPONT INCORPORATED

第13章 付録

目次
Product Code: CH 8753

The Sic wafer polishing market is projected to grow from USD 0.4 billion in 2023 to USD 2.2 billion by 2028, at a CAGR of 37.5% from 2023 to 2028. Considering these factors, the increasing demand for SiC wafers in the power electronics, automotive, aerospace, and telecommunications sectors is driving the market expansion. SiC wafers offer exceptional properties like high thermal conductivity and wide bandgap, making them essential for advanced devices that require higher efficiency and performance. Additionally, the growing adoption of SiC-based devices in renewable energy systems and electric vehicles is fueling the demand for high-quality polished wafers.

"By product type, the diamond slurry sic wafer polishing centrifuges segment is estimated to be the fastest-growing segment of the Sic wafer polishing market from 2023 to 2028."

Based on the product type, the Sic wafer polishing market made of diamond slurry sic wafer polishing centrifuge is regarded as one of the greatest product types. The inherent hardness and sharpness of diamond particles make them highly effective in tackling the challenges presented by SiC wafers, resulting in precise material removal and exceptional surface smoothness. As demand for SiC-based power electronics, optoelectronics, and high-frequency devices continues to surge, manufacturers seek advanced and reliable polishing solutions. Diamond slurry products meet these requirements, offering excellent control over material removal rates and superior planarization, leading to enhanced device performance and yield.

"By process, Chemical mechanical polishing process estimated to be the fastest-growing segment of Sic wafer polishing market from 2023 to 2028."

Based on application, the chemical mechanical polishing (CMP) segment is expected to be the most significant in the sic wafer polishing market during the forecast period due to Its unique capacity to give a highly controlled and exact polishing procedure. CMP combines chemical reactions and mechanical abrasion to provide superior planarization and surface smoothness on SiC wafers, both of which are required for high-performance semiconductor devices. Its success is also due to its compatibility with diverse SiC substrate types and its ability to handle larger wafer sizes, answering the semiconductor industry's aspirations for advanced applications. Furthermore, the efficacy of CMP in eliminating flaws and impurities from SiC wafers makes it a preferred method for producing reliable and high-quality devices.

"The Sic wafer polishing market in Asia Pacific region is projected to witness the highest CAGR during the forecast period."

The Asia Pacific region is projected to register the highest CAGR in the Sic wafer polishing market from 2023 to 2028. Asia Pacific is one of the key markets of sic wafer polishing considering these factors, as the region is a major hub for the electronics and semiconductor industries, with countries like China, Japan, South Korea, and Taiwan playing significant roles in global semiconductor production. The growing demand for SiC-based devices, such as power electronics, RF components, and LEDs, is driving the need for high-quality polished SiC wafers, fostering the expansion of the polishing market.

Profile break-up of primary participants for the report:

  • By Company Type: Tier 1 - 35%, Tier 2 - 45%, and Tier 3 - 20%
  • By Designation: C-level Executives - 35%, Directors - 25%, and Others - 40%
  • By Region: North America - 40%, Europe -20%, Asia Pacific - 30% Middle East & Africa-5%, and South America-5%

The Sic wafer polishing market report is dominated by players such as Kemet International (UK), Entegris (US), Iljin Diamond (US), Fujimi Corporation (Japan), Saint-Gobain (US), JSR Corporation (Japan), Engis Corporation (US), Ferro Corporation (US), 3M (US), SKC (South Korea), DuPont Incorporated (US), Fujifilm Holding America Corporation (US), and others.

Research Coverage:

The report defines, segments, and projects the size of the sic wafer polishing based on type, design type, application, and region. It strategically profiles the key players and comprehensively analyzes their market share and core competencies. It also tracks and analyzes competitive developments, such as new product launches, agreements, contracts, partnerships, and acquisitions undertaken by them in the market.

Reasons to Buy the Report:

The report is expected to help the market leaders/new entrants in the market by providing them with the closest approximations of revenue numbers of the sic wafer polishing and their segments. This report is also expected to help stakeholders obtain an improved understanding of the competitive landscape of the market, gain insights to improve the position of their businesses and make suitable go-to-market strategies. It also enables stakeholders to understand the pulse of the market and provides them with information on key market drivers, restraints, challenges, and opportunities.

The report provides insights on the following pointers:

Analysis of key drivers (Growing Consumption of Consumer Electronics, Growing demand for SIC-based power devices, Development of advanced polishing consumables, Adoption of SiC wafers in radio frequency (RF) devices.), restraints (Surface defects and contamination, Long polishing cycle times, Limited supplier base.), opportunities (Growing investments in SiC research and development, Emergence of new applications, Advancements in polishing technologies), and challenges (Complexity Regarding Manufacturing, Intense competition and market consolidation) influencing the growth of the sic wafer polishing market.

  • Product Development/Innovation: Detailed insights on upcoming technologies, research &

development activities in the sic wafer polishing.

  • Market Development: Comprehensive information about sic wafer polishing - the report analyses

the sic wafer polishing across varied regions.

  • Market Diversification: Exhaustive information about new products & services, untapped

geographies, recent developments, and investments in the sic wafer polishing market.

  • Competitive Assessment: In-depth assessment of market shares, growth strategies, and service

offerings of leading players like Kemet International (UK), Entegris (US), Iljin Diamond (US), Fujimi Corporation (Japan), and Saint-Gobain (US). among others in the sic wafer polishing market.

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 STUDY OBJECTIVES
  • 1.2 MARKET DEFINITION
  • 1.3 INCLUSIONS & EXCLUSIONS
  • 1.4 MARKET SCOPE
    • 1.4.1 MARKETS COVERED
    • 1.4.2 REGIONAL SCOPE
    • 1.4.3 YEARS CONSIDERED
  • 1.5 CURRENCY CONSIDERED
  • 1.6 LIMITATIONS
  • 1.7 STAKEHOLDERS

2 RESEARCH METHODOLOGY

  • 2.1 RESEARCH DATA
    • FIGURE 1 SIC WAFER POLISHING MARKET: RESEARCH DESIGN
    • 2.1.1 SECONDARY DATA
      • 2.1.1.1 Key data from secondary sources
    • 2.1.2 PRIMARY DATA
      • 2.1.2.1 Key data from primary sources
    • FIGURE 2 KEY INDUSTRY INSIGHTS
      • 2.1.2.2 Breakdown of primary interviews
    • FIGURE 3 BREAKDOWN OF PRIMARY INTERVIEWS: BY COMPANY TYPE, DESIGNATION, AND REGION
  • 2.2 DATA TRIANGULATION
    • FIGURE 4 DATA TRIANGULATION
  • 2.3 MARKET SIZE ESTIMATION
    • 2.3.1 BOTTOM-UP APPROACH
    • FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
    • 2.3.2 TOP-DOWN APPROACH
    • FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
    • 2.3.3 DEMAND SIDE
    • FIGURE 7 DEMAND-SIDE ANALYSIS
    • FIGURE 8 METRICS CONSIDERED FOR ANALYZING AND ASSESSING DEMAND FOR SIC WAFER POLISHING
      • 2.3.3.1 Research assumptions
    • 2.3.4 FORECAST

3 EXECUTIVE SUMMARY

    • TABLE 1 SIC WAFER POLISHING MARKET: SNAPSHOT
    • FIGURE 9 DIAMOND SLURRIES SEGMENT TO ACCOUNT FOR LARGEST SHARE DURING FORECAST PERIOD
    • FIGURE 10 POWER ELECTRONICS SEGMENT TO ACCOUNT FOR LARGEST SHARE DURING FORECAST PERIOD
    • FIGURE 11 CHEMICAL MECHANICAL POLISHING (CMP) PROCESS TO ACCOUNT FOR LARGEST SHARE DURING FORECAST PERIOD
    • FIGURE 12 ASIA PACIFIC TO LEAD SIC WAFER POLISHING MARKET IN 2023

4 PREMIUM INSIGHTS

  • 4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN SIC WAFER POLISHING MARKET
    • FIGURE 13 INCREASING AWARENESS OF SUSTAINABLE TECHNOLOGY DRIVING MARKET DURING FORECAST PERIOD
  • 4.2 SIC WAFER POLISHING MARKET: ASIA PACIFIC, BY APPLICATION AND COUNTRY
    • FIGURE 14 CHEMICAL AND CHINA ACCOUNTED FOR SIGNIFICANT SHARE IN 2022
  • 4.3 SIC WAFER POLISHING MARKET, BY PRODUCT
    • FIGURE 15 DIAMOND SLURRIES SEGMENT TO ACCOUNT FOR LARGEST SHARE BY 2028
  • 4.4 SIC WAFER POLISHING MARKET, BY APPLICATION
    • FIGURE 16 POWER ELECTRONICS SEGMENT TO ACCOUNT FOR LARGEST SHARE IN 2028
  • 4.5 SIC WAFER POLISHING MARKET, BY PROCESS
    • FIGURE 17 CHEMICAL MECHANICAL POLISHING SEGMENT TO ACCOUNT FOR LARGEST SHARE IN 2028
  • 4.6 SIC WAFER POLISHING MARKET: REGIONAL ANALYSIS
    • FIGURE 18 ASIA PACIFIC TO ACCOUNT FOR LARGEST SHARE OF SIC WAFER POLISHING MARKET IN 2023

5 MARKET OVERVIEW

  • 5.1 INTRODUCTION
  • 5.2 MARKET DYNAMICS
    • FIGURE 19 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES IN SIC WAFER POLISHING MARKET
    • 5.2.1 DRIVERS
      • 5.2.1.1 Growing consumption of consumer electronics
      • 5.2.1.2 Growing demand for SiC-based power devices
      • 5.2.1.3 Development of advanced polishing consumable
      • 5.2.1.4 Adoption of SiC wafers in radio frequency (RF) devices
    • 5.2.2 RESTRAINTS
      • 5.2.2.1 Surface defects and contamination
      • 5.2.2.2 Long polishing cycle times
      • 5.2.2.3 Limited supplier base
    • 5.2.3 OPPORTUNITIES
      • 5.2.3.1 Growing investments in SiC R&D
      • 5.2.3.2 Emergence of new applications
      • 5.2.3.3 Advancements in polishing technologies
    • 5.2.4 CHALLENGES
      • 5.2.4.1 Complexity regarding manufacturing
      • 5.2.4.2 Intense competition and market consolidation
  • 5.3 PORTER'S FIVE FORCES ANALYSIS
    • TABLE 2 SIC WAFER POLISHING MARKET: PORTER'S FIVE FORCES ANALYSIS
    • FIGURE 20 PORTER'S FIVE FORCES ANALYSIS: SIC WAFER POLISHING MARKET
    • 5.3.1 THREAT OF NEW ENTRANTS
    • 5.3.2 THREATS OF SUBSTITUTES
    • 5.3.3 BARGAINING POWER OF SUPPLIERS
    • 5.3.4 BARGAINING POWER OF BUYERS
    • 5.3.5 INTENSITY OF COMPETITIVE RIVALRY

6 INDUSTRY TRENDS

  • 6.1 RECESSION IMPACT
  • 6.2 VALUE CHAIN ANALYSIS
    • FIGURE 21 VALUE CHAIN FOR SIC WAFER POLISHING MARKET
    • 6.2.1 RAW MATERIAL SUPPLIERS
    • 6.2.2 MANUFACTURERS
    • 6.2.3 DISTRIBUTORS
    • 6.2.4 END USER
  • 6.3 MACROECONOMIC INDICATORS
    • 6.3.1 GDP TRENDS AND FORECASTS OF MAJOR ECONOMIES
    • TABLE 3 GDP TRENDS AND FORECASTS, BY KEY COUNTRY, 2019-2027 (USD MILLION)
  • 6.4 SIC WAFER POLISHING MARKET REGULATIONS
    • 6.4.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 4 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 5 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 6 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • 6.5 TRADE ANALYSIS
    • 6.5.1 EXPORT SCENARIO
    • FIGURE 22 EXPORT SCENARIO FOR HS CODE 381800, BY KEY COUNTRY (2019-2022)
    • 6.5.2 IMPORT SCENARIO
    • FIGURE 23 IMPORT SCENARIO FOR HS CODE 381800, BY KEY COUNTRY, (2019-2022)
  • 6.6 PATENT ANALYSIS
    • 6.6.1 INTRODUCTION
    • 6.6.2 METHODOLOGY
      • 6.6.2.1 Document type
    • TABLE 7 GRANTED PATENTS ACCOUNTED FOR 35% OF TOTAL PATENTS IN LAST 10 YEARS
    • FIGURE 24 PUBLICATION TRENDS OVER LAST TEN YEARS
    • 6.6.3 INSIGHTS
    • 6.6.4 LEGAL STATUS OF PATENTS
    • FIGURE 25 LEGAL STATUS OF PATENTS FIELD FOR SIC WAFER POLISHING MARKET
    • 6.6.5 JURISDICTION ANALYSIS
    • FIGURE 26 TOP JURISDICTION-BY DOCUMENT
    • 6.6.6 ANALYSIS OF TOP APPLICANTS
    • FIGURE 27 TAIWAN SEMICONDUCTOR MFG CO LTD REGISTERED HIGHEST NUMBER OF PATIENTS BETWEEN 2017 AND 2022
  • 6.7 TRENDS/DISRUPTIONS IMPACTING CUSTOMERS' BUSINESSES
    • 6.7.1 REVENUE SHIFTS & NEW REVENUE POCKETS FOR SIC WAFER POLISHING MARKET
    • FIGURE 28 REVENUE SHIFT OF SIC WAFER POLISHING PROVIDERS
  • 6.8 ECOSYSTEM/MARKETMAP
    • TABLE 8 GDP TRENDS AND FORECASTS, BY KEY COUNTRY, 2019-2027
    • FIGURE 29 SIC WAFER POLISHING MARKET: ECOSYSTEM
  • 6.9 TECHNOLOGY ANALYSIS
    • 6.9.1 CHEMICAL MECHANICAL PLANARIZATION (CMP) TECHNOLOGY
    • TABLE 9 ADVANTAGES OF CHEMICAL MECHANICAL PLANARIZATION (CMP) TECHNOLOGY
    • 6.9.2 FIXED ABRASIVE POLISHING (FAP)
    • TABLE 10 ADVANTAGES OF FIXED ABRASIVE POLISHING (FAP) TECHNOLOGY
  • 6.10 KEY STAKEHOLDERS AND BUYING CRITERIA
    • 6.10.1 KEY STAKEHOLDERS IN BUYING PROCESS
    • FIGURE 30 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 4 APPLICATIONS
    • TABLE 11 INFLUENCE OF INSTITUTIONAL BUYERS ON BUYING PROCESS FOR TOP 4 APPLICATIONS
    • 6.10.2 BUYING CRITERIA
    • FIGURE 31 KEY BUYING CRITERIA FOR END-USER INDUSTRIES
    • TABLE 12 KEY BUYING CRITERIA FOR END-USER INDUSTRIES

7 SIC WAFER POLISHING MARKET, BY PRODUCT

  • 7.1 INTRODUCTION
    • FIGURE 32 SIC WAFER POLISHING MARKET, BY PRODUCT, 2022
    • TABLE 13 SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 14 SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
  • 7.2 ABRASIVE POWDER
    • 7.2.1 COMPATIBILITY WITH DIFFERENT POLISHING SYSTEMS AND EQUIPMENT TO DRIVE MARKET
  • 7.3 POLISHING PADS
    • 7.3.1 HIGHLY VERSATILE NATURE TO INCREASE USAGE
  • 7.4 DIAMOND SLURRIES
    • 7.4.1 INCREASING DEMAND FOR HIGH-PERFORMANCE SIC-BASED DEVICES TO DRIVE MARKET
  • 7.5 COLLOIDAL SILICA SUSPENSIONS
    • 7.5.1 COST-EFFECTIVENESS IN SIC WAFER POLISHING PROCESSES TO DRIVE MARKET
  • 7.6 OTHERS
    • 7.6.1 ABRASIVE SLURRIES

8 SIC WAFER POLISHING MARKET, BY PROCESS

  • 8.1 INTRODUCTION
    • FIGURE 33 SIC WAFER POLISHING MARKET, BY PROCESS, 2022
    • TABLE 15 SIC WAFER POLISHING MARKET, BY PROCESS, 2020-2022 (USD MILLION)
    • TABLE 16 SIC WAFER POLISHING MARKET SIZE, BY PROCESS, 2023-2028 (USD MILLION)
  • 8.2 MECHANICAL POLISHING
    • 8.2.1 VERSATILE PROCESS FOR POLISHING COMPLEX SIC WAFERS TO DRIVE MARKET
  • 8.3 CHEMICAL-MECHANICAL POLISHING (CMP)
    • 8.3.1 HIGH DEMAND FOR POLISHING SEMICONDUCTOR DEVICES TO DRIVE MARKET
  • 8.4 ELECTROPOLISHING
    • 8.4.1 CUTTING-EDGE ELECTROPOLISHING ADVANCES TO INCREASE DEMAND
  • 8.5 CHEMICAL POLISHING
    • 8.5.1 RISING DEMAND FOR HIGH-THROUGHPUT SIC POLISHING TO DRIVE MARKET
  • 8.6 PLASMA-ASSISTED POLISHING
    • 8.6.1 HIGHLY EFFICIENT AND EFFECTIVE PROCESS TO DRIVE MARKET
  • 8.7 OTHERS
    • 8.7.1 REACTIVE ION ETCHING (RIE)

9 SIC WAFER POLISHING MARKET, BY APPLICATION

  • 9.1 INTRODUCTION
    • FIGURE 34 SIC WAFER POLISHING MARKET, BY APPLICATION, 2023
    • TABLE 17 SIC WAFER POLISHING MARKET, BY APPLICATION, 2020-2022 (USD MILLION)
    • TABLE 18 SIC WAFER POLISHING MARKET, BY APPLICATION, 2023-2028 (USD MILLION)
  • 9.2 POWER ELECTRONICS
    • 9.2.1 ADVANCED POLISHING TECHNIQUES TO DRIVE MARKET
  • 9.3 LIGHT-EMITTING DIODES (LEDS)
    • 9.3.1 STABLE ILLUMINATION AND INCREASING PRODUCTIVITY TO DRIVE MARKET
  • 9.4 SENSORS AND DETECTORS
    • 9.4.1 SIC POLISHING EMPOWERING GROWTH WITH ADVANCED SENSORS AND DETECTORS TO DRIVE MARKET
  • 9.5 RF AND MICROWAVE DEVICES
    • 9.5.1 ELECTRICAL AND THERMAL PERFORMANCE TO DRIVE MARKET
  • 9.6 OTHERS
    • 9.6.1 SEMICONDUCTOR DEVICES

10 SIC WAFER POLISHING MARKET, BY REGION

  • 10.1 INTRODUCTION
    • FIGURE 35 ASIA PACIFIC TO BE FASTEST-GROWING MARKET DURING FORECAST PERIOD
    • TABLE 19 SIC WAFER POLISHING MARKET, BY REGION, 2020-2022 (USD MILLION)
    • TABLE 20 SIC WAFER POLISHING MARKET, BY REGION, 2023-2028 (USD MILLION)
    • TABLE 21 SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 22 SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • TABLE 23 SIC WAFER POLISHING MARKET, BY PROCESS, 2020-2022 (USD MILLION)
    • TABLE 24 SIC WAFER POLISHING MARKET, BY PROCESS, 2023-2028 (USD MILLION)
    • TABLE 25 SIC WAFER POLISHING MARKET, BY APPLICATION, 2020-2022 (USD MILLION)
    • TABLE 26 SIC WAFER POLISHING MARKET, BY APPLICATION, 2023-2028 (USD MILLION)
  • 10.2 EUROPE
    • 10.2.1 RECESSION IMPACT
    • FIGURE 36 EUROPE: SIC WAFER POLISHING MARKET SNAPSHOT
    • TABLE 27 EUROPE: SIC WAFER POLISHING MARKET, BY COUNTRY, 2020-2022 (USD MILLION)
    • TABLE 28 EUROPE: SIC WAFER POLISHING MARKET, BY COUNTRY, 2023-2028 (USD MILLION)
    • TABLE 29 EUROPE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 30 EUROPE: SIC WAFER POLISHING, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.2.2 GERMANY
      • 10.2.2.1 Increasing availability of SiC wafers to drive market
    • TABLE 31 GERMANY: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 32 GERMANY: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.2.3 ITALY
      • 10.2.3.1 Government initiatives promoting adoption of renewable energy to drive market
    • TABLE 33 ITALY: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 34 ITALY: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.2.4 FRANCE
      • 10.2.4.1 Growing demand for high-performance electronic devices to drive market
    • TABLE 35 FRANCE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 36 FRANCE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.2.5 SWEDEN
      • 10.2.5.1 Growing importance of cybersecurity for semiconductors to increase market
    • TABLE 37 SWEDEN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 38 SWEDEN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.2.6 REST OF EUROPE
    • TABLE 39 REST OF EUROPE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 40 REST OF EUROPE: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
  • 10.3 ASIA PACIFIC
    • 10.3.1 RECESSION IMPACT
    • FIGURE 37 ASIA PACIFIC: SIC WAFER POLISHING MARKET SNAPSHOT
    • TABLE 41 ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY COUNTRY, 2020-2022 (USD MILLION)
    • TABLE 42 ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY COUNTRY, 2023-2028 (USD MILLION)
    • TABLE 43 ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 44 ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.3.2 CHINA
      • 10.3.2.1 Increasing demand for SiC wafers in power electronics applications to drive market
    • TABLE 45 CHINA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 46 CHINA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.3.3 JAPAN
      • 10.3.3.1 Growing importance as semiconductors market to drive growth
    • TABLE 47 JAPAN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 48 JAPAN: SIC WAFER POLISHING MARKET, BY PRODUCT 2023-2028 (USD MILLION)
    • 10.3.4 SOUTH KOREA
      • 10.3.4.1 Development of new polishing technologies to drive market
    • TABLE 49 SOUTH KOREA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 50 SOUTH KOREA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.3.5 TAIWAN
      • 10.3.5.1 Efforts to reduce carbon emissions to drive market
    • TABLE 51 TAIWAN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 52 TAIWAN: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.3.6 REST OF ASIA PACIFIC
    • TABLE 53 REST OF ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 54 REST OF ASIA PACIFIC: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
  • 10.4 NORTH AMERICA
    • 10.4.1 RECESSION IMPACT
    • FIGURE 38 NORTH AMERICA: SIC WAFER POLISHING MARKET SNAPSHOT
    • TABLE 55 NORTH AMERICA: SIC WAFER POLISHING MARKET, BY COUNTRY, 2020-2022 (USD MILLION)
    • TABLE 56 NORTH AMERICA: SIC WAFER POLISHING MARKE, BY COUNTRY, 2023-2028 (USD MILLION)
    • TABLE 57 NORTH AMERICA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 58 NORTH AMERICA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.4.2 US
      • 10.4.2.1 Rising adoption of SiC-based power devices in renewable energy to hamper market
    • TABLE 59 US: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 60 US: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.4.3 CANADA
      • 10.4.3.1 Growing research activities to drive market
    • TABLE 61 CANADA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 62 CANADA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.4.4 MEXICO
      • 10.4.4.1 Growing telecommunication industry to increase demand
    • TABLE 63 MEXICO: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 64 MEXICO: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
  • 10.5 REST OF WORLD (ROW)
    • TABLE 65 REST OF WORLD: SIC WAFER POLISHING MARKET SIZE, BY COUNTRY, 2020-2022 (USD MILLION)
    • TABLE 66 REST OF WORLD: SIC WAFER POLISHING MARKET, BY COUNTRY, 2023-2028 (USD MILLION)
    • TABLE 67 REST OF WORLD: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 68 REST OF WORLD: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.5.1 BRAZIL
      • 10.5.1.1 Favorable government policies to drive market
    • TABLE 69 BRAZIL: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 70 BRAZIL: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.5.2 SOUTH AFRICA
      • 10.5.2.1 Expanding SiC wafer manufacturing base to drive demand
    • TABLE 71 SOUTH AFRICA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 72 SOUTH AFRICA: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)
    • 10.5.3 REST OF ROW
    • TABLE 73 REST OF ROW: SIC WAFER POLISHING MARKET, BY PRODUCT, 2020-2022 (USD MILLION)
    • TABLE 74 REST OF ROW: SIC WAFER POLISHING MARKET, BY PRODUCT, 2023-2028 (USD MILLION)

11 COMPETITIVE LANDSCAPE

  • 11.1 INTRODUCTION
  • 11.2 STRATEGIES ADOPTED BY KEY PLAYERS
    • TABLE 75 OVERVIEW OF STRATEGIES ADOPTED BY KEY SIC WAFER POLISHING MARKET
  • 11.3 MARKET SHARE ANALYSIS
    • 11.3.1 RANKING OF KEY MARKET PLAYERS, 2022
    • FIGURE 39 RANKING OF TOP FIVE PLAYERS IN SIC WAFER POLISHING MARKET, 2022
    • 11.3.2 MARKET SHARE OF KEY PLAYERS
    • TABLE 76 SIC WAFER POLISHINGS: DEGREE OF COMPETITION
    • FIGURE 40 SIC WAFER POLISHING MARKET IN 2022
      • 11.3.2.1 Kemet International Limited
      • 11.3.2.2 Entegris
      • 11.3.2.3 Fujimi Incorporated
      • 11.3.2.4 Ferro Corporation
      • 11.3.2.5 Iljin Diamond
  • 11.4 COMPANY PRODUCT FOOTPRINT ANALYSIS
    • TABLE 77 SIC WAFER POLISHING MARKET: KEY COMPANY PROCESS FOOTPRINT
    • TABLE 78 SIC WAFER POLISHING MARKET: KEY COMPANY PRODUCT FOOTPRINT
    • TABLE 79 SIC WAFER POLISHING MARKET: KEY COMPANY APPLICATION FOOTPRINT
    • TABLE 80 SIC WAFER POLISHING MARKET: KEY COMPANY REGION FOOTPRINT
  • 11.5 COMPANY EVALUATION QUADRANT (TIER 1)
    • 11.5.1 STARS
    • 11.5.2 EMERGING LEADERS
    • 11.5.3 PERVASIVE PLAYERS
    • 11.5.4 PARTICIPANTS
    • FIGURE 41 SIC WAFER POLISHING MARKET COMPANY EVALUATION MATRIX, 2022 (TIER 1)
  • 11.6 COMPETITIVE BENCHMARKING
    • TABLE 81 SIC WAFER POLISHING MARKET: DETAILED LIST OF KEY STARTUPS/SMES
    • TABLE 82 SIC WAFER POLISHING MARKET: STARTUPS/SME PLAYERS PROCESS FOOTPRINT
    • TABLE 83 SIC WAFER POLISHING MARKET: STARTUPS/SME PLAYERS PRODUCT FOOTPRINT
    • TABLE 84 SIC WAFER POLISHING MARKET: STARTUPS/SME PLAYERS APPLICATION FOOTPRINT
    • TABLE 85 SIC WAFER POLISHING MARKET: STARTUPS/SME PLAYERS REGION FOOTPRINT
  • 11.7 STARTUP/SME EVALUATION QUADRANT
    • 11.7.1 RESPONSIVE COMPANIES
    • 11.7.2 STARTING BLOCKS
    • 11.7.3 PROGRESSIVE COMPANIES
    • 11.7.4 DYNAMIC COMPANIES
    • FIGURE 42 SIC WAFER POLISHING MARKET STARTUPS/SMES COMPANY EVALUATION MATRIX, 2022
  • 11.8 COMPETITIVE SCENARIOS AND TRENDS
    • 11.8.1 DEALS
    • TABLE 86 SIC WAFER POLISHING MARKET: DEALS (2020-2023)
    • 11.8.2 OTHERS
    • TABLE 87 SIC WAFER POLISHING MARKET: OTHERS (2021-2023)

12 COMPANY PROFILES

  • (Business overview, Products/Services/Solutions offered, Recent developments & MnM View)**
  • 12.1 KEY PLAYERS
    • 12.1.1 ENTEGRIS
    • TABLE 88 ENTEGRIS: COMPANY OVERVIEW
    • FIGURE 43 ENTEGRIS: COMPANY SNAPSHOT
    • TABLE 89 ENTEGRIS: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • TABLE 90 ENTEGRIS: DEALS
    • 12.1.2 SAINT-GOBAIN
    • TABLE 91 SAINT-GOBAIN: COMPANY OVERVIEW
    • TABLE 92 SAINT-GOBAIN: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • 12.1.3 KEMET INTERNATIONAL LIMITED
    • TABLE 93 KEMET INTERNATIONAL LIMITED: COMPANY OVERVIEW
    • TABLE 94 KEMET INTERNATIONAL LIMITED: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • 12.1.4 ILJIN DIAMOND CO., LTD.
    • TABLE 95 ILJIN DIAMOND CO., LTD.: COMPANY OVERVIEW
    • TABLE 96 ILJIN DIAMOND CO., LTD: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • 12.1.5 DUPONT INCORPORATED
    • TABLE 97 DUPONT INCORPORATED: COMPANY OVERVIEW
    • FIGURE 44 DUPONT: COMPANY SNAPSHOT
    • TABLE 98 DUPONT INCORPORATED: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • 12.1.6 FUJIBO HOLDINGS, INC.
    • TABLE 99 FUJIBO HOLDINGS, INC.: COMPANY OVERVIEW
    • FIGURE 45 FUJIBO HOLDING, INC.: COMPANY SNAPSHOT
    • TABLE 100 FUJIBO HOLDINGS, INC.: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • 12.1.7 FUJIFILM HOLDINGS AMERICA CORPORATION
    • TABLE 101 FUJIFILM HOLDINGS AMERICA CORPORATION: COMPANY OVERVIEW
    • TABLE 102 FUJIFILM HOLDINGS AMERICA CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • TABLE 103 FUJIFILM HOLDINGS AMERICA CORPORATION: OTHERS
    • TABLE 104 FUJIFILM HOLDINGS AMERICA CORPORATION: DEALS
    • 12.1.8 ENGIS CORPORATION
    • TABLE 105 ENGIS CORPORATION: COMPANY OVERVIEW
    • TABLE 106 ENGIS CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • 12.1.9 SKC
    • TABLE 107 SKC: COMPANY OVERVIEW
    • FIGURE 46 SKC: COMPANY SNAPSHOT
    • TABLE 108 SKC: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • TABLE 109 SKC: DEALS
    • TABLE 110 SKC: OTHERS
    • 12.1.10 FERRO CORPORATION
    • TABLE 111 FERRO CORPORATION: COMPANY OVERVIEW
    • TABLE 112 FERRO CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • 12.1.11 3M
    • TABLE 113 3M: COMPANY OVERVIEW
    • FIGURE 47 3M: COMPANY SNAPSHOT
    • TABLE 114 3M: PRODUCTS/SERVICES/SOLUTIONS OFFERED
    • 12.1.12 JSR CORPORATION
    • TABLE 115 JSR CORPORATION: COMPANY OVERVIEW
    • FIGURE 48 JSR CORPORATION: COMPANY SNAPSHOT
    • TABLE 116 JSR CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED
  • *Details on Business overview, Products/Services/Solutions offered, Recent developments & MnM View might not be captured in case of unlisted companies.
  • 12.2 OTHER PLAYERS
    • 12.2.1 PUREON
    • TABLE 117 PUREON: COMPANY OVERVIEW
    • 12.2.2 LAPMASTER WOLTERS
    • TABLE 118 LAPMASTER WOLTERS: COMPANY OVERVIEW
    • 12.2.3 LOGITECH LTD.
    • TABLE 119 LOGITECH LTD.: COMPANY OVERVIEW
    • 12.2.4 ADVANCED ABRASIVES CORPORATION
    • TABLE 120 ADVANCED ABRASIVES CORPORATION: COMPANY OVERVIEW
    • 12.2.5 ALLIED HIGH TECH PRODUCTS
    • TABLE 121 ALLIED HIGH TECH PRODUCTS: COMPANY OVERVIEW
    • 12.2.6 ACE NANOCHEM CO., LTD.
    • TABLE 122 ACE NANOCHEM CO., LTD.: COMPANY OVERVIEW
    • 12.2.7 SHANGHAI XINANNA ELECTRONIC TECHNOLOGY CO., LTD
    • TABLE 123 SHANGHAI XINANNA ELECTRONIC TECHNOLOGY CO., LTD: COMPANY OVERVIEW
    • 12.2.8 AGC INC.
    • TABLE 124 AGC INC.: COMPANY OVERVIEW
    • 12.2.9 FUJIMI INCORPORATED
    • TABLE 125 FUJIMI INCORPORATED: COMPANY OVERVIEW
    • 12.2.10 LAM PLAN SAS
    • TABLE 126 LAM PLAN SAS: COMPANY OVERVIEW
    • 12.2.11 NITTA DUPONT INCORPORATED
    • TABLE 127 NITTA DUPONT INCORPORATED: COMPANY OVERVIEW

13 APPENDIX

  • 13.1 DISCUSSION GUIDE
  • 13.2 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 13.3 CUSTOMIZATION OPTIONS
  • 13.4 RELATED REPORTS
  • 13.5 AUTHOR DETAILS