ファウンドリサービスの世界市場：市場規模（種類別・用途別・地域別）、将来予測

ファウンドリサービスの市場規模と予測

ファウンドリサービスの市場規模は、2024年に1,313億9,000万米ドルと評価され、2026年から2032年にかけてCAGR 6.07%で成長し、2032年には2,016億8,000万米ドルに達すると予測されます。

政府の好意的な取り組みと半導体チップの需要増加が、市場拡大の2大要因です。さらに、通信、エレクトロニクス、リンクデバイス向けのファウンドリサービスへのニーズが高く、市場拡大を後押しすると予測されます。世界のファウンドリサービス市場レポートは、市場の全体的な評価を提供します。主要セグメント、動向、市場促進要因、市場抑制要因、競合情勢、市場で重要な役割を果たしている要因などを包括的に分析しています。

世界のファウンドリサービス市場の定義

ファウンドリサービスとは、半導体、IC回路、その他の半導体を製造するために、ファウンドリ企業が第三者の顧客に提供する半導体製造サービスのことです。多くの企業は、自社で集積回路を開発・製造しているが、これはコスト効率が悪いです。そのため、企業は集積回路の製造を第三者のファウンドリ施設に委託しています。長期的には、IC回路製造工場は開発・運営にコストがかかります。これらの工場は、それを管理する企業の財政的な負担にならないよう、ほぼフル稼働の状態を維持する必要があります。

世界のファウンドリサービスの市場概要

ファウンドリサービスの主なエンドユーザーは、通信、コンピューティング、ネットワーキング、家電、自動車の各分野です。世界的には、通信機器と家電機器の消費の増加が、世界のファウンドリサービス市場の主な成長要因となっています。ファウンドリサービスの世界市場は、チップ製造プロセスを外注するファブレス企業の増加により、予測期間中に急速に発展すると予想されます。

さらに、ファウンドリは自動化、機械学習、分析にますます注力しています。品質を犠牲にすることなく生産工程を合理化し、歩留まりを向上させるなど、これらの技術の利点が需要を促進しています。生産能力の向上と低価格化により、ベンダーはより大規模な生産契約を受け入れると予測され、その結果、供給量が大幅に増加し、多くの業界で不足するギャップを埋めることになります。

しかし、最先端のファウンドリの建設コストは劇的に上昇し、このセクターに負担をかけています。性能の向上は減少しており、スペシャリスト向けチップの魅力が増しています。チップの普遍性に寄与する設計上の決定事項の中には、特定のコンピュータ活動には最適でないものもあります。

目次

第1章 世界のファウンドリサービス市場の導入

• 市場概要
• 調査範囲
• 前提条件

第2章 エグゼクティブサマリー

第3章 VERIFIED MARKET RESEARCHの調査手法

• データマイニング
• バリデーション
• 一次資料
• データソース一覧

第4章 世界のファウンドリサービス市場の展望

• 概要
• 市場力学
  • 促進要因
  • 抑制要因
  • 機会
• ポーターのファイブフォースモデル
• バリューチェーン分析

第5章 世界のファウンドリサービス市場：種類別

• 概要
• 8インチ
• 12インチ
• その他

第6章 世界のファウンドリサービス市場：用途別

• 概要
• 通信機器
• エレクトロニクス
• その他

第7章 世界のファウンドリサービス市場：地域別

• 概要
• 北米
  • 米国
  • カナダ
  • メキシコ
• 欧州
  • ドイツ
  • 英国
  • フランス
  • その他欧州
• アジア太平洋
  • 中国
  • 日本
  • インド
  • その他アジア太平洋
• その他の地域 (ROW)
  • ラテンアメリカ
  • 中東・アフリカ

第8章 世界のファウンドリサービス市場の競合情勢

• 概要
• 各社の市場ランキング
• 主な発展戦略

第9章 企業プロファイル

• Vanguard International Semiconductor
• Powerchip Technology
• Shanghai Huahong Grace Semiconductor Manufacturing
• Taiwan Semiconductor Manufacturing
• Global Foundries
• United Microelectronics
• Samsung Semiconductor
• TowerJazz Semiconductor
• Semiconductor Manufacturing International
• DB HiTek

第10章 付録

• 関連分析

Foundry Service Market Size And Forecast

Foundry Service Market size was valued at USD 131.39 Billion in 2024 and is projected to reach USD 201.68 Billion by 2032, growing at a CAGR of 6.07% from 2026 to 2032.

Favorable government efforts and rising demand for semiconductor chips are two significant drivers driving the market's expansion. Furthermore, there is a high need for foundry services for communication, electronics, and linked devices, which is projected to boost market expansion. The Global Foundry Service Market report provides a holistic evaluation of the market. The report offers a comprehensive analysis of key segments, trends, drivers, restraints, competitive landscape, and factors that are playing a substantial role in the market.

Global Foundry Service Market Definition

Foundry Services are semiconductor manufacturing services offered by a foundry corporation to third-party clients for the production of semiconductors, IC circuits, or other semiconductors. Many businesses develop and produce their own integrated circuits, which is not cost-effective. As a result, firms outsource the manufacture of integrated circuits to a third-party foundry facility. In the long term, IC circuit fabrication plants are costly to develop and operate. These factories should be kept nearly fully operational to avoid becoming a financial drain on the corporation that controls them.

Global Foundry Service Market Overview

The telecom, computing and networking, consumer electronics, and automotive sectors are the primary end-users of foundry services. Globally, the increasing consumption of communication and consumer electronic devices is the key development driver for the worldwide Foundry Service Market. The worldwide market for foundry services is expected to develop rapidly during the projected period, owing to an increase in the number of fabless firms that outsource their chip fabrication process.

The telecom, computing and networking, consumer electronics, and automotive sectors are the primary end-users of foundry services. Globally, the increasing consumption of communication and consumer electronic devices is the key development driver for the worldwide Foundry Service Market. The worldwide market for foundry services is expected to develop rapidly during the projected period, owing to an increase in the number of fabless firms that outsource their chip fabrication process.

Furthermore, Foundries are increasingly focused on automation, machine learning, and analytics. These technologies' benefits, such as streamlining the production process and improving yield without sacrificing quality, are fueling their demand. With increased production capacity and lower prices, vendors are projected to accept larger production contracts, resulting in considerably greater supply and filling shortfall gaps in numerous industries.

However, the cost of constructing cutting-edge foundries has risen dramatically, putting strain on the sector. Performance gains are decreasing, making specialist chips more appealing. Some design decisions that contribute to chip universality may be suboptimal for certain computer activities.

Global Foundry Service Market Segmentation Analysis

The Global Foundry Service Market is Segmented on the basis of Type, Application, And Geography.

Foundry Service Market, By Type

• 8 Inches
• 12 Inches
• Others

Based on Type, The market is segmented into 8 Inches, 12 Inches, and Others. The 12 Inches model is projected to dominate the market in this sector. Some advantages are provided by 12-inch technology. They often employ copper for metal interconnects, whereas greater resistivity aluminum is used in previous technology, allowing for larger current densities and electromigration prevention.

• The 12-inch technologies also offer a greater number of metal layers, which, when paired with the reduced transistor dimensions, allows for a rise in transistor and routing density, resulting in a decrease in die size or higher functionality for a given unit price. 8-inch wafers are commonly utilized for a wide range of power management and power discrete devices used in the automotive business, notably electric cars, as well as 5G smartphones and servers.

Foundry Service Market, By Application

• Communication
• Electronics
• Others

Based on Application, The market is segmented into Communication, Electronics, and Others. Electronics is expected to dominate the market for smartphones and high-performance computing (HPC) devices such as PCs, tablets, gaming consoles, servers, and 5G base stations due to growing demand.

Foundry Service Market, By Geography

• North America
• Europe
• Asia Pacific
• Rest of the world
• On the basis of Geography, The Global Foundry Service Market is classified into North America, Europe, Asia Pacific, and the Rest of the world. During the projected period, Asia Pacific is likely to lead the Foundry Service Market. As the Asia Pacific area has the largest proportion of semiconductor foundries in the world, with significant businesses like TSMC, Samsung Electronics, and others present. Taiwan, South Korea, Japan, and China are prominent players in the area, each with a sizable market share.

Key Players

The "Global Foundry Service Market" study report will provide a valuable insight with an emphasis on the global market including some of the major players such as Vanguard International Semiconductor, Powerchip Technology, Shanghai Huahong Grace Semiconductor Manufacturing, Taiwan Semiconductor Manufacturing, Global Foundries, United Microelectronics, Samsung Semiconductor, TowerJazz Semiconductor, Semiconductor Manufacturing International and DB HiTek.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share, and market ranking analysis of the above-mentioned players globally.

Key Developments

• In January 2022, - The acquisition of AUO's Fab L3B building and assets by VIS was finalized. These purchases willlet it to enhance its production capacity, with the business aiming for a monthly production capacity of 40,000 8-inch wafers. This enables the firm to meet the ever-increasing mid-and long-term demand for semiconductors.
• In December 2021, TSMC launched the N4X process technology, which is optimized for the high-performance computing (HPC) workload. The N4X is the first of TSMC's HPC-focused technology products to reflect the 5 nm family's highest performance and maximum clock frequency. With these HPC characteristics, the N4X can outperform the N5 by up to 15% and the 1.2 volts quicker N4P by up to 4%. The N4X is expected to enter risk production in the first half of 2024, according to TSMC.

TABLE OF CONTENTS

1 INTRODUCTION OF GLOBAL FOUNDRY SERVICE MARKET

• 1.1 Overview of the Market
• 1.2 Scope of Report
• 1.3 Assumptions

2 EXECUTIVE SUMMARY

3 RESEARCH METHODOLOGY OF VERIFIED MARKET RESEARCH

• 3.1 Data Mining
• 3.2 Validation
• 3.3 Primary Interviews
• 3.4 List of Data Sources

4 GLOBAL FOUNDRY SERVICE MARKET OUTLOOK

• 4.1 Overview
• 4.2 Market Dynamics
  • 4.2.1 Drivers
  • 4.2.2 Restraints
  • 4.2.3 Opportunities
• 4.3 Porters Five Force Model
• 4.4 Value Chain Analysis

5 GLOBAL FOUNDRY SERVICE MARKET, BY TYPE

• 5.1 Overview
• 5.2 8 inches
• 5.312 inches
• 5.4 Other

6 GLOBAL FOUNDRY SERVICE MARKET, BY APPLICATION

• 6.1 Overview
• 6.2 Communication
• 6.3 Electronics
• 6.4 Other

7 GLOBAL FOUNDRY SERVICE MARKET, BY GEOGRAPHY

• 7.1 Overview
• 7.2 North America
  • 7.2.1 U.S.
  • 7.2.2 Canada
  • 7.2.3 Mexico
• 7.3 Europe
  • 7.3.1 Germany
  • 7.3.2 U.K.
  • 7.3.3 France
  • 7.3.4 Rest of Europe
• 7.4 Asia Pacific
  • 7.4.1 China
  • 7.4.2 Japan
  • 7.4.3 India
  • 7.4.4 Rest of Asia Pacific
• 7.5 Rest of the World
  • 7.5.1 Latin America
  • 7.5.2 Middle East and Africa

8 GLOBAL FOUNDRY SERVICE MARKET COMPETITIVE LANDSCAPE

• 8.1 Overview
• 8.2 Company Market Ranking
• 8.3 Key Development Strategies

9 COMPANY PROFILES

• 9.1 Vanguard International Semiconductor
  • 9.1.1 Overview
  • 9.1.2 Financial Performance
  • 9.1.3 Product Outlook
  • 9.1.4 Key Developments
• 9.2 Powerchip Technology
  • 9.2.1 Overview
  • 9.2.2 Financial Performance
  • 9.2.3 Product Outlook
  • 9.2.4 Key Developments
• 9.3 Shanghai Huahong Grace Semiconductor Manufacturing
  • 9.3.1 Overview
  • 9.3.2 Financial Performance
  • 9.3.3 Product Outlook
  • 9.3.4 Key Developments
• 9.4 Taiwan Semiconductor Manufacturing
  • 9.4.1 Overview
  • 9.4.2 Financial Performance
  • 9.4.3 Product Outlook
  • 9.4.4 Key Developments
• 9.5 Global Foundries
  • 9.5.1 Overview
  • 9.5.2 Financial Performance
  • 9.5.3 Product Outlook
  • 9.5.4 Key Developments
• 9.6 United Microelectronics
  • 9.6.1 Overview
  • 9.6.2 Financial Performance
  • 9.6.3 Product Outlook
  • 9.6.4 Key Developments
• 9.7 Samsung Semiconductor
  • 9.7.1 Overview
  • 9.7.2 Financial Performance
  • 9.7.3 Product Outlook
  • 9.7.4 Key Developments
• 9.8 TowerJazz Semiconductor
  • 9.8.1 Overview
  • 9.8.2 Financial Performance
  • 9.8.3 Product Outlook
  • 9.8.4 Key Developments
• 9.9 Semiconductor Manufacturing International
  • 9.9.1 Overview
  • 9.9.2 Financial Performance
  • 9.9.3 Product Outlook
  • 9.9.4 Key Developments
• 9.10 DB HiTek
  • 9.10.1 Overview
  • 9.10.2 Financial Performance
  • 9.10.3 Product Outlook
  • 9.10.4 Key Developments

10 APPENDIX

• 10.1 Related Research