ウエハー処理装置市場- 世界の産業規模、シェア、動向、機会、予測、プロセス別、用途別、エンドユーザー別、地域別、競合別、2020～2030年

ウエハー処理装置の世界市場規模は2024年に89億米ドル、2030年までのCAGRは6.1%で2030年には128億米ドルに達すると予測されています。

人工知能（AI）、5Gネットワーク、モノのインターネット（IoT）の台頭により、高性能半導体チップのニーズが加速しており、ウエハー処理装置への投資が活発化しています。さらに、プロセスノードが5nm以下に微細化し、より小型で効率的なチップへの移行が進んでいるため、高度なウエハー製造技術が必要とされています。電気自動車（EV）市場の成長と自律走行の進歩は、特にパワーエレクトロニクスとMEMSセンサーといった特殊な半導体部品への需要をさらに促進しています。

さらに、データセンターやクラウドコンピューティングインフラの拡大により、高性能GPUやAIプロセッサのニーズが高まっています。米国CHIPS法や欧州の半導体戦略などの政府のイニシアティブは、国内半導体生産を強化するための財政的インセンティブを提供しています。さらに、炭化ケイ素（SiC）ウェハーや窒化ガリウム（GaN）ウェハーのハイパワーアプリケーションへの採用が、市場の展望を再構築しています。大手鋳造メーカーが事業を拡大し、新しい製造施設に投資を注ぎ込んでいることから、ウエハー処理装置市場は今後数年で大きく成長する見通しです。

主な市場促進要因

半導体製造の拡大と技術の進歩

主な市場課題

高額の設備投資と複雑な製造プロセス

主要市場動向

先端プロセスノードと新興半導体材料への移行

目次

第1章 ソリューションの概要

• 市場の定義
• 市場の範囲
  • 対象市場
  • 調査対象年
  • 主要市場セグメンテーション

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 顧客の声

第5章 世界のウエハー処理装置市場概要

第6章 世界のウエハー処理装置市場展望

• 市場規模・予測
  • 金額別
• 市場シェア・予測
  • プロセス別（蒸着、エッチング、質量計測、剥離および洗浄）
  • 用途別（研削・プロービング、研磨、エッジ成形、洗浄、ダイシング）
  • エンドユーザー別（コンピュータ、通信、消費者、産業、その他）
  • 地域別（北米、欧州、南米、中東・アフリカ、アジア太平洋）
• 企業別（2024）
• 市場マップ

第7章 北米のウエハー処理装置市場展望

• 市場規模・予測
• 市場シェア・予測
• 北米：国別分析
  • 米国
  • カナダ
  • メキシコ

第8章 欧州のウエハー処理装置市場展望

• 市場規模・予測
• 市場シェア・予測
• 欧州：国別分析
  • ドイツ
  • フランス
  • 英国
  • イタリア
  • スペイン
  • ベルギー

第9章 アジア太平洋地域のウエハー処理装置市場展望

• 市場規模・予測
• 市場シェア・予測
• アジア太平洋地域：国別分析
  • 中国
  • インド
  • 日本
  • 韓国
  • オーストラリア
  • インドネシア
  • ベトナム

第10章 南米のウエハー処理装置市場展望

• 市場規模・予測
• 市場シェア・予測
• 南米：国別分析
  • ブラジル
  • コロンビア
  • アルゼンチン
  • チリ

第11章 中東・アフリカのウエハー処理装置市場展望

• 市場規模・予測
• 市場シェア・予測
• 中東・アフリカ：国別分析
  • サウジアラビア
  • アラブ首長国連邦
  • 南アフリカ
  • トルコ
  • イスラエル

第12章 市場力学

• 促進要因
• 課題

第13章 市場動向と発展

第14章 企業プロファイル

• Applied Materials, Inc.
• ASML Holding N.V.
• Tokyo Electron Limited
• Lam Research Corporation
• KLA Corporation
• Hitachi Kokusai Electric Inc.
• Motorola Solutions, Inc.
• Nikon Corporation

第15章 戦略的提言

第16章 調査会社について・免責事項

The Global Wafer Processing Equipment Market was valued at USD 8.9 billion in 2024 and is expected to reach USD 12.8 billion by 2030 with a CAGR of 6.1% through 2030. The rise of artificial intelligence (AI), 5G networks, and the Internet of Things (IoT) is accelerating the need for high-performance semiconductor chips, thereby boosting investments in wafer processing equipment. Additionally, the transition to smaller and more efficient chips, with process nodes shrinking below 5nm, necessitates advanced wafer fabrication technologies. The growing electric vehicle (EV) market and autonomous driving advancements are further driving demand for specialized semiconductor components, particularly power electronics and MEMS sensors.

Moreover, the expansion of data centers and cloud computing infrastructure is increasing the need for high-performance GPUs and AI processors. Government initiatives, such as the U.S. CHIPS Act and Europe's semiconductor strategies, are providing financial incentives to enhance domestic semiconductor production. Furthermore, the adoption of silicon carbide (SiC) and gallium nitride (GaN) wafers for high-power applications is reshaping the market landscape. With major foundries expanding operations and investments pouring into new fabrication facilities, the wafer processing equipment market is poised for significant growth in the coming years.

Key Market Drivers

Expansion of Semiconductor Manufacturing and Technological Advancements

The Global Wafer Processing Equipment Market is significantly driven by the continuous expansion of semiconductor manufacturing and rapid technological advancements. The increasing demand for advanced semiconductor chips across various industries, including consumer electronics, automotive, telecommunications, and healthcare, is pushing manufacturers to invest heavily in new fabrication facilities and cutting-edge wafer processing technologies. With the advent of artificial intelligence (AI), 5G networks, and the Internet of Things (IoT), the need for high-performance chips has surged, requiring sophisticated wafer fabrication processes.

One of the most critical advancements is the transition toward smaller process nodes, with chip manufacturers moving from 7nm and 5nm technology to 3nm and beyond. This shift demands highly precise wafer processing techniques, including advanced lithography, etching, and chemical mechanical planarization (CMP). Technologies like Extreme Ultraviolet (EUV) Lithography have become essential for achieving high-resolution patterns on semiconductor wafers. This has resulted in increased investments from companies such as TSMC, Samsung, and Intel, which are expanding their foundry capacities to meet the growing global semiconductor demand.

Furthermore, as semiconductor applications diversify, there is an increasing need for advanced wafer materials such as silicon carbide (SiC) and gallium nitride (GaN), particularly for power electronics and RF devices. These materials offer superior electrical properties and are widely used in electric vehicles (EVs), 5G base stations, and high-frequency radar systems. The adoption of these materials is driving innovation in wafer processing equipment, as traditional silicon wafer processing tools must be adapted or upgraded to handle new substrates effectively.

Key Market Challenges

High Capital Investment and Complex Manufacturing Processes

One of the major challenges in the Global Wafer Processing Equipment Market is the high capital investment required for semiconductor fabrication and the complexity of wafer processing technologies. Setting up a semiconductor fabrication plant (fab) requires billions of dollars in initial investment, covering advanced equipment, cleanroom infrastructure, and R&D. The cost of state-of-the-art wafer processing tools, such as Extreme Ultraviolet (EUV) Lithography systems, atomic layer deposition (ALD) equipment, and ion implantation systems, has surged due to their increasing sophistication. For instance, an EUV lithography machine from ASML can cost over $150 million per unit, making it one of the most expensive pieces of equipment in semiconductor manufacturing.

Moreover, as semiconductor nodes continue to shrink below 5nm, 3nm, and even 2nm, the fabrication process becomes increasingly complex and challenging. Achieving high precision in wafer processing requires multi-step processes, including photolithography, etching, doping, deposition, and chemical mechanical planarization (CMP), each demanding ultra-precise control. Any defect or contamination during manufacturing can result in massive yield losses, affecting profitability. The industry's push towards 3D stacking, chiplet architectures, and heterogeneous integration has further added to the complexity of wafer processing, requiring new advancements in bonding, interconnect, and packaging technologies.

Another critical factor is the long lead time for new semiconductor fabs and equipment deployment. Setting up a new fabrication facility can take anywhere from 2 to 5 years, depending on the scale and location. Additionally, semiconductor equipment suppliers often face production bottlenecks due to limited manufacturing capacity, supply chain disruptions, and geopolitical restrictions. For instance, ASML, the only manufacturer of EUV lithography machines, has a limited supply capacity, creating delays in fab expansions for major foundries like TSMC, Samsung, and Intel.

The increasing cost and complexity of raw materials used in wafer processing also contribute to market challenges. High-purity silicon wafers, specialty gases, and advanced photoresists used in lithography are subject to supply chain volatility, price fluctuations, and geopolitical restrictions. The reliance on a few key suppliers for critical materials-such as Shin-Etsu and SUMCO for silicon wafers and JSR and TOK for photoresists-poses a risk of supply disruptions, impacting semiconductor production.

Furthermore, the rapid pace of innovation in semiconductor technology demands continuous R&D investment from wafer processing equipment manufacturers. Companies need to consistently develop next-generation equipment that supports advanced process nodes, higher wafer sizes (such as transitioning from 300mm to 450mm wafers), and new material capabilities. However, the high costs and technical challenges associated with these developments can limit the ability of smaller equipment manufacturers to compete with industry leaders like ASML, Applied Materials, Lam Research, and Tokyo Electron.

In summary, the high capital expenditure, technological complexity, long lead times, and supply chain dependencies make semiconductor wafer processing a highly challenging and resource-intensive industry. Overcoming these barriers requires strategic investments, innovation in manufacturing techniques, and global collaboration to ensure a stable and sustainable supply chain.

Key Market Trends

Transition to Advanced Process Nodes and Emerging Semiconductor Materials

One of the most prominent trends in the Global Wafer Processing Equipment Market is the shift towards smaller process nodes and the adoption of new semiconductor materials. As technology companies push for higher performance, lower power consumption, and greater efficiency, semiconductor manufacturers are increasingly adopting sub-5nm process technologies, with advancements towards 3nm, 2nm, and beyond. This shift requires cutting-edge wafer processing equipment, including Extreme Ultraviolet (EUV) Lithography, advanced etching, and atomic layer deposition (ALD) systems, which can achieve the necessary precision at nanometer scales.

EUV Lithography, pioneered by ASML, has become an essential technology for fabricating 3nm and 2nm chips, enabling higher transistor density and improved energy efficiency. Leading semiconductor foundries such as TSMC, Samsung, and Intel are heavily investing in next-generation lithography tools to remain competitive in high-performance computing, AI, and 5G applications. As a result, demand for wafer processing equipment capable of handling next-gen lithography techniques is growing rapidly.

In addition to shrinking process nodes, there is a major industry shift toward new semiconductor materials beyond traditional silicon. Silicon Carbide (SiC) and Gallium Nitride (GaN) are gaining traction in power electronics, electric vehicles (EVs), and 5G base stations, thanks to their superior electrical and thermal properties. SiC-based power semiconductors are widely adopted in EV inverters and fast-charging stations, as they offer higher efficiency and better heat resistance than conventional silicon-based semiconductors.

Key Market Players

• Applied Materials, Inc.
• ASML Holding N.V.
• Tokyo Electron Limited
• Lam Research Corporation
• KLA Corporation
• Hitachi Kokusai Electric Inc.
• Motorola Solutions, Inc.
• Nikon Corporation

Report Scope:

In this report, the Global Wafer Processing Equipment Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Wafer Processing Equipment Market, By Process:

• Depositon
• Etch
• Mass Metrology
• Strip and Clean

Wafer Processing Equipment Market, By Application:

• Grinding and Probing
• Polishing
• Edge Shaping
• Cleaning
• Dicing

Wafer Processing Equipment Market, By End User:

• Computer
• Communication
• Consumer
• Industrial
• Others

Wafer Processing Equipment Market, By Region:

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Belgium
• Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
  • Indonesia
  • Vietnam
• South America
  • Brazil
  • Colombia
  • Argentina
  • Chile
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • South Africa
  • Turkey
  • Israel

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Wafer Processing Equipment Market.

Available Customizations:

Global Wafer Processing Equipment Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Solution Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Formulation of the Scope
• 2.4. Assumptions and Limitations
• 2.5. Sources of Research
  • 2.5.1. Secondary Research
  • 2.5.2. Primary Research
• 2.6. Approach for the Market Study
  • 2.6.1. The Bottom-Up Approach
  • 2.6.2. The Top-Down Approach
• 2.7. Methodology Followed for Calculation of Market Size & Market Shares
• 2.8. Forecasting Methodology
  • 2.8.1. Data Triangulation & Validation

3. Executive Summary

4. Voice of Customer

5. Global Wafer Processing Equipment Market Overview

6. Global Wafer Processing Equipment Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Process (Deposition, Etch, Mass Metrology, Strip and Clean)
  • 6.2.2. By Application (Grinding and Probing, Polishing, Edge Shaping, Cleaning, Dicing)
  • 6.2.3. By End User (Computer, Communication, Consumer, Industrial, Others)
  • 6.2.4. By Region (North America, Europe, South America, Middle East & Africa, Asia Pacific)
• 6.3. By Company (2024)
• 6.4. Market Map

7. North America Wafer Processing Equipment Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Process
  • 7.2.2. By Application
  • 7.2.3. By End User
  • 7.2.4. By Country
• 7.3. North America: Country Analysis
  • 7.3.1. United States Wafer Processing Equipment Market Outlook
    • 7.3.1.1.Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2.Market Share & Forecast
      • 7.3.1.2.1. By Process
      • 7.3.1.2.2. By Application
      • 7.3.1.2.3. By End User
  • 7.3.2. Canada Wafer Processing Equipment Market Outlook
    • 7.3.2.1.Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2.Market Share & Forecast
      • 7.3.2.2.1. By Process
      • 7.3.2.2.2. By Application
      • 7.3.2.2.3. By End User
  • 7.3.3. Mexico Wafer Processing Equipment Market Outlook
    • 7.3.3.1.Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2.Market Share & Forecast
      • 7.3.3.2.1. By Process
      • 7.3.3.2.2. By Application
      • 7.3.3.2.3. By End User

8. Europe Wafer Processing Equipment Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Process
  • 8.2.2. By Application
  • 8.2.3. By End User
  • 8.2.4. By Country
• 8.3. Europe: Country Analysis
  • 8.3.1. Germany Wafer Processing Equipment Market Outlook
    • 8.3.1.1.Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2.Market Share & Forecast
      • 8.3.1.2.1. By Process
      • 8.3.1.2.2. By Application
      • 8.3.1.2.3. By End User
  • 8.3.2. France Wafer Processing Equipment Market Outlook
    • 8.3.2.1.Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2.Market Share & Forecast
      • 8.3.2.2.1. By Process
      • 8.3.2.2.2. By Application
      • 8.3.2.2.3. By End User
  • 8.3.3. United Kingdom Wafer Processing Equipment Market Outlook
    • 8.3.3.1.Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2.Market Share & Forecast
      • 8.3.3.2.1. By Process
      • 8.3.3.2.2. By Application
      • 8.3.3.2.3. By End User
  • 8.3.4. Italy Wafer Processing Equipment Market Outlook
    • 8.3.4.1.Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2.Market Share & Forecast
      • 8.3.4.2.1. By Process
      • 8.3.4.2.2. By Application
      • 8.3.4.2.3. By End User
  • 8.3.5. Spain Wafer Processing Equipment Market Outlook
    • 8.3.5.1.Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2.Market Share & Forecast
      • 8.3.5.2.1. By Process
      • 8.3.5.2.2. By Application
      • 8.3.5.2.3. By End User
  • 8.3.6. Belgium Wafer Processing Equipment Market Outlook
    • 8.3.6.1.Market Size & Forecast
      • 8.3.6.1.1. By Value
    • 8.3.6.2.Market Share & Forecast
      • 8.3.6.2.1. By Process
      • 8.3.6.2.2. By Application
      • 8.3.6.2.3. By End User

9. Asia Pacific Wafer Processing Equipment Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Process
  • 9.2.2. By Application
  • 9.2.3. By End User
  • 9.2.4. By Country
• 9.3. Asia Pacific: Country Analysis
  • 9.3.1. China Wafer Processing Equipment Market Outlook
    • 9.3.1.1.Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2.Market Share & Forecast
      • 9.3.1.2.1. By Process
      • 9.3.1.2.2. By Application
      • 9.3.1.2.3. By End User
  • 9.3.2. India Wafer Processing Equipment Market Outlook
    • 9.3.2.1.Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2.Market Share & Forecast
      • 9.3.2.2.1. By Process
      • 9.3.2.2.2. By Application
      • 9.3.2.2.3. By End User
  • 9.3.3. Japan Wafer Processing Equipment Market Outlook
    • 9.3.3.1.Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2.Market Share & Forecast
      • 9.3.3.2.1. By Process
      • 9.3.3.2.2. By Application
      • 9.3.3.2.3. By End User
  • 9.3.4. South Korea Wafer Processing Equipment Market Outlook
    • 9.3.4.1.Market Size & Forecast
      • 9.3.4.1.1. By Value
    • 9.3.4.2.Market Share & Forecast
      • 9.3.4.2.1. By Process
      • 9.3.4.2.2. By Application
      • 9.3.4.2.3. By End User
  • 9.3.5. Australia Wafer Processing Equipment Market Outlook
    • 9.3.5.1.Market Size & Forecast
      • 9.3.5.1.1. By Value
    • 9.3.5.2.Market Share & Forecast
      • 9.3.5.2.1. By Process
      • 9.3.5.2.2. By Application
      • 9.3.5.2.3. By End User
  • 9.3.6. Indonesia Wafer Processing Equipment Market Outlook
    • 9.3.6.1.Market Size & Forecast
      • 9.3.6.1.1. By Value
    • 9.3.6.2.Market Share & Forecast
      • 9.3.6.2.1. By Process
      • 9.3.6.2.2. By Application
      • 9.3.6.2.3. By End User
  • 9.3.7. Vietnam Wafer Processing Equipment Market Outlook
    • 9.3.7.1.Market Size & Forecast
      • 9.3.7.1.1. By Value
    • 9.3.7.2.Market Share & Forecast
      • 9.3.7.2.1. By Process
      • 9.3.7.2.2. By Application
      • 9.3.7.2.3. By End User

10. South America Wafer Processing Equipment Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Process
  • 10.2.2. By Application
  • 10.2.3. By End User
  • 10.2.4. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Wafer Processing Equipment Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Process
      • 10.3.1.2.2. By Application
      • 10.3.1.2.3. By End User
  • 10.3.2. Colombia Wafer Processing Equipment Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Process
      • 10.3.2.2.2. By Application
      • 10.3.2.2.3. By End User
  • 10.3.3. Argentina Wafer Processing Equipment Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Process
      • 10.3.3.2.2. By Application
      • 10.3.3.2.3. By End User
  • 10.3.4. Chile Wafer Processing Equipment Market Outlook
    • 10.3.4.1. Market Size & Forecast
      • 10.3.4.1.1. By Value
    • 10.3.4.2. Market Share & Forecast
      • 10.3.4.2.1. By Process
      • 10.3.4.2.2. By Application
      • 10.3.4.2.3. By End User

11. Middle East & Africa Wafer Processing Equipment Market Outlook

• 11.1. Market Size & Forecast
  • 11.1.1. By Value
• 11.2. Market Share & Forecast
  • 11.2.1. By Process
  • 11.2.2. By Application
  • 11.2.3. By End User
  • 11.2.4. By Country
• 11.3. Middle East & Africa: Country Analysis
  • 11.3.1. Saudi Arabia Wafer Processing Equipment Market Outlook
    • 11.3.1.1. Market Size & Forecast
      • 11.3.1.1.1. By Value
    • 11.3.1.2. Market Share & Forecast
      • 11.3.1.2.1. By Process
      • 11.3.1.2.2. By Application
      • 11.3.1.2.3. By End User
  • 11.3.2. UAE Wafer Processing Equipment Market Outlook
    • 11.3.2.1. Market Size & Forecast
      • 11.3.2.1.1. By Value
    • 11.3.2.2. Market Share & Forecast
      • 11.3.2.2.1. By Process
      • 11.3.2.2.2. By Application
      • 11.3.2.2.3. By End User
  • 11.3.3. South Africa Wafer Processing Equipment Market Outlook
    • 11.3.3.1. Market Size & Forecast
      • 11.3.3.1.1. By Value
    • 11.3.3.2. Market Share & Forecast
      • 11.3.3.2.1. By Process
      • 11.3.3.2.2. By Application
      • 11.3.3.2.3. By End User
  • 11.3.4. Turkey Wafer Processing Equipment Market Outlook
    • 11.3.4.1. Market Size & Forecast
      • 11.3.4.1.1. By Value
    • 11.3.4.2. Market Share & Forecast
      • 11.3.4.2.1. By Process
      • 11.3.4.2.2. By Application
      • 11.3.4.2.3. By End User
  • 11.3.5. Israel Wafer Processing Equipment Market Outlook
    • 11.3.5.1. Market Size & Forecast
      • 11.3.5.1.1. By Value
    • 11.3.5.2. Market Share & Forecast
      • 11.3.5.2.1. By Process
      • 11.3.5.2.2. By Application
      • 11.3.5.2.3. By End User

12. Market Dynamics

• 12.1. Drivers
• 12.2. Challenges

13. Market Trends and Developments

14. Company Profiles

• 14.1. Applied Materials, Inc.
  • 14.1.1. Business Overview
  • 14.1.2. Key Revenue and Financials
  • 14.1.3. Recent Developments
  • 14.1.4. Key Personnel/Key Contact Person
  • 14.1.5. Key Product/Services Offered
• 14.2. ASML Holding N.V.
  • 14.2.1. Business Overview
  • 14.2.2. Key Revenue and Financials
  • 14.2.3. Recent Developments
  • 14.2.4. Key Personnel/Key Contact Person
  • 14.2.5. Key Product/Services Offered
• 14.3. Tokyo Electron Limited
  • 14.3.1. Business Overview
  • 14.3.2. Key Revenue and Financials
  • 14.3.3. Recent Developments
  • 14.3.4. Key Personnel/Key Contact Person
  • 14.3.5. Key Product/Services Offered
• 14.4. Lam Research Corporation
  • 14.4.1. Business Overview
  • 14.4.2. Key Revenue and Financials
  • 14.4.3. Recent Developments
  • 14.4.4. Key Personnel/Key Contact Person
  • 14.4.5. Key Product/Services Offered
• 14.5. KLA Corporation
  • 14.5.1. Business Overview
  • 14.5.2. Key Revenue and Financials
  • 14.5.3. Recent Developments
  • 14.5.4. Key Personnel/Key Contact Person
  • 14.5.5. Key Product/Services Offered
• 14.6. Hitachi Kokusai Electric Inc.
  • 14.6.1. Business Overview
  • 14.6.2. Key Revenue and Financials
  • 14.6.3. Recent Developments
  • 14.6.4. Key Personnel/Key Contact Person
  • 14.6.5. Key Product/Services Offered
• 14.7. Motorola Solutions, Inc.
  • 14.7.1. Business Overview
  • 14.7.2. Key Revenue and Financials
  • 14.7.3. Recent Developments
  • 14.7.4. Key Personnel/Key Contact Person
  • 14.7.5. Key Product/Services Offered
• 14.8. Nikon Corporation
  • 14.8.1. Business Overview
  • 14.8.2. Key Revenue and Financials
  • 14.8.3. Recent Developments
  • 14.8.4. Key Personnel/Key Contact Person
  • 14.8.5. Key Product/Services Offered
  • 14.8.6. Key Product/Services Offered

15. Strategic Recommendations

16. About Us & Disclaimer