半導体組立・実装装置の世界市場レポート 2025年

半導体組立・実装装置市場規模は、今後数年間で力強い成長が見込まれます。2029年の年間平均成長率（CAGR）は9.5%で、193億9,000万米ドルに成長します。予測期間の成長は、半導体産業を推進する政府の取り組み、電気自動車需要の増加、医療産業からの需要増加、都市化の進展、携帯電子機器の需要増加などに起因しています。予測期間における主な動向としては、ビッグデータとAI（人工知能）を利用した新しい半導体検査機の発売、新しい自動フリップチップボンダーの導入など新製品の革新への注力、ウェットプロセス製品ラインを強化する化合物半導体装置の導入への注力、投資の増加への注力、新製品開発のためのパートナーシップの締結への注力などが挙げられます。

民生用電子機器の需要増加が半導体組立・実装装置市場の成長を牽引すると予想されます。民生用電子機器は、半導体産業に全面的に依存する重要な分野です。例えば、米国を拠点とする業界団体CTA（Consumer Technology Association）は2022年1月、スマートフォンの出荷台数が1億5,410万台に達し、2022年の売上が747億米ドルに達すると予測しました。これは、2021年の1億4,960万台から3％の増加です。さらに、自動車技術の売上は、チップ供給の改善により、2022年には7％成長し、149億米ドルから160億米ドルに達すると予想されています。その結果、コンシューマー・エレクトロニクス市場の拡大が半導体組立・実装装置の需要を高める可能性が高いです。

電気自動車（EV）の人気の高まりは、今後の半導体組立・実装装置市場の成長を牽引すると予想されます。EVは電気を動力源とし、通常は充電式バッテリーパックやエネルギー貯蔵システムに蓄えられ、その電気推進システムは高度なパワーエレクトロニクスに依存しています。これらのシステムは、精密に組み立てられ、パッケージングされなければならない特殊な半導体部品を必要とします。例えば、2024年6月、フランスを拠点とする政府間機関、国際エネルギー機関（IEA）のデータから、2023年の世界の電気自動車販売台数が1,400万台を超え、2022年から35％増加し、2018年の販売台数の6倍以上に達することが明らかになった。この伸びは、自動車販売全体に占める電気自動車の割合が前年の14％から約18％に上昇したことを示しています。その結果、電気自動車の人気の高まりが半導体組立・実装装置市場の成長に大きく寄与しています。

目次

第1章 エグゼクティブサマリー

第2章 市場の特徴

第3章 市場動向と戦略

第4章 市場：金利、インフレ、地政学、コロナ禍、回復が市場に与える影響を含むマクロ経済シナリオ

第5章 世界の成長分析と戦略分析フレームワーク

• 世界半導体組立・実装装置 PESTEL分析（政治、社会、技術、環境、法的要因、促進要因、抑制要因）
• 最終用途産業の分析
• 世界の半導体組立・実装装置市場：成長率分析
• 世界の半導体組立・実装装置市場の実績：規模と成長, 2019-2024
• 世界の半導体組立・実装装置市場の予測：規模と成長, 2024-2029, 2034F
• 世界半導体組立・実装装置総アドレス可能市場（TAM）

第6章 市場セグメンテーション

• 世界の半導体組立・実装装置市場：タイプ別、実績と予測, 2019-2024, 2024-2029F, 2034F
• メッキ装置
• 検査およびダイシング装置
• ワイヤーボンディング装置
• ダイボンディング装置
• その他のタイプ
• 世界の半導体組立・実装装置市場：用途別、実績と予測, 2019-2024, 2024-2029F, 2034F
• コンパニオンアニマル
• 家畜
• 世界の半導体組立・実装装置市場：エンドユーザー別、実績と予測, 2019-2024, 2024-2029F, 2034F
• OSATS（アウトソーシング半導体組立・テスト）
• IDMS（統合デバイスメーカー）
• 世界の半導体組立・実装装置市場めっき装置のサブセグメンテーション、タイプ別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 電気めっきシステム
• 無電解めっきシステム
• めっき工程制御装置
• 世界の半導体組立・実装装置市場検査およびダイシング装置のサブセグメンテーション、タイプ別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 自動光学検査（AOI）システム
• X線検査システム
• ダイシングソーとダイシングシステム
• 世界の半導体組立・実装装置市場、ワイヤボンディング装置のサブセグメンテーション、タイプ別、実績と予測, 2019-2024, 2024-2029F, 2034F
• サーモソニックワイヤボンダー
• ウェッジボンダー
• ボールボンダー
• 世界の半導体組立・実装装置市場、ダイボンディング装置のサブセグメンテーション、タイプ別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 自動ダイボンダー
• 手動ダイボンダー
• フリップチップボンダー
• 世界の半導体組立・実装装置市場、その他のタイプのサブセグメンテーション、タイプ別、実績と予測, 2019-2024, 2024-2029F, 2034F
• カプセル化および成形装置
• 試験および処理機器
• レーザーマーキング装置

第7章 地域別・国別分析

• 世界の半導体組立・実装装置市場：地域別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 世界の半導体組立・実装装置市場：国別、実績と予測, 2019-2024, 2024-2029F, 2034F

第8章 アジア太平洋市場

第9章 中国市場

第10章 インド市場

第11章 日本市場

第12章 オーストラリア市場

第13章 インドネシア市場

第14章 韓国市場

第15章 西欧市場

第16章 英国市場

第17章 ドイツ市場

第18章 フランス市場

第19章 イタリア市場

第20章 スペイン市場

第21章 東欧市場

第22章 ロシア市場

第23章 北米市場

第24章 米国市場

第25章 カナダ市場

第26章 南米市場

第27章 ブラジル市場

第28章 中東市場

第29章 アフリカ市場

第30章 競合情勢と企業プロファイル

• 半導体組立・実装装置市場：競合情勢
• 半導体組立・実装装置市場：企業プロファイル
  • Tokyo Electron Ltd Overview, Products and Services, Strategy and Financial Analysis
  • Applied Materials, Inc Overview, Products and Services, Strategy and Financial Analysis
  • Kulicke and Soffa Industries, Inc Overview, Products and Services, Strategy and Financial Analysis
  • ASML Holding N.V Overview, Products and Services, Strategy and Financial Analysis
  • BE Semiconductor Industries N.V Overview, Products and Services, Strategy and Financial Analysis

第31章 その他の大手企業と革新的企業

• Tokyo Seimitsu
• Amkor Technology
• ASM Pacific Technology
• Screen Holdings Co. Ltd
• KLA-Tencor
• Toshiba Corp
• Renesas Electronics Corporation
• Fujitsu Limited
• Panasonic Corporation
• Continental Device India Ltd（CDIL）
• MosChip Semiconductor Technologies
• Advanced Semiconductor Engineering Inc
• Zhixin Semiconductor
• UNISOC
• Yangtze Memory Technologies Co., Ltd（YTMC）

第32章 世界の市場競合ベンチマーキングとダッシュボード

第33章 主要な合併と買収

第34章 最近の市場動向

第35章 市場の潜在力が高い国、セグメント、戦略

• 半導体組立・実装装置市場2029：新たな機会を提供する国
• 半導体組立・実装装置市場2029：新たな機会を提供するセグメント
• 半導体組立・実装装置市場2029：成長戦略
  • 市場動向に基づく戦略
  • 競合の戦略

第36章 付録

Semiconductor assembly and packaging equipment consists of the tools and machinery utilized to assemble and package semiconductor devices, ensuring their functionality and protection. This process includes attaching semiconductor chips to substrates, connecting them with wires, and encasing them in protective materials for use in electronic devices.

The primary types of semiconductor assembly and packaging equipment include plating equipment, inspection and dicing equipment, wire bonding equipment, and die-bonding equipment. Wire bonding equipment specifically pertains to the process of connecting two pieces of equipment using a wire, a crucial step for hazard prevention. These equipment find diverse applications in consumer electronics, healthcare devices, automotive, enterprise storage, and various other sectors. The key end-users encompass OSATs (Outsourced Semiconductor Assembly and Test) and IDMs (Integrated Device Manufacturers).

The semiconductor assembly and packaging equipment market research report is one of a series of new reports from The Business Research Company that provides semiconductor assembly and packaging equipment market statistics, including semiconductor assembly and packaging equipment industry global market size, regional shares, competitors with a semiconductor assembly and packaging equipment market share, detailed semiconductor assembly and packaging equipment market segments, market trends and opportunities, and any further data you may need to thrive in the semiconductor assembly and packaging equipment industry. This semiconductor assembly and packaging equipment market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The semiconductor assembly and packaging equipment market size has grown rapidly in recent years. It will grow from $12.16 billion in 2024 to $13.48 billion in 2025 at a compound annual growth rate (CAGR) of 10.9%. The growth in the historic period can be attributed to growth in emerging markets, an increasing demand for semiconductor equipment, an increasing demand for consumer electronics and a rise in disposable income.

The semiconductor assembly and packaging equipment market size is expected to see strong growth in the next few years. It will grow to $19.39 billion in 2029 at a compound annual growth rate (CAGR) of 9.5%. The growth in the forecast period can be attributed to government initiatives to propel the semiconductor industry, an increasing demand for electric vehicles, an increasing demand from the medical industry, rising urbanization and an increasing demand for portable electronic devices. Major trends in the forecast period include focus on the launch of new semiconductor inspection machines using big data and ai (artificial intelligence), focus on innovating new products such as the introduction of a new automatic flip-chip bonder, focus on introducing compound semiconductor equipment to strengthen the wet process product line, focus on increasing investment and focus on undergoing partnerships to develop new products.

The increasing demand for consumer electronics is expected to drive the growth of the semiconductor assembly and packaging equipment market. Consumer electronics is a crucial segment that relies entirely on the semiconductor industry. For example, in January 2022, the Consumer Technology Association (CTA), a U.S.-based trade organization, projected smartphone shipments to reach 154.1 million units, generating $74.7 billion in revenue for 2022. This represents a 3% increase from 2021's 149.6 million units. Additionally, automotive technology sales are anticipated to grow by 7% in 2022, reaching $16 billion, up from $14.9 billion, thanks to improved chip supply. Consequently, the expanding consumer electronics market is likely to heighten the demand for semiconductor assembly and packaging equipment.

The rising popularity of electric vehicles (EVs) is expected to drive growth in the semiconductor assembly and packaging equipment market in the future. EVs are powered by electricity, typically stored in rechargeable battery packs or energy storage systems, and their electric propulsion systems rely on advanced power electronics. These systems require specialized semiconductor components that must be precisely assembled and packaged. For example, in June 2024, data from The International Energy Agency (IEA), a France-based intergovernmental organization, revealed that global electric car sales exceeded 14 million in 2023, representing a 35% increase from 2022 and more than six times the volume sold in 2018. This growth indicates that electric vehicles accounted for about 18% of total car sales, up from 14% the previous year. As a result, the rising popularity of electric vehicles is significantly contributing to the growth of the semiconductor assembly and packaging equipment market.

Technological advancements emerge as a prominent trend driving innovation in the semiconductor assembly and packaging equipment market. Key players in the market are actively introducing new technologies to enhance packaging applications, with a focus on compound equipment. Shengmei Semiconductor Equipment (Shanghai) Co., Ltd., a China-based provider of wafer process solutions, exemplifies this trend. In January 2022, the company launched an integrated equipment series supporting compound semiconductor manufacturing. The compound semiconductor wet process product line includes various equipment such as gluing, development, photoresist de-gluing, wet etching, cleaning, and metal plating equipment. It is designed to be automatically compatible with flat-edged or notched wafers, showcasing advancements in semiconductor assembly and packaging technology.

Major companies in the semiconductor assembly and packaging equipment market are also investing in the development of new technologies such as semiconductor package substrates to expand their customer bases, increase sales, and boost revenue. A semiconductor package substrate is a critical component in assembling semiconductor devices, including integrated circuits (ICs) and microprocessors. LG Innotek Co. Ltd., a South Korea-based electronic components manufacturer, introduced the 2Metal Chip on Film (COF) in February 2023. COF is an advanced semiconductor package substrate designed for establishing connections between displays and flexible Printed Circuit Boards (PCBs). The product minimizes bezels in devices such as TVs, notebook PCs, monitors, and smartphones while contributing to a reduction in module size. The innovative design features micro-via holes on a thin film and integrates ultra-miniaturized circuits on both sides, facilitating faster signal transmission and enabling ultra-high-definition screens.

In November 2022, Lam Research Corp, a U.S.-based wafer fabrication equipment and service company, acquired SPEC (Semiconductor Process Equipment Corporation) and SEMSYSCO GmbH for undisclosed amounts. This acquisition is intended to enhance Lam Research's capabilities in advanced chip packaging, particularly for state-of-the-art logic chips and chiplet-based solutions. This strategic move aims to meet the increasing demand for high-performance computing (HPC), artificial intelligence (AI), and other data-intensive applications. SEMSYSCO GmbH is an Austria-based company specializing in semiconductor manufacturing machines and systems.

Major companies operating in the semiconductor assembly and packaging equipment market include Tokyo Electron Ltd, Applied Materials, Inc, Kulicke and Soffa Industries, Inc, ASML Holding N.V, BE Semiconductor Industries N.V, Tokyo Seimitsu, Amkor Technology, ASM Pacific Technology, Screen Holdings Co. Ltd, KLA-Tencor, Toshiba Corp, Renesas Electronics Corporation, Fujitsu Limited, Panasonic Corporation, Continental Device India Ltd (CDIL), MosChip Semiconductor Technologies, Advanced Semiconductor Engineering Inc, Zhixin Semiconductor, UNISOC, Yangtze Memory Technologies Co., Ltd (YTMC), GigaDevice, CR Micro, Silan, Infineon Technologies AG, UnitySC, Lam Research Corporation, Hitachi High Technologies Corporation, Advantest, Teradyne Inc, Smart Modular Technologies, Multilaser, Flextronics, STMicroelectronics, ROHM Semiconductor, Semiconductors and Technologies Limited Company

Asia-Pacific was the largest region in the semiconductor assembly and packaging equipment market in 2024. Western Europe was the second-largest region in the global semiconductor assembly and packaging equipment market share. The regions covered in the semiconductor assembly and packaging equipment market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa

The countries covered in the semiconductor assembly and packaging equipment market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Italy, Canada, Spain

The semiconductor assembly and packaging equipment market consists of sales of precision ACCRETECH dicing blades, probing machines, polish grinders, high rigid grinder, CMP, edge shaping products, sliced wafer demounting and cleaning machine. Values in this market are factory gate values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Semiconductor Assembly And Packaging Equipment Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on semiconductor assembly and packaging equipment market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

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Where is the largest and fastest growing market for semiconductor assembly and packaging equipment ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The semiconductor assembly and packaging equipment market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

• The market characteristics section of the report defines and explains the market.
• The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
• The forecasts are made after considering the major factors currently impacting the market. These include:

The forecasts are made after considering the major factors currently impacting the market. These include the Russia-Ukraine war, rising inflation, higher interest rates, and the legacy of the COVID-19 pandemic.

• Market segmentations break down the market into sub markets.
• The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
• The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
• The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

• Markets Covered:1) By Type: Plating Equipment, Inspection And Dicing Equipment, Wire Bonding Equipment, Die-Bonding Equipment, And Other Types.
• 2) By Application: Companion Animals, Livestock.
• 3) By End User: OSATS (Outsourced Semiconductor Assembly And Test), IDMS (Integrated Device Manufacturers).
• Subsegments:
• 1) By Plating Equipment: Electroplating Systems; Electroless Plating Systems; Plating Process Control Equipment
• 2) By Inspection And Dicing Equipment: Automated Optical Inspection (AOI) Systems; X-Ray Inspection Systems; Dicing Saws And Dicing Systems
• 3) By Wire Bonding Equipment: Thermosonic Wire Bonders; Wedge Bonders; Ball Bonders
• 4) By Die-Bonding Equipment: Automated Die Bonders; Manual Die Bonders; Flip-Chip Bonders
• 5) By Other Types: Encapsulation And Molding Equipment; Test And Handling Equipment; Laser Marking Equipment
• Companies Mentioned: Tokyo Electron Ltd; Applied Materials, Inc; Kulicke and Soffa Industries, Inc; ASML Holding N.V; BE Semiconductor Industries N.V
• Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
• Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
• Time series: Five years historic and ten years forecast.
• Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
• Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
• Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
• Delivery format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. Semiconductor Assembly And Packaging Equipment Market Characteristics

3. Semiconductor Assembly And Packaging Equipment Market Trends And Strategies

4. Semiconductor Assembly And Packaging Equipment Market - Macro Economic Scenario including the impact of Interest Rates, Inflation, Geopolitics and Covid And Recovery on the Market

5. Global Semiconductor Assembly And Packaging Equipment Growth Analysis And Strategic Analysis Framework

• 5.1. Global Semiconductor Assembly And Packaging Equipment PESTEL Analysis (Political, Social, Technological, Environmental and Legal Factors, Drivers and Restraints)
• 5.2. Analysis Of End Use Industries
• 5.3. Global Semiconductor Assembly And Packaging Equipment Market Growth Rate Analysis
• 5.4. Global Semiconductor Assembly And Packaging Equipment Historic Market Size and Growth, 2019 - 2024, Value ($ Billion)
• 5.5. Global Semiconductor Assembly And Packaging Equipment Forecast Market Size and Growth, 2024 - 2029, 2034F, Value ($ Billion)
• 5.6. Global Semiconductor Assembly And Packaging Equipment Total Addressable Market (TAM)

6. Semiconductor Assembly And Packaging Equipment Market Segmentation

• 6.1. Global Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Plating Equipment
• Inspection And Dicing Equipment
• Wire Bonding Equipment
• Die-Bonding Equipment
• Other Types
• 6.2. Global Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Companion Animals
• Livestock
• 6.3. Global Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• OSATS (Outsourced Semiconductor Assembly And Test)
• IDMS (Integrated Device Manufacturers)
• 6.4. Global Semiconductor Assembly And Packaging Equipment Market, Sub-Segmentation Of Plating Equipment, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Electroplating Systems
• Electroless Plating Systems
• Plating Process Control Equipment
• 6.5. Global Semiconductor Assembly And Packaging Equipment Market, Sub-Segmentation Of Inspection And Dicing Equipment, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Automated Optical Inspection (AOI) Systems
• X-Ray Inspection Systems
• Dicing Saws And Dicing Systems
• 6.6. Global Semiconductor Assembly And Packaging Equipment Market, Sub-Segmentation Of Wire Bonding Equipment, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Thermosonic Wire Bonders
• Wedge Bonders
• Ball Bonders
• 6.7. Global Semiconductor Assembly And Packaging Equipment Market, Sub-Segmentation Of Die-Bonding Equipment, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Automated Die Bonders
• Manual Die Bonders
• Flip-Chip Bonders
• 6.8. Global Semiconductor Assembly And Packaging Equipment Market, Sub-Segmentation Of Other Types, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Encapsulation And Molding Equipment
• Test And Handling Equipment
• Laser Marking Equipment

7. Semiconductor Assembly And Packaging Equipment Market Regional And Country Analysis

• 7.1. Global Semiconductor Assembly And Packaging Equipment Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 7.2. Global Semiconductor Assembly And Packaging Equipment Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

8. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market

• 8.1. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market Overview
• Region Information, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
• 8.2. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 8.3. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 8.4. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

9. China Semiconductor Assembly And Packaging Equipment Market

• 9.1. China Semiconductor Assembly And Packaging Equipment Market Overview
• 9.2. China Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
• 9.3. China Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
• 9.4. China Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion

10. India Semiconductor Assembly And Packaging Equipment Market

• 10.1. India Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 10.2. India Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 10.3. India Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

11. Japan Semiconductor Assembly And Packaging Equipment Market

• 11.1. Japan Semiconductor Assembly And Packaging Equipment Market Overview
• 11.2. Japan Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 11.3. Japan Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 11.4. Japan Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

12. Australia Semiconductor Assembly And Packaging Equipment Market

• 12.1. Australia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 12.2. Australia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 12.3. Australia Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

13. Indonesia Semiconductor Assembly And Packaging Equipment Market

• 13.1. Indonesia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 13.2. Indonesia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 13.3. Indonesia Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

14. South Korea Semiconductor Assembly And Packaging Equipment Market

• 14.1. South Korea Semiconductor Assembly And Packaging Equipment Market Overview
• 14.2. South Korea Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 14.3. South Korea Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 14.4. South Korea Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

15. Western Europe Semiconductor Assembly And Packaging Equipment Market

• 15.1. Western Europe Semiconductor Assembly And Packaging Equipment Market Overview
• 15.2. Western Europe Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 15.3. Western Europe Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 15.4. Western Europe Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

16. UK Semiconductor Assembly And Packaging Equipment Market

• 16.1. UK Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 16.2. UK Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 16.3. UK Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

17. Germany Semiconductor Assembly And Packaging Equipment Market

• 17.1. Germany Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 17.2. Germany Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 17.3. Germany Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

18. France Semiconductor Assembly And Packaging Equipment Market

• 18.1. France Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 18.2. France Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 18.3. France Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

19. Italy Semiconductor Assembly And Packaging Equipment Market

• 19.1. Italy Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 19.2. Italy Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 19.3. Italy Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

20. Spain Semiconductor Assembly And Packaging Equipment Market

• 20.1. Spain Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 20.2. Spain Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 20.3. Spain Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

21. Eastern Europe Semiconductor Assembly And Packaging Equipment Market

• 21.1. Eastern Europe Semiconductor Assembly And Packaging Equipment Market Overview
• 21.2. Eastern Europe Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 21.3. Eastern Europe Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 21.4. Eastern Europe Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

22. Russia Semiconductor Assembly And Packaging Equipment Market

• 22.1. Russia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 22.2. Russia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 22.3. Russia Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

23. North America Semiconductor Assembly And Packaging Equipment Market

• 23.1. North America Semiconductor Assembly And Packaging Equipment Market Overview
• 23.2. North America Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 23.3. North America Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 23.4. North America Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

24. USA Semiconductor Assembly And Packaging Equipment Market

• 24.1. USA Semiconductor Assembly And Packaging Equipment Market Overview
• 24.2. USA Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 24.3. USA Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 24.4. USA Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

25. Canada Semiconductor Assembly And Packaging Equipment Market

• 25.1. Canada Semiconductor Assembly And Packaging Equipment Market Overview
• 25.2. Canada Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 25.3. Canada Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 25.4. Canada Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

26. South America Semiconductor Assembly And Packaging Equipment Market

• 26.1. South America Semiconductor Assembly And Packaging Equipment Market Overview
• 26.2. South America Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 26.3. South America Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 26.4. South America Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

27. Brazil Semiconductor Assembly And Packaging Equipment Market

• 27.1. Brazil Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 27.2. Brazil Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 27.3. Brazil Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

28. Middle East Semiconductor Assembly And Packaging Equipment Market

• 28.1. Middle East Semiconductor Assembly And Packaging Equipment Market Overview
• 28.2. Middle East Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 28.3. Middle East Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 28.4. Middle East Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

29. Africa Semiconductor Assembly And Packaging Equipment Market

• 29.1. Africa Semiconductor Assembly And Packaging Equipment Market Overview
• 29.2. Africa Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 29.3. Africa Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 29.4. Africa Semiconductor Assembly And Packaging Equipment Market, Segmentation By End User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

30. Semiconductor Assembly And Packaging Equipment Market Competitive Landscape And Company Profiles

• 30.1. Semiconductor Assembly And Packaging Equipment Market Competitive Landscape
• 30.2. Semiconductor Assembly And Packaging Equipment Market Company Profiles
  • 30.2.1. Tokyo Electron Ltd Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.2. Applied Materials, Inc Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.3. Kulicke and Soffa Industries, Inc Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.4. ASML Holding N.V Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.5. BE Semiconductor Industries N.V Overview, Products and Services, Strategy and Financial Analysis

31. Semiconductor Assembly And Packaging Equipment Market Other Major And Innovative Companies

• 31.1. Tokyo Seimitsu
• 31.2. Amkor Technology
• 31.3. ASM Pacific Technology
• 31.4. Screen Holdings Co. Ltd
• 31.5. KLA-Tencor
• 31.6. Toshiba Corp
• 31.7. Renesas Electronics Corporation
• 31.8. Fujitsu Limited
• 31.9. Panasonic Corporation
• 31.10. Continental Device India Ltd (CDIL)
• 31.11. MosChip Semiconductor Technologies
• 31.12. Advanced Semiconductor Engineering Inc
• 31.13. Zhixin Semiconductor
• 31.14. UNISOC
• 31.15. Yangtze Memory Technologies Co., Ltd (YTMC)

32. Global Semiconductor Assembly And Packaging Equipment Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The Semiconductor Assembly And Packaging Equipment Market

34. Recent Developments In The Semiconductor Assembly And Packaging Equipment Market

35. Semiconductor Assembly And Packaging Equipment Market High Potential Countries, Segments and Strategies

• 35.1 Semiconductor Assembly And Packaging Equipment Market In 2029 - Countries Offering Most New Opportunities
• 35.2 Semiconductor Assembly And Packaging Equipment Market In 2029 - Segments Offering Most New Opportunities
• 35.3 Semiconductor Assembly And Packaging Equipment Market In 2029 - Growth Strategies
  • 35.3.1 Market Trend Based Strategies
  • 35.3.2 Competitor Strategies

36. Appendix

• 36.1. Abbreviations
• 36.2. Currencies
• 36.3. Historic And Forecast Inflation Rates
• 36.4. Research Inquiries
• 36.5. The Business Research Company
• 36.6. Copyright And Disclaimer