表紙:SRAM・ROM設計IPの市場規模・シェア・成長分析 (用途別、製品別、技術別、最終用途別、地域別):産業予測 (2025~2032年)
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SRAM・ROM設計IPの市場規模・シェア・成長分析 (用途別、製品別、技術別、最終用途別、地域別):産業予測 (2025~2032年)

SRAM and ROM Design IP Market Size, Share, and Growth Analysis, By Application (Consumer Electronics, Automotive), By Product (Standard SRAM, Embedded SRAM), By Technology, By End use, By Region - Industry Forecast 2025-2032


出版日
発行
SkyQuest
ページ情報
英文 192 Pages
納期
3~5営業日
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=148.16円
SRAM・ROM設計IPの市場規模・シェア・成長分析 (用途別、製品別、技術別、最終用途別、地域別):産業予測 (2025~2032年)
出版日: 2025年08月13日
発行: SkyQuest
ページ情報: 英文 192 Pages
納期: 3~5営業日
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概要

世界のSRAM・ROM設計IPの市場規模は、2023年に24億米ドルと評価され、2024年の25億5,000万米ドルから2032年には41億6,000万米ドルに成長し、予測期間(2025~2032年)のCAGRは6.3%で成長する見通しです。

世界のSRAM・ROM設計IP市場は、民生用電子機器、車載用システム・オン・チップ(SoC)、エッジAI用途において、エネルギー効率に優れた高密度オンチップ・メモリへのニーズが高まっていることが背景にあります。設計者がより小さなフットプリントと消費電力を意識したアーキテクチャを好むようになり、組み込みSRAMとROMメモリIPブロックの需要が高まっています。これらのIPブロックは、さまざまな鋳造プロセスで互換性を提供しながら、性能を高め、レイテンシを低減します。AIアクセラレータや画像処理などの活用領域は、SRAMを活用して迅速なデータ処理を実現し、ROMはファームウェアとデバイスIDを保護します。さらに、車載ADASやウェアラブル技術など、特定の使用事例に合わせたカスタマイズの急増と、セキュリティ統合の進歩が相まって、多様な用途におけるSRAMおよびROM IPの力強い成長の可能性が浮き彫りになっています。

目次

イントロダクション

  • 分析目的
  • 市場範囲
  • 定義

分析手法

  • 情報調達
  • 二次・一次データの手法
  • 市場規模予測
  • 市場の想定と制約

エグゼクティブサマリー

  • 市場の概要と展望
  • 需給動向の分析
  • セグメント別の機会分析

市場力学と展望

  • 市場概要
  • 市場規模
  • 市場力学
    • 促進要因と機会
    • 抑制要因と課題
  • ポーター分析

市場の主な考察

  • 主な成功要因
  • 競合の程度
  • 主な投資機会
  • 市場エコシステム
  • 市場魅力度指数 (2024年)
  • PESTEL分析
  • マクロ経済指標
  • バリューチェーン分析
  • 価格分析
  • 技術進歩
  • ケーススタディ
  • 顧客と購買基準の分析

世界のSRAM・ROM設計IPの市場規模・CAGR:用途別 (2025~2032年)

  • 市場概要
  • 家電
  • 自動車
  • 通信
  • 産業オートメーション
  • 航空宇宙

世界のSRAM・ROM設計IPの市場規模・CAGR:製品別 (2025~2032年)

  • 市場概要
  • 標準SRAM
  • 組み込みSRAM
  • 非同期SRAM
  • 同期SRAM
  • ROM

世界のSRAM・ROM設計IPの市場規模・CAGR:技術別 (2025~2032年)

  • 市場概要
  • CMOS
  • BiCMOS
  • SOI
  • FinFET

世界のSRAM・ROM設計IPの市場規模・CAGR:最終用途別 (2025~2032年)

  • 市場概要
  • モバイルデバイス
  • コンピューター
  • ネットワーク機器
  • IoTデバイス

世界のSRAM・ROM設計IPの市場規模・CAGR (2025~2032年)

  • 北米
    • 米国
    • カナダ
  • 欧州
    • ドイツ
    • スペイン
    • フランス
    • 英国
    • イタリア
    • その他欧州
  • アジア太平洋
    • 中国
    • インド
    • 日本
    • 韓国
    • その他アジア太平洋
  • ラテンアメリカ
    • ブラジル
    • その他ラテンアメリカ
  • 中東・アフリカ
    • GCC諸国
    • 南アフリカ
    • その他中東・アフリカ

競合情勢

  • 上位5社の比較
  • 主要企業の市場ポジショニング (2024年)
  • 主要企業が採用した戦略
  • 市場の近年の動向
  • 主要企業の市場シェア (2024年)
  • 主要企業のプロファイル
    • 企業概要
    • 製品ポートフォリオ分析
    • セグメント別シェア分析
    • 収益の前年比比較 (2022~2024年)

主要企業プロファイル

  • Qualcomm
  • Cadence Design Systems
  • Broadcom
  • Analogue Devices
  • Texas Instruments
  • Infineon Technologies
  • Synopsys
  • ON Semiconductor
  • STMicroelectronics
  • Microchip Technology
  • Intel

結論と提言

目次
Product Code: SQMIG45N2129

Global SRAM and ROM Design IP Market size was valued at USD 2.4 billion in 2023 and is poised to grow from USD 2.55 billion in 2024 to USD 4.16 billion by 2032, growing at a CAGR of 6.3% during the forecast period (2025-2032).

The global SRAM and ROM design IP market is propelled by the rising need for energy-efficient, high-density on-chip memory in consumer electronics, automotive systems on chips (SoCs), and edge AI applications. As designers favor smaller footprints and power-conscious architectures, the demand for embedded SRAM and ROM memory IP blocks has intensified. These IP blocks enhance performance and reduce latency while offering compatibility across various foundry processes. Applications in AI accelerators and image processing leverage SRAM for rapid data handling, whereas ROM secures firmware and device ID. Additionally, the surge in customization tailored to specific use-cases, such as automotive ADAS and wearable tech, combined with advancements in security integration, underscores the robust growth potential for SRAM and ROM IP in diverse applications.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global SRAM and ROM Design IP market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global SRAM and ROM Design IP Market Segments Analysis

Global SRAM and ROM Design IP Market is segmented by Application, Product, Technology, End use and region. Based on Application, the market is segmented into Consumer Electronics, Automotive, Telecommunications, Industrial Automation and Aerospace. Based on Product, the market is segmented into Standard SRAM, Embedded SRAM, Asynchronous SRAM, Synchronous SRAM and ROM. Based on Technology, the market is segmented into CMOS, BiCMOS, SOI and FinFET. Based on End use, the market is segmented into Mobile Devices, Computers, Networking Equipment and IoT Devices. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global SRAM and ROM Design IP Market

The expansion of AI-driven applications across consumer electronics, automotive, and industrial sectors has greatly increased the demand for on-chip memory solutions. Embedded SRAM plays a pivotal role in edge AI chips, facilitating low-latency and high-speed memory required for real-time data processing. Additionally, ROM IP is vital for storing firmware and static configurations in ultra-compact IoT devices. The core advantage of these intellectual properties lies in their ability to enhance performance while managing power consumption effectively, influencing their widespread adoption in various domains, including smart wearables, drones, autonomous systems, and advanced neural processors.

Restraints in the Global SRAM and ROM Design IP Market

A significant challenge in the current Global SRAM and ROM Design IP market is the high licensing costs associated with high-performance SRAM and ROM IP blocks, which significantly impacts smaller chip developers and start-ups. In addition to navigating the complexities of licensing agreements, these smaller entities often face considerable integration challenges when incorporating these IPs into existing system-on-chip (SoC) frameworks. This integration process typically involves extensive verification, optimization, and validation, mainly driven by foundry requirements, which further escalates both development costs and timelines. Consequently, many smaller organizations find it prohibitively expensive to access premium IP options, limiting their competitive capacity in the market.

Market Trends of the Global SRAM and ROM Design IP Market

The Global SRAM and ROM Design IP market is experiencing a pronounced trend towards customizable and application-specific memory IP, driven by the evolving landscape of semiconductor applications such as AI accelerators, automotive systems-on-chip (SoCs), and wearable devices. As SoC designs become more specialized, the demand for memory IP that can be tailored to optimize power efficiency, enhance performance, bolster security, and minimize physical footprint is escalating. In response, IP vendors are increasingly offering configurable memory compilers and application-optimized memory solutions, enabling chipmakers to meet specific performance criteria and integrate cutting-edge technologies that cater to their unique design requirements.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Drivers & Opportunities
    • Restraints & Challenges
  • Porters Analysis
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2024
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis
  • Technology Analysis
  • Case Studies
  • Customer Buying Behavior Analysis

Global SRAM and ROM Design IP Market Size by Application & CAGR (2025-2032)

  • Market Overview
  • Consumer Electronics
  • Automotive
  • Telecommunications
  • Industrial Automation
  • Aerospace

Global SRAM and ROM Design IP Market Size by Product & CAGR (2025-2032)

  • Market Overview
  • Standard SRAM
  • Embedded SRAM
  • Asynchronous SRAM
  • Synchronous SRAM
  • ROM

Global SRAM and ROM Design IP Market Size by Technology & CAGR (2025-2032)

  • Market Overview
  • CMOS
  • BiCMOS
  • SOI
  • FinFET

Global SRAM and ROM Design IP Market Size by End use & CAGR (2025-2032)

  • Market Overview
  • Mobile Devices
  • Computers
  • Networking Equipment
  • IoT Devices

Global SRAM and ROM Design IP Market Size & CAGR (2025-2032)

  • North America (Application, Product, Technology, End use)
    • US
    • Canada
  • Europe (Application, Product, Technology, End use)
    • Germany
    • Spain
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia Pacific (Application, Product, Technology, End use)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • Latin America (Application, Product, Technology, End use)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa (Application, Product, Technology, End use)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2024
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2024
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

  • Qualcomm
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Cadence Design Systems
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Broadcom
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Analogue Devices
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Texas Instruments
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Infineon Technologies
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Synopsys
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ON Semiconductor
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • STMicroelectronics
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Microchip Technology
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Intel
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendations