市場調査レポート

商品コード

1610804

フリップチップの市場規模、シェア、成長分析、パッケージングタイプ別、パッケージング技術別、バンプ技術別、最終用途別、地域別 - 産業予測、2024年～2031年

Flip Chip Market Size, Share, Growth Analysis, By Packaging Type, By Packaging Technology, By Bumping Technology, By End Use, By Region -Industry Forecast 2024-2031

出版日: 2024年12月09日
発行: SkyQuest
ページ情報: 英文 192 Pages
納期: 3～5営業日

価格

PDF & Excel (Single User License)

USD 5,300 760,921円

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PDF & Excel (Multiple User License)

USD 6,200 890,134円

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PDF & Excel (Enterprise License)

USD 7,100 1,019,347円

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本日の銀行送金レート: 1USD=143.57円

全表示
概要
目次

概要

サンプル依頼リストに入れる

フリップチップの世界市場規模は、2022年に305億米ドルと評価され、2023年の324億3,000万米ドルから2031年には497億4,000万米ドルに成長し、予測期間中（2024-2031年）のCAGRは6.3％で成長する見通しです。

世界の急速なデジタル化の動向は、革新的な半導体やチップ、特にフリップチップの需要を大きく牽引しています。デバイスの小型化と半導体技術の進歩が加速する中、モノのインターネット（IoT）デバイスの普及と5Gネットワーク技術の展開が加速し、市場は成長する態勢にあります。さらに、自動車の電動化がカーエレクトロニクスの必要性を高め、フリップチップ市場の可能性をさらに高めています。高性能コンピューティングに対する需要の高まりと高度なデータセンターの設立は、今後数年間のフリップチップの売上を支えるものと予想されます。しかし、熱管理の複雑さ、代替パッケージングソリューションの利用可能性、初期導入コストの高さなどの課題が、市場開拓の妨げになる可能性があります。

北米
- 米国
- カナダ
欧州
- 英国
- ドイツ
- スペイン
- フランス
- イタリア
- その他欧州地域
アジア太平洋地域
- 中国
- インド
- 日本
- 韓国
- その他アジア太平洋地域
ラテンアメリカ
- ブラジル
- その他ラテンアメリカ地域
中東・アフリカ
- GCC諸国
- 南アフリカ
- その他中東・アフリカ

競合情報

上位5社の比較
主要企業の市場ポジショニング（2023年）
主な市場企業が採用した戦略
市場の最近の動向
企業の市場シェア分析（2023年）
主要企業の企業プロファイル
- 会社概要
- 製品ポートフォリオ分析
- セグメント別シェア分析
- 収益の前年比比較（2021-2023）

主要企業プロファイル

IBM Corporation
ASE Technology Holding Co., Ltd.
Advanced Micro Devices, Inc.
Intel Corporation
Fujitsu
Texas Instruments Incorporated
Fujitsu Ltd.
3M
Powertech Technology Inc.
Samsung Electronics Co. Ltd.
TSMC Ltd.,
Apple Inc.
AMD Inc.
Amkor Technology
International business machines corporation

結論と推奨事項

Product Code: SQMIG45I2223

Global Flip chip Market size was valued at USD 30.5 Billion in 2022 and is poised to grow from USD 32.43 Billion in 2023 to USD 49.74 Billion by 2031, growing at a CAGR of 6.3% during the forecast period (2024-2031).

The rapid global digitization trend is significantly driving the demand for innovative semiconductors and chips, particularly flip chips. As device miniaturization and semiconductor technology advancements accelerate, the market is poised for growth, fueled by the increasing prevalence of Internet of Things (IoT) devices and the rollout of 5G network technologies. Additionally, the electrification of vehicles is boosting the need for automotive electronics, further enhancing flip chip market potential. The rising demand for high-performance computing and the establishment of advanced data centers are expected to support flip chip sales in the coming years. However, challenges such as thermal management complexities, the availability of alternative packaging solutions, and high initial deployment costs may hinder market development.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Flip Chip market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Flip Chip Market Segmental Analysis

Global Flip Chip Market is segmented by Type, by Packaging Technology, by Bumping Technology, by End Use and by Region. Based on Type, the market is segmented into Ball Grid Array, Quad Flat No-Lead, Chip Scale Packaging, Chip System in Packaging. Based on Packaging Technology, the market is segmented into 3D, 2.5D, 2.1D. Based on Bumping Technology, the market is segmented into Copper Pillar, Solder Bumping, Gold Bumping, Others. Based on End User, the market is segmented into Consumer Electronics, IT & Telecommunication, Automotive, Industrial, Medical and Healthcare, Military & Aerospace, Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & and Africa.

Driver of the Global Flip Chip Market

One of the key drivers of the global flip chip market is the increasing utilization of automotive electronics. The automotive sector is experiencing significant transformation due to the growing incorporation of semiconductors and electronic components. The surge in popularity of electric vehicles, coupled with the demand for enhanced safety features and advanced infotainment systems, is driving the need for automotive semiconductors. This rising demand directly influences the flip chip market, as these technologies rely heavily on flip chip packaging for improved performance and efficiency. As a result, the evolution of the automotive landscape is favorably impacting the growth of the flip chip market.

Restraints in the Global Flip Chip Market

One of the significant restraints affecting the Global Flip Chip market is the complexity involved in its manufacturing process. Unlike traditional packaging methods, flip chip technology requires a series of intricate steps, including wafer bumping, underfill application, and die attachment. This multifaceted approach not only elevates the overall production complexity but also leads to increased manufacturing costs. Consequently, these heightened expenses can stifle market demand and hinder the growth prospects for flip chip technology moving forward. As manufacturers navigate these challenges, the intricate nature of flip chip production could continue to serve as a barrier to widespread adoption and utilization.

Market Trends of the Global Flip Chip Market

The Global Flip Chip market is increasingly driven by an emphasis on sustainability, prompting companies to innovate with lead-free solder technologies to align with stringent environmental standards. As regulations tighten with bans on hazardous materials and chemicals, manufacturers are compelled to explore new, eco-friendly materials for packaging solutions. This trend not only enhances the sustainability credentials of flip chip products but also positions companies favorably in a market that is progressively valuing environmentally responsible practices. Consequently, firms that prioritize sustainable development are likely to gain a competitive edge, thus shaping the future landscape of the Global Flip Chip market.

Introduction

Objectives of the Study
Scope of the Report
Definitions

Research Methodology

Information Procurement
Secondary & Primary Data Methods
Market Size Estimation
Market Assumptions & Limitations

Executive Summary

Global Market Outlook
Supply & Demand Trend Analysis
Segmental Opportunity Analysis

Market Dynamics & Outlook

Market Overview
Market Size
Market Dynamics
- Driver & Opportunities
- Restraints & Challenges
Porters Analysis & Impact
- Competitive rivalry
- Threat of substitute
- Bargaining power of buyers
- Threat of new entrants
- Bargaining power of suppliers

Key Market Insights

Key Success Factors
Degree of Competition
Top Investment Pockets
Market Ecosystem
Market Attractiveness Index, 2023
PESTEL Analysis
Macro-Economic Indicators
Value Chain Analysis
Pricing Analysis
Technological Advancement
Regulatory Landscape
Case Studies

Global Flip Chip Market Size by Type & CAGR (2024-2031)

Ball Grid Array
Quad Flat No-Lead
Chip Scale Packaging
Chip System in Packaging

Global Flip Chip Market Size by Packaging Technology & CAGR (2024-2031)

3D
2.5D
2.1D

Global Flip Chip Market Size by Bumping Technology & CAGR (2024-2031)

Copper Pillar
Solder Bumping
Gold Bumping
Others

Global Flip Chip Market Size by End Use & CAGR (2024-2031)

Aerospace and Defense
Manufacturing
Automotive & Transportation
Consumer Electronics
IT & Telecommunications
Others

Global Flip Chip Market Size by Region & CAGR (2024-2031)

North America, (by Type, by Packaging Technology, by Bumping Technology, by End User)
- US
- Canada
Europe, (by Type, by Packaging Technology, by Bumping Technology, by End User)
- UK
- Germany
- Spain
- France
- Italy
- Rest of Europe
Asia-Pacific, (by Type, by Packaging Technology, by Bumping Technology, by End User)
- China
- India
- Japan
- South Korea
- Rest of Asia Pacific
Latin America, (by Type, by Packaging Technology, by Bumping Technology, by End User)
- Brazil
- Rest of Latin America
Middle East & Africa, (by Type, by Packaging Technology, by Bumping Technology, by End User)
- GCC Countries
- South Africa
- Rest of Middle East & Africa

Competitive Intelligence

Top 5 Player Comparison
Market Positioning of Key Players, 2023
Strategies Adopted by Key Market Players
Recent Developments in the Market
Company Market Share Analysis, 2023
Company Profiles of All Key Players
- Company Details
- Product Portfolio Analysis
- Company's Segmental Share Analysis
- Revenue Y-O-Y Comparison (2021-2023)

Key Company Profiles

IBM Corporation
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
ASE Technology Holding Co., Ltd.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Advanced Micro Devices, Inc.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Intel Corporation
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Fujitsu
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Texas Instruments Incorporated
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Fujitsu Ltd.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
3M
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Powertech Technology Inc.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Samsung Electronics Co. Ltd.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
TSMC Ltd.,
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Apple Inc.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
AMD Inc.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Amkor Technology
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
International business machines corporation
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments

フリップチップの市場規模、シェア、成長分析、パッケージングタイプ別、パッケージング技術別、バンプ技術別、最終用途別、地域別 - 産業予測、2024年～2031年

Flip Chip Market Size, Share, Growth Analysis, By Packaging Type, By Packaging Technology, By Bumping Technology, By End Use, By Region -Industry Forecast 2024-2031

目次

イントロダクション

調査手法

エグゼクティブサマリー

市場力学と見通し

主な市場の考察

フリップチップ市場規模：タイプ別& CAGR（2024-2031）

フリップチップ市場規模：パッケージング技術& CAGR（2024-2031）

フリップチップ市場規模：バンプ技術& CAGR（2024-2031）

フリップチップ市場規模：最終用途別& CAGR（2024-2031）

フリップチップ市場規模：地域別& CAGR（2024-2031）