世界の薄ウェハ加工およびダイシング装置市場：種類・技術・地域別 - 成長、動向、予測
Global Thin Wafer Processing and Dicing Equipment Market - Segmented by Equipment Type, Technology, Application and Region - Growth, Trends, and Forecast
|発行||Mordor Intelligence LLP||商品コード||669991|
|出版日||ページ情報||英文 101 Pages
|世界の薄ウェハ加工およびダイシング装置市場：種類・技術・地域別 - 成長、動向、予測 Global Thin Wafer Processing and Dicing Equipment Market - Segmented by Equipment Type, Technology, Application and Region - Growth, Trends, and Forecast|
|出版日: 2018年07月07日||ページ情報: 英文 101 Pages||
Global Thin Wafer Processing and Dicing Equipment Market - Segmented by Equipment Type (Processing and Dicing), Technology (Grinding, Grinding and CPM, Blade Dicing, Laser Ablation), Application (Memory and Logic, MEMS Devices, Power Devices, RFID) and Region - Growth, Trends, and Forecast (2018 - 2023).
The thin wafer processing and dicing equipment market is expected to grow at a CAGR of over 6% during the forecast period (2018 - 2023).
Integration of microelectronics into several consumer electronics and smart cards needed for thinner wafers are increasing rapidly. Technologies like RFID, MEMS Devices, and power devices are considered to be the major source of demand for these thin wafers. This scenario is increasingly creating demand for better manufacturing process, especially processing and dicing which are important phases of ultra-thin wafer production. Many new processes such as chemical mechanical polishing (CMP) are increasingly being integrated into the processing phase along with grinding operations to ensure smoothly polished wafer surface. With increasing innovations in enterprise security solutions to manage employees of the organization, upcoming foundries and semiconductor manufacturing establishments and applications in consumer electronics are expected to keep a steady demand for processing and dicing equipment over the forecast period.
Radio Frequency Identification (RFID) is a major source of demand for wafer processing and dicing equipment. Generally, traditional methods of grinding or thinning are preferred to prepare wafers feasible for RFID applications. This involves grinding wafers as thin as 50 to 120 micrometers. But with most of the RFID technology being integrated into several consumer electronics and identity solutions such as smart cards and identification tags, end-users are increasingly asking for ultra-smooth surfaces and thinner wafers to incorporate them into these devices seamlessly.
This is one of the prime reasons why techniques like chemical mechanical polishing (CMP) are combined with traditional grinding mechanisms increasingly to conform to high-quality plane surface standards of the wafer. This scenario coupled with strong demand for enterprise identity management solutions and automobile telematics applications of the RFID technology is expected to create more demand for thinner wafers driving positive growth for processing and dicing equipment over the forecast period.
Asia Pacific is the fastest growing semiconductor market in the world. Growing initiatives like Make in India by the Indian government and Vision 2020 by the Chinese government are increasingly drawing attention from the international players to set up local production establishments. In case of India, the recent increment in customs duties on imported electronics is playing a pivotal role attracting companies like Apple to set up local manufacturing plants. According to the SEMI, a prominent global association serving the manufacturing supply chain of the electronics industry, more than 90% of the foundries being constructed in the world during 2017 were situated in the Asia Pacific. It is estimated that most of these foundries are concentrated in China and Japan. With initiatives for Tokyo Olympics 2020 already in motion, semiconductor manufacturing region is expected open up better opportunities for the thinning and dicing equipment shortly.
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