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市場調査レポート

世界の薄ウェハ加工およびダイシング装置市場:種類・技術・地域別 - 成長、動向、予測

Global Thin Wafer Processing and Dicing Equipment Market - Segmented by Equipment Type, Technology, Application and Region - Growth, Trends, and Forecast

発行 Mordor Intelligence LLP 商品コード 669991
出版日 ページ情報 英文 101 Pages
納期: 即日から翌営業日
価格
本日の銀行送金レート: 1USD=111.89円で換算しております。
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世界の薄ウェハ加工およびダイシング装置市場:種類・技術・地域別 - 成長、動向、予測 Global Thin Wafer Processing and Dicing Equipment Market - Segmented by Equipment Type, Technology, Application and Region - Growth, Trends, and Forecast
出版日: 2018年07月07日 ページ情報: 英文 101 Pages
概要

世界の薄ウェハ加工・ダイシング装置市場は、2018年から2023年にかけて6%を超えるCAGRで成長すると予測されています。

当レポートでは、世界の薄ウェハ加工・ダイシング装置市場を調査し、市場の概要、種類・技術・地域別の市場規模の推移と予測、成長要因および阻害要因の分析、市場機会、競合情勢、主要企業のプロファイルなど、包括的な情報を提供しています。

目次

第1章 イントロダクション

  • 調査成果
  • 調査の前提条件
  • 調査方法
  • 主な所見

第2章 エグゼクティブサマリー

第3章 市場分析

  • 市場概要
  • バリューチェーン分析
  • ファイブフォース分析
    • 買い手の交渉力
    • 供給企業の交渉力
    • 新規参入業者の脅威
    • 代替品の脅威
    • 競争企業間の敵対関係
  • 産業政策

第4章 市場力学

  • 成長要因
    • 半導体小型化に対するニーズの高まり
    • スマートカードとRFID技術の需要増加
  • 阻害要因
    • 初期投資コストの高さ
  • 市場機会
    • IoTの用途拡大
    • インダストリー4.0の迅速な採用

第5章 世界の薄ウエハ加工・ダイシング装置市場:セグメント別

  • 装置タイプ別
    • 加工装置
    • ダイシング装置
  • 技術別
    • 研削
    • 研削 & CPM
    • ブレードダイシング
    • レーザーアブレーション
  • 用途別
    • メモリ、ロジック、シリコン貫通電極(TSV)
    • MEMSデバイス
    • パワーデバイス
    • CMOSイメージセンサ
    • RFID
  • 地域別
    • 北米
    • 欧州
    • アジア太平洋
    • その他の地域

第6章 企業プロファイル

  • Suzhou Delphi Laser Co., Ltd
  • SPTS Technologies Limited (Orbotech)
  • Plasma-Therm LLC
  • Han's Laser Technology Co. Ltd
  • ASM Laser Separation International (ALSI) BV
  • DISCO Corporation
  • 東京精密
  • Neon Tech Co., Ltd
  • Nippon Pulse Motor Taiwan (NPMT)
  • パナソニック

第7章 投資分析

第8章 市場の将来展望

目次
Product Code: 62374

Title:
Global Thin Wafer Processing and Dicing Equipment Market - Segmented by Equipment Type (Processing and Dicing), Technology (Grinding, Grinding and CPM, Blade Dicing, Laser Ablation), Application (Memory and Logic, MEMS Devices, Power Devices, RFID) and Region - Growth, Trends, and Forecast (2018 - 2023).

The thin wafer processing and dicing equipment market is expected to grow at a CAGR of over 6% during the forecast period (2018 - 2023).

Integration of microelectronics into several consumer electronics and smart cards needed for thinner wafers are increasing rapidly. Technologies like RFID, MEMS Devices, and power devices are considered to be the major source of demand for these thin wafers. This scenario is increasingly creating demand for better manufacturing process, especially processing and dicing which are important phases of ultra-thin wafer production. Many new processes such as chemical mechanical polishing (CMP) are increasingly being integrated into the processing phase along with grinding operations to ensure smoothly polished wafer surface. With increasing innovations in enterprise security solutions to manage employees of the organization, upcoming foundries and semiconductor manufacturing establishments and applications in consumer electronics are expected to keep a steady demand for processing and dicing equipment over the forecast period.

Applications in RFID to Create a Huge Demand

Radio Frequency Identification (RFID) is a major source of demand for wafer processing and dicing equipment. Generally, traditional methods of grinding or thinning are preferred to prepare wafers feasible for RFID applications. This involves grinding wafers as thin as 50 to 120 micrometers. But with most of the RFID technology being integrated into several consumer electronics and identity solutions such as smart cards and identification tags, end-users are increasingly asking for ultra-smooth surfaces and thinner wafers to incorporate them into these devices seamlessly.

This is one of the prime reasons why techniques like chemical mechanical polishing (CMP) are combined with traditional grinding mechanisms increasingly to conform to high-quality plane surface standards of the wafer. This scenario coupled with strong demand for enterprise identity management solutions and automobile telematics applications of the RFID technology is expected to create more demand for thinner wafers driving positive growth for processing and dicing equipment over the forecast period.

Asia Pacific is growing at A Faster Pace

Asia Pacific is the fastest growing semiconductor market in the world. Growing initiatives like Make in India by the Indian government and Vision 2020 by the Chinese government are increasingly drawing attention from the international players to set up local production establishments. In case of India, the recent increment in customs duties on imported electronics is playing a pivotal role attracting companies like Apple to set up local manufacturing plants. According to the SEMI, a prominent global association serving the manufacturing supply chain of the electronics industry, more than 90% of the foundries being constructed in the world during 2017 were situated in the Asia Pacific. It is estimated that most of these foundries are concentrated in China and Japan. With initiatives for Tokyo Olympics 2020 already in motion, semiconductor manufacturing region is expected open up better opportunities for the thinning and dicing equipment shortly.

Key Developments in the Market:

  • February 2018 - SPTS Technologies received approximately USD 37 million in orders for multiple etch and deposition systems from two GaAs foundry customers. SPTS's Omega plasma etch, Delta PECVD, and Sigma PVD are expected to be installed in these foundries to manufacture radio frequency (RF) devices for 4G and emerging 5G wireless infrastructure.
  • Major Players: SUZHOU DELPHI LASER CO., LTD, SPTS TECHNOLOGIES LIMITED (ORBOTECH), PLASMA-THERM LLC, HAN'S LASER TECHNOLOGY CO. LTD, and ASM LASER SEPARATION INTERNATIONAL (ALSI) B.V., amongst others.

Reasons to Purchase this Report:

  • Current and future thin wafer processing and dicing equipment market outlook in the developed and emerging markets
  • Analyzing various perspectives of the market with the help of Porter's five forces analysis
  • The segment that is expected to dominate the market
  • Regions that are expected to witness the fastest growth during the forecast period
  • Identify the latest developments, market shares and strategies employed by the major market players.
  • 3 months analyst support along with the Market Estimate sheet (in excel).

Customization of the Report:

This report can be customized to meet your requirements. Please connect with our representative, who will ensure you get a report that suits your needs.

Table of Contents

1. Introduction

  • 1.1 Study Deliverables
  • 1.2 Study Assumptions
  • 1.3 Research Methodology
  • 1.4 Key Findings

2. Executive Summary

3. Market Overview

  • 3.1 Overview
  • 3.2 Value Chain Analysis
  • 3.3 Industry Attractiveness - Porter's Five Forces
    • 3.3.1 Bargaining Power Of Suppliers
    • 3.3.2 Bargaining Power Of Consumers
    • 3.3.3 Threat Of New Entrants
    • 3.3.4 Threat Of Substitute Product
    • 3.3.5 Competitive Rivalry Within The Industry
  • 3.4 Industry Policies

4. Market Dynamics

  • 4.1 Drivers
    • 4.1.1 Increasing Need for Miniaturization of Semiconductors
    • 4.1.2 Increasing Demand for Smart Cards and RFID Technology
  • 4.2 Restraints
    • 4.2.1 High Initial Cost of Equipment
  • 4.3 Opportunities
    • 4.3.1 Increasing IoT Applications
    • 4.3.2 Rapid Adoption of Industry 4.0 Policies

5. Global Thin Wafer Processing and Dicing Equipment Market Segmentation

  • 5.1 By Equipment Type
    • 5.1.1 Thinning Equipment
    • 5.1.2 Dicing Equipment
  • 5.2 By Equipment Technology
    • 5.2.1 Thinning Equipment
      • 5.2.1.1 Grinding
      • 5.2.1.2 Grinding + CPM
      • 5.2.1.3 Wet/Dry Etching
      • 5.2.1.4 TAIKO
    • 5.2.2 Dicing Equipment
      • 5.2.2.1 Blade Dicing
      • 5.2.2.2 Laser Ablation
      • 5.2.2.3 Stealth Dicing
      • 5.2.2.4 Plasma Dicing
  • 5.3 By Application
    • 5.3.1 Memory and Logic (TSV)
    • 5.3.2 MEMS Devices
    • 5.3.3 Power Devices
    • 5.3.4 CMOS Image Sensors
    • 5.3.5 RFID
  • 5.4 By Region
    • 5.4.1 North America
    • 5.4.2 Europe
    • 5.4.3 Asia-Pacific
    • 5.4.4 Rest of the World

6. Company Profiles

  • 6.1 Suzhou Delphi Laser Co., Ltd
  • 6.2 SPTS Technologies Limited (Orbotech)
  • 6.3 Plasma-Therm LLC
  • 6.4 Han's Laser Technology Co. Ltd
  • 6.5 ASM Laser Separation International (ALSI) B.V.
  • 6.6 DISCO Corporation
  • 6.7 Tokyo Seimitsu Co., Ltd. (Accretech)
  • 6.8 Neon Tech Co., Ltd
  • 6.9 Nippon Pulse Motor Taiwan (NPMT)
  • 6.10 Panasonic Corporation

List is Not Exhaustive

7. Investment Analysis

8. Future Of Global Thin Wafer Processing and Dicing Equipment Market

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