防衛・宇宙用途向けHDI (高密度相互接続) PCB：市場および技術の予測 (～2032年)

高密度相互接続 (HDI) PCBは現在、次世代の防衛および宇宙用ペイロードおよびデバイスにおいて重要な技術となっています。商業用途から軍事・航空宇宙用途への移行は、その汎用性と高度な機能を象徴しており、ミッションクリティカルな環境における小型化、性能向上、耐久性への高まる要求に応えています。

HDI PCBの重要な貢献のひとつは、現代の防衛・宇宙電子機器に要求されるスピードと性能の向上をサポートする能力です。高速処理チップの普及と高速データ転送の必要性の高まりにより、HDI PCBはこれらの進歩を促進する独自の地位を確立しています。その多層設計と高度な材料の使用により、優れたシグナルインテグリティを実現し、レーダー、ナビゲーション、電子戦システムなどの高周波アプリケーションでも干渉や信号損失を低減します。このため、HDI PCBは、スピードと精度の両方が最優先されるUAV、戦闘機、その他の次世代防衛システムなどの高度な軍事プラットフォームに最適です。

防衛および宇宙分野において、HDI PCBはコンパクトなフォームファクターで複雑な設計に対応し、高レベルの機能性を維持しながら部品のサイズと重量を大幅に削減できるため、評価が高まっています。防衛システムや宇宙ミッションでは、小型軽量化だけでなく、過酷な条件にも耐える電子機器が求められるため、HDI PCBは独自の利点を提供します。HDI PCBは回路密度を高めることができるため、デバイス全体のサイズを大きくすることなく、多層の機能を統合することができます。

戦略的な観点から、防衛・宇宙用途におけるHDI PCB市場は、2032年にかけて大きく成長する見込みです。世界の防衛近代化プログラムが勢いを増し、宇宙分野が急速な商業化と探査活動を進める中で、高度で高性能な電子部品に対する需要が急増すると予想されています。

当レポートでは、防衛・宇宙用途向けHDI (高密度相互接続) PCBの市場および技術を調査し、技術の概要・最新動向、市場成長への各種影響因子の分析、市場規模の推移・予測、各種区分・地域/主要国別の詳細分析、競合情勢、主要企業のプロファイルなどをまとめています。

目次

第1章 エグゼクティブサマリー

第2章 イントロダクション

第3章 技術と開発

• 技術の概要
  • HDI PCBの進化
• HDI PCBで使用される重要な技術
  • レーザードリリング技術
  • レーザーダイレクトイメージング
  • レーザードリル可能ラミネートとプリプレグ
• マイクロビアと高密度コネクタ
  • マイクロビア
  • 高密度PCBコネクタ
• 連続積層および積層技術
• 注目すべき技術開発
  • Ultra HDI PCB

第4章 市場概要

• HDI PCB市場の分布：地域別
• 主要企業の概要
  • HDI PCB材料会社
  • HDI PCB機械会社
  • HDI PCB製造および組み立て
• 最近の契約の概要
• 主な顧客：概要
• 最近の製品紹介の概要
• サプライチェーンの概要
• 重要な原材料

第5章 市場力学と予測要因

• 市場セグメンテーション
  • 主要地域別セグメント
  • 用途別セグメント
• 促進要因
• 動向
• 機会
• 課題

第6章 国別分析

• 概要
• 米国
• カナダ
• メキシコ
• EU
• ESA
• 中国
• 台湾

第7章 世界および地域市場の予測

• HDI PCB市場の概要：地域別
• HDI PCB市場：地域・技術別
  • 北米
  • 欧州：EU27カ国
  • 欧州：非EU27カ国
  • アジア太平洋
  • 中東・アフリカ
  • ラテンアメリカ
• 機会の分析
  • 地域別

第8章 市場予測：用途別

• HDI PCB市場の概要：用途別
• HDI PCB市場：地域・用途別
  • 航空
  • 陸上
  • 海洋・船舶
  • 宇宙
• 機会の分析
  • 用途別

第9章 影響分析

• 予測要因と市場への影響
  • "Silicon to System"アプローチの重要性の向上
  • 原材料のアベイラビリティと調達の障壁
  • シナリオ分析

第10章 主要企業

• ACB Group
• AGC Multi Materials
• Amphenol Invotec
• Austria Technologie & Systemtechnik AG (AT&S)
• Introduction
• DuPont (Electrical & Industrial)
• Firan Technology Group (FTG)
• Isola Group
• NCAB Group
• Sierra Circuits Inc.

• レーザーダイレクトイメージング (LDI) の主要企業
  • Orbotech (a KLA Company)
  • LPKF Laser & Electronics
  • Mitsubishi Electric
  • SCREEN Holdings Co., Ltd.
  • Manz AG
  • First EIE SA
  • Limata GmbH
  • Miva Technologies GmbH

第11章 結果・総論

第12章 市場予測について

付録A：掲載企業

付録B：略語

Market forecasts by Regions and Applications. Market and Technologies Overview, Critical Raw Materials, Country Analysis, Opportunity and Impact Analysis, , and Leading Companies.

High-Density Interconnect (HDI) PCBs have now become a crucial technology in next-generation defence and space payloads and devices. Their transition from commercial to military and aerospace applications highlights their versatility and advanced capabilities, meeting the growing demands for miniaturization, enhanced performance, and durability in mission-critical environments.

One of the key contributions of HDI PCBs is their ability to support the increasing speed and performance demands of modern defence and space electronics. With the proliferation of high-speed processing chips and the growing need for rapid data transfer, HDI PCBs are uniquely positioned to facilitate these advancements. Their multi-layer designs and use of advanced materials enable superior signal integrity, reducing interference and signal loss even in high-frequency applications such as radar, navigation, and electronic warfare systems. This makes HDI PCBs ideal for advanced military platforms, including UAVs, fighter jets, and other next-generation defence systems, where both speed and precision are paramount.

Our study "High-Density Interconnect PCB Technology - Market and Technology Forecast to 2032" covers the market demand potential for HDI PCBs in the defence and space sectors.

In the defence and space sectors, HDI PCBs are increasingly valued for their ability to handle complex designs within a compact form factor, significantly reducing the size and weight of components while maintaining high levels of functionality. As defence systems and space missions require electronics that are not only smaller and lighter but also capable of withstanding extreme conditions, HDI PCBs offer a unique advantage. They allow for increased circuit density, enabling the integration of multiple layers of functionality without increasing the overall size of the device.

From a strategic perspective, the market for HDI PCBs in defence and space applications is poised for significant growth through 2032. As global defence modernization programs gain momentum and the space sector witnesses rapid commercialization and exploration activities, the demand for advanced, high-performance electronic components is expected to soar. This study highlights key market trends, including the increasing collaboration between defence contractors, aerospace companies, and HDI PCB manufacturers, as well as the emergence of new manufacturing techniques that further drive innovation in this sector.

Additionally, regional insights are provided to outline the adoption trends across key markets worldwide. The study examines how different regions are responding to the technological shift towards HDI PCBs, with a focus on defence investments, space exploration initiatives, and the evolving regulatory landscape. Moreover, the competitive analysis section profiles leading HDI PCB manufacturers, offering insights into their technological advancements, market positioning, and product portfolios.

The study particularly addresses the recent developments and emphasis on reshoring PCB production by North American and European governments. The shifting landscape of global electronics production is driving developed countries to reevaluate their reliance on Asian manufacturers, especially in the context of critical raw materials and the growing emphasis on local production of Printed Circuit Boards (PCBs). This transformation is significantly impacting the dynamics of the HDI PCB value chain, as governments and industries in the West increasingly prioritize supply chain security and technological sovereignty.

Critical raw materials, such as rare earth elements and high-performance substrates essential for HDI PCBs, have become central to this strategic shift. Supply chain disruptions and geopolitical tensions have highlighted the vulnerability of relying on a concentrated pool of suppliers, particularly from Asia. In response, developed nations are ramping up efforts to secure these materials through domestic production, recycling initiatives, and strategic partnerships, aiming to reduce their dependence on imports from key Asian markets.

This move towards restoring local manufacturing capabilities is driven by the need for greater control over the production of advanced electronics, particularly in defence, aerospace, and other high-tech industries where HDI PCBs are critical. As the demand for HDI PCBs in these sectors grows, ensuring a steady, reliable supply of components is essential for national security and technological competitiveness. Countries like the United States and those within the European Union are investing heavily in PCB fabrication infrastructure, incentivizing local manufacturers, and encouraging innovation in PCB technology to meet these evolving demands.

This study has many such insights that will unveil the market demand and potential challenges the technology might face through 2032.

Covered in this study:

• Overview: Snapshot of the HDI PCB technology in the defence and space market during 2024-2032, including highlights of the demand drivers, trends, and challenges. It also provides a snapshot of the spending with respect to regions as well as segments and sheds light on the emergence of new technologies.
• Market Dynamics: Insights into the technological developments in the HDI PCB market and a detailed analysis of the changing preferences of governments around the world. It also analyses changing industry structure trends and the challenges faced by the industry participants.
• Segment Analysis:Insights into the various HDI PCB markets from a segmental perspective and a detailed analysis of factors influencing the market for each segment.
• Regional Review: Insights into modernization patterns and budgetary allocation for top countries within a region.
• Regional Analysis: Insights into the HDI PCB market from a regional perspective and a detailed analysis of factors influencing the market for each region.
• Impact Analysis: Analysis of how certain events will impact the HDI PCBs market. This will give you an indication of which factors are important for the forecast.
• Key Program Analysis: Details of the top programmes in each segment expected to be executed during the forecast period.
• Competitive landscape Analysis: Analysis of the competitive landscape of this industry. It provides an overview of key companies, together with insights such as key alliances, strategic initiatives, and a SWOT analysis.

Segmentation

The market has is segmented by Region and Application:

Region

• EU-27
• Non-EU 27
• North America
• Asia Pacific
• Middle East & Africa
• Latin America

Applications

• Ground
• Air
• Marine
• Space

Reasons to buy:

• To address the procurement and market analysis needs for HDI PCBs in defence and space applications over the next eight years.
• Conduct a comprehensive analysis of prospective procurement areas based on market trends and government programs. Identify specific areas of demand growth for HDI PCBs in defence and space applications, such as communication systems, command and control systems, radars,weapon systems, next-generation avionics and countermeasures.
• Develop a procurement plan that aligns with technological advancements and industry dynamics.
• Gain insights into the factors driving demand for HDI PCBs in leading countries and emerging markets. Identify opportunities presented by each market segment based on defence spending, technological advancements, and geopolitical factors. Analyze market potential in terms of applications like space-based internet, inter-satellite communication, and deep space missions.
• Strengthen understanding of market demand drivers, industry trends, regulatory landscapes, and technological developments influencing the adoption of HDI PCBs in defence and space applications. Monitor advancements in HDI PCB technology.
• Identify key channels driving the global HDI PCBs market for defence and space applications. Evaluate opportunities in government procurement programs, defence contracts, research collaborations, and commercial partnerships. Explore avenues for revenue expansion through market penetration and diversification.
• Conduct a comprehensive analysis of the competitive landscape in the HDI PCBs market. Profile leading providers of HDI PCbs for defence and space applications worldwide, including their product offerings, market presence, research capabilities, and strategic initiatives. Assess competitive positioning to make informed business decisions and identify potential partnership opportunities.

Companies Listed:

Table of Contents

1. Executive Summary

• 1.1. Trends and Insights
• 1.2. Main Findings
• 1.3. Key Conclusions

2. Introduction

• 2.1. Scope
• 2.2. Definitions
• 2.3. Methodology
• 2.4. Who will benefit from this study?

3. Technologies and Developments

• 3.1. Technology Overview
  • 3.1.1. Evolution of HDI PCBs
• 3.2. Critical Technologies used in HDI PCBs
  • 3.2.1. Laser Drilling Technology
  • 3.2.2. Laser Direct Imaging
  • 3.2.3. Laser Drillable Laminates and Prepregs
• 3.3. Microvias and High-density Connectors
  • 3.3.1. Microvias
  • 3.3.2. High-density PCB Connectors
• 3.4. Sequential Lamination and Layering Technologies
• 3.5. Notable Technology Developments
  • 3.5.1. Ultra HDI PCBs

4. Market Overview

• 4.1. Introduction
• 4.2. HDI PCB market volume distribution over the forecast period by Region
• 4.3. Main market players overview
  • 4.3.1. HDI PCB Material Companies
  • 4.3.2. HDI PCB Machinery Companies
  • 4.3.3. HDI PCB Fabrication and Assembly
• 4.4. Recent contracts overview
  • 4.4.1. Calumet Electronics and Green Source Awarded Major Contracts to Boost Advanced PCB Production
  • 4.4.2. Micross Components Awarded Major Contract to Develop Advanced Packaging Capabilities for Department of Defence
• 4.5. Main customers overview
• 4.6. Recent product introductions Overview
  • 4.6.1. ESA Approves VT-901 as the First Qualified HDI Material
  • 4.6.2. Atotech Demonstrated Printoganth T1 and InPro
• 4.7. Supply Chain Overview
• 4.8. Critical Raw Materials
  • 4.8.1. Laser Drillable (LD) Prepregs
  • 4.8.2. Substrate Material

5. Market Dynamics and Forecast Factors

• 5.1. Market Segmentation
  • 5.1.1. Segments by Key Regions
  • 5.1.2. Segmentation by Application
• 5.2. Drivers
• 5.3. Trends
• 5.4. Opportunities
• 5.5. Challenges

6. Country Analysis

• 6.1. Overview
• 6.2. USA
  • 6.2.1. Section 841 of the FY 2021 NDAA
  • 6.2.2. NDS and NDIS
  • 6.2.3. The CHIPS and Science Act of 2022
  • 6.2.4. The Defence Production Act (DPA) Title III program
  • 6.2.5. Defence Production Act Investment (DPAI) Program
  • 6.2.6. Supporting PCB Act 2022 and PCBS Act 2023
  • 6.2.7. Relevant contracts
• 6.3. Canada
• 6.4. Mexico
• 6.5. European Union
  • 6.5.1. Europe Chips Act
  • 6.5.2. Horizon Focusing
  • 6.5.3. JTF-2021/23-15 - High Challenges for PCBs and SMT (Surface Mount Technologies)
• 6.6. ESA
  • 6.6.1. General Support Technology Programme (GSTP)
  • 6.6.2. G61A-017QT
  • 6.6.3. ESA HDI PCB Technology Roadmap
  • 6.6.4. ESA Qualified HDI PCB Suppliers
• 6.7. China
• 6.8. Taiwan

7. Global and Regional Market Forecast to 2032

• 7.1. Introduction
• 7.2. HDI PCB market by Region overview
• 7.3. HDI PCB Market Regions by Technology
  • 7.3.1. North America HDI PCB Market by Technology
  • 7.3.2. EU-27 HDI PCB Market by Technology
  • 7.3.3. Non EU-27 HDI PCB Market by Technology
  • 7.3.4. APAC HDI PCB Market by Technology
  • 7.3.5. MEA HDI PCB Market by Technology
  • 7.3.6. LATAM HDI PCB Market by Technology
• 7.4. Opportunity Analysis
  • 7.4.1. By Region

8. Market Forecast to 2032 by Application

• 8.1. Introduction
• 8.2. HDI PCB market by Application overview
• 8.3. HDI PCB Applications Market by Region
  • 8.3.1. Airborne HDI PCB Market by Region
  • 8.3.2. Ground-based HDI PCB market by Region
  • 8.3.3. Naval-based HDI PCB market by Region
  • 8.3.4. Space-based HDI PCB market by Region
• 8.4. Opportunity Analysis
  • 8.4.1. By Application

9. Impact Analysis

• 9.1. Introduction
• 9.2. Forecast Factors and Market Impact
  • 9.2.1. Growing Emphasis on"Silicon to System" approach
  • 9.2.2. Challenges in Raw Material Availability and Procurement Hurdles
  • 9.2.3. Scenario Analysis

10. Leading Companies

• 10.1. ACB Group
  • 10.1.1. Introduction
  • 10.1.2. Related Products and Services
  • 10.1.3. Recent Developments and Contracts
  • 10.1.4. SWOT Analysis
• 10.2. AGC Multi Materials
  • 10.2.1. Introduction
  • 10.2.2. Related Products and Services
  • 10.2.3. Recent Developments and Contracts
  • 10.2.4. SWOT Analysis
• 10.3. Amphenol Invotec
  • 10.3.1. Introduction
  • 10.3.2. Related Products and Services
  • 10.3.3. Recent Developments and Contracts
  • 10.3.4. SWOT Analysis
• 10.4. Austria Technologie & Systemtechnik AG (AT&S)
  • 10.4.1. Introduction
  • 10.4.2. Related Products and Services
  • 10.4.3. SWOT Analysis
• 10.5. Calumet Electronics Corporation
  • 10.5.1. Introduction
  • 10.5.2. Related Products and Services
  • 10.5.3. Recent Developments and Contracts
  • 10.5.4. SWOT Analysis
• 10.6. DuPont (Electrical & Industrial)
  • 10.6.1. Introduction
  • 10.6.2. Related Products and Services
  • 10.6.3. SWOT Analysis
• 10.7. Firan Technology Group (FTG)
  • 10.7.1. Introduction
  • 10.7.2. Related Products and Services
  • 10.7.3. Recent Developments and Contracts
  • 10.7.4. SWOT Analysis
• 10.8. Isola Group
  • 10.8.1. Introduction
  • 10.8.2. Related Products and Services
  • 10.8.3. Recent Developments and Contracts
  • 10.8.4. SWOT Analysis
• 10.9. NCAB Group
  • 10.9.1. Introduction
  • 10.9.2. Related Products and Services
  • 10.9.3. Recent Developments and Contracts
  • 10.9.4. SWOT Analysis
• 10.10. Sierra Circuits Inc.
  • 10.10.1. Introduction
  • 10.10.2. Related Products and Services
  • 10.10.3. Recent Developments and Contracts
  • 10.10.4. SWOT Analysis
• 10.11. Leading Companies in Laser Direct Imaging (LDI)
  • 10.11.1. Orbotech (a KLA Company)
  • 10.11.2. LPKF Laser & Electronics
  • 10.11.3. Mitsubishi Electric
  • 10.11.4. SCREEN Holdings Co., Ltd.
  • 10.11.5. Manz AG
  • 10.11.6. First EIE SA
  • 10.11.7. Limata GmbH
  • 10.11.8. Miva Technologies GmbH

11. Results and Conclusions

12. About Market Forecast

• 12.1. General
• 12.2. Contact us
• 12.3. Disclaimer
• 12.4. License

Appendix A: Companies Mentioned

Appendix B: Abbreviations

List of figures

• Figure 1: HDI PCB Market Summary by Region
• Figure 2: Market volumes over the forecast period per region
• Figure 3: Market Segmentation and Sub-Segmentation HDI PCB Market
• Figure 4: Global and Regional HDI PCB Defence and Space Market 2024 - 2032 [US$ million]
• Figure 5: Global HDI PCB Market Forecast to 2032 by Region [%]
• Figure 6: North America HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
• Figure 7: EU-27 HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
• Figure 8: Non EU-27 HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
• Figure 9: APAC HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
• Figure 10: MEA HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
• Figure 11: LATAM HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
• Figure 12: HDI PCB market size, 2024-2032 (US$ million) by region
• Figure 13: HDI PCB market CAGR, 2024-2032 by region
• Figure 14: Global HDI PCB Market Forecast to 2032 by Application [US$ million]
• Figure 14: Airborne HDI PCB Market Forecast to 2032 by Region [US$ million]
• Figure 15: Ground-based HDI PCB Market Forecast to 2032 by Region [US$ million]
• Figure 16: Naval-based HDI PCB Market Forecast to 2032 by Region [US$ million]
• Figure 17: HDI PCB for Space Applications Market Forecast to 2032 by Region [US$ million]
• Figure 18: HDI PCB market size, 2024-2034 (US$ million) by Application
• Figure 19: HDI PCB market CAGR, 2024-2034 by Application
• Figure 20: HDI PCB Market Forecast to 2031 Scenario I Vs. Scenario II

List of tables

• Table 1: HDI PCB Market Summary by Region [US$ million]
• Table 2: HDI PCB Technology Characteristics
• Table 3: Microvias and High-density Connectors
• Table 4: HDI PCB Material Companies
• Table 5: HDI PCB Machinery Companies
• Table 6: HDI PCB Machinery Companies
• Table 7: HDI PCB Supply Chain
• Table 8: HDI PCB Market Defence and Space Forecast to 2032 by Region [US$ million]
• Table 9: North America HDI PCB Market Forecast to 2032 by Technology [US$ million]
• Table 10: EU-27 HDI PCB Market Forecast to 2032 by Technology [US$ million]
• Table 11: Non EU-27 HDI PCB Market Forecast to 2032 by Technology [US$ million]
• Table 12: APAC HDI PCB Market Forecast to 2032 by Technology [US$ million]
• Table 13: MEA HDI PCB Market Forecast to 2032 by Technology [US$ million]
• Table 14: LATAM HDI PCB Market Forecast to 2032 by Technology [US$ million]
• Table 15: Global HDI PCB Market Forecast to 2032 by Application [US$ million]
• Table 15: Airborne HDI PCB Market Forecast to 2032 by Region [US$ million]
• Table 17: Ground-based HDI PCB Market Forecast to 2032 by Region [US$ million]
• Table 18: Naval-based HDI PCB Market Forecast to 2032 by Region [US$ million]
• Table 19: HDI PCB for Space Applications Market Forecast to 2032 by Region [US$ million]
• Table 20: HDI PCB Market Forecast to 2032 Scenario I Vs. Scenario II [US$ million]
• Table 21: ACB Group Company SWOT Analysis
• Table 22: AGC Group Company SWOT Analysis
• Table 23: Amphenol Invotec Company SWOT Analysis
• Table 24: AT&S Company SWOT Analysis
• Table 25: Calumet Company SWOT Analysis
• Table 26: DuPont Company SWOT Analysis
• Table 27: Firan Technology Company SWOT Analysis
• Table 28: Isola Group Company SWOT Analysis
• Table 29: NCAB Group Company SWOT Analysis
• Table 30: Sierra Circuits Company SWOT Analysis