多層プリント基板の市場規模、シェア、成長分析：材料タイプ別、基板別、流通チャネル別、層数別、用途別、地域別-産業予測、2025～2032年

世界の多層プリント基板の市場規模は、2023年に773億米ドルと評価され、予測期間（2025～2032年）のCAGRは5.1%で、2024年の812億4,000万米ドルから2032年には1,209億5,000万米ドルに成長する見通しです。

多層プリント基板（PCB）は、コンパクトなサイズ、軽量設計、優れた耐久性、柔軟性の向上など、数多くの技術的利点があるため、人気を集めています。スマートフォンやコンピュータのようなデバイスの小型化需要の高まりに対応するために不可欠なこれらのPCBは、家電、軍事機器、ヘルスケア技術、特にスマートホームオートメーションソリューションなど、さまざまな分野でますます使用されるようになっています。その設計は、単一基板内に複数の層を組み合わせることで機能性を高め、省スペースで大容量と高速性を実現します。さらにメーカーは、リジッドPCBとフレキシブルPCBの両方を製造できる汎用性という利点も享受しています。しかし、高い製造コストやコンパクトな設計に伴う複雑さなどの課題が、この分野の市場成長を妨げる可能性があります。

目次

イントロダクション

• 調査の目的
• 調査範囲
• 定義

調査手法

• 情報調達
• 二次・一次データの方法
• 市場規模予測
• 市場の前提条件と制限

エグゼクティブサマリー

• 世界市場の展望
• 供給と需要の動向分析
• セグメント別機会分析

市場力学と展望

• 市場概要
• 市場規模
• 市場力学
  • 促進要因と機会
  • 抑制要因と課題
• ポーターの分析

主な市場の考察

• 重要成功要因
• 競合の程度
• 主な投資機会
• 市場エコシステム
• 市場の魅力指数（2024年）
• PESTEL分析
• マクロ経済指標
• バリューチェーン分析
• 価格分析
• ケーススタディ
• 顧客購買行動分析

多層プリント基板市場規模：材料タイプ別、CAGR（2025～2032年）

• 市場概要
• エポキシ樹脂
• ポリイミド
• CFRエポキシ
• PTFE
• 熱可塑性

多層プリント基板市場規模：基板別、CAGR（2025～2032年）

• 市場概要
• リジッド
• フレキシブル
• リジッドフレックス

多層プリント基板市場規模：流通チャネル別、CAGR（2025～2032年）

• 市場概要
• 直接販売
• 販売代理店
• オンライン販売
• OEM

多層プリント基板市場規模：層数別、CAGR（2025～2032年）

• 市場概要
• 4層
• 6層
• 8層
• 10層
• 10層以上

多層プリント基板市場規模：用途別、CAGR（2025～2032年）

• 市場概要
• 産業用電子機器
• ヘルスケア
• 航空宇宙・防衛
• 自動車
• IT・通信
• 家電
• その他

多層プリント基板市場規模：地域別、CAGR（2025～2032年）

• 北米
  • 米国
  • カナダ
• 欧州
  • ドイツ
  • スペイン
  • フランス
  • 英国
  • イタリア
  • その他欧州地域
• アジア太平洋地域
  • 中国
  • インド
  • 日本
  • 韓国
  • その他アジア太平洋地域
• ラテンアメリカ
  • ブラジル
  • その他ラテンアメリカ地域
• 中東・アフリカ
  • GCC諸国
  • 南アフリカ
  • その他中東・アフリカ

競合情報

• 上位5社の比較
• 主要企業の市場ポジショニング（2024年）
• 主な市場企業が採用した戦略
• 最近の市場動向
• 企業の市場シェア分析（2024年）
• 主要企業の企業プロファイル
  • 企業の詳細
  • 製品ポートフォリオ分析
  • 企業のセグメント別シェア分析
  • 収益の前年比比較（2022～2024年）

主要企業プロファイル

• Vector Electronics
• Compal Electronics
• Flex Ltd.
• Jabil Circuit
• Banda Electronics
• Zhen Ding Technology
• Taiwan Semiconductor Manufacturing Company
• Shenzhen Fastprint Electronics
• Sanmina Corporation
• Shenzhen Kaifa Technology
• Unimicron Technology
• Samsung Electronics
• Millennium Circuits Limited
• Nippon Mektron

結論と提言

Global Multilayer Printed Circuit Board Market size was valued at USD 77.3 billion in 2023 and is poised to grow from USD 81.24 billion in 2024 to USD 120.95 billion by 2032, growing at a CAGR of 5.1% during the forecast period (2025-2032).

Multilayer Printed Circuit Boards (PCBs) are gaining traction due to their numerous technical advantages, including compact size, lightweight design, exceptional durability, and improved flexibility. Essential for meeting the growing demand for miniaturization in devices like smartphones and computers, these PCBs are increasingly used across various sectors, such as consumer electronics, military equipment, and healthcare technologies, particularly in smart home automation solutions. Their design allows for increased functionality by combining multiple layers within a single board, delivering high capacity and speed in a reduced footprint. Moreover, manufacturers benefit from the versatility of producing both rigid and flexible PCBs. However, challenges such as high production costs and the complexity associated with compact designs may hinder market growth in this sector.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Multilayer Printed Circuit Board market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Multilayer Printed Circuit Board Market Segments Analysis

Global Multilayer Printed Circuit Board Market is segmented by Material Type, Substrate, Distribution Channel, Number of Layers, Application and region. Based on Material Type, the market is segmented into Epoxy Resin, Polyimide, CFR-epoxy, PTFE and Thermoplastic. Based on Substrate, the market is segmented into Rigid, Flexible and Rigid-Flex. Based on Distribution Channel, the market is segmented into Direct Sales, Distributors, Online Sales and OEMs. Based on Number of Layers, the market is segmented into 4 Layers, 6 Layers, 8 Layers, 10 Layers and More than 10 Layers. Based on Application, the market is segmented into Industrial Electronics, Healthcare, Aerospace and Defense, Automotive, IT and Telecom, Consumer Electronics and Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Multilayer Printed Circuit Board Market

The global demand for electronic devices, including smartphones, laptops, and smart televisions, has significantly surged, driving the growth of the multilayer printed circuit board market. This upsurge is largely attributed to the increasing global population, which has heightened the need for advanced electronic gadgets. Additionally, the role of automated machinery and the prevalence of cellular towers in this tech-driven age cannot be overlooked. Furthermore, these electronic devices are not only essential for consumer use but also play a critical role in sectors such as aerospace, military, and various government institutions, all of which contribute to the expanding requirements for multilayer printed circuit boards.

Restraints in the Global Multilayer Printed Circuit Board Market

One of the key challenges facing the global multilayer printed circuit board market is the high cost associated with manufacturing, design, and depaneling processes. These expenses can significantly drive up the overall cost of multilayer boards. As a result, many leading electrical device manufacturers often turn to more affordable alternatives, which can be more economically viable. Additionally, the production timeline for multilayer printed circuit boards is considerably longer compared to that of traditional single or double-layer boards, further escalating costs and impacting the final product pricing. This combination of factors poses a significant restraint on market growth.

Market Trends of the Global Multilayer Printed Circuit Board Market

The Global Multilayer Printed Circuit Board (PCB) market is witnessing substantial growth, driven by the rapid adoption of technologies such as Artificial Intelligence (AI), the Internet of Things (IoT), and 5G. As we move further into a digitized era, the demand for efficient, high-capacity data transmission and processing solutions is accelerating. Multilayer PCBs are uniquely positioned to support these trends, offering enhanced capabilities for managing vast amounts of data with minimal latency. This synergy between multilayer PCBs and advanced technologies not only fuels market expansion but also aligns with the increasing need for innovative electronic applications across various industries.

Table of Contents

Introduction

• Objectives of the Study
• Scope of the Report
• Definitions

Research Methodology

• Information Procurement
• Secondary & Primary Data Methods
• Market Size Estimation
• Market Assumptions & Limitations

Executive Summary

• Global Market Outlook
• Supply & Demand Trend Analysis
• Segmental Opportunity Analysis

Market Dynamics & Outlook

• Market Overview
• Market Size
• Market Dynamics
  • Drivers & Opportunities
  • Restraints & Challenges
• Porters Analysis
  • Competitive rivalry
  • Threat of substitute
  • Bargaining power of buyers
  • Threat of new entrants
  • Bargaining power of suppliers

Key Market Insights

• Key Success Factors
• Degree of Competition
• Top Investment Pockets
• Market Ecosystem
• Market Attractiveness Index, 2024
• PESTEL Analysis
• Macro-Economic Indicators
• Value Chain Analysis
• Pricing Analysis
• Case Studies
• Customer Buying Behavior Analysis

Global Multilayer Printed Circuit Board Market Size by Material Type & CAGR (2025-2032)

• Market Overview
• Epoxy Resin
• Polyimide
• CFR-epoxy
• PTFE
• Thermoplastic

Global Multilayer Printed Circuit Board Market Size by Substrate & CAGR (2025-2032)

• Market Overview
• Rigid
• Flexible
• Rigid-Flex

Global Multilayer Printed Circuit Board Market Size by Distribution Channel & CAGR (2025-2032)

• Market Overview
• Direct Sales
• Distributors
• Online Sales
• OEMs

Global Multilayer Printed Circuit Board Market Size by Number of Layers & CAGR (2025-2032)

• Market Overview
• 4 Layers
• 6 Layers
• 8 Layers
• 10 Layers
• More than 10 Layers

Global Multilayer Printed Circuit Board Market Size by Application & CAGR (2025-2032)

• Market Overview
• Industrial Electronics
• Healthcare
• Aerospace and Defense
• Automotive
• IT and Telecom
• Consumer Electronics
• Others

Global Multilayer Printed Circuit Board Market Size & CAGR (2025-2032)

• North America (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • US
  • Canada
• Europe (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • Germany
  • Spain
  • France
  • UK
  • Italy
  • Rest of Europe
• Asia Pacific (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
• Latin America (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • Brazil
  • Rest of Latin America
• Middle East & Africa (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • GCC Countries
  • South Africa
  • Rest of Middle East & Africa

Competitive Intelligence

• Top 5 Player Comparison
• Market Positioning of Key Players, 2024
• Strategies Adopted by Key Market Players
• Recent Developments in the Market
• Company Market Share Analysis, 2024
• Company Profiles of All Key Players
  • Company Details
  • Product Portfolio Analysis
  • Company's Segmental Share Analysis
  • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

• Vector Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Compal Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Flex Ltd.
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Jabil Circuit
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Banda Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Zhen Ding Technology
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Taiwan Semiconductor Manufacturing Company
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Shenzhen Fastprint Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Sanmina Corporation
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Shenzhen Kaifa Technology
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Unimicron Technology
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Samsung Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Millennium Circuits Limited
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Nippon Mektron
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments

Conclusion & Recommendations