市場調査レポート
商品コード
1356545
3D TSVパッケージ市場レポート:2030年までの動向、予測、競合分析3D TSV Package Market Report: Trends, Forecast and Competitive Analysis to 2030 |
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3D TSVパッケージ市場レポート:2030年までの動向、予測、競合分析 |
出版日: 2023年09月01日
発行: Lucintel
ページ情報: 英文 150 Pages
納期: 3営業日
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3D TSVパッケージの動向と予測
世界の3D TSVパッケージ市場は、2024年から2030年までのCAGRが15.8%で、2030年までに219億米ドルに達すると推定されます。この市場の主な促進要因は、高性能でコンパクトな電子機器に対する需要の高まり、5G技術の急速な採用、AIとML技術に対する需要の増加です。世界の3D TSVパッケージ市場の将来は、コンシューマーエレクトロニクス、自動車、ヘルスケア、航空宇宙・防衛市場におけるビジネスチャンスで有望視されています。
3D TSVパッケージ市場の洞察
Lucintelは、ウエハーレベルパッケージングが予測期間中に最も高い成長を遂げると予測しています。
同市場では、民生用電子機器が最大セグメントであり続ける。
NA市場は予測期間中に最も高い成長が見込まれます。
3D TSV Package Trends and Forecast
The future of the global 3D TSV package market looks promising with opportunities in the consumer electronic, automotive, healthcare,and aerospace & defense markets. The global 3D TSV package market is expected to reach an estimated $21.9 billion by 2030 with a CAGR of 15.8% from 2024 to 2030. The major drivers for this market are growing demand for high-performance and compact electronic devices., rapid adoption of 5G technology ,and increasing demand for AI and ML technologies.
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3D TSV Package by Segment
The study includes a forecast for the global 3D TSV package by technology, application, end use, and region.
3D TSV Package Market by Technology [Shipment Analysis by Value from 2018 to 2030]:
3D TSV Package Market by Application [Shipment Analysis by Value from 2018 to 2030]:
3D TSV Package Market by End Use [Shipment Analysis by Value from 2018 to 2030]:
3D TSV Package Market by Region [Shipment Analysis by Value from 2018 to 2030]:
List of 3D TSV Package Companies
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies 3D TSV package companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the 3D TSV package companies profiled in this report include-
3D TSV Package Market Insights
Lucintel forecasts that wafer level packaging is expected to witness highest growth over the forecast period.
Within this market, consumer electronics will remain the largest segment.
NA is expected to witness highest growth over the forecast period.
Features of the Global 3D TSV Package Market
Market Size Estimates: 3D TSV Package Market size estimation in terms of value ($B).
Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
Segmentation Analysis: 3D TSV package market size by technology, application, end use, and region. in terms of value ($B).
Regional Analysis: 3D TSV package market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
Growth Opportunities: Analysis of growth opportunities in different technologies, applications, end uses, and region.s for the 3D TSV package market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape of the 3D TSV package market.
Analysis of competitive intensity of the industry based on Porter's Five Forces model.
FAQ
Q.1. What is the 3D TSV package market size?
Answer: The global 3D TSV package market is expected to reach an estimated $21.9 billion by 2030.
Q.2. What is the growth forecast for 3D TSV package market?
Answer: The global 3D TSV package market is expected to grow with a CAGR of 15.8% from 2024 to 2030
Q.3. What are the major drivers influencing the growth of the 3D TSV package market?
Answer: The major drivers for this market are growing demand for high-performance and compact electronic devices. rapid adoption of 5g technology increasing demand for ai and ml technologies
Q.4. What are the major segments for 3D TSV package market?
Answer: The future of the 3D TSV package market looks promising with opportunities in the consumer electronic, automotive, healthcare, and aerospace & defense markets.
Q.5. Who are the key 3D TSV package market companies?
Answer: Some of the key 3D TSV package companies are as follows:
Q.6. Which 3D TSV package market segment will be the largest in future?
Answer: Lucintel forecasts that wafer level packaging is expected to witness highest growth over the forecast period.
Q.7. In 3D TSV package market, which region is expected to be the largest in next 5 years?
Answer: NA is expected to witness highest growth over the forecast period.
Q.8. Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% customization without any additional cost.