DRAMモジュールとコンポーネント市場：動向、ビジネスチャンス、競合分析【2023-2028年】

DRAMモジュールおよびコンポーネント市場の動向と予測

世界のDRAMモジュールおよびコンポーネント市場は、2023年から2028年までのCAGRが1.2%で、2028年までに推定1,034億米ドルに達すると予測されます。この市場の主な促進要因は、5Gベースの技術動向の拡大、IoT対応デバイスの需要増加、超薄型ノートPCやハイブリッドデバイスなど最新のDRAMベースのコンピューティングガジェットの人気の高まりです。DRAMモジュールおよびコンポーネントの世界市場は、サーバー、自動車、家電、コンピュータ、モバイル機器の各アプリケーションにおけるビジネスチャンスにより、将来性が期待されます。

DRAMモジュールおよびコンポーネント市場の洞察

• Lucintelの予測では、DDR5はその次世代性能、大容量、電力効率により、PC愛好家、ハードコアゲーマー、コンテンツメーカーにとって理想的な選択肢と考えられているため、予測期間中に最も高い成長を遂げる見込みです。
• 自動車は、IoTガジェット、自動化技術、リモート・アクセス・アプリケーションの自動車への浸透の増加や、運転体験をより快適で安全なものにするための高度なデジタル・デバイスのイントロダクションより、最大セグメントであり続けると思われます。
• APACは、スマートガジェットへの莫大な需要、主要な半導体製造拠点の存在、同地域における主要プレイヤーの存在により、最大地域であり続けると思われます。

本レポートでは、以下の11の主要な質問に回答している：

• Q.1.市場セグメントのうち、最も有望かつ高成長な機会は何か？
• Q.2.どのセグメントがより速いペースで成長するのか、またその理由は？
• Q.3.今後成長が加速すると思われる地域とその理由は？
• Q.4.市場力学に影響を与える主な要因は何か？市場における主な課題とビジネスリスクは？
• Q.5.この市場におけるビジネスリスクと競合の脅威は？
• Q.6.この市場における新たな動向とその理由は？
• Q.7.市場における顧客の需要の変化にはどのようなものがありますか？
• Q.8.この市場における新たな開発と、その開発をリードしている企業は？
• Q.9.この市場における主要企業は？また、主要企業はどのような戦略的取り組みを進めているのか？
• Q10.この市場における競合製品にはどのようなものがあり、材料や製品の代替による市場シェア低下の脅威はどの程度あるのか？
• Q11.過去5年間にどのようなM&Aが行われ、業界にどのような影響を与えたか？

目次

第1章 エグゼクティブサマリー

第2章 世界のDRAMモジュールおよびコンポーネント市場：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 業界の促進要因と課題

第3章 2017年から2028年までの市場動向と予測分析

• マクロ経済動向（2017～2022年）と予測（2023～2028年）
• 世界のDRAMモジュールおよびコンポーネント市場の動向（2017～2022年）および予測（2023～2028年）
• 製品タイプ別の世界のDRAMモジュールおよびコンポーネント市場
  • LPDRAM
  • DDR2
  • DDR5
  • GDDR
  • HBM
  • DDR4
  • DDR3
  • その他
• メモリタイプ別の世界のDRAMモジュールおよびコンポーネント市場
  • 8GB以上
  • 6～8GB
  • 3～4GB
  • 2GB
  • その他
• 最終用途産業別の世界のDRAMモジュールおよびコンポーネント市場
  • サーバー
  • 自動車
  • 家電
  • コンピュータ
  • モバイルデバイス
  • その他

第4章 2017年から2028年までの地域別の市場動向と予測分析

• 地域別の世界のDRAMモジュールおよびコンポーネント市場
• 北米のDRAMモジュールおよびコンポーネント市場
• 欧州のDRAMモジュールおよびコンポーネント市場
• アジア太平洋 DRAMモジュールおよびコンポーネント市場
• その他地域 DRAMモジュールおよびコンポーネント市場

第5章 競合の分析

• 製品ポートフォリオ分析
• 運用上の統合
• ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

• 成長機会分析
  • 製品タイプ別の世界のDRAMモジュールおよびコンポーネント市場の成長機会
  • メモリタイプ別の世界のDRAMモジュールおよびコンポーネント市場の成長機会
  • 最終用途産業別の世界のDRAMモジュールおよびコンポーネント市場の成長機会
  • 地域別の世界のDRAMモジュールおよびコンポーネント市場の成長機会
• 世界のDRAMモジュールおよびコンポーネント市場の新たな動向
• 戦略的分析
  • 新製品の開発
  • 世界のDRAMモジュールおよびコンポーネント市場の生産能力拡大
  • 世界のDRAMモジュールおよびコンポーネント市場における合併、買収、合弁事業
  • 認証とライセンシング

第7章 有力企業の企業プロファイル

• Samsung Electronics
• SK Hynix
• Micron Technology
• Nanya Technology
• Winbond Electronics
• Powerchip Technology
• ADATA Technology

DRAM Module and Component Market Trends and Forecast

The future of the global dram module and component market looks promising with opportunities in the server, automobile, consumer electronic, computer, and mobile device applications. The global dram module and component market is expected to reach an estimated $103.4 billion by 2028 with a CAGR of 1.2% from 2023 to 2028. The major drivers for this market are growing trend of 5G based technologies, rising demand for IoT enabled devices, and growing popularity of modern DRAM-based computing gadgets, such as ultra-thin laptops and hybrid devices.

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DRAM Module and Component Market by Segment

The study includes trends and forecast for the global dram module and component market by product type, memory type, end use industry, and region

DRAM Module and Component Market by Product Type [Shipment Analysis by Value from 2017 to 2028]:

• LPDRAM
• DDR2
• DDR5
• GDDR
• HBM
• DDR4
• DDR3
• Others

DRAM Module and Component Market by Memory Type [Shipment Analysis by Value from 2017 to 2028]:

• Above 8 GB
• 6-8GB
• 3-4GB
• 2GB
• Others

DRAM Module and Component Market by End Use Industry [Shipment Analysis by Value from 2017 to 2028]:

• Servers
• Automobiles
• Consumer Electronics
• Computers
• Mobile Devices
• Others

DRAM Module and Component Market by Region [Shipment Analysis by Value from 2017 to 2028]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of DRAM Module and Component Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies, DRAM module and component companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the dram module and component companies profiled in this report include:

• Samsung Electronics
• SK Hynix
• Micron Technology
• Nanya Technology
• Winbond Electronics
• Powerchip Technology
• ADATA Technology

DRAM Module and Components Market Insights

• Lucintel forecasts that DDR5 is expected to witness the highest growth over the forecast period as it is considered an ideal option for PC enthusiasts, hardcore gamers, and content makers owing to its next-generation performance, extended capacity, and power efficiency.
• Automotive will remain the largest segment due to increasing penetration of IoT gadgets, automation technology, and remote access applications in vehicles and introduction of advanced digital devices to make driving experience more comfortable and safe.
• APAC will remain the largest region due to tremendous demand for smart gadgets, the existence of major semiconductor manufacturing hubs, and the presence of key players in the region.

Features of the Global DRAM Module and Component Market

• Market Size Estimates: DRAM module and component market size estimation in terms of value ($B).
• Trend and Forecast Analysis: Market trends (2017 to 2022) and forecast (2023 to 2028) by various segments and regions.
• Segmentation Analysis: DRAM module and component market size by various segments, such as by product type, memory type, end use industry, and region in terms of value ($B).
• Regional Analysis: DRAM module and component market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
• Growth Opportunities: Analysis of growth opportunities in different product types, memory types, end use industries, and regions for the DRAM module and component market.
• Strategic Analysis: This includes M&A, new product development, and competitive landscape of the DRAM module and component market.
• Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

• Q1. What is the DRAM module and component market size?
• Answer: The global DRAM module and component market is expected to reach an estimated $103.4 billion by 2028.
• Q2.What is the growth forecast for DRAM module and component market?
• Answer: The global DRAM module and component market is expected to grow with a CAGR of 1.2% from 2023 to 2028
• Q3.What are the major drivers influencing the growth of the DRAM module and component market?
• Answer: The major drivers for this market are growing trend of 5G based technologies, rising demand for IoT enabled devices, and growing popularity of modern DRAM-based computing gadgets, such as ultra-thin laptops and hybrid devices.
• Q4. What are the major segments for DRAM module and component market?
• Answer: The future of the DRAM module and component market looks promising with opportunities in the server, automobile, consumer electronic, computer, and mobile device applications.
• Q5. Who are the key DRAM module and component companies?
• Answer: Some of the key DRAM module and component companies are as follows:
  • Samsung Electronics
  • SK Hynix
  • Micron Technology
  • Nanya Technology
  • Winbond Electronics
  • Powerchip Technology
  • ADATA Technology
• Q6. Which DRAM module and component market segment will be the largest in future?
• Answer: Lucintel forecasts that DDR5 is expected to witness the highest growth over the forecast period as it is considered an ideal option for PC enthusiasts, hardcore gamers, and content makers owing to its next-generation performance, extended capacity, and power efficiency.
• Q7. In DRAM module and component market, which region is expected to be the largest in next 5 years?
• Answer: APAC will remain the largest region due to tremendous demand for smart gadgets, the existence of major semiconductor manufacturing hubs, and the presence of key players in the region.
• Q8.Do we receive customization in this report?
• Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the global dram module and component market by product type (LPDRAM, DDR2, DDR5, GDDR, HBM, DDR4, DDR3, and others), memory type (above 8 GB, 6-8GB, 3-4GB, 2GB, and others), end use industry (servers, automobiles, consumer electronics, computers, mobile devices, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global DRAM Module and Component Market: Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

• 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
• 3.2: Global DRAM Module and Component Market Trends (2017-2022) and Forecast (2023-2028)
• 3.3: Global DRAM Module and Component Market by Product Type
  • 3.3.1: LPDRAM
  • 3.3.2: DDR2
  • 3.3.3: DDR5
  • 3.3.4: GDDR
  • 3.3.5: HBM
  • 3.3.6: DDR4
  • 3.3.7: DDR3
  • 3.3.8: Others
• 3.4: Global DRAM Module and Component Market by Memory Type
  • 3.4.1: Above 8 GB
  • 3.4.2: 6-8GB
  • 3.4.3: 3-4GB
  • 3.4.4: 2GB
  • 3.4.5: Others
• 3.5: Global DRAM Module and Component Market by End Use Industry
  • 3.5.1: Servers
  • 3.5.2: Automobiles
  • 3.5.3: Consumer Electronics
  • 3.5.4: Computers
  • 3.5.5: Mobile Devices
  • 3.5.6: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

• 4.1: Global DRAM Module and Component Market by Region
• 4.2: North American DRAM Module and Component Market
  • 4.2.1: North American DRAM Module and Component Market by Product Type: LPDRAM, DDR2, DDR5, GDDR, HBM, DDR4, DDR3, and Others
  • 4.2.2: North American DRAM Module and Component Market by End Use Industry: Servers, Automobiles, Consumer Electronics, Computers, Mobile Devices, and Others
• 4.3: European DRAM Module and Component Market
  • 4.3.1: European DRAM Module and Component Market by Product Type: LPDRAM, DDR2, DDR5, GDDR, HBM, DDR4, DDR3, and Others
  • 4.3.2: European DRAM Module and Component Market by End Use Industry: Servers, Automobiles, Consumer Electronics, Computers, Mobile Devices, and Others
• 4.4: APAC DRAM Module and Component Market
  • 4.4.1: APAC DRAM Module and Component Market by Product Type: LPDRAM, DDR2, DDR5, GDDR, HBM, DDR4, DDR3, and Others
  • 4.4.2: APAC DRAM Module and Component Market by End Use Industry: Servers, Automobiles, Consumer Electronics, Computers, Mobile Devices, and Others
• 4.5: ROW DRAM Module and Component Market
  • 4.5.1: ROW DRAM Module and Component Market by Product Type: LPDRAM, DDR2, DDR5, GDDR, HBM, DDR4, DDR3, and Others
  • 4.5.2: ROW DRAM Module and Component Market by End Use Industry: Servers, Automobiles, Consumer Electronics, Computers, Mobile Devices, and Others

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global DRAM Module and Component Market by Product Type
  • 6.1.2: Growth Opportunities for the Global DRAM Module and Component Market by Memory Type
  • 6.1.3: Growth Opportunities for the Global DRAM Module and Component Market by End Use Industry
  • 6.1.4: Growth Opportunities for the Global DRAM Module and Component Market by Region
• 6.2: Emerging Trends in the Global DRAM Module and Component Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global DRAM Module and Component Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global DRAM Module and Component Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: Samsung Electronics
• 7.2: SK Hynix
• 7.3: Micron Technology
• 7.4: Nanya Technology
• 7.5: Winbond Electronics
• 7.6: Powerchip Technology
• 7.7: ADATA Technology