3D ICおよび2.5D ICパッケージング市場：動向、機会、競合分析【2023-2028年】

3D ICおよび2.5D ICパッケージング市場の動向と予測

世界の3D ICおよび2.5D ICパッケージング市場は、2023年から2028年までのCAGRが11%で、2028年までに推定811億米ドルに達すると予測されます。この市場の主な促進要因は、小型化されたIoTベースのデバイスに対する需要の高まり、5G技術の出現、ハイエンドコンピューティング、サーバー、データセンターの普及です。世界の3D ICおよび2.5D ICパッケージング市場の将来は、民生用電子機器、産業、通信、自動車、軍事・航空宇宙、医療機器産業におけるビジネスチャンスで有望視されています。

3D ICおよび2.5D ICパッケージング市場の洞察

• マイクロフォン、加速度計、ジャイロスコープ、デジタルコンパス、慣性モジュール、圧力センサ、湿度センサ、スマートセンサなどの先進MEMSや小型化センサで2.5Dおよび3D ICパッケージングが広く使用されているため、MEMS/センサ分野が予測期間中に最も高い成長を遂げるとLucintelは予測しています。
• スマートフォンやタブレットなどの電子機器では、ダブルデータレート（DDR）DRAMやフラッシュメモリーなど、3D ICおよび2.5D ICパッケージングをベースとした革新的メモリーの採用が増加しているため、民生用電子機器が最大セグメントであり続けると予想されます。
• APAC地域は、人口増加による電子機器の普及、通信および自動車産業からのIC需要の増加、主要メーカーの存在により、予測期間中に最も高い成長が見込まれています。

本レポートでは、以下の11の主要な質問に回答しています。

• Q.1.市場セグメントのうち、最も有望かつ高成長な機会は何か？
• Q.2.今後成長が加速するセグメントとその理由は？
• Q.3.今後成長が加速すると思われる地域とその理由は？
• Q.4.市場力学に影響を与える主な要因は何か？市場における主な課題とビジネスリスクは？
• Q.5.この市場におけるビジネスリスクと競合の脅威は？
• Q.6.この市場における新たな動向とその理由は？
• Q.7.市場における顧客の需要の変化にはどのようなものがありますか？
• Q.8.この市場における新たな開発と、その開発をリードしている企業は？
• Q.9.市場の主要企業は？主要企業は事業成長のためにどのような戦略的取り組みを進めていますか？
• Q.10.この市場における競合製品にはどのようなものがあり、材料や製品の代替による市場シェア低下の脅威はどの程度ありますか？
• Q.11.過去5年間にどのようなM&Aが行われ、業界にどのような影響を与えましたか？

目次

第1章 エグゼクティブサマリー

第2章 世界の3D ICおよび2.5D ICパッケージング市場：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 業界の推進力と課題

第3章 2017年から2028年までの市場動向と予測分析

• マクロ経済動向（2017～2022年）と予測（2023～2028年）
• 世界の3D ICおよび2.5D ICパッケージング市場の動向（2017～2022年）および予測（2023～2028年）
• パッケージング技術別の世界の3D ICおよび2.5D ICパッケージング市場
  • 3Dウェーハレベルチップ- スケールパッケージング（WLCSP）
  • 3Dシリコン貫通ビア（TSV）
  • 2.5D
• アプリケーション別の世界の3D ICおよび2.5D ICパッケージング市場
  • 論理
  • イメージングとオプトエレクトロニクス
  • メモリー
  • MEMS/センサー
  • LED
  • その他
• 最終用途産業別の世界の3D ICおよび2.5D ICパッケージング市場
  • 家電
  • 産業用
  • 電気通信
  • 自動車
  • 軍事および航空宇宙
  • 医療機器
  • その他

第4章 2017年から2028年までの地域別の市場動向と予測分析

• 地域別の世界の3D ICおよび2.5D ICパッケージング市場
• 北米の3D ICおよび2.5D ICパッケージング市場
• 欧州の3D ICおよび2.5D ICパッケージング市場
• アジア太平洋 3D ICおよび2.5D ICパッケージング市場
• その他地域 3D ICおよび2.5D ICパッケージング市場

第5章 競合の分析

• 製品ポートフォリオ分析
• 運用上の統合
• ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

• 成長機会分析
  • パッケージング技術による世界の3D ICおよび2.5D ICパッケージング市場の成長機会
  • アプリケーション別の世界の3D ICおよび2.5D ICパッケージング市場の成長機会
  • 最終用途産業別の世界の3D ICおよび2.5D ICパッケージング市場の成長機会
  • 地域別の世界の3D ICおよび2.5D ICパッケージング市場の成長機会
• 世界の3D ICおよび2.5D ICパッケージング市場の新たな動向
• 戦略的分析
  • 新製品の開発
  • 世界の3D ICおよび2.5D ICパッケージング市場の能力拡大
  • 世界の3D ICおよび2.5D ICパッケージング市場における合併、買収、合弁事業
  • 認証とライセンシング

第7章 有力企業の企業プロファイル

• Taiwan Semiconductor Manufacturing
• Samsung Electronics
• Toshiba
• Advanced Semiconductor Engineering
• Amkor Technology

3D IC and 2.5D IC Packaging Market Trends and Forecast

The future of the global 3D IC and 2.5D IC packaging market looks promising with opportunities in the consumer electronic, industrial, telecommunication, automotive, military & aerospace, and medical device industries. The global 3D IC and 2.5D IC packaging market is expected to reach an estimated $81.1 billion by 2028 with a CAGR of 11% from 2023 to 2028. The major drivers for this market are growing demand for miniaturized IoT based devices, emergence of 5G technologies, and the widespread use of high-end computation, servers, and data centers.

A more than 150-page report is developed to help in your business decisions.

3D IC and 2.5D IC Packaging Market by Segment

The study includes trends and forecast for the global 3D IC and 2.5D IC packaging market by packaging technology, application, end use industry, and region, as follows:

3D IC and 2.5D IC Packaging Market by Packaging Technology [Shipment Analysis by Value from 2017 to 2028]:

• 3D Wafer-Level Chip-Scale Packaging (WLCSP)
• 3D Through-Silicon Via (TSV)
• 2.5D

3D IC and 2.5D IC Packaging Market by Application [Shipment Analysis by Value from 2017 to 2028]:

• Logic
• Imaging & Optoelectronics
• Memory
• MEMS/Sensors
• LED
• Others

3D IC and 2.5D IC Packaging Market by End Use Industry [Shipment Analysis by Value from 2017 to 2028]:

• Consumer Electronics
• Industrial
• Telecommunications
• Automotive
• Military & Aerospace
• Medical Devices
• Others

3D IC and 2.5D IC Packaging Market by Region [Shipment Analysis by Value from 2017 to 2028]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of 3D IC and 2.5D IC Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies, 3D IC and 2.5D IC packaging companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the 3D IC and 2.5D IC packaging companies profiled in this report include:

• Taiwan Semiconductor Manufacturing
• Samsung Electronics
• Toshiba
• Advanced Semiconductor Engineering
• Amkor Technology

3D IC and 2.5D IC Packaging Market Insights

• Lucintel forecasts that the MEMS/sensor segment is expected to witness the highest growth over the forecast period due to the widespread use of 2.5D and 3D IC packaging in advanced MEMS and miniaturized sensors, such as microphones, accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, and smart sensors.
• Consumer electronics is expected to remain the largest segment due to the increasing adoption of 3D IC and 2.5D IC packaging based innovative memories, such as double-data-rate (DDR) DRAM and flash memory in the electronic devices, like smartphones and tablets.
• APAC is expected to witness the highest growth over the forecast period due to the huge adoption of electronic gadgets among increasing population, growing demand for ICs from the telecommunication and automotive industries, and the presence of key manufacturers in the region.

Features of the 3D IC and 2.5D IC Packaging Market

• Market Size Estimates: 3D IC and 2.5D IC packaging market size estimation in terms of value ($B)
• Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
• Segmentation Analysis: 3D IC and 2.5D IC packaging market size by various segments, such as by packaging technology, application, end use industry, and region
• Regional Analysis: 3D IC and 2.5D IC packaging market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
• Growth Opportunities: Analysis on growth opportunities in different packaging technologies, applications, end use industries, and regions for the 3D IC and 2.5D IC packaging market.
• Strategic Analysis: This includes M&A, new product development, and competitive landscape for the 3D IC and 2.5D IC packaging market.
• Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

• Q1. What is the 3D IC and 2.5D IC packaging market size?
• Answer: The global 3D IC and 2.5D IC packaging market is expected to reach an estimated $81.1 billion by 2028.
• Q2. What is the growth forecast for 3D IC and 2.5D IC packaging market?
• Answer: The global 3D IC and 2.5D IC packaging market is expected to grow with a CAGR of 11% from 2023 to 2028.
• Q3. What are the major drivers influencing the growth of the 3D IC and 2.5D IC packaging market?
• Answer: The major drivers for this market are growing demand for miniaturized IoT based devices, the emergence of 5G technologies, and the widespread use of high-end computation, servers, and data centers.
• Q4. What are the major segments for 3D IC and 2.5D IC packaging market?
• Answer: The future of the 3D IC and 2.5D IC packaging market looks promising with opportunities in the consumer electronic, industrial, telecommunication, automotive, military & aerospace, and medical device industries.
• Q5. Who are the key 3D IC and 2.5D IC packaging companies?
• Answer: Some of the key 3D IC and 2.5D IC packaging companies are as follows:
  • Taiwan Semiconductor Manufacturing
  • Samsung Electronics
  • Toshiba
  • Advanced Semiconductor Engineering
  • Amkor Technology
• Q6. Which 3D IC and 2.5D IC packaging segment will be the largest in future?
• Answer:Lucintel forecasts that MEMS/sensor is expected to witness the highest growth over the forecast period due to the widespread use of 2.5D and 3D IC packaging in advanced MEMS and miniaturized sensors, such as microphones, accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, and smart sensors.
• Q7. In 3D IC and 2.5D IC packaging market, which region is expected to be the largest in next 5 years?
• Answer: APAC is expected to witness the highest growth over the forecast period due to the huge adoption of electronic gadgets among increasing population, growing demand for ICs in the telecommunication and automotive industries, and presence of key manufacturers in the region.
• Q8. Do we receive customization in this report?
• Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

• Q.1. What are some of the most promising, high-growth opportunities for the global 3D IC and 2.5D IC packaging market by packaging technology (3D wafer-level chip-scale packaging (WLCSP), 3D through-silicon via (TSV), and 2.5D), application (logic, imaging & optoelectronics, memory, MEMS/sensors, LED, and others), end use industry (consumer electronics, industrial, telecommunications, automotive, military & aerospace, medical devices, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last five years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global 3D IC and 2.5D IC Packaging Market: Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

• 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
• 3.2: Global 3D IC and 2.5D IC Packaging Market Trends (2017-2022) and Forecast (2023-2028)
• 3.3: Global 3D IC and 2.5D IC Packaging Market by Packaging Technology
  • 3.3.1: 3D Wafer-Level Chip-Scale Packaging (WLCSP)
  • 3.3.2: 3D Through-Silicon Via (TSV)
  • 3.3.3: 2.5D
• 3.4: Global 3D IC and 2.5D IC Packaging Market by Application
  • 3.4.1: Logic
  • 3.4.2: Imaging & Optoelectronics
  • 3.4.3: Memory
  • 3.4.4: MEMS/Sensors
  • 3.4.5: LED
  • 3.4.6: Others
• 3.5: Global 3D IC and 2.5D IC Packaging Market by End Use Industry
  • 3.5.1: Consumer Electronics
  • 3.5.2: Industrial
  • 3.5.3: Telecommunications
  • 3.5.4: Automotive
  • 3.5.5: Military & Aerospace
  • 3.5.6: Medical Devices
  • 3.5.7: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

• 4.1: Global 3D IC and 2.5D IC Packaging Market by Region
• 4.2: North American 3D IC and 2.5D IC Packaging Market
  • 4.2.1: North American 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
  • 4.2.2: North American 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others
• 4.3: European 3D IC and 2.5D IC Packaging Market
  • 4.3.1: European 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
  • 4.3.2: European 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others
• 4.4: APAC 3D IC and 2.5D IC Packaging Market
  • 4.4.1: APAC 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
  • 4.4.2: APAC 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others
• 4.5: ROW 3D IC and 2.5D IC Packaging Market
  • 4.5.1: ROW 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
  • 4.5.2: ROW 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by Packaging Technology
  • 6.1.2: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by Application
  • 6.1.3: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by End Use Industry
  • 6.1.4: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by Region
• 6.2: Emerging Trends in the Global 3D IC and 2.5D IC Packaging Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global 3D IC and 2.5D IC Packaging Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global 3D IC and 2.5D IC Packaging Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: Taiwan Semiconductor Manufacturing
• 7.2: Samsung Electronics
• 7.3: Toshiba
• 7.4: Advanced Semiconductor Engineering
• 7.5: Amkor Technology