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1270836

3D IC・2.5D ICパッケージングの世界市場：パッケージング技術別（3D WLCSP、3D TSV、2.5D）、用途別（ロジック、メモリー、MEMS/センサー、イメージング・オプトエレクトロニクス、LED）、エンドユーザー別、地域別 - 2028年までの予測

3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028
出版日: | 発行: MarketsandMarkets | ページ情報: 英文 218 Pages | 納期: 即納可能 即納可能とは

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価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=156.53円
3D IC・2.5D ICパッケージングの世界市場：パッケージング技術別（3D WLCSP、3D TSV、2.5D）、用途別（ロジック、メモリー、MEMS/センサー、イメージング・オプトエレクトロニクス、LED）、エンドユーザー別、地域別 - 2028年までの予測
出版日: 2023年05月02日
発行: MarketsandMarkets
ページ情報: 英文 218 Pages
納期: 即納可能 即納可能とは
  • 全表示
  • 概要
  • 目次
概要

世界の3D IC・2.5D ICパッケージングの市場規模は、2023年の493億米ドルから、2028年までに820億米ドルに達し、2023年から2028年までのCAGRで10.7％の成長が予測されています。

3D IC・2.5D ICパッケージング市場の成長を促進する主な要因としては、電子デバイスの集積密度の向上と小型化の動向の高まり、コンシューマーエレクトロニクスやゲーム用デバイスに対する需要の拡大が挙げられます。

3D TSVが提供する最高の相互接続密度で、市場の需要を促進する

TSVは、シリコンウエハーの厚さ全体をスライスして、3D ICのさまざまな層を結合する垂直相互接続です。ICの層全体で効率よく信号を伝送し、信号の移動距離を短縮することで、消費電力の低減や性能の向上を実現します。

ADAS・自動運転におけるICパッケージングの利用が市場成長を促進する

現在の自動車は、ECU、センサー、パワーモジュール、マイクロプロセッサー、DSP、ADASなど、さまざまな技術デバイスが組み込まれており、DRAM、NANDフラッシュ、NORフラッシュ、SSDストレージなどのメモリーが使用可能で、3D ICや2.5D ICの先進パッケージングによって牽引されています。3D ICの低消費電力と高密度パッケージングが、自動車産業におけるメモリー用途の成長を後押ししています。

自動車産業によるMEMS/センサーの採用が市場成長を促進する

自動車産業は、性能向上、コスト削減、信頼性向上のためにMEMSセンサーを採用しています。例えば、自動車産業における慣性MEMSセンサーは、エアバッグ制御用の衝突検出を行います。エアバッグ制御用の衝突検出、ダイナミック車両制御、横転検出、盗難防止システムなど、自動車のいくつかの先進的な機能では、高性能、迅速応答、低消費電力、小型化を実現するために、先進パッケージングを備えたMEMSが求められています。

予測期間中、北米が2番目の市場シェアを占めると予想される

北米の3D IC・2.5D ICパッケージング市場は、米国、カナダ、メキシコにさらに細分化されています。Intel Corporation（米国）、Texas Instruments Inc.（米国）、Qualcomm Incorporated（米国）、Advanced Micro Devices, Inc.（米国）などの大手半導体企業の本拠地で、この地域は技術的に進んでいます。

目次

第1章 イントロダクション

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 重要考察

第5章 市場概要

  • イントロダクション
  • 市場力学
    • 促進要因
    • 抑制要因
    • 機会
    • 課題
  • サプライチェーン分析
  • 3D IC・2.5D ICパッケージングエコシステム
  • 3D IC・2.5D ICパッケージング市場の収益シフトと新たな収益源
  • 平均販売価格分析
  • 技術動向
  • ポーターのファイブフォース分析
  • 主要な利害関係者と購入プロセス/購入基準
  • ケーススタディ分析
  • 貿易分析
  • 特許分析
  • 主要な会議とイベント（2023年～2024年）
  • 基準と規制状況

第6章 3D IC・2.5D ICパッケージング市場：パッケージング技術別

  • イントロダクション
  • 3Dウエハーレベルチップスケールパッケージング（WLCSP）
  • 3Dシリコン貫通電極（TSV）
  • 2.5D

第7章 3D IC・2.5D ICパッケージング市場：用途別

  • イントロダクション
  • ロジック
  • イメージング・オプトエレクトロニクス
  • メモリー
  • MEMS/センサー
  • LED
  • その他

第8章 3D IC・2.5D ICパッケージング市場：エンドユーザー別

  • イントロダクション
  • コンシューマーエレクトロニクス
  • 工業
  • 通信
  • 自動車
  • 軍事・航空宇宙
  • 医療機器

第9章 3D IC・2.5D ICパッケージング市場：地域別

  • イントロダクション
  • 北米
    • 米国
    • カナダ
    • メキシコ
  • 欧州
    • 英国
    • ドイツ
    • フランス
    • その他の欧州
  • アジア太平洋地域
    • 中国
    • 日本
    • 台湾
    • 韓国
    • その他のアジア太平洋地域
  • その他の地域
    • 中東・アフリカ
    • 南米

第10章 競合情勢

  • イントロダクション
  • 主要企業戦略/有力企業
  • 市場シェア分析（2022年）
  • 3D IC・2.5D ICパッケージング市場の上位企業の収益分析
  • 主要企業の評価象限（2022年）
  • 競合ベンチマーキング
  • スタートアップ/中小企業の評価象限（2022年）
  • 競合状況と動向

第11章 企業プロファイル

  • 主要企業
    • SAMSUNG
    • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    • INTEL CORPORATION
    • ASE TECHNOLOGY HOLDING CO., LTD.
    • AMKOR TECHNOLOGY
    • BROADCOM
    • TEXAS INSTRUMENTS INC.
    • UNITED MICROELECTRONICS CORPORATION
    • JCET GROUP CO., LTD.
    • POWERTECH TECHNOLOGY INC.
  • その他の企業
    • CADENCE DESIGN SYSTEMS, INC.
    • SILICONWARE PRECISION INDUSTRIES CO., LTD.
    • ADVANCED MICRO DEVICES, INC.
    • TEZZARON
    • TELEDYNE TECHNOLOGIES INCORPORATED
    • FUJITSU
    • XPERI INC.
    • MONOLITHIC 3D INC.
    • DECA TECHNOLOGIES
    • 3M
    • GLOBALFOUNDRIES INC.
    • NHANCED SEMICONDUCTORS
    • MOLDEX3D
    • CEREBRAS
    • AYAR LABS, INC.

第12章 付録

目次
Product Code: SE 4844

The 3D IC and 2.5D IC packaging market is projected to reach USD 82.0 billion by 2028 from USD 49.3 billion in 2023, at a CAGR of 10.7% from 2023 to 2028. The major factors driving the market growth of the 3D IC and 2.5D IC packaging market include rising trend of increased integration density and miniaturization of electronic devices and growing demand for consumer electronics and gaming devices.

Highest interconnect density offered by 3d tsv to fuel market demand

TSVs are vertical interconnects that join the various layers of the 3D IC by slicing through the whole thickness of the silicon wafer. They enable more effective signal transmission across IC layers and shorten the distance that signals must travel, which lowers power consumption and boosts performance.

Use of IC packaging in ADAS and autonomous driving to fuel market growth

Automobiles today are integrated with various technology devices, such as ECUs, sensors, power modules, microprocessors, DSPs, and advanced driver assistance systems, among many others, which enables the usage of memories such as DRAM, NAND flash, NOR flash, and SSD storage, driven by advanced packaging of 3D IC and 2.5D IC. Low power consumption and dense packaging of 3D ICs are driving its growth in the automobile industry for memory applications.

Adoption of mems/sensors by automotive industry to drive market growth

The automotive industry has adopted MEMS sensors to boost performance, save costs, and increase reliability. For instance, inertial MEMS sensors in the automobile industry are crash-sensing for airbag control. Several advanced features of automobiles, such as crash sensing for airbag control, dynamic vehicle control, rollover detection, antitheft systems, and many more, demand MEMS with advanced packaging to ensure high performance, quick response, low power consumption, and greater compactness.

North America is expected to account for the second largest market share during the forecast period

The 3D IC and 2.5D IC packaging market in North America has been further segmented into the US., Canada, and Mexico. Being home to some of the leading semiconductor companies, such as Intel Corporation (US), Texas Instruments Inc. (US), Qualcomm Incorporated (US), and Advanced Micro Devices, Inc. (US), makes the region technologically advanced.

The break-up of profile of primary participants in the 3D IC and 2.5D IC packaging market-

  • By Company Type: Tier 1 - 38%, Tier 2 - 28%, Tier 3 - 34%
  • By Designation Type: C Level - 40%, Director Level - 30%, Others - 30%
  • By Region Type: North America - 35%, Europe - 35%, Asia Pacific - 20%, Rest of the World - 10%

The major players of 3D IC and 2.5D IC packaging market are Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US) among others.

Research Coverage

The report segments the 3D IC and 2.5D IC packaging market and forecasts its size based on packaging technology, application, end user and region. The report also provides a comprehensive review of drivers, restraints, opportunities, and challenges influencing the market growth. The report also covers qualitative aspects in addition to the quantitative aspects of the market.

Reasons to buy the report:

The report will help the market leaders/new entrants in this market with information on the closest approximate revenues for the overall 3D IC and 2.5D IC packaging market and related segments. This report will help stakeholders understand the competitive landscape and gain more insights to strengthen their position in the market and plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, opportunities, and challenges.

The report provides insights on the following pointers:

  • Analysis of key drivers (Increasing need for advanced architecture in electronic products; Rising trend of increased integration density and miniaturization of electronic devices; Growing demand for consumer electronics and gaming devices), restraints (Thermal issues resulting from higher level of integration; High unit cost of 3D IC packages), opportunities (Growing adoption of high-end computing, servers, and data centers; Miniaturization of IoT Devices; Rising number of smart infrastructure and smart city projects), and challenges (Effective supply chain management; Reliability challenges with 3D IC packaging)
  • Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product launches in the 3D IC and 2.5D IC packaging market
  • Market Development: Comprehensive information about lucrative markets - the report analyses the 3D IC and 2.5D IC packaging market across varied regions
  • Market Diversification: Exhaustive information about new products, untapped geographies, recent developments, and investments in the 3D IC and 2.5D IC packaging market

Competitive Assessment: In-depth assessment of market shares, growth strategies and product offerings of leading players like Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan) and Amkor Technology (US).

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 STUDY OBJECTIVES
  • 1.2 MARKET DEFINITION
    • 1.2.1 INCLUSIONS AND EXCLUSIONS
  • 1.3 STUDY SCOPE
    • FIGURE 1 3D IC AND 2.5D IC PACKAGING MARKET: SEGMENTATION
    • 1.3.1 REGIONAL SCOPE
    • 1.3.2 YEARS CONSIDERED
  • 1.4 CURRENCY CONSIDERED
  • 1.5 LIMITATIONS
  • 1.6 STAKEHOLDERS
  • 1.7 SUMMARY OF CHANGES
    • 1.7.1 RECESSION IMPACT

2 RESEARCH METHODOLOGY

  • 2.1 RESEARCH DATA
    • FIGURE 2 3D IC AND 2.5D IC PACKAGING MARKET: RESEARCH DESIGN
    • 2.1.1 SECONDARY AND PRIMARY RESEARCH
    • 2.1.2 SECONDARY DATA
      • 2.1.2.1 Major secondary sources
      • 2.1.2.2 Secondary sources
    • 2.1.3 PRIMARY DATA
      • 2.1.3.1 Breakdown of primaries
      • 2.1.3.2 Key data from primary sources
      • 2.1.3.3 Key industry insights
  • 2.2 MARKET SIZE ESTIMATION
    • FIGURE 3 PROCESS FLOW OF MARKET SIZE ESTIMATION
    • 2.2.1 BOTTOM-UP APPROACH
      • 2.2.1.1 Estimating market size by bottom-up approach (demand side)
    • FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
    • 2.2.2 TOP-DOWN APPROACH
      • 2.2.2.1 Estimating market size by top-down approach (supply side)
    • FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
    • FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH (SUPPLY SIDE)-REVENUE GENERATED FROM 3D IC AND 2.5D IC PACKAGING SOLUTIONS AND SERVICES
  • 2.3 DATA TRIANGULATION
    • FIGURE 7 DATA TRIANGULATION
  • 2.4 RESEARCH ASSUMPTIONS
    • TABLE 1 ASSUMPTIONS FOR RESEARCH STUDY
    • 2.4.1 RESEARCH LIMITATIONS
  • 2.5 RISK ASSESSMENT
  • 2.6 PARAMETERS CONSIDERED TO ANALYZE IMPACT OF RECESSION ON 3D IC AND 2.5D IC PACKAGING MARKET

3 EXECUTIVE SUMMARY

  • 3.1 3D IC AND 2.5D IC PACKAGING MARKET: RECESSION IMPACT
    • FIGURE 8 RECESSION IMPACT: GDP GROWTH PROJECTION UNTIL 2023 FOR MAJOR ECONOMIES
    • FIGURE 9 RECESSION IMPACT ON 3D IC AND 2.5D IC PACKAGING MARKET, 2019-2028 (USD MILLION)
    • FIGURE 10 CONSUMER ELECTRONICS TO HOLD LARGEST MARKET SHARE AMONG END USERS IN 3D IC AND 2.5D IC PACKAGING MARKET
    • FIGURE 11 MEMORY TO HOLD LARGEST MARKET SHARE AMONG APPLICATIONS IN 3D IC AND 2.5D IC PACKAGING MARKET
    • FIGURE 12 2.5D PACKAGING TECHNOLOGY TO CONTINUE TO HOLD LARGEST MARKET SHARE IN 3D IC AND 2.5D IC PACKAGING MARKET DURING FORECAST PERIOD
    • FIGURE 13 3D IC AND 2.5D IC PACKAGING MARKET IN ASIA PACIFIC TO EXHIBIT FASTEST GROWTH DURING FORECAST PERIOD

4 PREMIUM INSIGHTS

  • 4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET
    • FIGURE 14 INCREASED ADOPTION OF CONSUMER ELECTRONICS AND GAMING DEVICES TO BOOST MARKET GROWTH
  • 4.2 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER
    • FIGURE 15 MILITARY & AEROSPACE TO REGISTER HIGHEST CAGR FROM 2023 TO 2028
  • 4.3 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY
    • FIGURE 16 2.5D TO HOLD LARGEST SHARE OF 3D IC AND 2.5D IC PACKAGING MARKET IN 2028
  • 4.4 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION
    • FIGURE 17 MEMORY TO HOLD LARGEST SHARE OF 3D IC AND 2.5D IC PACKAGING MARKET IN 2028
  • 4.5 3D IC AND 2.5D IC PACKAGING MARKET IN ASIA PACIFIC, BY END USER AND COUNTRY
    • FIGURE 18 CONSUMER ELECTRONICS VERTICAL AND CHINA WERE LARGEST SHAREHOLDERS IN ASIA PACIFIC 3D IC AND 2.5D IC PACKAGING MARKET IN 2022
  • 4.6 GEOGRAPHIC SNAPSHOT OF 3D IC AND 2.5D IC PACKAGING MARKET
    • FIGURE 19 3D IC AND 2.5D IC PACKAGING MARKET IN MEXICO EXPECTED TO GROW AT FASTEST RATE DURING FORECAST PERIOD

5 MARKET OVERVIEW

  • 5.1 INTRODUCTION
  • 5.2 MARKET DYNAMICS
    • FIGURE 20 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES: 3D IC AND 2.5D IC PACKAGING MARKET
    • 5.2.1 DRIVERS
    • FIGURE 21 ANALYSIS OF IMPACT OF DRIVERS ON 3D IC AND 2.5D IC PACKAGING MARKET
      • 5.2.1.1 Increasing need for advanced architecture in electronic products
      • 5.2.1.2 Rising trend of increased integration density and miniaturization of electronic devices
      • 5.2.1.3 Growing demand for consumer electronics and gaming devices
    • FIGURE 22 NUMBER OF SMARTPHONE AND MOBILE PHONE USERS GLOBALLY, 2020-2025 (BILLION)
    • 5.2.2 RESTRAINTS
    • FIGURE 23 ANALYSIS OF IMPACT OF RESTRAINTS ON 3D IC AND 2.5D IC PACKAGING MARKET
      • 5.2.2.1 Thermal issues resulting from higher level of integration
      • 5.2.2.2 High unit cost of 3D IC packages
    • 5.2.3 OPPORTUNITIES
    • FIGURE 24 ANALYSIS OF IMPACT OF OPPORTUNITIES ON 3D IC AND 2.5D IC PACKAGING MARKET
      • 5.2.3.1 Growing adoption of high-end computing, servers, and data centers
      • 5.2.3.2 Miniaturization of IoT devices
      • 5.2.3.3 Rising number of smart infrastructure and smart city projects
    • 5.2.4 CHALLENGES
    • FIGURE 25 ANALYSIS OF IMPACT OF CHALLENGES ON 3D IC AND 2.5D IC PACKAGING MARKET
      • 5.2.4.1 Effective supply chain management
      • 5.2.4.2 Reliability challenges in 3D IC packaging
  • 5.3 SUPPLY CHAIN ANALYSIS
    • FIGURE 26 SUPPLY CHAIN ANALYSIS: 3D IC AND 2.5D IC PACKAGING MARKET
  • 5.4 3D IC AND 2.5D IC PACKAGING ECOSYSTEM
    • FIGURE 27 3D IC AND 2.5D IC PACKAGING ECOSYSTEM
  • 5.5 REVENUE SHIFT AND NEW REVENUE POCKETS FOR 3D IC AND 2.5D IC PACKAGING MARKET
    • FIGURE 28 REVENUE SHIFT IN 3D IC AND 2.5D IC PACKAGING MARKET
  • 5.6 AVERAGE SELLING PRICE ANALYSIS
    • TABLE 2 AVERAGE SELLING PRICE OF 12-INCH EQUIVALENT WAFERS, 2022 (THOUSAND UNITS)
    • 5.6.1 AVERAGE SELLING PRICE OF 3D IC AND 2.5D IC PACKAGING PRODUCTS/SOLUTIONS, BY KEY PLAYERS
    • FIGURE 29 AVERAGE SELLING PRICE OF 3D IC AND 2.5D IC PACKAGING PRODUCTS/SOLUTIONS, BY KEY PLAYERS
    • 5.6.2 AVERAGE SELLING PRICE TREND
    • TABLE 3 AVERAGE SELLING PRICE: 3D IC AND 2.5D IC PACKAGING MARKET, 12-INCH EQUIVALENT WAFERS, (USD/THOUSAND UNITS)
    • FIGURE 30 AVERAGE SELLING PRICE: 3D IC AND 2.5D IC PACKAGING MARKET, BY WAFER (USD/THOUSAND UNITS)
  • 5.7 TECHNOLOGY TRENDS
    • 5.7.1 FAN-OUT WAFER-LEVEL PACKAGING
    • 5.7.2 FAN-OUT PANEL-LEVEL PACKAGING
  • 5.8 PORTER'S FIVE FORCES ANALYSIS
    • TABLE 4 3D IC AND 2.5D IC PACKAGING MARKET: PORTER'S FIVE FORCES ANALYSIS
    • FIGURE 31 PORTER'S FIVE FORCES ANALYSIS
    • 5.8.1 THREAT OF NEW ENTRANTS
    • 5.8.2 THREAT OF SUBSTITUTES
    • 5.8.3 BARGAINING POWER OF SUPPLIERS
    • 5.8.4 BARGAINING POWER OF BUYERS
    • 5.8.5 INTENSITY OF COMPETITIVE RIVALRY
  • 5.9 KEY STAKEHOLDERS AND BUYING PROCESS AND/ OR BUYING CRITERIA
    • 5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS
    • FIGURE 32 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END USERS
    • TABLE 5 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 VERTICALS (%)
    • 5.9.2 BUYING CRITERIA
    • FIGURE 33 KEY BUYING CRITERIA FOR TOP THREE VERTICALS
    • TABLE 6 KEY BUYING CRITERIA FOR TOP THREE VERTICALS
  • 5.10 CASE STUDY ANALYSIS
    • 5.10.1 CLOSED-LOOP MONITORING AND CONTROL BASED ON THERMAL BEHAVIOR REDUCED WAFER REJECTION
    • 5.10.2 SPTS'S DRIE TECHNOLOGY STRENGTHENED IMEC'S SILICON ETCH PLATFORM
  • 5.11 TRADE ANALYSIS
    • 5.11.1 IMPORT SCENARIO
    • TABLE 7 IMPORT DATA, BY COUNTRY, 2018-2022 (USD MILLION)
    • 5.11.2 EXPORT SCENARIO
    • TABLE 8 EXPORT DATA, BY COUNTRY, 2018-2022 (USD MILLION)
  • 5.12 PATENT ANALYSIS
    • TABLE 9 NOTABLE PATENTS RELATED TO 3D IC AND 2.5D IC PACKAGING MARKET, 2020-2023
    • FIGURE 34 NUMBER OF PATENTS GRANTED PER YEAR, 2013-2022
    • TABLE 10 NUMBER OF PATENTS REGISTERED RELATED TO 3D IC AND 2.5D IC PACKAGING MARKET IN LAST 10 YEARS
    • FIGURE 35 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS
  • 5.13 KEY CONFERENCES AND EVENTS, 2023-2024
    • TABLE 11 3D IC AND 2.5D IC PACKAGING MARKET: KEY CONFERENCES AND EVENTS
  • 5.14 STANDARDS AND REGULATORY LANDSCAPE
    • 5.14.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 12 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 13 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • TABLE 14 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
    • 5.14.2 KEY REGULATIONS AND STANDARDS
      • 5.14.2.1 North America
      • 5.14.2.2 Europe
      • 5.14.2.3 Asia Pacific
      • 5.14.2.4 Regulations
      • 5.14.2.5 Standards

6 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY

  • 6.1 INTRODUCTION
    • FIGURE 36 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY
    • TABLE 15 COMPARISON BETWEEN 2.5D AND 3D IC TECHNOLOGIES
    • FIGURE 37 MARKET FOR 3D WLCSP TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
    • TABLE 16 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019-2022 (USD MILLION)
    • TABLE 17 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023-2028 (USD MILLION)
  • 6.2 3D WAFER-LEVEL CHIP-SCALE PACKAGING (WLCSP)
    • 6.2.1 USE OF 3D WLCSP IN CONSUMER ELECTRONICS TO DRIVE MARKET
    • TABLE 18 3D WLCSP: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 19 3D WLCSP: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
  • 6.3 3D THROUGH-SILICON VIA (TSV)
    • 6.3.1 HIGHEST INTERCONNECT DENSITY OFFERED BY 3D TSV TO FUEL DEMAND
    • TABLE 20 3D TSV: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 21 3D TSV: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
  • 6.4 2.5D
    • 6.4.1 REDUCED COST BENEFIT OFFERED BY 2.5D IC PACKAGING TO DRIVE MARKET
    • TABLE 22 2.5D: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 23 2.5D WLCSP: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)

7 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION

  • 7.1 INTRODUCTION
    • FIGURE 38 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION
    • FIGURE 39 MEMS/SENSORS TO RECORD HIGHEST CAGR DURING FORECAST PERIOD
    • TABLE 24 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019-2022 (USD MILLION)
    • TABLE 25 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023-2028 (USD MILLION)
  • 7.2 LOGIC
    • 7.2.1 GROWING PENETRATION OF IOT TO DRIVE MARKET
    • TABLE 26 LOGIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 27 LOGIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
  • 7.3 IMAGING & OPTOELECTRONICS
    • 7.3.1 RISING DEMAND FOR SECURITY AND REAL-TIME MONITORING IN AUTOMOBILES TO DRIVE MARKET
    • FIGURE 40 MILITARY & AEROSPACE MARKET TO GROW AT HIGHEST CAGR FROM 2023 TO 2028
    • TABLE 28 IMAGING & OPTOELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 29 IMAGING & OPTOELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
  • 7.4 MEMORY
    • 7.4.1 INCREASED USE OF ARTIFICIAL INTELLIGENCE AND MACHINE LEARNING TO DRIVE MARKET
    • TABLE 30 MEMORY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 31 MEMORY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
  • 7.5 MEMS/SENSORS
    • 7.5.1 ADOPTION OF MEMS/SENSORS BY AUTOMOTIVE INDUSTRY TO DRIVE MARKET
    • TABLE 32 MEMS/SENSORS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 33 MEMS/SENSORS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
  • 7.6 LEDS
    • 7.6.1 USE OF LEDS IN FIBER OPTICS TO DRIVE MARKET
    • TABLE 34 LEDS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 35 LEDS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
  • 7.7 OTHERS
    • TABLE 36 OTHERS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 37 OTHERS: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)

8 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER

  • 8.1 INTRODUCTION
    • FIGURE 41 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER
    • FIGURE 42 MILITARY & AEROSPACE MARKET TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
    • TABLE 38 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 39 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
  • 8.2 CONSUMER ELECTRONICS
    • 8.2.1 INCREASING MEMORY REQUIREMENTS IN CONSUMER ELECTRONICS TO FUEL MARKET
    • TABLE 40 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019-2022 (USD MILLION)
    • TABLE 41 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023-2028 (USD MILLION)
    • TABLE 42 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019-2022 (USD MILLION)
    • TABLE 43 CONSUMER ELECTRONICS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023-2028 (USD MILLION)
  • 8.3 INDUSTRIAL
    • 8.3.1 RISING ADOPTION OF INDUSTRY 4.0 TO DRIVE MARKET
    • TABLE 44 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019-2022 (USD MILLION)
    • TABLE 45 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023-2028 (USD MILLION)
    • TABLE 46 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019-2022 (USD MILLION)
    • TABLE 47 INDUSTRIAL: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023-2028 (USD MILLION)
  • 8.4 TELECOMMUNICATIONS
    • 8.4.1 GROWING USE CASES OF 5G TECHNOLOGY TO FUEL MARKET
    • TABLE 48 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019-2022 (USD MILLION)
    • TABLE 49 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023-2028 (USD MILLION)
    • TABLE 50 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019-2022 (USD MILLION)
    • TABLE 51 TELECOMMUNICATIONS: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023-2028 (USD MILLION)
  • 8.5 AUTOMOTIVE
    • 8.5.1 USE OF IC PACKAGING IN ADAS AND AUTONOMOUS DRIVING TO FUEL MARKET
    • TABLE 52 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019-2022 (USD MILLION)
    • TABLE 53 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023-2028 (USD MILLION)
    • TABLE 54 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019-2022 (USD MILLION)
    • TABLE 55 AUTOMOTIVE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023-2028 (USD MILLION)
  • 8.6 MILITARY & AEROSPACE
    • 8.6.1 NEED FOR RELIABLE AND SECURE COMMUNICATION TO FUEL MARKET
    • TABLE 56 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019-2022 (USD MILLION)
    • TABLE 57 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023-2028 (USD MILLION)
    • TABLE 58 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019-2022 (USD MILLION)
    • TABLE 59 MILITARY & AEROSPACE: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023-2028 (USD MILLION)
  • 8.7 MEDICAL DEVICES
    • 8.7.1 CAPABILITY TO INCORPORATE MANY SENSORS INTO SINGLE PACKAGE TO FUEL MARKET DEMAND FOR IC PACKAGING
    • TABLE 60 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2019-2022 (USD MILLION)
    • TABLE 61 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY APPLICATION, 2023-2028 (USD MILLION)
    • TABLE 62 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2019-2022 (USD MILLION)
    • TABLE 63 MEDICAL DEVICES: 3D IC AND 2.5D IC PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 2023-2028 (USD MILLION)

9 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION

  • 9.1 INTRODUCTION
    • FIGURE 43 ASIA PACIFIC TO WITNESS HIGHEST CAGR IN 3D IC AND 2.5D IC PACKAGING MARKET DURING FORECAST PERIOD
    • TABLE 64 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2019-2022 (USD MILLION)
    • TABLE 65 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2023-2028 (USD MILLION)
  • 9.2 NORTH AMERICA
    • FIGURE 44 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT
    • TABLE 66 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2019-2022 (USD MILLION)
    • TABLE 67 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2023-2028 (USD MILLION)
    • TABLE 68 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 69 NORTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
    • FIGURE 45 CONSUMER ELECTRONICS TO HOLD LARGEST MARKET SHARE IN NORTH AMERICAN 3D IC AND 2.5D IC PACKAGING MARKET DURING FORECAST PERIOD
    • 9.2.1 US
      • 9.2.1.1 US to lead 3D IC and 2.5D IC packaging market in North America
    • TABLE 70 US: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 71 US: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
    • 9.2.2 CANADA
      • 9.2.2.1 Establishment of Canada's Semiconductor Council to drive regional market
    • TABLE 72 CANADA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 73 CANADA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
    • 9.2.3 MEXICO
      • 9.2.3.1 Automotive industry in Mexico to fuel market
    • TABLE 74 MEXICO: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 75 MEXICO: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
  • 9.3 EUROPE
    • FIGURE 46 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT
    • TABLE 76 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2019-2022 (USD MILLION)
    • TABLE 77 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2023-2028 (USD MILLION)
    • TABLE 78 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 79 EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
    • 9.3.1 UK
      • 9.3.1.1 Increased use of 5G networks to fuel market
    • TABLE 80 UK: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 81 UK: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
    • 9.3.2 GERMANY
      • 9.3.2.1 Automotive industry to drive market
    • TABLE 82 GERMANY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 83 GERMANY: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
    • 9.3.3 FRANCE
      • 9.3.3.1 Highly developed transportation and communication networks to drive market
    • TABLE 84 FRANCE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 85 FRANCE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
    • 9.3.4 REST OF EUROPE
    • TABLE 86 REST OF EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 87 REST OF EUROPE: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
  • 9.4 ASIA PACIFIC
    • FIGURE 47 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET SNAPSHOT
    • TABLE 88 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2019-2022 (USD MILLION)
    • TABLE 89 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY COUNTRY, 2023-2028 (USD MILLION)
    • TABLE 90 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 91 ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
    • FIGURE 48 MILITARY & AEROSPACE SEGMENT IN ASIA PACIFIC MARKET TO RECORD HIGHEST CAGR DURING FORECAST PERIOD
    • 9.4.1 CHINA
      • 9.4.1.1 Increased semiconductor manufacturing to drive market
    • TABLE 92 CHINA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 93 CHINA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
    • 9.4.2 JAPAN
        • 9.4.2.1.1 Increased production of consumer electronics and automobiles to drive market
    • TABLE 94 JAPAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 95 JAPAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
    • 9.4.3 TAIWAN
      • 9.4.3.1 Presence of many key OSAT companies to fuel market
    • TABLE 96 TAIWAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 97 TAIWAN: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
    • 9.4.4 SOUTH KOREA
      • 9.4.4.1 High manufacturing capacity to drive market
    • TABLE 98 SOUTH KOREA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 99 SOUTH KOREA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
    • 9.4.5 REST OF ASIA PACIFIC
    • TABLE 100 REST OF ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 101 REST OF ASIA PACIFIC: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
  • 9.5 ROW
    • TABLE 102 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2019-2022 (USD MILLION)
    • TABLE 103 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY REGION, 2023-2028 (USD MILLION)
    • TABLE 104 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 105 ROW: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
    • 9.5.1 MIDDLE EAST & AFRICA
    • TABLE 106 MIDDLE EAST & AFRICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 107 MIDDLE EAST & AFRICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)
    • 9.5.2 SOUTH AMERICA
    • TABLE 108 SOUTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2019-2022 (USD MILLION)
    • TABLE 109 SOUTH AMERICA: 3D IC AND 2.5D IC PACKAGING MARKET, BY END USER, 2023-2028 (USD MILLION)

10 COMPETITIVE LANDSCAPE

  • 10.1 INTRODUCTION
  • 10.2 KEY PLAYER STRATEGIES/RIGHT TO WIN
    • TABLE 110 OVERVIEW OF STRATEGIES DEPLOYED BY KEY PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET
    • 10.2.1 PRODUCT PORTFOLIO
    • 10.2.2 REGIONAL FOCUS
    • 10.2.3 ORGANIC/INORGANIC GROWTH STRATEGIES
  • 10.3 MARKET SHARE ANALYSIS, 2022
    • TABLE 111 3D IC AND 2.5D IC PACKAGING MARKET SHARE ANALYSIS (2022)
  • 10.4 REVENUE ANALYSIS OF TOP PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET
    • FIGURE 49 FIVE-YEAR REVENUE ANALYSIS OF TOP PLAYERS IN 3D IC AND 2.5D IC PACKAGING MARKET
  • 10.5 KEY COMPANY EVALUATION QUADRANT, 2022
    • 10.5.1 STARS
    • 10.5.2 PERVASIVE PLAYERS
    • 10.5.3 EMERGING LEADERS
    • 10.5.4 PARTICIPANTS
    • FIGURE 50 3D IC AND 2.5D IC PACKAGING MARKET (GLOBAL): KEY COMPANY EVALUATION QUADRANT, 2022
  • 10.6 COMPETITIVE BENCHMARKING
    • 10.6.1 COMPANY FOOTPRINT, BY PACKAGING TECHNOLOGY
    • 10.6.2 COMPANY FOOTPRINT, BY REGION
    • 10.6.3 OVERALL COMPANY FOOTPRINT
  • 10.7 STARTUP/SMALL AND MEDIUM-SIZED ENTERPRISES (SMES) EVALUATION QUADRANT, 2022
    • TABLE 112 3D IC AND 2.5D IC PACKAGING MARKET: LIST OF KEY STARTUPS/SMES
    • 10.7.1 COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES
      • 10.7.1.1 Company footprint, by packaging technology
      • 10.7.1.2 Company footprint, by region
    • 10.7.2 PROGRESSIVE COMPANIES
    • 10.7.3 RESPONSIVE COMPANIES
    • 10.7.4 DYNAMIC COMPANIES
    • 10.7.5 STARTING BLOCKS
    • FIGURE 51 3D IC AND 2.5D IC PACKAGING MARKET (GLOBAL): STARTUPS/SMES EVALUATION QUADRANT, 2022
  • 10.8 COMPETITIVE SITUATION AND TRENDS
    • 10.8.1 PRODUCT LAUNCHES AND DEVELOPMENTS
    • TABLE 113 3D IC AND 2.5D IC PACKAGING MARKET: PRODUCT LAUNCHES/DEVELOPMENTS, 2019-2023
    • 10.8.2 DEALS
    • TABLE 114 3D IC AND 2.5D IC PACKAGING MARKET: DEALS, 2019-2023

11 COMPANY PROFILES

  • 11.1 INTRODUCTION
  • 11.2 KEY PLAYERS
  • (Business overview, Products/Services/Solutions offered, Recent Developments, MNM view)**
    • 11.2.1 SAMSUNG
    • TABLE 115 SAMSUNG: BUSINESS OVERVIEW
    • FIGURE 52 SAMSUNG: COMPANY SNAPSHOT
    • 11.2.2 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    • TABLE 116 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: BUSINESS OVERVIEW
    • FIGURE 53 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.: COMPANY SNAPSHOT
    • 11.2.3 INTEL CORPORATION
    • TABLE 117 INTEL CORPORATION: BUSINESS OVERVIEW
    • FIGURE 54 INTEL CORPORATION: COMPANY SNAPSHOT
    • 11.2.4 ASE TECHNOLOGY HOLDING CO., LTD.
    • TABLE 118 ASE TECHNOLOGY HOLDING CO., LTD: BUSINESS OVERVIEW
    • FIGURE 55 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY SNAPSHOT
    • 11.2.5 AMKOR TECHNOLOGY
    • TABLE 119 AMKOR TECHNOLOGY: BUSINESS OVERVIEW
    • FIGURE 56 AMKOR TECHNOLOGY: COMPANY SNAPSHOT
    • 11.2.6 BROADCOM
    • TABLE 120 BROADCOM: BUSINESS OVERVIEW
    • FIGURE 57 BROADCOM: COMPANY SNAPSHOT
    • 11.2.7 TEXAS INSTRUMENTS INC.
    • TABLE 121 TEXAS INSTRUMENTS INC.: BUSINESS OVERVIEW
    • FIGURE 58 TEXAS INSTRUMENTS INC.: COMPANY SNAPSHOT
    • 11.2.8 UNITED MICROELECTRONICS CORPORATION
    • TABLE 122 UNITED MICROELECTRONICS CORPORATION: BUSINESS OVERVIEW
    • FIGURE 59 UNITED MICROELECTRONICS CORPORATION: COMPANY SNAPSHOT
    • 11.2.9 JCET GROUP CO., LTD.
    • TABLE 123 JCET GROUP CO., LTD.: BUSINESS OVERVIEW
    • FIGURE 60 JCET GROUP CO., LTD.: COMPANY SNAPSHOT
    • 11.2.10 POWERTECH TECHNOLOGY INC.
    • TABLE 124 POWERTECH TECHNOLOGY INC.: BUSINESS OVERVIEW
    • FIGURE 61 POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT
  • *Details on Business overview, Products/Services/Solutions offered, Recent Developments, MNM view might not be captured in case of unlisted companies.
  • 11.3 OTHER PLAYERS
    • 11.3.1 CADENCE DESIGN SYSTEMS, INC.
    • 11.3.2 SILICONWARE PRECISION INDUSTRIES CO., LTD.
    • 11.3.3 ADVANCED MICRO DEVICES, INC.
    • 11.3.4 TEZZARON
    • 11.3.5 TELEDYNE TECHNOLOGIES INCORPORATED
    • 11.3.6 FUJITSU
    • 11.3.7 XPERI INC.
    • 11.3.8 MONOLITHIC 3D INC.
    • 11.3.9 DECA TECHNOLOGIES
    • 11.3.10 3M
    • 11.3.11 GLOBALFOUNDRIES INC.
    • 11.3.12 NHANCED SEMICONDUCTORS
    • 11.3.13 MOLDEX3D
    • 11.3.14 CEREBRAS
    • 11.3.15 AYAR LABS, INC.

12 APPENDIX

  • 12.1 DISCUSSION GUIDE
  • 12.2 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 12.3 CUSTOMIZATION OPTIONS
  • 12.4 RELATED REPORTS
  • 12.5 AUTHOR DETAILS