世界のPCB市場におけるIC基板：動向、機会、競合分析【2023-2028年】

PCB市場におけるIC基板の市場動向と予測

IC基板利用の観点から見た世界のPCB市場は、2023年から2028年までのCAGRが14.2%で、2028年までに推定153億米ドルに達すると予測されています。この市場の主な促進要因は、ウエハーレベルパッケージングやフリップチップパッケージングなどの先進パッケージング技術の受け入れ拡大、スマートウォッチやフィットネスバンドなどのスマートウェアラブルの人気の高まり、小型化の傾向の高まりです。タブレットPC、スマートフォン、ノートPC、ウェアラブルデバイスのアプリケーションにおける機会により、世界のPCB市場におけるIC基板の将来性は有望視されています。

PCB市場におけるIC基板の参入企業一覧

同市場の企業は、提供する製品の品質で競争しています。この市場の主要企業は、製造施設の拡大、研究開発投資、インフラ開拓、バリューチェーン全体にわたる統合機会の活用に注力しています。これらの戦略により、PCB市場のIC基板企業は需要の増加に対応し、競争力を確保し、革新的な製品と技術を開発し、生産コストを削減し、顧客基盤を拡大しています。

PCB市場におけるIC基板の市場洞察

Lucintelの予測によると、FC BGAは配線密度が高く、電気的性能を最大化するためのカスタマイズが可能なため、予測期間中、より大きなタイプセグメントであり続けると予想されます。

同市場では、高性能モバイル機器への需要の高まりと先端技術の浸透により、予測期間中スマートフォンが最大セグメントであり続けると予想されます。

APACは、エレクトロニクス産業の著しい成長、先進パッケージング技術の動向の増加、同地域における老舗半導体・エレクトロニクスメーカーの存在により、引き続き最大の地域となります。

本レポートでは、以下の11の主要な質問に回答している：

• Q.1.市場セグメントのうち、最も有望かつ高成長な機会は何か？
• Q.2.今後成長が加速するセグメントとその理由は？
• Q.3.今後成長が加速すると思われる地域とその理由は？
• Q.4.市場力学に影響を与える主な要因は何か？市場における主な課題とビジネスリスクは？
• Q.5.この市場におけるビジネスリスクと競合の脅威は？
• Q.6.この市場における新たな動向とその理由は？
• Q.7.市場における顧客の需要の変化にはどのようなものがありますか？
• Q.8.新興国市場の開発にはどのようなものがありますか？これらの開発をリードしている企業はどこですか？
• Q.9.市場の主要企業は？主要企業は事業成長のためにどのような戦略的取り組みを進めていますか？
• Q.10.この市場における競合製品にはどのようなものがあり、材料や製品の代替別市場シェア低下の脅威はどの程度ありますか？
• Q.11.過去5年間にどのようなM&Aが行われ、業界にどのような影響を与えましたか？

目次

第1章 エグゼクティブサマリー

第2章 世界のPCB市場におけるIC基板：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 業界の推進力と課題

第3章 2017年から2028年までの市場動向と予測分析

• マクロ経済動向（2017～2022年）と予測（2023～2028年）
• 世界のPCB市場におけるIC基板の動向（2017～2022年）と予測（2023～2028年）
• 世界のPCB市場におけるIC基板の種類別
  • FC BGA
  • FC CSP
• アプリケーション別の世界のPCB市場におけるIC基板
  • タブレットPC
  • スマートフォン
  • ラップトップ
  • ウェアラブルデバイス
  • その他

第4章 2017年から2028年までの地域別の市場動向と予測分析

• 地域別の世界のPCB市場におけるIC基板
• 北米PCB市場におけるIC基板
• 欧州PCB市場におけるIC基板
• APAC PCB市場におけるIC基板
• ROW PCB市場におけるIC基板

第5章 競合の分析

• 製品ポートフォリオ分析
• 運用上の統合
• ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

• 成長機会分析
  • 世界のPCB市場におけるIC基板のタイプ別成長機会
  • 世界のPCB市場におけるIC基板の用途別成長機会
  • 地域別の世界のPCB市場におけるIC基板の成長機会
• 世界のPCB市場におけるIC基板の新たな動向
• 戦略的分析
  • 新製品の開発
  • 世界のPCB市場におけるIC基板の生産能力拡大
  • 世界のPCB市場におけるIC基板の合併、買収、合弁事業
  • 認証とライセンシング

第7章 主要企業プロファイル

• ASE Group
• TTM Technologies
• Simmtech
• Fujitsu Limited
• Ibiden
• JCET Group
• Kinsus Interconnect Technology
• Korea Circuit
• KYOCERA Corporation
• LG Innotek

IC Substrate in PCB Market Trends and Forecast

The future of the global IC substrate in the global PCB market looks promising with opportunities in the tablet PC, smartphone, laptop, and wearable device applications. The global PCB market in terms of IC substrate usage is expected to reach an estimated $15.3 billion by 2028 with a CAGR of 14.2% from 2023 to 2028. The major drivers for this market are increasing acceptance of advanced packaging technologies, such as wafer-level packaging and flip-chip packaging, increasing popularity of smart wearable, like smart watches and fitness bands, and growing trend of miniaturization.

IC Substrate in PCB Market

A more than 150-page report is developed to help in your business decisions.

IC Substrate in PCB Market by Segments

The study includes trends and forecast for IC substrate in the global PCB market by type, application, and region, as follows:

IC Substrate in PCB Market by Type [Value ($B) Shipment Analysis from 2017 to 2028]:

• FC BGA
• FC CSP

IC Substrate in PCB Market by Application [Value ($B) Shipment Analysis from 2017 to 2028]:

• Tablet PC
• Smart Phones
• Laptops
• Wearable Devices
• Others

IC Substrate in PCB Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of IC Substrate in PCB Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies, IC substrate companies in the PCB market cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of IC substrate companies in the PCB market profiled in this report include.

• ASE Group
• TTM Technologies
• Simmtech
• Fujitsu Limited
• Ibiden
• JCET Group
• Kinsus Interconnect Technology
• Korea Circuit
• KYOCERA Corporation
• LG Innotek

IC Substrate in PCB Market Insights

Lucintel forecasts that FC BGA is expected to remain the larger type segment over the forecast period due to its capability of routing density and ability to be customized for maximum electrical performance.

Within this market, smartphones are expected to remain the largest segment over the forecast period due to rising demand for high-performance mobile devices and increasing penetration of advanced technologies.

APAC will remain the largest region due to significantly growing electronics industry, increasing trend of advanced packaging technologies, and presence of the well-established semiconductor and electronics players in the region.

Features of IC Substrate in PCB Market

• Market Size Estimates: IC substrate in the global PCB market size estimation in terms of value ($B)

• Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.

• Segmentation Analysis: IC substrate in the global PCB market size by various segments, such as by raw material usage, end use industry, and region

• Regional Analysis: IC substrate in the global PCB market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.

• Growth Opportunities: Analysis on growth opportunities in different raw material usages, end use industries, and regions for IC substrate in PCB market.

• Strategic Analysis: This includes M&A, new product development, and competitive landscape for IC substrate in PCB market.

• Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

• Q1. What is IC substrate in PCB market size?
• Answer: The global PCB market in terms of IC substrate usage is expected to reach an estimated $15.3 billion by 2028.
• Q2. What is the growth forecast for IC substrate in PCB market?
• Answer: The global PCB market in terms of IC substrate usage is expected to grow with a CAGR of 14.2% from 2023 to 2028.
• Q3. What are the major drivers influencing the growth of IC substrate in PCB market?
• Answer: The major drivers for this market are increasing acceptance of advanced packaging technologies, such as wafer-level packaging and flip-chip packaging, increasing popularity of smart wearable's like smart watches and fitness bands, and growing trend of miniaturization.
• Q4. What are the major segments for IC substrate in PCB market?
• Answer: The future of IC substrate in the global PCB market looks promising with opportunities in the tablet PC, smartphone, laptop, and wearable device markets.
• Q5. Who is the key IC substrate in PCB companies?
• Answer: Some of the key IC substrate in PCB companies are as follows:
• ASE Group
• TTM Technologies
• Simmtech
• Fujitsu Limited
• Ibiden
• JCET Group
• Kinsus Interconnect Technology
• Korea Circuit
• KYOCERA Corporation
• LG Innotek
• Q6. Which IC substrate in PCB segment will be the largest in future?
• Answer: Lucintel forecasts that FC BGA is expected to remain the larger type segment over the forecast period due to its capability of routing density and ability to be customized for maximum electrical performance.
• Q7. In IC substrate in PCB market, which region is expected to be the largest in next 5 years?
• Answer: APAC will remain the largest region due to significantly growing electronics industry, increasing trend of advanced packaging technologies, and presence of the well-established semiconductor and electronics players in the region.
• Q8. Do we receive customization in this report?
• Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for IC substrate in the global PCB market by type (FC BGA and FC CSP), application (tablet PC, smartphones, laptops, wearable devices, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last five years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. IC Substrate in the Global PCB Market: Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

• 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
• 3.2: IC Substrate in the Global PCB Market Trends (2017-2022) and Forecast (2023-2028)
• 3.3: IC Substrate in the Global PCB Market by Type
  • 3.3.1: FC BGA
  • 3.3.2: FC CSP
• 3.4: IC Substrate in the Global PCB Market by Application
  • 3.4.1: Tablet PC
  • 3.4.2: Smart Phones
  • 3.4.3: Laptops
  • 3.4.4: Wearable Devices
  • 3.4.5: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

• 4.1: IC Substrate in the Global PCB Market by Region
• 4.2: IC Substrate in the North American PCB Market
  • 4.2.1: IC Substrate in the North American PCB Market by Type: FC BGA and FC CSP
  • 4.2.2: IC Substrate in the North American PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others
• 4.3: IC Substrate in the European PCB Market
  • 4.3.1: IC Substrate in the European PCB Market by Type: FC BGA and FC CSP
  • 4.3.2: IC Substrate in the European PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others
• 4.4: IC Substrate in the APAC PCB Market
  • 4.4.1: IC Substrate in the APAC PCB Market by Type: FC BGA and FC CSP
  • 4.4.2: IC Substrate in the APAC PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others
• 4.5: IC Substrate in the ROW PCB Market
  • 4.5.1: IC Substrate in the ROW PCB Market by Type: FC BGA and FC CSP
  • 4.5.2: IC Substrate in the ROW PCB Market by Application: Tablet PC, Smartphones, Laptops, Wearable Devices, and Others

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for IC Substrate in the Global PCB Market by Type
  • 6.1.2: Growth Opportunities for IC Substrate in the Global PCB Market by Application
  • 6.1.3: Growth Opportunities for IC Substrate in the Global PCB Market by Region
• 6.2: Emerging Trends for IC Substrate in the Global PCB Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of IC Substrate in the Global PCB Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures of IC Substrate in the Global PCB Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: ASE Group
• 7.2: TTM Technologies
• 7.3: Simmtech
• 7.4: Fujitsu Limited
• 7.5: Ibiden
• 7.6: JCET Group
• 7.7: Kinsus Interconnect Technology
• 7.8: Korea Circuit
• 7.9: KYOCERA Corporation
• 7.10: LG Innotek