フリップチップ技術市場：動向、機会、競合分析【2023年～2028年】

フリップチップ技術市場の動向と予測

世界のフリップチップ技術市場は、2023年から2028年までのCAGRが5.8%で、2028年までに推定441億米ドルに達すると予想されています。この市場の主な促進要因は、電気自動車の需要拡大、小型化傾向の高まり、家電、自動車、通信業界におけるこれらの技術の浸透の高まりです。フリップチップ技術市場の将来は、エレクトロニクス、産業、自動車・輸送、ヘルスケア、IT・通信、航空宇宙・防衛の各産業におけるビジネスチャンスで有望視されています。

フリップチップ技術関連企業一覧

同市場の企業は、提供する製品の品質に基づいて競争しています。この市場の主要企業は、製造施設の拡張、R&D投資、インフラ整備、バリューチェーン全体における統合機会の活用に注力しています。これらの戦略により、フリップチップ技術企業は、需要の増加への対応、競争力の確保、革新的な製品・技術の開発、製造コストの削減、顧客基盤の拡大を図っています。

フリップチップ技術の市場洞察

• トランシーバー、組み込みプロセッサ、パワーマネージメント、ベースバンド、ASIC、SOCなどのアプリケーションで、インターコネクターとしての銅ピラーの利用が増加していることから、Lucintelは予測期間中、銅ピラーが最も高い成長率を示すと予測しています。
• エレクトロニクスは、チップの封止、チップの電気的接続、回路基板へのパッケージの相互接続、パッケージ設計のための装置におけるフリップチップの需要の増加により、予測期間中に最も高い成長を示すと予想されています。
• APACは、大手企業別継続的な研究開発と、インドと中国における製造拠点の存在により、予測期間中に最も高い成長を遂げると予想されています。

本レポートでは、以下の11の主要な質問に回答しています：

• Q.1.市場セグメントのうち、最も有望かつ高成長な機会は何か？
• Q.2.どの分野がより速いペースで成長すると思うか、またその理由は？
• Q.3.どの地域がより速いペースで成長すると思うか、またその理由は？
• Q.4.市場力学に影響を与える主要因は何か？この市場における主な課題とビジネスリスクは何か？
• Q.5.この市場におけるビジネスリスクと競合の脅威は何か？
• Q.6.この市場における新たな動向とその理由は何か？
• Q.7.この市場における顧客の要求の変化にはどのようなものがあるか？
• Q.8.市場における新たな開拓は何か？これらの開発をリードしているのはどの企業か？
• Q.9.この市場における主要なプレーヤーは誰か？主要プレーヤーは事業成長のためにどのような戦略的取り組みを進めているのか？
• Q.10.この市場における競合製品にはどのようなものがあり、材料や製品の代替別市場シェア喪失の脅威はどの程度あるのか？
• Q.11.過去5年間で、どのようなM&Aが行われ、業界にどのような影響を与えたか？

目次

第1章 エグゼクティブサマリー

第2章 フリップチップ技術の世界市場：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 業界を牽引する要因と課題

第3章 2017年から2028年までの市場動向と予測分析

• マクロ経済動向（2017年～2022年）および予測（2023年～2028年）
• フリップチップ技術の世界市場動向（2017年～2022年）および予測（2023年～2028年）
• フリップチップ技術の世界市場：パッケージング技術別
  • 3D IC
  • 5D IC
  • 2D IC
• フリップチップ技術の世界市場：バンピング技術別
  • 銅ピラー
  • はんだバンピング
  • 錫-鉛共晶はんだ
  • 鉛フリーはんだ
  • 金バンピング
  • その他
• フリップチップ技術の世界市場：最終用途産業別
  • エレクトロニクス
  • 産業
  • 自動車・輸送機器
  • ヘルスケア
  • IT・通信
  • 航空宇宙・防衛
  • その他

第4章 2017年から2028年までの地域別市場動向と予測分析

• フリップチップ技術の世界市場：地域別
• 北米のフリップチップ技術市場
• 欧州のフリップチップ技術市場
• アジア太平洋のフリップチップ技術市場
• その他地域のフリップチップ技術市場

第5章 競合分析

• 製品ポートフォリオ分析
• オペレーショナルインテグレーション
• ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

• 成長機会分析
  • フリップチップ技術の世界市場の成長機会：パッケージング技術別
  • フリップチップ技術の世界市場の成長機会：バンピング技術別
  • フリップチップ技術の世界市場の成長機会：最終用途産業別
  • フリップチップ技術の世界市場の成長機会：地域別
• 世界のフリップチップ技術市場の新たな動向
• 戦略的分析
  • 新製品開発
  • フリップチップ技術の世界市場における生産能力拡大
  • フリップチップ技術の世界市場におけるM&A、ジョイントベンチャー
  • 認証とライセンシング

第7章 主要企業プロファイル

• IBM
• Intel
• Fujitsu
• 3M
• Samsung Electronics

Flip Chip Technology Market Trends and Forecast

The future of the flip chip technology market looks promising with opportunities in the electronic, industrial, automotive & transport, healthcare, IT & telecommunication, and aerospace & defense industries. The global flip chip technology market is expected to reach an estimated $44.1 billion by 2028 with a CAGR of 5.8% from 2023 to 2028. The major drivers for this market are growing demand for electric vehicles, increasing trend of miniaturization, and rising penetration of these technology in consumer electronics, automotive, and telecommunication industries.

A more than 150-page report is developed to help in your business decisions.

Flip Chip Technology Market by Segment

The study includes a forecast for the global flip chip technology market by packaging technology, bumping technology, end use industry, and region, as follows.

Flip Chip Technology Market by Packaging Technology [Value ($B) Shipment Analysis from 2017 to 2028]:

• 3D IC
• 5D IC
• 2D IC

Flip Chip Technology Market by Bumping Technology [Value ($B) Shipment Analysis from 2017 to 2028]:

• Copper Pillar
• Solder Bumping
• Tin-Lead Eutectic Solder
• Lead-Free Solder
• Gold Bumping
• Others

Flip Chip Technology Market by End Use Industry [Value ($B) Shipment Analysis from 2017 to 2028]:

• Electronics
• Industrial
• Automotive & Transport
• Healthcare
• IT & Telecommunication
• Aerospace & Defense
• Others

Flip Chip Technology Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Flip Chip Technology Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies flip chip technology companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the flip chip technology companies profiled in this report include.

• IBM
• Intel
• Fujitsu
• 3M
• Samsung Electronics

Flip Chip Technology Market Insights

• Lucintel forecasts that copper pillar is expected to witness highest growth over the forecast period due to increasing usage of copper pillar as an interconnector in transceiver, embedded processor, power management, baseband, ASIC, and SOC application.
• Electronics is expected to witness highest growth over the forecast period due to the increasing demand for flip chips in devices for chip encapsulating, chips electrical link, package interconnection to circuit boards, and package design.
• APAC is expected to witness highest growth over the forecast period due to the continuous research and development by major players and existence of manufacturing hubs in India and China.

Features of the Flip Chip Technology Market

• Market Size Estimates: Flip chip technology market size estimation in terms of value ($B)
• Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
• Segmentation Analysis: Flip chip technology market size by various segments, such as by packaging technology, bumping technology, end use industry, and region
• Regional Analysis: Flip chip technology market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
• Growth Opportunities: Analysis on growth opportunities in different by packaging technology, bumping technology, end use industry, and regions for the flip chip technology market.
• Strategic Analysis: This includes M&A, new product development, and competitive landscape for the flip chip technology market.
• Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the flip chip technology market size?

Answer: The global flip chip technology market is expected to reach an estimated $44.1 billion by 2028.

Q2. What is the growth forecast for flip chip technology market?

Answer: The global flip chip technology market is expected to grow with a CAGR of 5.8% from 2023 to 2028.

Q3. What are the major drivers influencing the growth of the flip chip technology market?

Answer: The major drivers for this market are growing demand for electric vehicles, increasing trend of miniaturization, and rising penetration of these technology in consumer electronics, automotive, and telecommunication industries.

Q4. What are the major segments for flip chip technology market?

Answer: The future of the flip chip technology market looks promising with opportunities in the electronics, industrial, automotive & transport, healthcare, IT & telecommunication, and aerospace & defense industries.

Q5. Who are the key flip chip technology companies?

Answer: Some of the key flip chip technology companies are as follows.

• IBM
• Intel
• Fujitsu
• 3M
• Samsung Electronics

Q6. Which flip chip technology segment will be the largest in future?

Answer: Lucintel forecasts that copper pillar is expected to witness highest growth over the forecast period due to increasing usage of copper pillar as an interconnector in transceiver, embedded processor, power management, baseband, ASIC, and SOC application.

Q7. In flip chip technology market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to the continuous research and development by major players and existence of manufacturing hubs in India and China.

Q8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the flip chip technology market by packaging technology (3D IC, 5D IC, and 2D IC), bumping technology (copper pillar, solder bumping, tin-lead eutectic solder, lead-free solder, gold bumping, and others), end use industry (electronics, industrial, automotive & transport, healthcare, IT & telecommunication, aerospace & defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Flip Chip Technology Market: Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

• 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
• 3.2: Global Flip Chip Technology Market Trends (2017-2022) and Forecast (2023-2028)
• 3.3: Global Flip Chip Technology Market by Packaging Technology
  • 3.3.1: 3D IC
  • 3.3.2: 5D IC
  • 3.3.3: 2D IC
• 3.4: Global Flip Chip Technology Market by Bumping Technology
  • 3.4.1: Copper Pillar
  • 3.4.2: Solder Bumping
  • 3.4.3: Tin-Lead Eutectic Solder
  • 3.4.4: Lead-Free Solder
  • 3.4.5: Gold Bumping
  • 3.4.6: Others
• 3.5: Global Flip Chip Technology Market by End Use Industry
  • 3.5.1: Electronics
  • 3.5.2: Industrial
  • 3.5.3: Automotive & Transport
  • 3.5.4: Healthcare
  • 3.5.5: IT & Telecommunication
  • 3.5.6: Aerospace & Defense
  • 3.5.7: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

• 4.1: Global Flip Chip Technology Market by Region
• 4.2: North American Flip Chip Technology Market
  • 4.2.1: North American Flip Chip Technology Market by Packaging Technology: 3D IC, 5D IC, and 2D IC
  • 4.2.2: North American Flip Chip Technology Market by End Use Industry: Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others
• 4.3: European Flip Chip Technology Market
  • 4.3.1: European Flip Chip Technology Market by Packaging Technology: 3D IC, 5D IC, and 2D IC
  • 4.3.2: European Flip Chip Technology Market by End Use Industry: Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others
• 4.4: APAC Flip Chip Technology Market
  • 4.4.1: APAC Flip Chip Technology Market by Packaging Technology: 3D IC, 5D IC, and 2D IC
  • 4.4.2: APAC Flip Chip Technology Market by End Use Industry: Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others
• 4.5: ROW Flip Chip Technology Market
  • 4.5.1: ROW Flip Chip Technology Market by Packaging Technology: 3D IC, 5D IC, and 2D IC
  • 4.5.2: ROW Flip Chip Technology Market by End Use Industry: Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global Flip Chip Technology Market by Packaging Technology
  • 6.1.2: Growth Opportunities for the Global Flip Chip Technology Market by Bumping Technology
  • 6.1.3: Growth Opportunities for the Global Flip Chip Technology Market by End Use Industry
  • 6.1.4: Growth Opportunities for the Global Flip Chip Technology Market by Region
• 6.2: Emerging Trends in the Global Flip Chip Technology Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global Flip Chip Technology Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Flip Chip Technology Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: IBM
• 7.2: Intel
• 7.3: Fujitsu
• 7.4: 3M

7:5: Samsung Electronics