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市場調査レポート
商品コード
1353049
基板対基板コネクタの世界市場規模、シェア、産業動向分析レポート:タイプ別、ピッチ別、用途別、地域別展望と予測、2023年~2030年Global Board-to-Board Connectors Market Size, Share & Industry Trends Analysis Report By Type (Pin Headers (Stacked Header, and Shrouded Header), and Socket), By Pitch, By Application, By Regional Outlook and Forecast, 2023 - 2030 |
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基板対基板コネクタの世界市場規模、シェア、産業動向分析レポート:タイプ別、ピッチ別、用途別、地域別展望と予測、2023年~2030年 |
出版日: 2023年08月31日
発行: KBV Research
ページ情報: 英文 449 Pages
納期: 即納可能
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基板対基板コネクタ市場規模は、予測期間中にCAGR 6.2%の市場成長率で上昇し、2030年には175億米ドルに達すると予測されます。2022年の市場規模は18億4,290万台、成長率は2.7%(2019-2022年)。
KBVカーディナルマトリックスに掲載された分析によると、Amphenol CorporationとTE Connectivity Ltd.が同市場の先行企業です。2023年7月、京セラ株式会社は、挿入後の接触不良の原因となるFPC/FFCの堆積を防止する6893シリーズコネクタを発表しました。京セラ株式会社、オムロン株式会社、ヒロセ電機株式会社などの企業が、この市場における主要なイノベーターです。
出典KBV調査
市場成長要因
継続的な技術進歩
基板対基板コネクタの市場は、電子機器や通信を含むいくつかの産業における迅速な技術改善によって大きく牽引されています。高度なコネクタの使用は、電子機器の継続的な進化と多数の産業における発展により、絶えず増大する接続需要に対応するために必要です。スマートフォン、タブレット、ウェアラブル・テクノロジーは、新しい機能や特徴を継続的に開発している民生用電子機器の一例です。さまざまな産業で技術が急速に進歩しているため、接続に対する要求が高まっており、市場の拡大を後押ししています。
世界のデータセンターの増加
基板対基板コネクターは、データセンター・ストレージにおける高速データ転送とコンピューティングに信頼できる接続を提供します。限られた物理的スペースの中で、データセンターには多くのサーバーやガジェットが設置されています。基板対基板コネクターは、狭いスペースでの接続を可能にし、データセンターのレイアウトとエアフローを改善します。また、基板対基板コネクターは、複数の種類のPCBを異なる方法で接続することを可能にし、専門部品の統合やカスタムソリューションの作成を容易にします。データセンターにおけるBTB接続の利点と、世界のデータセンター数の拡大により、基板対基板コネクタの市場は大幅に拡大すると予想されます。
市場抑制要因
技術的な複雑さと課題
データ転送速度の上昇に伴い、信号の損失、ノイズ、干渉を最小限に抑えて送信することがますます重要になっています。これらの困難は、インピーダンス制御、反射、挿入損失、クロストーク、ノイズ、電磁干渉(EMI)、スキュー、タイミングの問題、材料の選択、接続のクロストークによって悪化します。高速データ転送システムの厳しい要求を満たす基板対基板コネクタを提供するには、顧客と協力し、特定のアプリケーションの要件を考慮する必要があります。このような特有の技術的困難や複雑さにより、市場の成長は予測期間を通じて鈍化すると予想されます。
タイプ別展望
タイプ別では、市場はピンヘッダー、スタックドヘッダー、シュラウドヘッダー、ソケットに区分されます。2022年の市場では、ピンヘッダーセグメントが最も高い収益シェアを占めています。ピンヘッダーは、他の種類の基板対基板コネクターと比較して、より手頃な価格であることが多いです。その単純な構造と設計により、競合価格であり、生産も極めて簡単です。その手頃な価格のため、ピンヘッダーは、複数のコネクターを必要とするアプリケーションや、コストが重要なアプリケーションで頻繁に使用されています。また、ピンヘッダーは使いやすく、組み立ても簡単です。
ピッチの展望
部品別では、市場は1mm未満、1mm~2mm、2mm以上に細分化されます。2022年の市場では、1mm未満セグメントが大きな収益シェアを獲得しました。さまざまな業界の電子機器は、ますます小型化・コンパクト化が進んでいます。限られた場所での部品統合に対応するため、より小型・軽量で持ち運び可能なシステムに対するニーズの高まりから、より小さなピッチ幅の基板対基板コネクタが必要とされています。このような小型化設計に必要なコンパクト性を提供するのが、ピッチサイズ1mm以下のコネクターです。
アプリケーションの展望
市場はエンドユーザー別に、家電、産業オートメーション、通信、自動車、ヘルスケア、その他に区分されます。2022年、市場セグメンテーションでは、通信分野が有望な成長率を確保しました。特に基地局やルーターでは、基板対基板コネクタが通信機器に広く採用されています。高い柔軟性が提供され、更新や容量増加が容易です。さらに、さまざまなデータレートを可能にし、優れたEMIシールドを提供します。より大きな帯域幅への需要が高まるにつれ、ボード・ツー・ボード・インターフェイスは通信アプリケーションにおいてさらに重要になると思われます。
地域別展望
地域別に見ると、市場は北米、欧州、アジア太平洋、LAMEAで分析されます。2022年には、アジア太平洋地域が最も高い収益シェアを獲得して市場をリードしました。アジア太平洋地域には、スマート製造プログラムを積極的に検討し、インダストリー4.0イノベーションを実施する国が多いです。これには、自動化、ロボット工学、IoT、データ分析を生産プロセスに組み込むことが含まれます。ボード間接続は、スマート製造システムのさまざまなコンポーネント間のスムーズな接続と通信を可能にするために不可欠であり、市場の拡大を後押ししています。
パートナーシップ、コラボレーション、契約:
製品発表と製品拡大:
買収と合併:
The Global Board-to-Board Connectors Market size is expected to reach $17.5 billion by 2030, rising at a market growth of 6.2% CAGR during the forecast period. In the year 2022, the market attained a volume of 1,842.9 million units, experiencing a growth of 2.7% (2019-2022).
The demand for board-to-board connectors to facilitate connectivity between consumer electronics such as gadgets, sensors, and edge computing modules is growing as IoT devices and edge computing solutions become more widely used. Therefore, Consumer electronics segment would generate $3,943.7 million revenue in the market in 2022. As a result, there are potential for connectors that have certain qualities including low power consumption, secure connections, and durable designs for IoT and edge computing application.
The major strategies followed by the market participants are Product Launches as the key developmental strategy to keep pace with the changing demands of end users. For instance, In July, 2023, Japan Aviation Electronics Industry, Limited announced the launch of the WP55DK Series, a compact stacking type board-to-board (FPC) connector with power terminals. The launched product would be ideal for small wearable devices such as smart glasses and smartwatches. Moreover, In May, 2023, Molex, LLC launched 224G, the industry's first chip-to-chip product offerings. The launched product would encircle next-gen cables, board-to-board connectors, backplanes, and near-ASIC connector-to-cable solutions working at speeds up to 224 Gbps-PAM4.
Based on the Analysis presented in the KBV Cardinal matrix; Amphenol Corporation and TE Connectivity Ltd. are the forerunners in the Market. In July, 2023, Kyocera Corporation unveiled 6893 Series connectors, to prevent the FPC/FFC deposits which could cause contact failure after insertion. Companies such as Kyocera Corporation, Omron Corporation, Hirose Electric Co., Ltd are some of the key innovators in the Market.
Source: KBV Research
Market Growth Factors
Continuous Technological Advances
The market for board-to-board connectors is significantly driven by swift technical improvements in several industries, including electronics and telecommunications. The use of sophisticated connectors is necessary to address the constantly growing connectivity demands due to the ongoing evolution of electronic devices and developments in numerous industries. Smartphones, tablets, and wearable technology are examples of consumer electronics continually developing new features and functionalities. Because of rapid advances in technology in several industries, there is an increasing requirement for them, which is assisting market expansion.
Rising number of data centers globally
Board-to-board connectors provide dependable connections for high-speed data transfer and computing in data center storage. Within a constrained physical space, data centers hold many servers and gadgets. Board-to-board connectors make it possible for connections to be made in small spaces, improving the data center's layout and airflow. Board-to-board connectors also make it possible to link several types of PCBs differently, making it easier to integrate specialist components and create custom solutions. The market for board-to-board connectors is anticipated to expand significantly due to the advantages of BTB connections in data centers and the expanding number of data centers globally.
Market Restraining Factors
Technical Complexity and challenges
Making sure that signals are sent with minimal loss, noise, and interference becomes increasingly important as data transfer rates rise. These difficulties are exacerbated by impedance control, reflection, insertion loss, crosstalk, noise, electromagnetic interference (EMI), skew, timing problems, material choice, and connection crosstalk. Delivering board-to-board connectors that satisfy the stringent demands of rapid data transfer systems depends on working with clients and considering the requirements of a certain application. The market's growth is anticipated to be slow throughout the forecast period due to these specific technical difficulties and complexities.
Type Outlook
By type, the market is segmented into pin headers, stacked header, shrouded header, and socket. The pin headers segment held the highest revenue share in the market in 2022. Pin headers are often more affordable compared to other kinds of board-to-board connectors. Due to their straightforward structure and design, they are competitively priced and extremely simple to produce. Because of their affordability, pin headers are frequently used in applications that call for several connectors or where cost is crucial. Pin headers are also user-friendly and simple to put together.
Pitch Outlook
On the basis of component, the market is fragmented into less than 1mm, 1mm to 2mm, and greater than 2mm. The less than 1mm segment garnered a significant revenue share in the market in 2022. Electronic equipment across various industries is increasingly becoming more miniature and compact. In order to accommodate the integration of components within constrained locations, board-to-board connectors with smaller pitch widths are required due to the rising need for smaller, lighter, and more portable systems. The compactness required for these miniature designs is provided by connectors with a pitch size of less than 1 mm.
Application Outlook
Based on end user, the market is segmented into consumer electronics, industrial automation, telecommunication, automotive, healthcare, and others. In 2022, the telecommunication segment procured a promising growth rate in the market. Especially in base stations & routers, board-to-board connectors are widely employed in communications equipment. High levels of flexibility are provided, and it is simple to update and increase capacity. Additionally, they enable different data rates and provide outstanding EMI shielding. Board-to-board interfaces will become even more crucial in communications applications as demand for larger bandwidths rises.
Regional Outlook
Region wise, the market is analysed across North America, Europe, Asia Pacific and LAMEA. In 2022, the Asia Pacific region led the market by generating the highest revenue share. The Asia Pacific region is home to many nations actively looking into smart manufacturing programs and implementing Industry 4.0 innovations. This includes incorporating automation, robotics, IoT, and data analytics into the production processes. Board-to-board connections are essential for enabling smooth connectivity and communication between various components in smart manufacturing systems, which is fuelling market expansion.
The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Amphenol Corporation, TE Connectivity Ltd., Molex, LLC (Koch Industries, Inc.), Kyocera Corporation, HARTING Technology Group, Omron Corporation, Japan Aviation Electronics Industry, Limited, Hirose Electric Co., Ltd, Samtec, FIT Hon Teng Limited (Foxconn (Far East) Limited).
Partnerships, Collaborations & Agreements:
Apr-2023: HIROSE Electric Co., partnered with TraceParts, one of the world's leading CAD-content platforms for Engineering. This partnership would release more than 10,000 ready-to-use 3D models for a variety of Hirose's PCB mountable connectors.
May-2022: TE Connectivity Ltd. collaborated with Phoenix Contact, a manufacturer of industrial automation, interconnection, and interface solutions. Through this collaboration, both companies would develop M12 hybrid connectivity, a new Single Pair Ethernet. The launched product would align with the hybrid format defined by the International Electrotechnical Commission 63171-7 standard, which the IEC begins under the guidance of TE in 2021.
Product Launches and Product Expansions:
Jul-2023: Japan Aviation Electronics Industry, Limited announced the launch of the WP55DK Series, a compact stacking type board-to-board (FPC) connector with power terminals. The launched product would be ideal for small wearable devices such as smart glasses and smartwatches.
Jul-2023: Kyocera Corporation unveiled 6893 Series connectors. The launched product would provide a 2x improvement in foreign matter removal performance compared to its previous products, supporting to prevent the FPC/FFC deposits which could cause contact failure after insertion.
May-2023: Molex, LLC launched 224G, the industry's first chip-to-chip product offerings. The launched product would encircle next-gen cables, board-to-board connectors, backplanes, and near-ASIC connector-to-cable solutions working at speeds up to 224 Gbps-PAM4.
Nov-2022: Hirose Electric Co., Ltd introduced BM55 Series, a newly released compact board-to-board/FPC connector. The launched product would integrate a current capacity of up to 5A along with a robustness and armored design despite its extremely small size.
Jun-2022: Molex, LLC unveiled the Molex Quad-Row Board-to-Board Connectors, highlighting the industry's first staggered-circuit layout for 30% space savings over typical connector designs. The launched product would provide product developers and device manufacturers flexibility and greater freedom to back up compact form factors, including smartphones, game consoles, smartwatches, wearables, and Augmented Reality/Virtual Reality (AR/VR) devices.
May-2022: Omron Corporation unveiled G9KB, a new high-voltage DC relay. The launched product would safely cut off the direct current in household storage systems which would increase capacity.
Dec-2021: Hirose Electric Co., Ltd unveiled GT50 Series, a 1mm pitch, small and robust wire-to-board connector. The launched product could be utilized for automotive applications because of its high heat resistance up to 125°C and robust design.
Sep-2021: TE Connectivity Ltd. unveiled the NanoRF Edge Launch connector, the single solution that could combine the RF above an optical interconnect for military and radar RF-embedded computing applications.
Feb-2021: Kyocera Corporation released 0.5mm-pitch floating board-to-board connector series. The launched product could float within ±0.85mm for easy and errorless mating.
Acquisitions and Mergers:
Dec-2021: Molex, LLC completed the acquisition of Keyssa Inc., a pioneer in high-speed contactless connectors. This acquisition would hasten Molex's strategy to further widen and diversify its micro-connector offerings with highly flexible, cable-free connectors for near-field, device-to-device applications.
Sep-2021: TE Connectivity Ltd. took over ERNI Group AG, a leading company in electronic connectivity for factory automation and automotive. Under this acquisition, ERNI accompanies TE's wide connectivity product offerings, particularly in fine-pitch and high-speed connectors for factory automation, medical, automotive, and other industrial applications.
Market Segments covered in the Report:
By Type (Volume, Million Units, USD Million, 2019-2030)
By Pitch (Volume, Million Units, USD Million, 2019-2030)
By Application (Volume, Million Units, USD Million, 2019-2030)
By Geography (Volume, Million Units, USD Million, 2019-2030)
Companies Profiled
Unique Offerings from KBV Research