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基板対基板コネクター市場レポート：2030年までの動向、予測、競合分析

Board-to-Board Connector Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日: | 発行: Lucintel | ページ情報: 英文 150 - page report | 納期: 3営業日

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基板対基板コネクター市場レポート：2030年までの動向、予測、競合分析
出版日: 2024年01月29日
発行: Lucintel
ページ情報: 英文 150 - page report
納期: 3営業日
ご注意事項 :
本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
  • 全表示
  • 概要
  • 目次
概要

基板対基板コネクターの動向と予測

世界の基板対基板コネクター市場は、2024年から2030年までのCAGRが5.5%で、2030年までに推定155億米ドルに達すると予想されます。この市場の主な促進要因は、5Gネットワークの展開と通信インフラの拡大とともに、高密度接続性を備えた縮小・小型デバイスの需要増加、産業オートメーションとロボット工学への関心の高まりです。世界の基板対基板コネクター市場の将来は、家庭用電子機器、産業用オートメーション、通信、自動車、ヘルスケア市場における機会で有望視されています。

基板対基板コネクター市場の洞察

Lucintelの予測では、ピンヘッダーは他のタイプの基板対基板コネクターに比べて安価であることが多く、形状や構造が単純であるため、作成が非常に簡単で価格競争力があるため、予測期間中に高い成長が見込まれます。

アジア太平洋は、スマート製造プロジェクトを推進し、インダストリー4.0技術を積極的に導入しているため、予測期間中に最も高い成長が見込まれます。

よくある質問

Q1.市場規模は？

A1.世界の基板対基板コネクター市場は、2030年までに推定155億米ドルに達すると予想されています。

Q2.市場の成長予測は？

A2.世界の基板対基板コネクター市場は、2024年から2030年にかけてCAGR 5.5%で成長する見込みです。

Q3.市場の成長に影響を与える主な促進要因は？

A3.この市場の主な促進要因は、5Gネットワークの展開と通信インフラの拡大とともに、高密度接続性を備えた縮小・小型デバイスの需要の増加、産業オートメーションとロボット工学への関心の高まりです。

Q4.市場の主要セグメントは？

A4.世界の基板対基板コネクター市場の将来性は、家電、産業オートメーション、通信、自動車、ヘルスケア市場における機会により有望視されています。

Q5.市場の主要企業は？

A5.基板対基板コネクターの主要企業は以下の通りです。

  • Amphenol
  • TE Connectivity
  • Japan Aviation Electronics
  • Hirose Electric
  • Molex
  • Omron
  • Samtec
  • Harting Technology
  • FIT Hon Teng Limited
  • Kyocera

Q6.今後、最大となる市場セグメントは？

A6.Lucintelは、ピンヘッダーは他のタイプの基板対基板コネクターに比べて安価であり、形状や構造が単純であるため、作成が非常に容易であり、価格競争力もあることから、予測期間中に高い成長が見込まれると予測しています。

Q7.市場において、今後5年間に最大になると予想される地域は？

A7.アジア太平洋は、スマート製造プロジェクトを推進し、インダストリー4.0技術を積極的に導入しているため、予測期間中に最も高い成長が見込まれます。

Q8.レポートのカスタマイズは可能？

A8.はい、Lucintelは追加費用なしで10％のカスタマイズを提供します。

目次

第1章 エグゼクティブサマリー

第2章 世界の基板対基板コネクター市場：市場力学

  • イントロダクション、背景、分類
  • サプライチェーン
  • 業界の促進要因と課題

第3章 2018年から2030年までの市場動向と予測分析

  • マクロ経済動向（2018～2023年）と予測（2024～2030年）
  • 世界の基板対基板コネクター市場動向（2018-2023）と予測（2024-2030）
  • タイプ別の世界の基板対基板コネクター市場
    • ピンヘッダーー
    • ソケット
  • 部品別の世界の基板対基板コネクター市場
    • 1mm未満
    • 1mm～2mm
    • 2mm以上
  • 最終用途別の世界の基板対基板コネクター市場
    • 家電
    • 産業自動化
    • 通信
    • 自動車
    • ヘルスケア
    • その他

第4章 2018年から2030年までの地域別の市場動向と予測分析

  • 地域別の世界の基板対基板コネクター市場
  • 北米の基板対基板コネクター市場
  • 欧州の基板対基板コネクター市場
  • アジア太平洋の基板対基板コネクター市場
  • その他地域の基板対基板コネクター市場

第5章 競合の分析

  • 製品ポートフォリオ分析
  • 運用上の統合
  • ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

  • 成長機会分析
    • 種類別の世界の基板対基板コネクター市場の成長機会
    • コンポーネント別の世界の基板対基板コネクター市場の成長機会
    • 最終用途別の世界の基板対基板コネクター市場の成長機会
    • 地域別の世界の基板対基板コネクター市場の成長機会
  • 世界の基板対基板コネクター市場の新たな動向
  • 戦略的分析
    • 新製品の開発
    • 世界の基板対基板コネクター市場の生産能力拡大
    • 世界の基板対基板コネクター市場における合併、買収、合弁事業
    • 認証とライセンシング

第7章 有力企業の企業プロファイル

  • Amphenol
  • TE Connectivity
  • Japan Aviation Electronics
  • Hirose Electric
  • Molex
  • Omron
  • Samtec
  • Harting Technology
  • FIT Hon Teng Limited
  • Kyocera
目次

Board-to-Board Connector Trends and Forecast

The future of the global board-to-board connector market looks promising with opportunities in the consumer electronics, industrial automation, telecommunication, automotive, and healthcare markets. The global board-to-board connector market is expected to reach an estimated $15.5 billion by 2030 with a CAGR of 5.5% from 2024 to 2030. The major drivers for this market are increased demand for miniature and small devices with high-density connectivity, rising interest in industrial automation and robotics, along with deployment of 5G networks and the expansion of telecommunications infrastructure.

A more than 150-page report is developed to help in your business decisions.

Board-to-Board Connector by Segment

The study includes a forecast for the global board-to-board connector by type, component, end use, and region.

Board-to-Board Connector Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Pin Headers
  • Socket

Board-to-Board Connector Market by Component [Shipment Analysis by Value from 2018 to 2030]:

  • Less Than 1mm
  • 1mm To 2mm
  • Greater Than 2mm

Board-to-Board Connector Market by End Use [Shipment Analysis by Value from 2018 to 2030]:

  • Consumer Electronics
  • Industrial Automation
  • Telecommunication
  • Automotive
  • Healthcare
  • Others

Board-to-Board Connector Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Board-to-Board Connector Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies board-to-board connector companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the board-to-board connector companies profiled in this report include-

  • Amphenol
  • TE Connectivity
  • Japan Aviation Electronics
  • Hirose Electric
  • Molex
  • Omron
  • Samtec
  • Harting Technology
  • FIT Hon Teng Limited
  • Kyocera

Board-to-Board Connector Market Insights

Lucintel forecasts that pin header is expected to witness the higher growth over the forecast period because it is frequently less expensive as compared to alternative types of board-to-board connectors, and owing to their simple shape and structure, they are very easy to create and come at a competitive price.

APAC is expected to witness highest growth over the forecast period because the region is pursuing smart manufacturing projects and implementing industry 4.0 technology aggressively.

Features of the Global Board-to-Board Connector Market

Market Size Estimates: Board-to-board connector market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Board-to-board connector market size by type, component, end use, and region in terms of value ($B).

Regional Analysis: Board-to-board connector market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, component, end use, and regions for the board-to-board connector market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the board-to-board connector market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the board-to-board connector market size?

Answer: The global board-to-board connector market is expected to reach an estimated $15.5 billion by 2030.

Q2. What is the growth forecast for board-to-board connector market?

Answer: The global board-to-board connector market is expected to grow with a CAGR of 5.5% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the board-to-board connector market?

Answer: The major drivers for this market are increased demand for miniature and small devices with high-density connectivity, rising interest in industrial automation and robotics, along with deployment of 5G networks and the expansion of telecommunications infrastructure.

Q4. What are the major segments for board-to-board connector market?

Answer: The future of the global board-to-board connector market looks promising with opportunities in the consumer electronics, industrial automation, telecommunication, automotive, and healthcare markets.

Q5. Who are the key board-to-board connector market companies?

Answer: Some of the key board-to-board connector companies are as follows.

  • Amphenol
  • TE Connectivity
  • Japan Aviation Electronics
  • Hirose Electric
  • Molex
  • Omron
  • Samtec
  • Harting Technology
  • FIT Hon Teng Limited
  • Kyocera

Q6. Which board-to-board connector market segment will be the largest in future?

Answer: Lucintel forecasts that pin header is expected to witness the higher growth over the forecast period because it is frequently less expensive as compared to alternative types of board-to-board connectors, and owing to their simple shape and structure, they are very easy to create and come at a competitive price.

Q7. In board-to-board connector market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period because the region is pursuing smart manufacturing projects and implementing industry 4.0 technology aggressively.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the board-to-board connector market by type (pin headers and socket), component (less than 1mm, 1mm to 2mm, and greater than 2mm), end use (consumer electronics, industrial automation, telecommunication, automotive, healthcare, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Board-to-Board Connector Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Board-to-Board Connector Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Board-to-Board Connector Market by Type
    • 3.3.1: Pin Headers
    • 3.3.2: Socket
  • 3.4: Global Board-to-Board Connector Market by Component
    • 3.4.1: Less than 1mm
    • 3.4.2: 1mm to 2mm
    • 3.4.3: Greater than 2mm
  • 3.5: Global Board-to-Board Connector Market by End Use
    • 3.5.1: Consumer Electronics
    • 3.5.2: Industrial Automation
    • 3.5.3: Telecommunication
    • 3.5.4: Automotive
    • 3.5.5: Healthcare
    • 3.5.6: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Board-to-Board Connector Market by Region
  • 4.2: North American Board-to-Board Connector Market
    • 4.2.2: North American Board-to-Board Connector Market by Component: Less than 1mm, 1mm to 2mm, and Greater than 2mm
  • 4.3: European Board-to-Board Connector Market
    • 4.3.1: European Board-to-Board Connector Market by Type: Pin Headers and Socket
    • 4.3.2: European Board-to-Board Connector Market by Component: Less than 1mm, 1mm to 2mm, and Greater than 2mm
  • 4.4: APAC Board-to-Board Connector Market
    • 4.4.1: APAC Board-to-Board Connector Market by Type: Pin Headers and Socket
    • 4.4.2: APAC Board-to-Board Connector Market by Component: Less than 1mm, 1mm to 2mm, and Greater than 2mm
  • 4.5: ROW Board-to-Board Connector Market
    • 4.5.1: ROW Board-to-Board Connector Market by Type: Pin Headers and Socket
    • 4.5.2: ROW Board-to-Board Connector Market by Component: Less than 1mm, 1mm to 2mm, and Greater than 2mm

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Board-to-Board Connector Market by Type
    • 6.1.2: Growth Opportunities for the Global Board-to-Board Connector Market by Component
    • 6.1.3: Growth Opportunities for the Global Board-to-Board Connector Market by End Use
    • 6.1.4: Growth Opportunities for the Global Board-to-Board Connector Market by Region
  • 6.2: Emerging Trends in the Global Board-to-Board Connector Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Board-to-Board Connector Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Board-to-Board Connector Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Amphenol
  • 7.2: TE Connectivity
  • 7.3: Japan Aviation Electronics
  • 7.4: Hirose Electric
  • 7.5: Molex
  • 7.6: Omron
  • 7.7: Samtec
  • 7.8: Harting Technology
  • 7.9: FIT Hon Teng Limited
  • 7.10: Kyocera