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市場調査レポート
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1093127

ウェーハレベルパッケージングの世界市場：規模、シェア、産業動向分析、エンドユーザー別（家電、自動車、ヘルスケア、IT・通信）、タイプ別、地域別の展望と予測（2022年～2028年）

Global Wafer Level Packaging Market Size, Share & Industry Trends Analysis Report By End User (Consumer Electronics, Automotive, Healthcare, IT & Telecommunication), By Type, By Regional Outlook and Forecast, 2022 - 2028
出版日: | 発行: KBV Research | ページ情報: 英文 213 Pages | 納期: 即納可能 即納可能とは

価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=156.76円
ウェーハレベルパッケージングの世界市場：規模、シェア、産業動向分析、エンドユーザー別（家電、自動車、ヘルスケア、IT・通信）、タイプ別、地域別の展望と予測（2022年～2028年）
出版日: 2022年05月31日
発行: KBV Research
ページ情報: 英文 213 Pages
納期: 即納可能 即納可能とは
  • 全表示
  • 概要
  • 図表
  • 目次
概要

世界のウェーハレベルパッケージングの市場規模は、予測期間中に17.7%のCAGRで成長し、2028年までに141億米ドルに達すると予測されています。同市場の成長を後押しする主な要因には、ウェーハレベルパッケージングの費用対効果・時間対効果、温度制御の最適化などが挙げられます。一方で、高額な初期投資の必要性などが同市場の成長を抑制する可能性があります。

当レポートでは、世界のウェーハレベルパッケージング市場を調査しており、市場の概要、市場規模や予測、動向、成長要因および抑制要因、エンドユーザー・タイプ・地域別などの分析、さらに企業プロファイルなどを提供しています。

目次

第1章 市場の範囲と調査手法

第2章 市場概要

  • イントロダクション
  • 市場に影響を与える主な要因

第3章 世界のウェーハレベルパッケージング市場：エンドユーザー別

  • 地域別の世界の家電市場
  • 地域別の世界の自動車市場
  • 地域別の世界のヘルスケア市場
  • 地域別の世界のIT・通信市場
  • 地域別の世界のその他の市場

第4章 世界のウェーハレベルパッケージング市場：タイプ別

  • 地域別の世界のWLCSP市場
  • 地域別の世界の2.5D TSV WLP市場
  • 地域別の世界の3D TSV WLP市場
  • 地域別の世界のナノWLP市場
  • 地域別の世界のその他の市場

第5章 世界のウェーハレベルパッケージング市場：技術別

  • 地域別の世界のファンイン型市場
  • 地域別の世界のファンアウト型市場

第6章 世界のウェーハレベルパッケージング市場：地域別

  • 北米のウェーハレベルパッケージング市場
  • 欧州のウェーハレベルパッケージング市場
  • アジア太平洋のウェーハレベルパッケージング市場
  • LAMEAのウェーハレベルパッケージング市場

第7章 企業プロファイル

  • ASML Holding N.V.
  • Fujitsu Limited
  • Toshiba Corporation
  • Qualcomm, Inc.
  • Amkor Technology, Inc.
  • Deca Technologies, Inc.
  • Jiangsu Changjing Electronics Technology Co., Ltd.
  • Tokyo Electron Ltd.
  • Applied Materials, Inc.
  • Lam Research Corporation
図表

LIST OF TABLES

  • TABLE 1 Global Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 2 Global Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 3 Global Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 4 Global Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 5 Global Consumer Electronics Market by Region, 2018 - 2021, USD Million
  • TABLE 6 Global Consumer Electronics Market by Region, 2022 - 2028, USD Million
  • TABLE 7 Global Automotive Market by Region, 2018 - 2021, USD Million
  • TABLE 8 Global Automotive Market by Region, 2022 - 2028, USD Million
  • TABLE 9 Global Healthcare Market by Region, 2018 - 2021, USD Million
  • TABLE 10 Global Healthcare Market by Region, 2022 - 2028, USD Million
  • TABLE 11 Global IT & Telecommunication Market by Region, 2018 - 2021, USD Million
  • TABLE 12 Global IT & Telecommunication Market by Region, 2022 - 2028, USD Million
  • TABLE 13 Global Others Market by Region, 2018 - 2021, USD Million
  • TABLE 14 Global Others Market by Region, 2022 - 2028, USD Million
  • TABLE 15 Global Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 16 Global Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 17 Global WLCSP Market by Region, 2018 - 2021, USD Million
  • TABLE 18 Global WLCSP Market by Region, 2022 - 2028, USD Million
  • TABLE 19 Global 2.5D TSV WLP Market by Region, 2018 - 2021, USD Million
  • TABLE 20 Global 2.5D TSV WLP Market by Region, 2022 - 2028, USD Million
  • TABLE 21 Global 3D TSV WLP Market by Region, 2018 - 2021, USD Million
  • TABLE 22 Global 3D TSV WLP Market by Region, 2022 - 2028, USD Million
  • TABLE 23 Global Nano WLP Market by Region, 2018 - 2021, USD Million
  • TABLE 24 Global Nano WLP Market by Region, 2022 - 2028, USD Million
  • TABLE 25 Global Others Market by Region, 2018 - 2021, USD Million
  • TABLE 26 Global Others Market by Region, 2022 - 2028, USD Million
  • TABLE 27 Global Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 28 Global Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 29 Global Fan IN Market by Region, 2018 - 2021, USD Million
  • TABLE 30 Global Fan IN Market by Region, 2022 - 2028, USD Million
  • TABLE 31 Global Fan OUT Market by Region, 2018 - 2021, USD Million
  • TABLE 32 Global Fan OUT Market by Region, 2022 - 2028, USD Million
  • TABLE 33 Global Wafer Level Packaging Market by Region, 2018 - 2021, USD Million
  • TABLE 34 Global Wafer Level Packaging Market by Region, 2022 - 2028, USD Million
  • TABLE 35 North America Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 36 North America Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 37 North America Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 38 North America Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 39 North America Consumer Electronics Market by Country, 2018 - 2021, USD Million
  • TABLE 40 North America Consumer Electronics Market by Country, 2022 - 2028, USD Million
  • TABLE 41 North America Automotive Market by Country, 2018 - 2021, USD Million
  • TABLE 42 North America Automotive Market by Country, 2022 - 2028, USD Million
  • TABLE 43 North America Healthcare Market by Country, 2018 - 2021, USD Million
  • TABLE 44 North America Healthcare Market by Country, 2022 - 2028, USD Million
  • TABLE 45 North America IT & Telecommunication Market by Country, 2018 - 2021, USD Million
  • TABLE 46 North America IT & Telecommunication Market by Country, 2022 - 2028, USD Million
  • TABLE 47 North America Others Market by Country, 2018 - 2021, USD Million
  • TABLE 48 North America Others Market by Country, 2022 - 2028, USD Million
  • TABLE 49 North America Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 50 North America Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 51 North America WLCSP Market by Country, 2018 - 2021, USD Million
  • TABLE 52 North America WLCSP Market by Country, 2022 - 2028, USD Million
  • TABLE 53 North America 2.5D TSV WLP Market by Country, 2018 - 2021, USD Million
  • TABLE 54 North America 2.5D TSV WLP Market by Country, 2022 - 2028, USD Million
  • TABLE 55 North America 3D TSV WLP Market by Country, 2018 - 2021, USD Million
  • TABLE 56 North America 3D TSV WLP Market by Country, 2022 - 2028, USD Million
  • TABLE 57 North America Nano WLP Market by Country, 2018 - 2021, USD Million
  • TABLE 58 North America Nano WLP Market by Country, 2022 - 2028, USD Million
  • TABLE 59 North America Others Market by Country, 2018 - 2021, USD Million
  • TABLE 60 North America Others Market by Country, 2022 - 2028, USD Million
  • TABLE 61 North America Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 62 North America Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 63 North America Fan IN Market by Country, 2018 - 2021, USD Million
  • TABLE 64 North America Fan IN Market by Country, 2022 - 2028, USD Million
  • TABLE 65 North America Fan OUT Market by Country, 2018 - 2021, USD Million
  • TABLE 66 North America Fan OUT Market by Country, 2022 - 2028, USD Million
  • TABLE 67 North America Wafer Level Packaging Market by Country, 2018 - 2021, USD Million
  • TABLE 68 North America Wafer Level Packaging Market by Country, 2022 - 2028, USD Million
  • TABLE 69 US Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 70 US Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 71 US Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 72 US Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 73 US Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 74 US Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 75 US Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 76 US Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 77 Canada Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 78 Canada Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 79 Canada Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 80 Canada Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 81 Canada Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 82 Canada Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 83 Canada Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 84 Canada Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 85 Mexico Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 86 Mexico Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 87 Mexico Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 88 Mexico Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 89 Mexico Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 90 Mexico Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 91 Mexico Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 92 Mexico Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 93 Rest of North America Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 94 Rest of North America Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 95 Rest of North America Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 96 Rest of North America Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 97 Rest of North America Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 98 Rest of North America Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 99 Rest of North America Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 100 Rest of North America Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 101 Europe Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 102 Europe Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 103 Europe Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 104 Europe Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 105 Europe Consumer Electronics Market by Country, 2018 - 2021, USD Million
  • TABLE 106 Europe Consumer Electronics Market by Country, 2022 - 2028, USD Million
  • TABLE 107 Europe Automotive Market by Country, 2018 - 2021, USD Million
  • TABLE 108 Europe Automotive Market by Country, 2022 - 2028, USD Million
  • TABLE 109 Europe Healthcare Market by Country, 2018 - 2021, USD Million
  • TABLE 110 Europe Healthcare Market by Country, 2022 - 2028, USD Million
  • TABLE 111 Europe IT & Telecommunication Market by Country, 2018 - 2021, USD Million
  • TABLE 112 Europe IT & Telecommunication Market by Country, 2022 - 2028, USD Million
  • TABLE 113 Europe Others Market by Country, 2018 - 2021, USD Million
  • TABLE 114 Europe Others Market by Country, 2022 - 2028, USD Million
  • TABLE 115 Europe Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 116 Europe Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 117 Europe WLCSP Market by Country, 2018 - 2021, USD Million
  • TABLE 118 Europe WLCSP Market by Country, 2022 - 2028, USD Million
  • TABLE 119 Europe 2.5D TSV WLP Market by Country, 2018 - 2021, USD Million
  • TABLE 120 Europe 2.5D TSV WLP Market by Country, 2022 - 2028, USD Million
  • TABLE 121 Europe 3D TSV WLP Market by Country, 2018 - 2021, USD Million
  • TABLE 122 Europe 3D TSV WLP Market by Country, 2022 - 2028, USD Million
  • TABLE 123 Europe Nano WLP Market by Country, 2018 - 2021, USD Million
  • TABLE 124 Europe Nano WLP Market by Country, 2022 - 2028, USD Million
  • TABLE 125 Europe Others Market by Country, 2018 - 2021, USD Million
  • TABLE 126 Europe Others Market by Country, 2022 - 2028, USD Million
  • TABLE 127 Europe Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 128 Europe Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 129 Europe Fan IN Market by Country, 2018 - 2021, USD Million
  • TABLE 130 Europe Fan IN Market by Country, 2022 - 2028, USD Million
  • TABLE 131 Europe Fan OUT Market by Country, 2018 - 2021, USD Million
  • TABLE 132 Europe Fan OUT Market by Country, 2022 - 2028, USD Million
  • TABLE 133 Europe Wafer Level Packaging Market by Country, 2018 - 2021, USD Million
  • TABLE 134 Europe Wafer Level Packaging Market by Country, 2022 - 2028, USD Million
  • TABLE 135 Germany Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 136 Germany Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 137 Germany Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 138 Germany Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 139 Germany Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 140 Germany Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 141 Germany Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 142 Germany Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 143 UK Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 144 UK Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 145 UK Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 146 UK Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 147 UK Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 148 UK Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 149 UK Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 150 UK Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 151 France Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 152 France Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 153 France Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 154 France Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 155 France Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 156 France Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 157 France Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 158 France Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 159 Russia Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 160 Russia Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 161 Russia Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 162 Russia Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 163 Russia Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 164 Russia Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 165 Russia Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 166 Russia Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 167 Spain Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 168 Spain Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 169 Spain Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 170 Spain Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 171 Spain Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 172 Spain Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 173 Spain Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 174 Spain Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 175 Italy Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 176 Italy Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 177 Italy Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 178 Italy Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 179 Italy Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 180 Italy Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 181 Italy Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 182 Italy Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 183 Rest of Europe Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 184 Rest of Europe Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 185 Rest of Europe Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 186 Rest of Europe Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 187 Rest of Europe Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 188 Rest of Europe Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 189 Rest of Europe Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 190 Rest of Europe Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 191 Asia Pacific Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 192 Asia Pacific Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 193 Asia Pacific Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 194 Asia Pacific Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 195 Asia Pacific Consumer Electronics Market by Country, 2018 - 2021, USD Million
  • TABLE 196 Asia Pacific Consumer Electronics Market by Country, 2022 - 2028, USD Million
  • TABLE 197 Asia Pacific Automotive Market by Country, 2018 - 2021, USD Million
  • TABLE 198 Asia Pacific Automotive Market by Country, 2022 - 2028, USD Million
  • TABLE 199 Asia Pacific Healthcare Market by Country, 2018 - 2021, USD Million
  • TABLE 200 Asia Pacific Healthcare Market by Country, 2022 - 2028, USD Million
  • TABLE 201 Asia Pacific IT & Telecommunication Market by Country, 2018 - 2021, USD Million
  • TABLE 202 Asia Pacific IT & Telecommunication Market by Country, 2022 - 2028, USD Million
  • TABLE 203 Asia Pacific Others Market by Country, 2018 - 2021, USD Million
  • TABLE 204 Asia Pacific Others Market by Country, 2022 - 2028, USD Million
  • TABLE 205 Asia Pacific Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 206 Asia Pacific Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 207 Asia Pacific WLCSP Market by Country, 2018 - 2021, USD Million
  • TABLE 208 Asia Pacific WLCSP Market by Country, 2022 - 2028, USD Million
  • TABLE 209 Asia Pacific 2.5D TSV WLP Market by Country, 2018 - 2021, USD Million
  • TABLE 210 Asia Pacific 2.5D TSV WLP Market by Country, 2022 - 2028, USD Million
  • TABLE 211 Asia Pacific 3D TSV WLP Market by Country, 2018 - 2021, USD Million
  • TABLE 212 Asia Pacific 3D TSV WLP Market by Country, 2022 - 2028, USD Million
  • TABLE 213 Asia Pacific Nano WLP Market by Country, 2018 - 2021, USD Million
  • TABLE 214 Asia Pacific Nano WLP Market by Country, 2022 - 2028, USD Million
  • TABLE 215 Asia Pacific Others Market by Country, 2018 - 2021, USD Million
  • TABLE 216 Asia Pacific Others Market by Country, 2022 - 2028, USD Million
  • TABLE 217 Asia Pacific Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 218 Asia Pacific Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 219 Asia Pacific Fan IN Market by Country, 2018 - 2021, USD Million
  • TABLE 220 Asia Pacific Fan IN Market by Country, 2022 - 2028, USD Million
  • TABLE 221 Asia Pacific Fan OUT Market by Country, 2018 - 2021, USD Million
  • TABLE 222 Asia Pacific Fan OUT Market by Country, 2022 - 2028, USD Million
  • TABLE 223 Asia Pacific Wafer Level Packaging Market by Country, 2018 - 2021, USD Million
  • TABLE 224 Asia Pacific Wafer Level Packaging Market by Country, 2022 - 2028, USD Million
  • TABLE 225 China Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 226 China Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 227 China Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 228 China Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 229 China Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 230 China Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 231 China Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 232 China Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 233 Japan Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 234 Japan Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 235 Japan Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 236 Japan Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 237 Japan Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 238 Japan Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 239 Japan Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 240 Japan Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 241 India Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 242 India Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 243 India Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 244 India Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 245 India Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 246 India Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 247 India Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 248 India Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 249 South Korea Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 250 South Korea Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 251 South Korea Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 252 South Korea Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 253 South Korea Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 254 South Korea Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 255 South Korea Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 256 South Korea Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 257 Singapore Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 258 Singapore Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 259 Singapore Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 260 Singapore Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 261 Singapore Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 262 Singapore Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 263 Singapore Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 264 Singapore Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 265 Malaysia Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 266 Malaysia Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 267 Malaysia Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 268 Malaysia Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 269 Malaysia Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 270 Malaysia Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 271 Malaysia Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 272 Malaysia Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 273 Rest of Asia Pacific Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 274 Rest of Asia Pacific Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 275 Rest of Asia Pacific Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 276 Rest of Asia Pacific Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 277 Rest of Asia Pacific Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 278 Rest of Asia Pacific Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 279 Rest of Asia Pacific Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 280 Rest of Asia Pacific Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 281 LAMEA Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 282 LAMEA Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 283 LAMEA Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 284 LAMEA Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 285 LAMEA Consumer Electronics Market by Country, 2018 - 2021, USD Million
  • TABLE 286 LAMEA Consumer Electronics Market by Country, 2022 - 2028, USD Million
  • TABLE 287 LAMEA Automotive Market by Country, 2018 - 2021, USD Million
  • TABLE 288 LAMEA Automotive Market by Country, 2022 - 2028, USD Million
  • TABLE 289 LAMEA Healthcare Market by Country, 2018 - 2021, USD Million
  • TABLE 290 LAMEA Healthcare Market by Country, 2022 - 2028, USD Million
  • TABLE 291 LAMEA IT & Telecommunication Market by Country, 2018 - 2021, USD Million
  • TABLE 292 LAMEA IT & Telecommunication Market by Country, 2022 - 2028, USD Million
  • TABLE 293 LAMEA Others Market by Country, 2018 - 2021, USD Million
  • TABLE 294 LAMEA Others Market by Country, 2022 - 2028, USD Million
  • TABLE 295 LAMEA Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 296 LAMEA Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 297 LAMEA WLCSP Market by Country, 2018 - 2021, USD Million
  • TABLE 298 LAMEA WLCSP Market by Country, 2022 - 2028, USD Million
  • TABLE 299 LAMEA 2.5D TSV WLP Market by Country, 2018 - 2021, USD Million
  • TABLE 300 LAMEA 2.5D TSV WLP Market by Country, 2022 - 2028, USD Million
  • TABLE 301 LAMEA 3D TSV WLP Market by Country, 2018 - 2021, USD Million
  • TABLE 302 LAMEA 3D TSV WLP Market by Country, 2022 - 2028, USD Million
  • TABLE 303 LAMEA Nano WLP Market by Country, 2018 - 2021, USD Million
  • TABLE 304 LAMEA Nano WLP Market by Country, 2022 - 2028, USD Million
  • TABLE 305 LAMEA Others Market by Country, 2018 - 2021, USD Million
  • TABLE 306 LAMEA Others Market by Country, 2022 - 2028, USD Million
  • TABLE 307 LAMEA Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 308 LAMEA Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 309 LAMEA Fan IN Market by Country, 2018 - 2021, USD Million
  • TABLE 310 LAMEA Fan IN Market by Country, 2022 - 2028, USD Million
  • TABLE 311 LAMEA Fan OUT Market by Country, 2018 - 2021, USD Million
  • TABLE 312 LAMEA Fan OUT Market by Country, 2022 - 2028, USD Million
  • TABLE 313 LAMEA Wafer Level Packaging Market by Country, 2018 - 2021, USD Million
  • TABLE 314 LAMEA Wafer Level Packaging Market by Country, 2022 - 2028, USD Million
  • TABLE 315 Brazil Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 316 Brazil Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 317 Brazil Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 318 Brazil Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 319 Brazil Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 320 Brazil Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 321 Brazil Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 322 Brazil Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 323 Argentina Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 324 Argentina Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 325 Argentina Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 326 Argentina Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 327 Argentina Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 328 Argentina Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 329 Argentina Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 330 Argentina Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 331 UAE Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 332 UAE Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 333 UAE Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 334 UAE Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 335 UAE Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 336 UAE Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 337 UAE Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 338 UAE Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 339 Saudi Arabia Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 340 Saudi Arabia Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 341 Saudi Arabia Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 342 Saudi Arabia Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 343 Saudi Arabia Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 344 Saudi Arabia Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 345 Saudi Arabia Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 346 Saudi Arabia Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 347 South Africa Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 348 South Africa Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 349 South Africa Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 350 South Africa Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 351 South Africa Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 352 South Africa Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 353 South Africa Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 354 South Africa Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 355 Nigeria Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 356 Nigeria Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 357 Nigeria Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 358 Nigeria Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 359 Nigeria Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 360 Nigeria Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 361 Nigeria Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 362 Nigeria Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 363 Rest of LAMEA Wafer Level Packaging Market, 2018 - 2021, USD Million
  • TABLE 364 Rest of LAMEA Wafer Level Packaging Market, 2022 - 2028, USD Million
  • TABLE 365 Rest of LAMEA Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
  • TABLE 366 Rest of LAMEA Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
  • TABLE 367 Rest of LAMEA Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
  • TABLE 368 Rest of LAMEA Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
  • TABLE 369 Rest of LAMEA Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
  • TABLE 370 Rest of LAMEA Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
  • TABLE 371 Key information - ASML Holding N.V.
  • TABLE 372 Key Information - Fujitsu Limited
  • TABLE 373 Key Information - Toshiba Corporation
  • TABLE 374 Key Information - Qualcomm, Inc.
  • TABLE 375 Key Information - Amkor Technology, Inc.
  • TABLE 376 Key Information - Deca Technologies, Inc.
  • TABLE 377 Key Information - Jiangsu Changjing Electronics Technology Co., Ltd.
  • TABLE 378 Key Information - Tokyo Electron Ltd.
  • TABLE 379 Key Information - Applied Materials, Inc.
  • TABLE 380 Key Information - Lam Research Corporation

List of Figures

  • FIG 1 Methodology for the research
  • FIG 2 Global Wafer Level Packaging Market Share by End User, 2021
  • FIG 3 Global Wafer Level Packaging Market Share by End User, 2028
  • FIG 4 Global Wafer Level Packaging Market Share by End User, 2018 - 2028, USD Million
  • FIG 5 Global Wafer Level Packaging Market Share by Type, 2021
  • FIG 6 Global Wafer Level Packaging Market Share by Type, 2028
  • FIG 7 Global Wafer Level Packaging Market by Type, 2018 - 2028, USD Million
  • FIG 8 Global Wafer Level Packaging Market Share by Technology, 2021
  • FIG 9 Global Wafer Level Packaging Market Share by Technology, 2028
  • FIG 10 Global Wafer Level Packaging Market by Technology, 2018 - 2028, USD Million
  • FIG 11 Global Wafer Level Packaging Market Share by Region, 2021
  • FIG 12 Global Wafer Level Packaging Market Share by Region, 2028
  • FIG 13 Global Wafer Level Packaging Market by Region, 2018 - 2028, USD Million
  • FIG 14 SWOT Analysis: Fujitsu Limited
目次

The Global Wafer Level Packaging Market size is expected to reach $14.1 billion by 2028, rising at a market growth of 17.7% CAGR during the forecast period.

Wafer level packaging (WLP) is a technique for connecting packaging elements to an integrated circuit before slicing it. Unlike the traditional approach, which involves slicing the wafer into individual circuits before attaching the packaging components, this procedure does not include slicing the wafer into distinct circuits. Factors such as increased usage of high-speed, compact-size, and less expensive electronic goods are expected to propel the worldwide wafer level packaging business forward. Furthermore, the technological superiority of wafer level packaging over traditional packaging approaches, as well as the approaching requirement for circuit downsizing in microelectronic devices, drive market growth. Moreover, the increased utilization of wafers throughout the automotive industry is anticipated to drive the market.

Wafer-level packaging entails extending wafer fabrication methods to include device connectivity and protection. Most alternative types of packaging start with wafer dicing and then place the individual die in a plastic box with solder bumps attached. Wafer-level packaging entails attaching the bottom and top outer layers of packaging, as well as the solder bumps, onto integrated circuits while the wafer is still in the wafer, and then slicing the wafer. At the moment, there is no one industry-standard approach to wafer-level packaging. Because of their small size, cellphones are a popular application for WLPs.

Because of the rapid advancements in integrated circuit manufacturing processes, fans in wafer level packaging solutions are becoming increasingly significant in the semiconductor packaging area. Moreover, one of the primary drivers driving the market for wafer level packaging solutions is the demand for faster, lighter, smaller, and more cost-effective electronic equipment with high performance as well as low-cost packaging. WLP can be found in consumer electronic devices such as cellphones and other semiconductor devices, as well as in ICs. One of the primary elements driving demand for wafer level packaging technology over traditional packaging solutions is the growing demand for technical improvement in mobile devices that are capable of completing a variety of programs in a single small-end product.

COVID-19 Impact

The COVID-19 outbreak had a considerable impact on the semiconductor and electronics industries. Due to an increase in the number of COVID-19 cases, business and manufacturing facilities in several nations were closed during the pandemic. Additionally, the partial and complete travel restrictions impacted the worldwide supply chain, making it difficult for manufacturers to access customers. The COVID-19 outbreak had a global impact on society and the economy. The impact of this pandemic was growing rapidly, and it affected worldwide business. The crisis has wreaked havoc on the stock market, causing a drop in corporate confidence, a major slowdown in the supply chain, and an increase in customer concern. Due to the shutdown of production operations, various countries under the lockdown lost a significant amount of business and money.

Market Growth Factors

Cost-effective and time-efficient

Electrical testing is less expensive and takes less time because these programs were designed with DFT in mind. Because the connections are exposed on the wafer, advanced fabs can automate this procedure, and testing is not required after packaging. Burn-in testing is also accelerated due to the utilization of a single wafer. The IC verification method includes two critical steps, including assessing reliability and functional testing. Wafer-level packaging was not designed specifically to improve DFT, but it undoubtedly helps because it exposes critical test locations and interconnects directly on the wafer.

Optimizes temperature control

When the casting solutions are efficiently emerging from the film, imidization rates can be better regulated. Controlled and regulated temperature ramp rates provide an enhanced system window for optimal polyimide film curing. When using many layers of polyimide, optimal temperature control is very important. Due to tension, improper curing can cause the first polyimide layer to soften and the metal lines to wrinkle. Absorption of oxygen in the polyimide can result in a dark, brittle coating. Vacuum / N2 cycles generate an oxygen-free environment for curing. The diameter of the intermediate wafer determines the investment and manufacturing infrastructure in traditional WLCSP processing.

Market Restraining Factors

Requirement for high initial investment

Various wafer level packaging, or WLP, technologies are currently being introduced in the market at an extremely high altitude, particularly in portable and mobile applications. In recent years, a considerable number of wafer level packaging units were installed in smartphones, tablet PCs, and portable gadgets, indicating a significant rise in the wafer level packaging industry. However, there are several challenges that are being posed to the market players operating in this sector. one of the major challenges is that wafer level packaging requires a higher capital investment than traditional flip-chip and wire bonding packaging since it uses fab-like tools for the redistribution process using thin layer metals and dielectric polymers. Cost reduction is a significant aspect of expanding the market beyond its present limitations.

End User Outlook

Based on End User, the market is segmented into Consumer Electronics, Automotive, Healthcare, IT & Telecommunication, and Others. In 2021, the consumer electronics segment recorded the largest revenue share of the wafer level packaging market. The constantly increasing growth of this segment is attributed to the advancements in electronic packaging technology, which have resulted in highly efficient and robust electrical interconnect methods for electronic products.

Type Outlook

Based on Type, the market is segmented into WLCSP, 2.5D TSV WLP, 3D TSV WLP, Nano WLP, and Others. In 2021, the 2.5D TSV WLP segment garnered a substantial revenue share of the wafer level packaging market. The increased capacity, reduced system space requirements, improved performance, and low power consumption are all characteristics that contribute to the widespread use of 2.5D TSV WLP. This factor would aid in increasing the growth of this segment across the market in the forecast years.

Technology Outlook

Based on Technology, the market is segmented into Fan IN and Fan OUT. In 2021, the Fan-in WLP segment witnessed the largest revenue share of the wafer level packaging market. The increasing growth of this segment is attributed to the st4rong position of Fan-in WLP technology in the semiconductor sector, offering undeniable benefits in terms of shape and cost. Moreover, technological improvement and innovation continue to expand the range of fan-in WLP solutions. The growing use and use of fans in wafer level packaging across automotive, consumer electronics, and industrial applications are driving the demand for sophisticated fan-in WLP solutions around the world. Furthermore, the IoT (Internet of Things) promises a plethora of new applications for which fan-in WLP would be an ideal option, presenting a lucrative chance to further boost the demand.

Regional Outlook

Based on Regions, the market is segmented into North America, Europe, Asia Pacific, and Latin America, Middle East & Africa. In 2021, Asia-Pacific accounted for the largest revenue share of the wafer level packaging market. The growth of the regional market is majorly attributed to the fact that Taiwan is home to some of the world's largest semiconductor manufacturers, fueling demand for sophisticated semiconductor packaging, particularly in PLPs. According to the Semiconductor Industry Association (SIA), this region accounts for more than half of worldwide semiconductor sales, giving Taiwanese manufacturers more opportunities to supply FOWLP for growing semiconductor applications. The majority of enterprises in the country are expanding their Fan-out packaging production capacity, which is projected to boost exports while also helping to strengthen the local market.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include ASML Holding N.V., Fujitsu Limited, Toshiba Corporation, Qualcomm, Inc., Amkor Technology, Inc., Deca Technologies, Inc., Jiangsu Changjing Electronics Technology Co., Ltd., Tokyo Electron Ltd., Applied Materials, Inc., and Lam Research Corporation.

Scope of the Study

Market Segments covered in the Report:

By End User

  • Consumer Electronics
  • Automotive
  • Healthcare
  • IT & Telecommunication
  • Others

By Type

  • WLCSP
  • 2.5D TSV WLP
  • 3D TSV WLP
  • Nano WLP
  • Others

By Technology

  • Fan IN
  • Fan OUT

By Geography

  • North America
    • US
    • Canada
    • Mexico
    • Rest of North America
  • Europe
    • Germany
    • UK
    • France
    • Russia
    • Spain
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Singapore
    • Malaysia
    • Rest of Asia Pacific
  • LAMEA
    • Brazil
    • Argentina
    • UAE
    • Saudi Arabia
    • South Africa
    • Nigeria
    • Rest of LAMEA

Companies Profiled

  • ASML Holding N.V.
  • Fujitsu Limited
  • Toshiba Corporation
  • Qualcomm, Inc.
  • Amkor Technology, Inc.
  • Deca Technologies, Inc.
  • Jiangsu Changjing Electronics Technology Co., Ltd.
  • Tokyo Electron Ltd.
  • Applied Materials, Inc.
  • Lam Research Corporation

Unique Offerings from KBV Research

  • Exhaustive coverage
  • Highest number of market tables and figures
  • Subscription based model available
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  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology

  • 1.1 Market Definition
  • 1.2 Objectives
  • 1.3 Market Scope
  • 1.4 Segmentation
    • 1.4.1 Global Wafer Level Packaging Market, by End User
    • 1.4.2 Global Wafer Level Packaging Market, by Type
    • 1.4.3 Global Wafer Level Packaging Market, by Technology
    • 1.4.4 Global Wafer Level Packaging Market, by Geography
  • 1.5 Methodology for the research

Chapter 2. Market Overview

  • 2.1 Introduction
    • 2.1.1 Overview
      • 2.1.1.1 Market Composition and Scenario
  • 2.2 Key Factors Impacting the Market
    • 2.2.1 Market Drivers
    • 2.2.2 Market Restraints

Chapter 3. Global Wafer Level Packaging Market by End User

  • 3.1 Global Consumer Electronics Market by Region
  • 3.2 Global Automotive Market by Region
  • 3.3 Global Healthcare Market by Region
  • 3.4 Global IT & Telecommunication Market by Region
  • 3.5 Global Others Market by Region

Chapter 4. Global Wafer Level Packaging Market by Type

  • 4.1 Global WLCSP Market by Region
  • 4.2 Global 2.5D TSV WLP Market by Region
  • 4.3 Global 3D TSV WLP Market by Region
  • 4.4 Global Nano WLP Market by Region
  • 4.5 Global Others Market by Region

Chapter 5. Global Wafer Level Packaging Market by Technology

  • 5.1 Global Fan IN Market by Region
  • 5.2 Global Fan OUT Market by Region

Chapter 6. Global Wafer Level Packaging Market by Region

  • 6.1 North America Wafer Level Packaging Market
    • 6.1.1 North America Wafer Level Packaging Market by End User
      • 6.1.1.1 North America Consumer Electronics Market by Country
      • 6.1.1.2 North America Automotive Market by Country
      • 6.1.1.3 North America Healthcare Market by Country
      • 6.1.1.4 North America IT & Telecommunication Market by Country
      • 6.1.1.5 North America Others Market by Country
    • 6.1.2 North America Wafer Level Packaging Market by Type
      • 6.1.2.1 North America WLCSP Market by Country
      • 6.1.2.2 North America 2.5D TSV WLP Market by Country
      • 6.1.2.3 North America 3D TSV WLP Market by Country
      • 6.1.2.4 North America Nano WLP Market by Country
      • 6.1.2.5 North America Others Market by Country
    • 6.1.3 North America Wafer Level Packaging Market by Technology
      • 6.1.3.1 North America Fan IN Market by Country
      • 6.1.3.2 North America Fan OUT Market by Country
    • 6.1.4 North America Wafer Level Packaging Market by Country
      • 6.1.4.1 US Wafer Level Packaging Market
        • 6.1.4.1.1 US Wafer Level Packaging Market by End User
        • 6.1.4.1.2 US Wafer Level Packaging Market by Type
        • 6.1.4.1.3 US Wafer Level Packaging Market by Technology
      • 6.1.4.2 Canada Wafer Level Packaging Market
        • 6.1.4.2.1 Canada Wafer Level Packaging Market by End User
        • 6.1.4.2.2 Canada Wafer Level Packaging Market by Type
        • 6.1.4.2.3 Canada Wafer Level Packaging Market by Technology
      • 6.1.4.3 Mexico Wafer Level Packaging Market
        • 6.1.4.3.1 Mexico Wafer Level Packaging Market by End User
        • 6.1.4.3.2 Mexico Wafer Level Packaging Market by Type
        • 6.1.4.3.3 Mexico Wafer Level Packaging Market by Technology
      • 6.1.4.4 Rest of North America Wafer Level Packaging Market
        • 6.1.4.4.1 Rest of North America Wafer Level Packaging Market by End User
        • 6.1.4.4.2 Rest of North America Wafer Level Packaging Market by Type
        • 6.1.4.4.3 Rest of North America Wafer Level Packaging Market by Technology
  • 6.2 Europe Wafer Level Packaging Market
    • 6.2.1 Europe Wafer Level Packaging Market by End User
      • 6.2.1.1 Europe Consumer Electronics Market by Country
      • 6.2.1.2 Europe Automotive Market by Country
      • 6.2.1.3 Europe Healthcare Market by Country
      • 6.2.1.4 Europe IT & Telecommunication Market by Country
      • 6.2.1.5 Europe Others Market by Country
    • 6.2.2 Europe Wafer Level Packaging Market by Type
      • 6.2.2.1 Europe WLCSP Market by Country
      • 6.2.2.2 Europe 2.5D TSV WLP Market by Country
      • 6.2.2.3 Europe 3D TSV WLP Market by Country
      • 6.2.2.4 Europe Nano WLP Market by Country
      • 6.2.2.5 Europe Others Market by Country
    • 6.2.3 Europe Wafer Level Packaging Market by Technology
      • 6.2.3.1 Europe Fan IN Market by Country
      • 6.2.3.2 Europe Fan OUT Market by Country
    • 6.2.4 Europe Wafer Level Packaging Market by Country
      • 6.2.4.1 Germany Wafer Level Packaging Market
        • 6.2.4.1.1 Germany Wafer Level Packaging Market by End User
        • 6.2.4.1.2 Germany Wafer Level Packaging Market by Type
        • 6.2.4.1.3 Germany Wafer Level Packaging Market by Technology
      • 6.2.4.2 UK Wafer Level Packaging Market
        • 6.2.4.2.1 UK Wafer Level Packaging Market by End User
        • 6.2.4.2.2 UK Wafer Level Packaging Market by Type
        • 6.2.4.2.3 UK Wafer Level Packaging Market by Technology
      • 6.2.4.3 France Wafer Level Packaging Market
        • 6.2.4.3.1 France Wafer Level Packaging Market by End User
        • 6.2.4.3.2 France Wafer Level Packaging Market by Type
        • 6.2.4.3.3 France Wafer Level Packaging Market by Technology
      • 6.2.4.4 Russia Wafer Level Packaging Market
        • 6.2.4.4.1 Russia Wafer Level Packaging Market by End User
        • 6.2.4.4.2 Russia Wafer Level Packaging Market by Type
        • 6.2.4.4.3 Russia Wafer Level Packaging Market by Technology
      • 6.2.4.5 Spain Wafer Level Packaging Market
        • 6.2.4.5.1 Spain Wafer Level Packaging Market by End User
        • 6.2.4.5.2 Spain Wafer Level Packaging Market by Type
        • 6.2.4.5.3 Spain Wafer Level Packaging Market by Technology
      • 6.2.4.6 Italy Wafer Level Packaging Market
        • 6.2.4.6.1 Italy Wafer Level Packaging Market by End User
        • 6.2.4.6.2 Italy Wafer Level Packaging Market by Type
        • 6.2.4.6.3 Italy Wafer Level Packaging Market by Technology
      • 6.2.4.7 Rest of Europe Wafer Level Packaging Market
        • 6.2.4.7.1 Rest of Europe Wafer Level Packaging Market by End User
        • 6.2.4.7.2 Rest of Europe Wafer Level Packaging Market by Type
        • 6.2.4.7.3 Rest of Europe Wafer Level Packaging Market by Technology
  • 6.3 Asia Pacific Wafer Level Packaging Market
    • 6.3.1 Asia Pacific Wafer Level Packaging Market by End User
      • 6.3.1.1 Asia Pacific Consumer Electronics Market by Country
      • 6.3.1.2 Asia Pacific Automotive Market by Country
      • 6.3.1.3 Asia Pacific Healthcare Market by Country
      • 6.3.1.4 Asia Pacific IT & Telecommunication Market by Country
      • 6.3.1.5 Asia Pacific Others Market by Country
    • 6.3.2 Asia Pacific Wafer Level Packaging Market by Type
      • 6.3.2.1 Asia Pacific WLCSP Market by Country
      • 6.3.2.2 Asia Pacific 2.5D TSV WLP Market by Country
      • 6.3.2.3 Asia Pacific 3D TSV WLP Market by Country
      • 6.3.2.4 Asia Pacific Nano WLP Market by Country
      • 6.3.2.5 Asia Pacific Others Market by Country
    • 6.3.3 Asia Pacific Wafer Level Packaging Market by Technology
      • 6.3.3.1 Asia Pacific Fan IN Market by Country
      • 6.3.3.2 Asia Pacific Fan OUT Market by Country
    • 6.3.4 Asia Pacific Wafer Level Packaging Market by Country
      • 6.3.4.1 China Wafer Level Packaging Market
        • 6.3.4.1.1 China Wafer Level Packaging Market by End User
        • 6.3.4.1.2 China Wafer Level Packaging Market by Type
        • 6.3.4.1.3 China Wafer Level Packaging Market by Technology
      • 6.3.4.2 Japan Wafer Level Packaging Market
        • 6.3.4.2.1 Japan Wafer Level Packaging Market by End User
        • 6.3.4.2.2 Japan Wafer Level Packaging Market by Type
        • 6.3.4.2.3 Japan Wafer Level Packaging Market by Technology
      • 6.3.4.3 India Wafer Level Packaging Market
        • 6.3.4.3.1 India Wafer Level Packaging Market by End User
        • 6.3.4.3.2 India Wafer Level Packaging Market by Type
        • 6.3.4.3.3 India Wafer Level Packaging Market by Technology
      • 6.3.4.4 South Korea Wafer Level Packaging Market
        • 6.3.4.4.1 South Korea Wafer Level Packaging Market by End User
        • 6.3.4.4.2 South Korea Wafer Level Packaging Market by Type
        • 6.3.4.4.3 South Korea Wafer Level Packaging Market by Technology
      • 6.3.4.5 Singapore Wafer Level Packaging Market
        • 6.3.4.5.1 Singapore Wafer Level Packaging Market by End User
        • 6.3.4.5.2 Singapore Wafer Level Packaging Market by Type
        • 6.3.4.5.3 Singapore Wafer Level Packaging Market by Technology
      • 6.3.4.6 Malaysia Wafer Level Packaging Market
        • 6.3.4.6.1 Malaysia Wafer Level Packaging Market by End User
        • 6.3.4.6.2 Malaysia Wafer Level Packaging Market by Type
        • 6.3.4.6.3 Malaysia Wafer Level Packaging Market by Technology
      • 6.3.4.7 Rest of Asia Pacific Wafer Level Packaging Market
        • 6.3.4.7.1 Rest of Asia Pacific Wafer Level Packaging Market by End User
        • 6.3.4.7.2 Rest of Asia Pacific Wafer Level Packaging Market by Type
        • 6.3.4.7.3 Rest of Asia Pacific Wafer Level Packaging Market by Technology
  • 6.4 LAMEA Wafer Level Packaging Market
    • 6.4.1 LAMEA Wafer Level Packaging Market by End User
      • 6.4.1.1 LAMEA Consumer Electronics Market by Country
      • 6.4.1.2 LAMEA Automotive Market by Country
      • 6.4.1.3 LAMEA Healthcare Market by Country
      • 6.4.1.4 LAMEA IT & Telecommunication Market by Country
      • 6.4.1.5 LAMEA Others Market by Country
    • 6.4.2 LAMEA Wafer Level Packaging Market by Type
      • 6.4.2.1 LAMEA WLCSP Market by Country
      • 6.4.2.2 LAMEA 2.5D TSV WLP Market by Country
      • 6.4.2.3 LAMEA 3D TSV WLP Market by Country
      • 6.4.2.4 LAMEA Nano WLP Market by Country
      • 6.4.2.5 LAMEA Others Market by Country
    • 6.4.3 LAMEA Wafer Level Packaging Market by Technology
      • 6.4.3.1 LAMEA Fan IN Market by Country
      • 6.4.3.2 LAMEA Fan OUT Market by Country
    • 6.4.4 LAMEA Wafer Level Packaging Market by Country
      • 6.4.4.1 Brazil Wafer Level Packaging Market
        • 6.4.4.1.1 Brazil Wafer Level Packaging Market by End User
        • 6.4.4.1.2 Brazil Wafer Level Packaging Market by Type
        • 6.4.4.1.3 Brazil Wafer Level Packaging Market by Technology
      • 6.4.4.2 Argentina Wafer Level Packaging Market
        • 6.4.4.2.1 Argentina Wafer Level Packaging Market by End User
        • 6.4.4.2.2 Argentina Wafer Level Packaging Market by Type
        • 6.4.4.2.3 Argentina Wafer Level Packaging Market by Technology
      • 6.4.4.3 UAE Wafer Level Packaging Market
        • 6.4.4.3.1 UAE Wafer Level Packaging Market by End User
        • 6.4.4.3.2 UAE Wafer Level Packaging Market by Type
        • 6.4.4.3.3 UAE Wafer Level Packaging Market by Technology
      • 6.4.4.4 Saudi Arabia Wafer Level Packaging Market
        • 6.4.4.4.1 Saudi Arabia Wafer Level Packaging Market by End User
        • 6.4.4.4.2 Saudi Arabia Wafer Level Packaging Market by Type
        • 6.4.4.4.3 Saudi Arabia Wafer Level Packaging Market by Technology
      • 6.4.4.5 South Africa Wafer Level Packaging Market
        • 6.4.4.5.1 South Africa Wafer Level Packaging Market by End User
        • 6.4.4.5.2 South Africa Wafer Level Packaging Market by Type
        • 6.4.4.5.3 South Africa Wafer Level Packaging Market by Technology
      • 6.4.4.6 Nigeria Wafer Level Packaging Market
        • 6.4.4.6.1 Nigeria Wafer Level Packaging Market by End User
        • 6.4.4.6.2 Nigeria Wafer Level Packaging Market by Type
        • 6.4.4.6.3 Nigeria Wafer Level Packaging Market by Technology
      • 6.4.4.7 Rest of LAMEA Wafer Level Packaging Market
        • 6.4.4.7.1 Rest of LAMEA Wafer Level Packaging Market by End User
        • 6.4.4.7.2 Rest of LAMEA Wafer Level Packaging Market by Type
        • 6.4.4.7.3 Rest of LAMEA Wafer Level Packaging Market by Technology

Chapter 7. Company Profiles

  • 7.1 ASML Holding N.V.
    • 7.1.1 Company Overview
    • 7.1.2 Financial Analysis
    • 7.1.3 Regional Analysis
    • 7.1.4 Research & Development Expenses
  • 7.2 Fujitsu Limited
    • 7.2.1 Company Overview
    • 7.2.2 Financial Analysis
    • 7.2.3 Segmental Analysis
    • 7.2.4 SWOT Analysis
  • 7.3 Toshiba Corporation
    • 7.3.1 Company Overview
    • 7.3.2 Financial Analysis
    • 7.3.3 Segmental and Regional Analysis
    • 7.3.4 Research and Development Expense
  • 7.4 Qualcomm, Inc.
    • 7.4.1 Company Overview
    • 7.4.2 Financial Analysis
    • 7.4.3 Segmental and Regional Analysis
    • 7.4.4 Research & Development Expense
  • 7.5 Amkor Technology, Inc.
    • 7.5.1 Company Overview
    • 7.5.2 Financial Analysis
    • 7.5.3 Regional Analysis
    • 7.5.4 Research & Development Expense
  • 7.6 Deca Technologies, Inc.
    • 7.6.1 Company Overview
    • 7.6.2 Recent strategies and developments:
      • 7.6.2.1 Partnerships, Collaborations, and Agreements:
      • 7.6.2.2 Product Launches and Product Expansions:
  • 7.7 Jiangsu Changjing Electronics Technology Co., Ltd.
    • 7.7.1 Company Overview
  • 7.8 Tokyo Electron Ltd.
    • 7.8.1 Company Overview
    • 7.8.2 Financial Analysis
    • 7.8.3 Segmental and Regional Analysis
    • 7.8.4 Research & Development Expenses
  • 7.9 Applied Materials, Inc.
    • 7.9.1 Company Overview
    • 7.9.2 Financial Analysis
    • 7.9.3 Segmental and Regional Analysis
    • 7.9.4 Research & Development Expenses
  • 7.10. Lam Research Corporation
    • 7.10.1 Company Overview
    • 7.10.2 Financial Analysis
    • 7.10.3 Regional Analysis
    • 7.10.4 Research & Development Expenses